CN106332473B - Back plate processing method, mold adopted by back plate processing method and back plate manufactured by back plate processing method - Google Patents
Back plate processing method, mold adopted by back plate processing method and back plate manufactured by back plate processing method Download PDFInfo
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- CN106332473B CN106332473B CN201510330870.XA CN201510330870A CN106332473B CN 106332473 B CN106332473 B CN 106332473B CN 201510330870 A CN201510330870 A CN 201510330870A CN 106332473 B CN106332473 B CN 106332473B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insertion Pins And Rivets (AREA)
Abstract
The invention provides a back plate processing method and a mold adopted by the same, wherein the back plate processing method comprises the following steps of 1) processing a plurality of sets of rivet holes and a plurality of target patterns on a sub-core plate, wherein each set of rivet holes comprises at least three rivet holes which are linearly arranged; 2) browning the coreboard; 3) laminating and riveting a plurality of sub-core plates to form a back plate, wherein each set of rivet holes is riveted with at least two rivet holes; 4) grabbing a target pattern on the back plate by using a target drilling machine, and drilling a target hole at the position of the target pattern; 5) and (3) using a CCD (charge coupled device) drilling machine, taking any three drilled target holes as targets to form a plane coordinate system, measuring, calculating and moving to the position of the back plate where the functional holes need to be drilled according to the any three target holes as reference points, and drilling the functional holes of the back plate on the front surface and the back surface in an equal-size manner by adopting a conductive control depth mode. The processing method of the invention can improve the control of the alignment degree of each sub-core plate in lamination during the manufacture of the back plate, and improve the processing precision and yield of the back plate.
Description
Technical Field
The invention relates to a manufacturing method of a circuit board, in particular to a processing method of a multilayer large-size thick backboard, a mold adopted by the processing method and a backboard manufactured by the method.
Background
In the PCB industry, a back panel is a main board commonly used in an electrical device, and is provided with an interface for facilitating insertion of various types of substrates thereon, such as a main board of a computer, a video card, an internal memory, a hard disk, and a CPU. The back plate has powerful functions and is formed by laminating a plurality of sub-core plates. The respective core sheets are usually riveted by rivets at the time of lamination bonding. At present, the conventional riveting adopts fixed rivets which are uniformly distributed, the distance between the rivets is large, when a plurality of layers (more than 38 layers) of large-size (the long edge is more than 42 inches, the inch is an English length unit, and 1 inch is 25.4mm) thick back boards (the board thickness is more than 7mm) are manufactured, the rivet fixing action is poor, the partial scrapping caused by the poor local fixing action is easy to generate, and particularly, each layer is not fixed and is easy to loosen in the moving process. In addition, the existing drilling method for the back plate with the plate thickness larger than 7mm cannot ensure that the hole site precision of the tool entering surface and the tool exiting surface meets the requirements of back drilling on the compression joint and non-compression joint surfaces of the back plate, so that compression joint failure and back drilling residual copper cause short circuit. For the above reasons, the current high multi-layer large-size thick backplane cannot meet the requirement of controlling the alignment within 7 mils (mil, imperial length unit, 1 mil-0.001 inch).
Disclosure of Invention
In view of the foregoing, the present invention needs to provide a method for processing a back plate, which can improve the alignment of a multi-layer thick back plate with a large size, so that the alignment of the multi-layer thick back plate with a large size can be controlled within 7 mils.
A backboard processing method for improving the alignment degree of a multilayer large-size thick backboard comprises the following steps,
1) processing a plurality of sets of rivet holes and a plurality of target patterns on the sub-core plate, wherein each set of rivet holes comprises at least three rivet holes which are linearly arranged;
2) browning the coreboard;
3) laminating and riveting a plurality of sub-core plates to form a back plate, wherein each set of rivet holes is riveted with at least two rivet holes;
4) grabbing a target pattern on the back plate by using a target drilling machine, and drilling a target hole at the position of the target pattern;
5) and (3) using a CCD (charge coupled device) drilling machine, taking any three drilled target holes as targets to form a plane coordinate system, measuring, calculating and moving to the position of the back plate where the functional holes need to be drilled according to the any three target holes as reference points, and drilling the functional holes of the back plate on the front surface and the back surface in an equal-size manner by adopting a conductive control depth mode.
