CN104507252A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN104507252A CN104507252A CN201410700671.9A CN201410700671A CN104507252A CN 104507252 A CN104507252 A CN 104507252A CN 201410700671 A CN201410700671 A CN 201410700671A CN 104507252 A CN104507252 A CN 104507252A
- Authority
- CN
- China
- Prior art keywords
- circle
- setting circle
- positioning
- printed substrate
- annulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a printed circuit board. The printed circuit board comprises a multilayer board. The board is provided with a printed line and a pad; the edge of the board is provided with a contraposition figure for positioning during boring; the contraposition figure comprises a first positioning circle and a second positioning circle which are respectively arranged at the two side edges of the printed circuit board, and a third positioning circle disposed at the same side edge as the first positioning circle; the circle center of the first positioning circle and the circle center of the second positioning circle are at the same line; the circle center of the first positioning circle and the circle center of the third positioning circle are at the same line; a triangle is arranged in the third positioning circle, and one corner of the triangle is oriented towards the circle center of the first positioning circle; and the first positioning circle, the second positioning circle and the third positioning circle are provided with three circular rings which are unequal in diameters and linewidths and are concentric with the positioning circles. According to the invention, the printed circuit board can realize feeding of an X-RAY drilling target at a time to finish three-target boring, shortens the processing period and improves the work efficiency; and the target drilling precision can be enhanced.
Description
Technical field
The present invention relates to wiring board manufacturing technology field, be specifically related to a kind of printed substrate.
Background technology
When traditional multilayer circuit board makes, all need Design Orientation circle with in drilling operating for the accurate location between multi-layer sheet.Setting circle is designed to certain figure, surperficial copper sheet is milled after pressing, high light is utilized to penetrate base material part, there is the light tight formation image of copper part, CCD camera lens is automatically positioned to brill target position and completes bore operation after catching, or adopting X-RAY ray to penetrate the characteristic of different-thickness metal weakening degree varies, the graphical projection that formation shade differs is on CCD camera lens, and board is positioned to setting circle position and bore operation automatically.Along with the development of wiring board industry, make the wiring board number of plies more and more higher, requirement on machining accuracy is also more and more higher, and use milling copper sheet and CCD to bore target operating type by factors such as thickness of slab, precision and interlayer skews to affect, cannot meet the demand of production development, so most of pressing manufacturer is all importing and adopting X-RAY brill target mode to produce energetically.But the setting circle of X-RAY lathe is arranged, often different because lathe model is different, be difficult to unified, setting circle design adds designer's workload, and production efficiency is low.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of being applicable to and different bores level to level alignment degree after the pressing of target drone platform energy effective monitoring multi-layer sheet and the printed substrate of location hole degrees of offset after boring target.
For solving the problems of the technologies described above, the technical scheme that the present invention takes is: a kind of printed substrate, comprise multi-layer sheet, plate is provided with printed wire, pad, the aligning graph of location when edges of boards are provided with for holing, described aligning graph comprises the first setting circle and the second setting circle that are separately positioned on printed substrate dual-side, and with three setting circle of the first setting circle at same side, on the same line, the first, the 3rd setting circle center of circle on the same line in first, second setting circle center of circle described.
Preferably, described first, second, third setting circle size is identical, and diameter is preferably 2.5-3.0mm.
Preferably, three diameters, live width is not equipped with outside described first, second, third setting circle not etc. and the annulus concentric with setting circle.
Preferably, in donut maximum annulus be live width 0.05mm lines composition external diameter be the annulus of 6.0mm; Minimum annulus is the external diameter of the lines composition of live width 0.15mm is the annulus of 4.0mm.
Preferably, arrange a triangle in described 3rd setting circle, one jiao, described triangle points to the center of circle of the first setting circle.
Preferably, first, second setting circle described is solid circles.
Preferably, described first, second, third setting circle and donut all etch and form before boring.
Compared with prior art, the invention has the beneficial effects as follows:
(1) adopt two setting circles of rectangular distribution to bore origin reference location circle and the direction setting circle of target respectively as X-RAY in the present invention, the feeding of X-RAY brill target can be realized and complete three targets borings, shorten the process-cycle, increase work efficiency;
(2) wherein equilateral triangle is set as the setting circle center of circle that origin reference location is round and can plays Y-axis fool proof and direction setting circle boring foolproof function, enhance productivity, direction setting circle adopts and does not chase after target operation, shorten board identification and reaction time, maximize under the prerequisite guaranteeing quality and improve board production efficiency;
(3) the present invention adopts diameter to be the circular target center of 2.5-3.0mm, is applicable to any brill target drone platform, is the most suitable design, can effectively shortens board recognition time, make board quick position, shorten process time, and can improve brill target precision.
Accompanying drawing explanation
fig. 1 is printed circuit board structure schematic diagram of the present invention;
Fig. 2 is setting circle structure enlarged diagram in described wiring board.
Embodiment
The present invention to be explained in further detail below in conjunction with accompanying drawing and embodiment for the ease of it will be appreciated by those skilled in the art that.
