CN103753643B - The boring method that a kind of tow sides bore - Google Patents
The boring method that a kind of tow sides bore Download PDFInfo
- Publication number
- CN103753643B CN103753643B CN201410030865.2A CN201410030865A CN103753643B CN 103753643 B CN103753643 B CN 103753643B CN 201410030865 A CN201410030865 A CN 201410030865A CN 103753643 B CN103753643 B CN 103753643B
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- Prior art keywords
- pcb board
- hole
- predetermined depth
- auxiliary positioning
- drill point
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 230000005611 electricity Effects 0.000 claims description 2
- 230000001788 irregular Effects 0.000 abstract description 8
- 229920001342 Bakelite® Polymers 0.000 abstract description 5
- 239000004637 bakelite Substances 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 241001074085 Scophthalmus aquosus Species 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses the boring method that a kind of tow sides bore, including: A, hole, three location is set in the centre of described pcb board, shop bolt is used to fix described pcb board through hole, described location, and three auxiliary positioning holes it are respectively provided with in the corner of pcb board, use screw and pad, through auxiliary positioning hole, pcb board and machine table top bakelite plate are locked；B, the extraordinary drill point of use first pierce the first predetermined depth；C, the conventional drill point of use pierce the second predetermined depth in the front of pcb board, by the coordinate quadrant in hole, described location, carry out mirror image with Y-axis, and the reverse side at pcb board pierces the 3rd predetermined depth again, drills plate face.Use technical solution of the present invention to process the non-machinable slab of prior art and particular design irregular plate face, improve yields in the case of the non-machinable slab of existing drill point.
Description
Technical field
The present invention relates to printed board manufacturing technology field, particularly relate to the boring method that a kind of tow sides bore.
Background technology
In the process of manufacture of printed board, need to hole on applicable position, in order to components and parts
Install or the layout of circuit.Conventional boring method is to be fixed on board by pcb board, often then re-uses
The drill bit of rule gets out required position, hole.But along with the development of technology, the thickness of printed board is gradually increased, existing
Drill point can not drill thicker pcb board.It addition, part wiring board producer is for≤1.0mm small-bore
The method taking to lengthen sword length, but the still difficult quality requirements meeting processing.Uneven finally, for plate face
Whole plate, existing boring method is: irregular region is taked the method filled make plate face holding level,
Holing, operation easier is high the most again, it is impossible to meets plate face and is designed as windowing that position is more and welding PAD is more
Pcb board quality requirements.
Summary of the invention
Present invention aim at the boring method providing a kind of tow sides to bore, use technical solution of the present invention energy
In the case of the non-machinable slab of existing drill point, process the non-machinable slab of prior art and particular design
Irregular plate face, improves yields.
The embodiment of the present invention proposes the boring method that a kind of tow sides bore, including:
A, arrange in the centre of pcb board three location hole, described three location hole constitute coordinate quadrant, make
Fix described pcb board with shop bolt through hole, described location, and be respectively provided with three in the corner of pcb board
Auxiliary positioning hole, uses screw and pad, through described auxiliary positioning hole, by pcb board and machine table top electricity
Plank locks；
B, the extraordinary drill point of use first pierce the first predetermined depth；Described extraordinary drill point is for for entering bore position
The drill point of row preboring；
C, the conventional drill point of use pierce the second predetermined depth in the front of pcb board, by hole, described location
Coordinate quadrant, carries out mirror image with Y-axis, corresponding to described second predetermined depth on the reverse side of described pcb board
Position pierce the 3rd predetermined depth again, drill plate face.
Further, when using screw and pad locking, in three described auxiliary positioning holes of corner,
One of them described auxiliary positioning hole at selected each angle locks, and other two auxiliary positioning hole is standby
Hole.
Further, described auxiliary positioning hole be aperture be 5 millimeters, spacing between three auxiliary positioning holes
It it is the auxiliary positioning hole of 3 millimeters.