Further, in the step 1), the sub-core plates are rectangular plates, and 4 target patterns 11 are designed when the size of the plate surface is smaller than 36 inches, are uniformly distributed at the four plate corner positions and are 10mm-20mm away from the plate edges; when the size of the plate surface is larger than 36 inches, 6 plates are designed, and two plates are added to the plate surface on the basis of 4 plate corners.
Further, in step 1), three rivet holes are selected for each set of rivet holes, including a conventional rivet hole and reinforced rivet holes with a distance of 10mm-30mm between the two sides of the conventional rivet hole.
Further, in step 4), the target holes penetrate through the front side and the back side of the back plate.
Further, in the step 5), firstly, target holes are selected on the front surface of the back plate to be used as targets of the CCD drilling machine, conductive depth control blind drilling is conducted, the plate thickness is drilled to 55% -60% on one side, then the back plate is turned over, the same target holes are used as targets of the CCD drilling machine, conductive depth control drilling is conducted on the back surface of the back plate, and the plate thickness is drilled to 55% -60%.
In addition, the present invention also provides a back plate manufactured by the above method.
The backboard is manufactured by the backboard processing method for improving the alignment of the multilayer large-size thick backboard.
Next, the present invention is necessary to provide a mold for caulking used in the above-described back plate processing method.
The utility model provides a mould for riveting, includes mould needle, lower mould needle and lower mould base, goes up the mould needle and can reciprocate, and the lower mould needle is fixed on the lower mould base, and the lower mould base includes base main part and the protruding boss of stretching in the base main part, and the center of boss upper surface is protruding to be established lower mould needle to form annular lower mould edge of a knife face on the boss upper surface correspondingly, protruding a plurality of sword strips that are equipped with equidistant radial extension on the lower mould edge of a knife face, mould for riveting still includes lower mould dust absorption cover seat, and lower mould dust absorption cover seat sets firmly and surrounds in the base main part the boss to the upper surface of lower mould dust absorption cover seat is higher than the upper surface of boss.
The utility model provides a mould for riveting, includes last mould needle, lower mould needle and lower mould base, goes up the mould needle and can reciprocate, and the lower mould needle is fixed on the lower mould base, and the lower mould base includes base main part and the protruding boss of stretching in the base main part, and the center of boss upper surface is protruding to be established lower mould needle to form annular lower mould edge of a knife face on the boss upper surface correspondingly, protruding a plurality of sword strips that are equipped with equidistant radial extension on the lower mould edge of a knife face, mould for riveting still includes elastic lower mould packing ring, lower mould packing ring pad is established on lower mould edge of a knife face.
Furthermore, the lower die is provided with two lower die gaskets, one of the lower die gaskets is sleeved on the periphery of the boss and is padded on the base main body, and the other lower die gasket is sleeved on the periphery of the lower die needle and is padded on the surface of the lower die knife edge.
Compared with the prior art, the processing method of the back plate has the advantages that multiple sets of rivets are designed in the step 1) for riveting, the rivet fixing effect is increased, and scrapping caused by poor alignment caused by poor riveting of a single rivet is prevented. In the step 3), a special riveting die structure is adopted, namely, a lower touch suction seat is eliminated, and two gaskets are sleeved on a lower die needle, so that the riveting rivet of the backboard with the thickness larger than 7mm is enabled to bloom uniformly, the blooming stability is good, and the problem that the rivet falls off due to the fact that a core plate is not damaged is solved. In the step 5), two sides of the high-density multi-layer large-size thick backboard are drilled in an equal-size mode by combining CBD (cubic boron nitride) conductive depth control with CCD (charge coupled device) drilling, the hole site precision of the tool face entering and exiting is guaranteed to meet the requirements of crimping and backdrilling within 3mil at the same time, and therefore the alignment degree of the high-density multi-layer large-size thick backboard is guaranteed to be controlled within 7mil through the comprehensive method.