As shown in Figure 1, disclosed printed substrate 10, comprise printed wire, pad etc., also comprise the origin reference location circle 12 and 14 being arranged on edges of boards, setting circle 12 and setting circle 14 are separately positioned on wiring board two relative side, the target center line of setting circle 12 and 14 is parallel to wiring board plate central axis, and the distance of setting circle 12 and 14 is between 250-650mm.Direction setting circle 16 and origin reference location circle 12 are at the same side of wiring board plate, and the target center line of setting circle 12 and 16 is perpendicular to plank central axis, and three setting circles 12,14,16 at right angles distribute.
The size of setting circle 12 of the present invention, setting circle 14 and setting circle 16, size, shape are all identical, draw out an equilateral triangle in the center circle unlike setting circle 12.As shown in Fig. 2 embodiment, origin reference location circle 14 and direction setting circle 16 comprise the first annulus 2, second annulus 3, the 3rd annulus 4 and circular 5.Origin reference location circle 12 is then setting circle annulus 5 to be drawn out an equilateral triangle 6, and the center of circle of one of them drift angle fixed directional direction setting circle 16 of triangle, this design can play Y-axis fool proof and direction setting circle boring foolproof function, by the distinctive points of setting circle 12 in setting circle 14, and the drift angle of equilateral triangle points in setting circle 12, when employing three axle bores target or the 3rd hole (i.e. hole, direction 16) blind brill, can effectively prevent plank back and forth or left and right from putting back and causing boring wrong wad cutter 16, rear processing procedure produces because of Wrong localization to be scrapped.And making boring board can identify origin reference location circle easily, not only direction setting circle adopts and does not chase after target operation, directly realizes boring by machine internal setup algorithm, ensures processing quality but also can shorten board identification and reaction time.
During concrete enforcement, preferably the first annulus 2 adopts the lines of live width 0.05mm, and external diameter is 6.0mm; Second annulus 3 is the lines adopting live width 0.10mm, and external diameter is 5mm; 3rd annulus 4 is the lines adopting live width 0.15mm, and internal diameter is the annulus of 4mm; Circle 5 diameters are 3.5mm.Equilateral triangle is drawn out in circle 5.
Above-described embodiment is the preferred embodiment of the present invention, and in addition, the present invention can also have other implementations.That is, under the prerequisite not departing from the present invention's design, any apparent replacement also should fall within protection scope of the present invention.
Claims (8)
1. a printed substrate, comprise multi-layer sheet, plate is provided with printed wire, pad, the aligning graph of location when edges of boards are provided with for holing, it is characterized in that: described aligning graph comprises the first setting circle and the second setting circle that are separately positioned on printed substrate dual-side, and with three setting circle of the first setting circle at same side, on the same line, the first, the 3rd setting circle center of circle is on the same line in first, second setting circle center of circle described.
2. printed substrate according to claim 1, is characterized in that: described first, second, third setting circle size is identical.
3. printed substrate according to claim 1, is characterized in that: be not equipped with three diameters, live width outside described first, second, third setting circle not etc. and the annulus concentric with setting circle.
4. printed substrate according to claim 3, is characterized in that: in donut, maximum annulus is the external diameter of the lines composition of live width 0.05mm is the annulus of 6.0mm; Minimum annulus is the external diameter of the lines composition of live width 0.15mm is the annulus of 4.0mm.
5. printed substrate according to claim 1, is characterized in that: arrange a triangle in described 3rd setting circle, one jiao, described triangle points to the center of circle of the first setting circle.
6. printed substrate according to claim 1, is characterized in that: first, second setting circle described is solid circles.
7. printed substrate according to claim 1, is characterized in that: described first, second, third setting circle diameter is 2.5-3.0mm.
8. the printed substrate according to claim 5 or 6, is characterized in that: described first, second, third setting circle and donut all etch and form before boring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410700671.9A CN104507252A (en) | 2014-11-28 | 2014-11-28 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410700671.9A CN104507252A (en) | 2014-11-28 | 2014-11-28 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104507252A true CN104507252A (en) | 2015-04-08 |
Family
ID=52948945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410700671.9A Withdrawn CN104507252A (en) | 2014-11-28 | 2014-11-28 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104507252A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318233A (en) * | 2017-07-13 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of HDI board blind holes |
| CN115988736A (en) * | 2023-03-17 | 2023-04-18 | 广州添利电子科技有限公司 | Circuit board core board and manufacturing method thereof |
-
2014
- 2014-11-28 CN CN201410700671.9A patent/CN104507252A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318233A (en) * | 2017-07-13 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of HDI board blind holes |
| CN107318233B (en) * | 2017-07-13 | 2019-09-10 | 深圳明阳电路科技股份有限公司 | A kind of production method of HDI board blind hole |
| CN115988736A (en) * | 2023-03-17 | 2023-04-18 | 广州添利电子科技有限公司 | Circuit board core board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20150408 |