CN108282969B - A kind of PCB production method and PCB for realizing internal layer connection - Google Patents
A kind of PCB production method and PCB for realizing internal layer connection Download PDFInfo
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- CN108282969B CN108282969B CN201810253874.6A CN201810253874A CN108282969B CN 108282969 B CN108282969 B CN 108282969B CN 201810253874 A CN201810253874 A CN 201810253874A CN 108282969 B CN108282969 B CN 108282969B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
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- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to PCB technical fields, disclose a kind of PCB production method and PCB for realizing internal layer connection.The production method includes: that the first daughter board with odd-level metallic circuit and with the second core plate uniform thickness is made by the pressing of the first core plate, prepreg and copper foil after completing inner line figure production；Accommodation groove is opened up on the first daughter board, the second core plate is embedded in accommodation groove；For being intended to be stacked in the prepreg of second core plate top surface and/or bottom surface, conductive layer is set in local location on the surface adjacent with the second core plate of the prepreg；Local location corresponds to the binding site between the second core plate internal layer circuit corresponding to the first daughter board；It is pressed after the first daughter board for being embedded with the second core plate is stacked with other plates and each prepreg according to preset order.The junction of first core plate of different materials and the internal layer circuit of the second core plate is connected to by the present invention using the conductive layer added on prepreg, can effectively ensure that the quality of PCB.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed wiring board) technical fields, more particularly to one kind
Realize the PCB production method and PCB of internal layer connection.
Background technique
Electric signal is generally divided into multiple grades in a system, i.e., different grades of signal (packet is walked in same system
Containing normal signal, high-frequency signal, high speed signal etc.), partial hybrid high-frequency high-speed PCB manufacturing technology can not only meet high frequency height
Fast signal transmits and cost is greatly reduced in low-loss situation, moreover it is possible to improve reliability to a certain extent, and have various combination
Mode, become the perfect solution of different brackets signal hierarchical transmission.But traditional partial hybrid technique is due to its manufacture
The limitation of technique can not achieve the conducting of the internal layer circuit between different materials core plate.Thus, it is necessary to it is directed to different materials core plate
Internal layer circuit conducting demand when combination provides a kind of effective solution scheme.
Summary of the invention
The purpose of the present invention is to provide a kind of PCB production methods and PCB for realizing internal layer connection, solve different materials core
Internal layer circuit conduction problem between plate.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of PCB production method for realizing internal layer connection, the PCB include the first core plate being made from a different material and the
Two core plates, and the thickness of second core plate is greater than the thickness of the first core plate；The PCB production method includes:
After completing each inner line figure production, it is made of the pressing of the first core plate, prepreg and copper foil with odd number
Layer metallic circuit and the first daughter board with the second core plate uniform thickness；
Predeterminated position on first daughter board opens up accommodation groove, and second core plate is embedded in the accommodation groove；
For being intended to be stacked in the prepreg of second core plate top surface and/or bottom surface, in the prepreg with it is described
Conductive layer is arranged in local location on the adjacent surface of second core plate；The local location corresponds to second core plate and the first son
Binding site between the corresponding internal layer circuit of plate；
It is pressed after the first daughter board for being embedded with the second core plate is stacked with other plates and each prepreg according to preset order.
Optionally, the conductive layer is conducting resinl, is pasted on described to be stacked in the half of the second core plate top surface and/or bottom surface
In cured sheets.
Optionally, the conductive layer is conductive paste, is printed in described to be stacked in the half of the second core plate top surface and/or bottom surface
In cured sheets.
Optionally, suitable according to presetting in first daughter board and other plates and each prepreg that will be embedded with the second core plate
In the step of sequence presses after stacking, the stacked position of first daughter board for being embedded with the second core plate is internal layer or outer layer.
Optionally, in the PCB production method, if the stacked position of first daughter board for being embedded with the second core plate is most
Then conductive layer is arranged on the prepreg for being intended to be stacked in the second core plate bottom surface in top layer；
If the stacked position of first daughter board for being embedded with the second core plate is the bottom, it is being intended to be stacked in the second core plate
Conductive layer is set on the prepreg of top surface；
If the stacked position of first daughter board for being embedded with the second core plate is internal layer, it is being intended to be stacked in the second core plate top
Conductive layer is respectively set on the prepreg of face and bottom surface.
Optionally, it is folded with other plates and each prepreg according to preset order in the first daughter board that will be embedded with the second core plate
Before putting, the second daughter board being made with the first daughter board uniform thickness and same tier structure is further comprised the steps of:；
It is described the first daughter board for being embedded with the second core plate and other plates and each prepreg are stacked according to preset order after
The step of pressing includes: first to fold first daughter board, the second daughter board, other core plates and each prepreg according to preset order
It puts, and the stacked position of the first daughter board and the second daughter board is in symmetrical above and below；It is pressed again.
Optionally, it is folded with other plates and each prepreg according to preset order in the first daughter board that will be embedded with the second core plate
Before putting, the second daughter board being made with the first daughter board uniform thickness and same tier structure is further comprised the steps of:, and described second
Second core plate is embedded in daughter board；
It is described the first daughter board for being embedded with the second core plate and other plates and each prepreg are stacked according to preset order after
The step of pressing includes: first to fold first daughter board, the second daughter board, other core plates and each prepreg according to preset order
It puts, and the stacked position of the first daughter board and the second daughter board is in symmetrical above and below；It is pressed again.
Optionally, the quantity for the first core plate that first daughter board is included is at least one.
Optionally, the PCB production method further include: in the first daughter board and other plates that will be embedded with the second core plate and respectively
It after prepreg pressing, is drilled and is electroplated, make outer-layer circuit figure.