Drawings
The above description is only an overview of the technical solutions of the present invention, and in order to more clearly illustrate the technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, the drawings in the description are only specific embodiments corresponding to the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings when necessary without creative efforts.
Fig. 1 is a flowchart of a method for processing a multi-layer thick backplate to improve the alignment of the backplate.
FIG. 2 is a schematic partial cross-sectional view of each of the sub-core boards constituting the backplane according to the preferred embodiment of the present invention;
FIG. 3 is a schematic surface view of the core layer shown in FIG. 2 after patterning;
FIG. 4 is a schematic cross-sectional view of a clinch die typically used in laminating a coreboard (including a top view of the exit face of the lower die);
FIG. 5 is a schematic cross-sectional view of a riveting die used in a laminate core panel in accordance with a preferred embodiment of the invention;
FIG. 6 is a schematic view of a target design for a back plate surface obtained after lamination of a sub-core plate;
FIG. 7 is a schematic cross-sectional view of a CCD drilled hole on the front side of a back plate obtained after the lamination of the sub-core plates;
fig. 8 is a schematic cross-sectional view of the back plate of fig. 7 drilled with a CCD on the back side after drilling on the front side.
Detailed Description
To elaborate on technical solutions adopted by the present invention to achieve the predetermined technical objectives, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, it is obvious that the described embodiments are only partial embodiments of the present invention, not all embodiments, and technical means or technical features in the embodiments of the present invention may be replaced without creative efforts, and the present invention will be described in detail below with reference to the drawings and in combination with the embodiments.
Referring to fig. 1, a method for processing a multi-layer thick backplate capable of improving alignment of the backplate comprises the following steps.
1) And (4) manufacturing the patterns of the sub-core plate, processing a plurality of sets of rivet holes and a plurality of target patterns on the sub-core plate, wherein each set of rivet holes comprises at least three rivet holes which are linearly arranged. Referring to fig. 2 and 3, fig. 2 shows five sub-core plates 10, each sub-core plate 10 has an odd number of surfaces (i.e., the upper surface) designed with X-RAY target patterns 11, in this embodiment, the sub-core plates 10 are rectangular plates, and when the size of the plate surface is smaller than 36 inches, the target patterns 11 are designed with 4 (shown in fig. 3) and uniformly distributed at the plate corner positions 10mm to 20mm away from the plate edges; when the size of the plate surface is larger than 36 inches, 6 plates are designed, namely two plates are added to the plate surface on the basis of 4 plate corners (as shown in figure 6). Each sub-core plate 10 is provided with a plurality of sets of rivet holes 12 adjacent to the edge, and each set of rivet holes 12 comprises at least three rivet holes which are linearly arranged and parallel to the edge of the sub-core plate 10. In the present embodiment, preferably, each set of rivet holes 12 is selected as three rivet holes, including a conventional rivet hole 121 and reinforcement rivet holes 122 added on both sides of the conventional rivet hole 121, spaced from the conventional rivet hole 121 by 10mm to 30mm and having the same design requirements as the conventional rivet hole 121. During riveting, only riveting reinforcement rivet hole 122, middle conventional rivet hole 121 regard as reserve riveting rivet hole to use when strengthening rivet hole 122 on both sides and going wrong, use as the interim fixed usefulness during riveting simultaneously, the single is three a set of at most riveting, need fix the rivet hole that other not rivets when riveting a set of, prevent other position slides and off normal.
2) Browning the coreboard; i.e. the surfaces of the sub-core plates are rough, and the binding force between every two sub-core plates when the sub-core plates are overlapped is enhanced. Specifically, the surface of the core plate is a smooth copper surface, and can be roughened by oxidation of the copper surface.