Further, the interval of described first predetermined depth is the 5% to 20% of described pcb board thickness.
Further, the interval of described second predetermined depth is the 40% to 70% of described pcb board thickness；Described
The interval of the 3rd predetermined depth is 40% to 70% that described pcb board is thick；And described second predetermined depth adds
Described 3rd predetermined depth is more than or equal to the 100% of described pcb board thickness.
Therefore, the present invention implements by being respectively provided with three auxiliary positioning holes in the corner of pcb board, makes
Being locked on machine table top bakelite plate by pcb board with screw and pad, the centre of plate arranges hole, three location,
So that the leveling in the location of boring and plate face (using screw and pad can effectively prevent plate from sticking up), then adopt
First carry out preboring with extraordinary drill point, be pre-drilled into the first predetermined depth, it is achieved pre-determined bit during boring, finally exist
Use the method that tow sides bore, first pierce the second predetermined depth, by the seat in this hole, location with conventional drill point
Mark quadrant, carries out mirror image with Y-axis, pierces the 3rd predetermined depth the most again, once drill plate face.It is visible,
Application the technical program, it is not necessary to specific drill point be designed and lengthen, using existing drill point can process relatively
Thick pcb board, and irregular pcb board is arranged for plate face, the method using positive back-drilling, aperture can
To carry out normal process, and during big-diameter hole drilling, it is avoided that because of the out-of-flatness of plate face, with pad contact
The most unsettled hole caused is damaged, thus improves working ability and product yield.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the boring method that a kind of tow sides that the present invention provides bore；
Fig. 2 is the locking schematic diagram of the pcb board of the boring method that the present invention provides；
Fig. 3 is position, the hole schematic diagram of the pcb board that the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, be fully described by, it is clear that described embodiment be only a part of embodiment of the present invention rather than
Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creation
The every other embodiment obtained under property work premise, broadly falls into the scope of protection of the invention.
See Fig. 1, be the first reality of the boring method of the tow sides brill of a kind of pcb board that the present invention provides
Executing the schematic flow sheet of example, the method comprises the following steps:
Step 101:A, hole, three location is set in the centre of pcb board, uses shop bolt through described fixed
Pcb board is fixed in hole, position, and is respectively provided with three auxiliary positioning holes in the corner of pcb board, use screw and
Pad, through auxiliary positioning hole, locks pcb board and machine table top bakelite plate.
In the present embodiment, see the pcb board locking schematic diagram that Fig. 2, Fig. 2 provide for the present embodiment, its
In, screw 201 and pad 202 pass through auxiliary positioning hole by pcb board 203 and machine table top bakelite plate 204
Locking, and shop bolt 205 fixes pcb board by hole, location.Pad 202 can increase contact area.Spiral shell
Silk nail 201 can be, but not limited to for long 18.2 millimeters, aperture be the screw of 4 millimeters.Pad 202 can
With but be not limited to outer annular diameter be 9 millimeters, annular diameters be the pad of 4.15 millimeters.
In the present embodiment, see position, the hole schematic diagram that Fig. 3, Fig. 3 are pcb board, as it can be seen, wherein
Reference a is auxiliary positioning hole and the distance of pcb board left margin is 3 millimeters, b be aperture be 5 millimeters
Auxiliary positioning hole, c is hole and the coboundary distance of pcb board is 5 millimeters, d be aperture be 3.175 millimeters
Hole, location, wherein the hole, location on PCB top is positioned at the center of pcb board.The hole, left location of bottom is positioned at
The center of pcb board, e be the spacing between auxiliary positioning hole be 3 millimeters, f is the spacing that bottom two positions hole
It is 100 to 150 millimeters.
In the present embodiment, be provided with three auxiliary positioning holes in the corner of pcb board, use screw and
During pad locking, in three auxiliary positioning holes of corner, one of them auxiliary positioning hole at selected each angle
Locking, flatten plate face, can effectively prevent plate from sticking up, prevent locating bias, other two assists
Hole, location is standby hole, can prevent because positioning with standby hole after via hole breakage again..
