CN216491190U - Inlaid copper plate - Google Patents
Inlaid copper plate Download PDFInfo
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- CN216491190U CN216491190U CN202122640011.4U CN202122640011U CN216491190U CN 216491190 U CN216491190 U CN 216491190U CN 202122640011 U CN202122640011 U CN 202122640011U CN 216491190 U CN216491190 U CN 216491190U
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- copper foil
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Abstract
The utility model discloses an embedded copper plate, which comprises a plurality of glass fiber plate layers which are sequentially laminated, wherein each glass fiber plate layer is provided with an embedded hole, a copper sheet is embedded in each embedded hole, an insulating adhesive layer is arranged between the adjacent glass fiber plate layers, circuit copper foil layers are respectively arranged above the glass fiber plate layer at the top end and below the glass fiber plate layer at the bottom end, an opening matched with the copper sheet is arranged on each circuit copper foil layer, a plurality of riveting holes penetrating through the circuit copper foil layers, the glass fiber plate layers and the insulating adhesive layers are arranged between the two circuit copper foil layers, and the riveting holes are arranged outside the copper sheets.
Description
Technical Field
The utility model relates to a circuit board, in particular to an inlaid copper plate.
Background
In new energy, high-frequency circuits, areas with large high and low temperature changes, precision communication equipment and architectural decoration, multiple layers of inlaid copper plates are generally needed to meet the requirement of cooling, so that a plurality of inlaid copper plates need to be overlapped, and if the inlaid copper plates are only overlapped by using glue in a compounding way, the phenomenon of offset of the inlaid copper plates is easily generated, so that the precision of the finished circuit board is reduced, and the requirement cannot be met.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides an inlaid copper plate.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
the utility model provides an inlay copper, is including a plurality of fine sheet layers of glass that stack gradually, every fine sheet layer of glass is last to have seted up and to inlay the hole, it has the copper sheet to inlay on the hole, and is adjacent be provided with insulating glue film between the fine sheet layer of glass, be located the top fine sheet layer of glass's top and the below of the fine sheet layer of glass that is located the bottom are provided with circuit copper foil layer respectively, be provided with on the circuit copper foil layer with the opening that the copper sheet matches is two-layer seted up between the circuit copper foil layer and run through a plurality of riveting holes of circuit copper foil layer, fine sheet layer of glass and insulating glue film, the riveting hole sets up outside the copper sheet.
The upper surface of the copper sheet after being embedded is flush with the upper surface of the glass fiber board layer.
The number of the glass fiber board layers and the number of the copper sheets are at least 2.
The number of the riveting holes is at least 3.
Every layer the circuit copper foil layer, every layer the fine laminated layer of glass and every layer the outward flange of insulating glue layer flushes.
The insulating glue layer is a PP glue layer.
The utility model has the beneficial effects that: according to the utility model, the insulating glue layers are arranged among the glass fiber plate layers for pressing, then the through riveting holes are arranged among the glass fiber plate layers, and then the rivets are used for riveting the glass fiber plate layers, so that the glass fiber plate layers can be effectively prevented from deviating, and the precision of the finished product of the multi-layer embedded copper plate is ensured.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" or "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1, an inlay copper, including a plurality of glass fiber sheet layer 1 that stack gradually, every have seted up on the glass fiber sheet layer 1 and have inlayed hole 2, it has copper sheet 3 to inlay on the hole 2, and is adjacent be provided with insulating glue film 4 between the glass fiber sheet layer 1, be located the top of glass fiber sheet layer 1 and the below of the glass fiber sheet layer 1 that is located the bottom are provided with circuit copper foil layer 5 respectively, be provided with on the circuit copper foil layer 5 with opening 6 that copper sheet 3 matches is two-layer seted up between the circuit copper foil layer 5 and run through a plurality of riveting holes 7 of circuit copper foil layer 5, glass fiber sheet layer 1 and insulating glue film 4, riveting hole 7 sets up outside copper sheet 3.
This embodiment sets up 4 pressfittings of insulating glue layer between each layer glass fiber plate layer 1, then sets up the riveting hole that link up between each layer, then uses the rivet to carry out the riveting to each layer, can effectively prevent to take place the skew between each glass fiber plate layer 1, guarantees the precision that the copper was inlayed to finished product multilayer.
The upper surface of copper sheet 3 after inlaying is level with the upper surface of glass fiber board layer 1.
The number of the glass fiber board layers 1 and the number of the copper sheets 3 are at least 2.
The number of the riveting holes 7 is at least 3, and the number of the riveting holes can be determined according to the size of the glass fiber plate layer 1.
Every circuit copper foil layer 5, every layer glass fiber plate layer 1 and every layer the outward flange of insulating glue layer 4 flushes.
The insulating glue layer 4 is a PP glue layer, and 180 ℃ high-temperature pressing is adopted between each glass fiber plate layer 1 and the insulating glue layer 4.
The above embodiments do not limit the scope of the present invention, and those skilled in the art can make equivalent modifications and variations without departing from the overall concept of the present invention.
Claims (6)
1. The utility model provides an inlay copper, its characterized in that is including a plurality of glass fiber sheet layer (1) that stack gradually, every seted up on the glass fiber sheet layer (1) and inlayed hole (2), it has copper sheet (3) to inlay on hole (2), and is adjacent be provided with insulating glue film (4) between the glass fiber sheet layer (1), be located the top of glass fiber sheet layer (1) and the below that is located the glass fiber sheet layer (1) of bottom are provided with circuit copper foil layer (5) respectively, be provided with on circuit copper foil layer (5) with opening (6) that copper sheet (3) match are two-layer seted up between circuit copper foil layer (5) and run through a plurality of riveting hole (7) of circuit copper foil layer (5), glass fiber sheet layer (1) and insulating glue film (4), riveting hole (7) set up outside copper sheet (3).
2. The inlaid copper plate according to claim 1, wherein the upper surface of the copper sheet (3) after inlaying is flush with the upper surface of the glass fiber board layer (1).
3. Inlaid copper board according to claim 1, characterized in that the number of said layers of fiberglass board and copper sheets (3) is at least 2 each.
4. Inlaid copper plate according to claim 1, characterized in that the number of said riveting holes (7) is at least 3.
5. Inlaid copper board according to claim 1, characterized in that the outer edges of each of said circuit copper foil layers (5), each of said glass fiber board layers (1) and each of said insulating glue layers (4) are flush.
6. Inlaid copper plate according to claim 1, characterised in that said insulating glue layer (4) is a PP glue layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122640011.4U CN216491190U (en) | 2021-10-29 | 2021-10-29 | Inlaid copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122640011.4U CN216491190U (en) | 2021-10-29 | 2021-10-29 | Inlaid copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216491190U true CN216491190U (en) | 2022-05-10 |
Family
ID=81445467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122640011.4U Active CN216491190U (en) | 2021-10-29 | 2021-10-29 | Inlaid copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216491190U (en) |
-
2021
- 2021-10-29 CN CN202122640011.4U patent/CN216491190U/en active Active
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