3) And laminating and riveting the plurality of sub-core plates, wherein at least two rivet holes are riveted in each set of rivet holes. And adopting a mould to rivet the laminated plurality of core plates. Referring to fig. 4 and 5, fig. 4 shows a riveting mold of the present invention, which includes an upper mold pin 21, a lower mold pin 22, a lower mold base 23, and a lower mold dust hood base 24. The upper mold needle 21 can move up and down, the lower mold needle 22 is fixed on the lower mold base 23, the lower mold base 23 comprises a base main body 231 and a boss 232 protruding on the base main body 231, the lower mold needle 22 is protruded at the center of the upper surface of the boss 232, an annular lower mold knife edge surface 233 is correspondingly formed on the upper surface of the boss 232, a plurality of knife edge strips 2331 extending along the radial direction at equal intervals are formed on the lower mold knife edge surface 233, the knife edge strips 2331 are protruded micro wedge bodies and are used for cutting the peripheral wall of the lower end of the rivet into a plurality of strips when the rivet is punched, so that the bottom end of the rivet blooms to form a plurality of fixed connecting strips which are bent and fixed on. The lower mold dust hood base 24 is fixedly arranged on the base body 231 and surrounds the boss 232 for supporting the plurality of laminated core plates, and the upper surface of the lower mold dust hood base 24 is slightly higher than the upper surface of the boss 232 to reserve an extension space for the fixed connecting strip after the bottom end of the rivet blooms. During punching, a plurality of core plates 25 are provided, the core plates 25 are stacked, the rivet holes 12 in the core plates 25 are aligned and supported on the lower die dust collection cover seat 24, and the lower die pins 22 penetrate through the rivet holes 12 in the core plates 25; providing a rivet 26, wherein the lower end of the rivet 26 is of a hollow sleeve structure, the lower end of the rivet 26 is sleeved on the lower mold needle 22, then the upper mold 21 performs downward stamping, the nut surface of the rivet 26 is fixed on the top surface of the topmost core board, and the bottom end of the rivet 26 blooms to form a plurality of fixed connection strips which are bent and fixed on the bottom surface of the bottommost core board. The rivets 24 are riveted to the laminated core plates 25, and the core plates 25 are connected to form an integral back plate.
However, in the conventional riveting die, since the lower die dust hood 24 is a fixed part and is fixed at a distance relatively higher than the upper surface of the boss 232 during punching, the upper die pin 21 impacts the rivet head surface under cylinder pressure during riveting, and since the lower die dust hood 24 is fixed, when the rivet 26 drives the laminated sub-core plate 25 to press down, the lower die dust hood 24 gives a strong reaction force to the sub-core plate 25, and the reaction force and the pressure of the upper die pin 21 cylinder together cause the sub-core plate 25 to be crushed and damaged, and finally the rivet fixing action fails, and simultaneously affects the action force of the rivet and the lower die knife edge surface 233, resulting in uneven rivet blooming.
Fig. 5 shows an improved riveting die provided by the invention, wherein the lower die dust hood 24 is removed and replaced by a lower die gasket 27 with elasticity, and the lower die gasket 27 is padded on the lower die cutting edge surface 233. In this embodiment, two lower mold washers 27 are preferably selected, and are made of rubber, one of which is sleeved on the periphery of the boss 232 and is padded on the base main body 231 to protect the boss 232, and the other is sleeved on the periphery of the lower mold needle 22 and is padded on the lower mold edge surface 233. When the upper die 21 is punched downwards, the rubber has good compression performance, so that the sub-core plate is not damaged by pressure, meanwhile, the lower die gasket 27 cannot block the bottom end of the rivet 26 by extending a plurality of fixed connection strips in a flowering mode, the fixed connection strips can be bent and extend to the bottom surface of the lowermost sub-core plate, the nail cap cannot fall off, and meanwhile, the rivet is stable and controllable in flowering. The pressing stability is further improved, and the pressing time can be prolonged to 1.5-2.0 seconds in the stamping process.