Step 102:B, the extraordinary drill point of use first pierce the first predetermined depth.
In the present embodiment, first use extraordinary drill point that bore position carries out preboring, the district of the first predetermined depth
Between be pcb board thick 5% to 20%, irregular plate is arranged for plate face, in conjunction with location mode and preboring,
Can normal process.
Step 103:C, the conventional drill point of use pierce the second predetermined depth in the front of pcb board, by location
The coordinate quadrant in hole, carries out mirror image with Y-axis, and the reverse side at pcb board pierces the 3rd predetermined depth again, drills
Plate face.
In the present embodiment, the interval of the second predetermined depth is the 40% to 70% of pcb board thickness.3rd presets
The interval of the degree of depth is 40% to 70% that described pcb board is thick.And the second predetermined depth is preset deep plus the 3rd
Degree have to be larger than or equal to the 100% of pcb board thickness, such that it is able to drill plate face.Such as when preboring, first
Preboring 5%, pierces 60% when then boring in front, reverse side pierces 50% when boring, and once drills through plate face.
In the present embodiment, board processing can be carried out with segmentation, improves the production yield of printed board.It addition,
By taking special location mode, and the method using segmentation brill, make tow sides add the coincidence essence in man-hour
Degree is within 3mil.When can ensure effective sword length design that thickness of slab exceeds drill point, product is processed.?
After, use the method that this invents, during to big hole machined, the going out the edge of a knife and will not touch irregular plate of drill point
Face, can avoid the hole worn because designing irregular plate to damage.
Therefore, the embodiment of the present invention by being respectively provided with three auxiliary positioning holes in the corner of pcb board,
Using screw and pad to be locked in by pcb board on machine table top bakelite plate, the centre of plate arranges hole, three location,
So that the leveling in the location of boring and plate face (using screw and pad can effectively prevent plate from sticking up), then adopt
First carry out preboring, the 5% of the preboring thickness of slab degree of depth, it is achieved pre-determined bit during boring with extraordinary drill point, finally adopting
The method bored with tow sides, first pierces the 60% of the thickness of slab degree of depth, by the seat in this hole, location with conventional drill point
Mark quadrant, carries out mirror image with Y-axis, bores 50% the most again, once drill plate face.Visible, apply this skill
Art scheme, it is not necessary to specific be designed drill point and lengthen, uses existing drill point can process thicker PCB
Plate, and irregular pcb board is arranged for plate face, the method using positive back-drilling, aperture can just carried out
Often processing, and during big-diameter hole drilling, it is avoided that, because of the out-of-flatness of plate face, the one side with pad contact is unsettled
The hole caused is damaged, thus improves working ability and product yield.
The above is the preferred embodiment of the present invention, it is noted that for the common skill of the art
For art personnel, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, this
A little improvements and modifications are also considered as protection scope of the present invention.
Claims (5)
1. the boring method that tow sides bore, it is characterised in that including:
A, arrange in the centre of pcb board three location hole, described three location hole constitute coordinate quadrant, make
Fix described pcb board with shop bolt through hole, described location, and be respectively provided with three in the corner of pcb board
Auxiliary positioning hole, uses screw and pad, through described auxiliary positioning hole, by pcb board and machine table top electricity
Plank locks；
B, the extraordinary drill point of use first pierce the first predetermined depth；Described extraordinary drill point is for for entering bore position
The drill point of row preboring；
C, the conventional drill point of use pierce the second predetermined depth in the front of pcb board, by hole, described location
Coordinate quadrant, carries out mirror image with Y-axis, corresponding to described second predetermined depth on the reverse side of described pcb board
Position pierce the 3rd predetermined depth again, drill plate face.