4) Target holes 13 are drilled at target pattern locations by grabbing the target pattern 11 with radiation using an x-ray target drill. Specifically, the back plate obtained after lamination riveting is fixed on an x-ray target drilling machine, the target is grabbed by using x-ray, the center of the target pattern 11 is calculated by adopting a surface compensation mode, and then x-ray target holes 13 (refer to fig. 6) of the plate edge are correspondingly drilled at the position of the target pattern, wherein the target holes 13 penetrate through the back plate.
5) And drilling the functional holes of the back plate by taking the drilled target holes 13 as targets of a CCD (charge coupled device) drilling machine and performing front-back equal-size counter drilling in a conductive depth control mode through the CCD drilling machine. Specifically, the back plate after the target holes 13 are drilled is placed and fixed on a CCD drilling machine, a camera of the CCD drilling machine scans the positions of the target holes 13 (any three target holes 13 can be used) to serve as reference points, and then the back plate is measured, calculated and moved to the positions of the back plate where the holes need to be drilled according to the reference points, so as to drill the required functional holes on the back plate. Considering that the back plate is too thick, the cutting edge of the drill bit is possibly not long enough, the deeper the drill bit drills, the larger the stress is, the cutting edge of the drill bit is possibly damaged, and the front side and the back side of the drill bit are drilled in an equal size by adopting a conductive depth control mode during drilling. Referring to fig. 7 and 8, a target hole 13 is used as a target of a CCD drilling machine, a conductive depth-control blind drill is firstly used on the front surface 31 of a back plate to ensure that the plate thickness is 55-60% of the depth of a single-side drill, then a drill is withdrawn, the back plate is turned over and placed on the CCD drilling machine, the same X-RAY target hole 13 is used as the target of the CCD drilling machine to perform conductive depth-control drilling on the back surface 32 of the back plate, the drill is 55-60% of the plate thickness, the front surface and the back surface are drilled in pairs, and the depth of the two drill surfaces is overlapped by 5-10%. In this way, the back plate is drilled with functional holes 33. By adopting the CCD drilling machine to drill holes on the front side and the back side in an equal-size mode by conducting electric control depth, the contact ratio of the centers of holes on the two sides of the drilled holes can be ensured, the edge length of a drill bit can be reduced, a drill bit with a common edge length can be used for drilling thick plates with the thickness of 8mm-10mm, the length of the drill bit is short, the rigidity is high, the risk of cutter breakage can be reduced, and the drilling precision is controlled within 3 mils.
6) And electroplating the drilled functional holes and performing subsequent processes.
In summary, the processing method of the back plate of the invention can reinforce the fixing effect of the rivet by designing a plurality of sets of rivet holes for riveting, each set of rivet holes comprises at least three rivet holes which are linearly arranged, and the rejection of the back plate caused by poor alignment caused by poor riveting of a single rivet is prevented. During riveting, a brand new riveting die is adopted, a lower die dust absorption cover seat is omitted, and a lower die needle is sleeved with a gasket, so that the problems that the rivet in the riveting of the back plate with the plate thickness larger than 7mm is uniform in flowering, good in flowering stability and free of damage to a core plate, and the rivet falls off are solved; in addition, the CBD conductive depth control and the CCD drilling mode are adopted for double-side equal-size drilling, compared with the traditional mode that functional holes are machined through a common drill after a back plate is fixed through pins, the precision of the hole positions of the tool face entering and exiting is guaranteed, and meanwhile the requirements of compression joint and back drilling are met within 3 mil; by adopting the steps and the flow to process the back plate, the alignment degree of the high-multilayer large-size thick back plate can be controlled within 7 mil.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A backboard processing method is characterized by comprising the following steps: the processing method comprises the following steps of,
1) processing a plurality of sets of rivet holes and a plurality of target patterns on the sub-core plate, wherein each set of rivet holes comprises at least three rivet holes which are linearly arranged;
2) browning the coreboard;
3) laminating and riveting a plurality of sub-core plates to form a back plate, wherein each set of rivet holes is riveted with at least two rivet holes;
4) grabbing a target pattern on the back plate by using a target drilling machine, and drilling a target hole at the position of the target pattern;
5) and (3) using a CCD (charge coupled device) drilling machine, taking any three drilled target holes as targets to form a plane coordinate system, measuring, calculating and moving to the position of the back plate where the functional holes need to be drilled according to the any three target holes as reference points, and drilling the functional holes of the back plate on the front surface and the back surface in an equal-size manner by adopting a conductive control depth mode.
2. The method of processing a back sheet according to claim 1, wherein: in the step 1), the sub-core plates are rectangular plates, and 4 target patterns 11 are designed when the size of the plate surface is less than 36 inches and are uniformly distributed at the four plate corner positions and 10-20 mm away from the plate edges; when the size of the plate surface is larger than 36 inches, 6 plates are designed, and two plates are added to the plate surface on the basis of 4 plate corners.
3. The method of processing a back sheet according to claim 1, wherein: in the step 1), each set of rivet holes is selected to be three rivet holes, including a conventional rivet hole and reinforced rivet holes with the distance between the two sides of the conventional rivet hole and the conventional rivet hole being 10-30 mm.
4. The method of processing a back sheet according to claim 1, wherein: in the step 4), the target holes penetrate through the front side and the back side of the back plate.
5. The method of processing a back sheet according to claim 1, wherein: in the step 5), target holes are selected on the front surface of the back plate to serve as targets of the CCD drilling machine, conductive depth control blind drilling is conducted, the thickness of the plate with the depth being 55% -60% is drilled on one side, then the back plate is turned over, the same target holes serve as targets of the CCD drilling machine, conductive depth control drilling is conducted on the back surface of the back plate, and the thickness of the plate with the depth being 55% -60% is drilled.
6. A backsheet produced by the backsheet processing method of any one of claims 1 to 5.
7. A mold for caulking used in the back plate processing method of any one of claims 1 to 5, comprising an upper mold pin (21), a lower mold pin (22), and a lower mold base (23), the upper mold pin (21) being movable up and down, the lower mold pin (22) being fixed to the lower mold base (23), characterized in that: the lower die base (23) comprises a base main body (231) and a boss (232) protruding out of the base main body (231), the center of the upper surface of the boss (232) is provided with the lower die needle (22) in a protruding mode, an annular lower die cutting edge surface (233) is correspondingly formed on the upper surface of the boss (232), the lower die cutting edge surface (233) is provided with a plurality of blade strips (2331) extending in the radial direction at equal intervals in a protruding mode, the die for riveting further comprises an elastic lower die gasket (27), the lower die gasket (27) is arranged on the lower die cutting edge surface (233) in a cushioning mode, the number of the lower die gaskets (27) is two, one of the lower die gaskets is sleeved on the periphery of the boss (232) in a cushioning mode and is arranged on the base main body (231), and the other lower die gasket is sleeved on the periphery of the lower die needle (22) in a cushioning mode and is arranged on the.
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| CN110788927B (en) * | 2019-11-13 | 2021-12-28 | 莆田市涵江区依吨多层电路有限公司 | Hole opening method for printed circuit board thickness core combined product of 5G high-end server |
| CN114423161A (en) * | 2021-12-27 | 2022-04-29 | 生益电子股份有限公司 | PCB processing method and PCB |
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| CN106332473A (en) | 2017-01-11 |
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Address after: 523127, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Patentee after: SHENGYI ELECTRONICS Co.,Ltd. Address before: 523127, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Patentee before: DONGGUAN SHENGYI ELECTRONICS Ltd. |
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