2. the boring method that tow sides as claimed in claim 1 bore, it is characterised in that
When using screw and pad locking, in three described auxiliary positioning holes of corner, selected each
One of them of angle described auxiliary positioning hole locks, and other two auxiliary positioning hole is standby hole.
3. the boring method that tow sides as claimed in claim 1 or 2 bore, it is characterised in that
Described auxiliary positioning hole be aperture be 5 millimeters, spacing between three auxiliary positioning holes be 3 millimeters
Auxiliary positioning hole.
The boring method that tow sides the most according to claim 1 bore, it is characterised in that described first
The interval of predetermined depth is 5% to 20% that described pcb board is thick.
The boring method that tow sides the most according to claim 1 bore, it is characterised in that
The interval of described second predetermined depth is 40% to 70% that described pcb board is thick；
The interval of described 3rd predetermined depth is 40% to 70% that described pcb board is thick；
And described second predetermined depth is plus described 3rd predetermined depth thick more than or equal to described pcb board
100%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410030865.2A CN103753643B (en) | 2014-01-22 | 2014-01-22 | The boring method that a kind of tow sides bore |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410030865.2A CN103753643B (en) | 2014-01-22 | 2014-01-22 | The boring method that a kind of tow sides bore |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103753643A CN103753643A (en) | 2014-04-30 |
| CN103753643B true CN103753643B (en) | 2016-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410030865.2A Expired - Fee Related CN103753643B (en) | 2014-01-22 | 2014-01-22 | The boring method that a kind of tow sides bore |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104260146B (en) * | 2014-08-15 | 2016-06-22 | 安徽广德威正光电科技有限公司 | BT plate bore process |
| CN104785811B (en) * | 2015-05-11 | 2017-06-30 | 大族激光科技产业集团股份有限公司 | A kind of capillary processing method |
| CN106332473B (en) * | 2015-06-15 | 2019-12-20 | 东莞生益电子有限公司 | Back plate processing method, mold adopted by back plate processing method and back plate manufactured by back plate processing method |
| CN105671217A (en) * | 2016-04-11 | 2016-06-15 | 侯如升 | Leather drilling device |
| CN107486892B (en) * | 2017-09-29 | 2020-03-27 | 广东兴达鸿业电子有限公司 | PCB drilling positioning method |
| CN109176703A (en) * | 2018-08-01 | 2019-01-11 | 广州美维电子有限公司 | A kind of boring method improving high thick diameter pcb board borehole accuracy |
| CN109093773A (en) * | 2018-09-18 | 2018-12-28 | 奥士康精密电路（惠州）有限公司 | A method of promoting shape bakelite plate service efficiency |
| CN112974918B (en) * | 2021-04-15 | 2021-07-30 | 苏州维嘉科技股份有限公司 | Contact tip detecting device and method, signal processing device and method, and drilling machine |
| CN114340174B (en) * | 2022-01-10 | 2024-04-05 | 鹤山市泰利诺电子有限公司 | Drilling method of single panel and single panel manufactured by drilling method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101085472A (en) * | 2007-07-06 | 2007-12-12 | 深圳市深南电路有限公司 | PCB plate double-face drilling and positioning method |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN201947534U (en) * | 2011-01-12 | 2011-08-24 | 深圳市兴森快捷电路科技股份有限公司 | Multilayer printed circuit board with high thickness-diameter ratio |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08323697A (en) * | 1995-05-26 | 1996-12-10 | Matsushita Electric Works Ltd | Multi-layered printed circuit board drilling method |
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2014
- 2014-01-22 CN CN201410030865.2A patent/CN103753643B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101085472A (en) * | 2007-07-06 | 2007-12-12 | 深圳市深南电路有限公司 | PCB plate double-face drilling and positioning method |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN201947534U (en) * | 2011-01-12 | 2011-08-24 | 深圳市兴森快捷电路科技股份有限公司 | Multilayer printed circuit board with high thickness-diameter ratio |
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| CN103753643A (en) | 2014-04-30 |
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Granted publication date: 20160928 |