A kind of PCB, the PCB are made according to any production method as above.
Compared with prior art, the invention has the benefit that
In the embodiment of the present invention, the first core plate and prepreg and copper foil pressing are first made to the with the second core plate uniform thickness
One daughter board, and conductive layer is added on the prepreg for being intended to be stacked in the second core plate top surface and/or bottom surface, it then will embed second
First daughter board of core plate is pressed with other plates, utilizes conductive layer by the first core plate and the second core of different materials after pressing
The junction of the internal layer circuit of plate is connected to, and can effectively ensure that the quality of PCB.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the PCB production method flow chart that the embodiment of the present invention one provides；
Fig. 2 is the topology view made of the pressing of the first core plate, prepreg and copper foil as the daughter board of top plate；
Fig. 3 is the topology view made of the pressing of the first core plate, prepreg and copper foil as the daughter board of bottom plate；
Fig. 4 is the topology view made of the pressing of the first core plate, prepreg and copper foil as the daughter board of inner plating；
Fig. 5 is the topology view of daughter board shown in Fig. 2 after grooving；
Fig. 6 is the topology view of daughter board shown in Fig. 3 after grooving；
Fig. 7 is the topology view of daughter board shown in Fig. 4 after grooving；
Fig. 8 is topology view of second core plate before and after being cut into junior unit；
Fig. 9 is topology view of the prepreg before and after its regional area adds conductive layer；
Figure 10 is the topology view after daughter board shown in fig. 5 is stacked with other core plates and prepreg according to preset order；
Figure 11 is topology view of the stacked configuration shown in Fig. 10 after pressing；
Figure 12 is topology view of the pressing structure shown in Figure 11 after drilling plating；
Figure 13 is PCB production method flow chart provided by Embodiment 2 of the present invention；
Figure 14 is to be folded by daughter board shown in fig. 5, daughter board shown in Fig. 3 and other core plates and prepreg according to preset order
Topology view after putting；
Figure 15 is topology view of the stacked configuration after pressing shown in Figure 14；
Figure 16 is topology view of the pressing structure shown in figure 15 after drilling plating；
Figure 17 is after being stacked by two daughter boards and other core plates and prepreg for embedding the second core plate according to preset order
Topology view；
Figure 18 is topology view of the stacked configuration after pressing shown in Figure 17；
Figure 19 is topology view of the pressing structure shown in Figure 18 after drilling plating.
It illustrates: the first core plate 1, the second core plate 2, the prepreg 3 for being stacked in the second core plate top/bottom, conduction
Layer 4.
Specific embodiment
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
Those of ordinary skill's all other embodiment obtained without making creative work, belongs to protection of the present invention
Range.
Embodiment one
Referring to Fig. 1, present embodiments providing a kind of PCB production method for realizing internal layer connection, which includes the first core
The material of plate 1 and the second core plate 2, the first core plate 1 and the second core plate 2 is different, and the thickness of the second core plate 2 is greater than the first core plate 1
Thickness；Specific production method comprising steps of
Step 101, according to normal process, after completing inner line figure production, by the first core plate 1 and prepreg and
The first daughter board with odd-level metallic circuit and with 2 uniform thickness of the second core plate is made in copper foil pressing.
When the quantity of first core plate 1 is one, successively stacked according to the sequence of the first core plate 1, prepreg and copper foil；The
The quantity of one core plate 1 be two when, according to the first core plate 1, prepreg, the first core plate 1, prepreg and copper foil sequence according to
It is secondary to stack.The thickness of first daughter board is equal to the thickness of the second core plate 2, will be used to embed the second core plate 2 in subsequent handling.
In subsequent lamination process, according to application demand, the first daughter board can be located at outer layer, can also be located at internal layer, tool
Body does not limit.Shown in please see Fig. 2 to Fig. 4, Fig. 2 shows first made of the pressing of the first core plate 1, prepreg and copper foil
Daughter board, first daughter board will will be used as top plate in subsequent lamination process, and bottom surface production has internal layer circuit；Fig. 3 is shown
The first daughter board made of the pressing of the first core plate 1, prepreg and copper foil, first daughter board will will be made in subsequent lamination process
For bottom plate, top surface production has internal layer circuit；Fig. 4 is shown the made of the pressing of the first core plate 1, prepreg and copper foil
One daughter board, first daughter board will will be used as inner plating in subsequent lamination process, and two sides, which makes, internal layer circuit.
Step 102, predeterminated position opens up accommodation groove on the first daughter board.
It please refers to shown in Fig. 5 to Fig. 7, the first daughter board shown in Fig. 2 is after opening up accommodation groove as shown in figure 5, shown in Fig. 3
First daughter board is after opening up accommodation groove as shown in fig. 6, the first daughter board shown in Fig. 4 is as shown in Figure 7 after opening up accommodation groove.
Step 103 is cut into junior unit after second core plate 2 is completed inner line figure production, as shown in Figure 8.
The size of the accommodation groove opened up on the second core plate 2 and the first daughter board after being cut into junior unit matches.
Step 104, for being intended to be stacked in the prepreg 3 of 2 top surface of the second core plate and/or bottom surface, in the prepreg 3
A conductive layer 4 is arranged in local location on the surface adjacent with the second core plate 2, as shown in Figure 9；Local location therein, corresponds to
Binding site between second core plate 2 internal layer circuit corresponding to the first daughter board.
In this step, conductive layer 4 will be for realizing the connection of the first daughter board and the corresponding internal layer circuit of the second core plate 2.It should
Conductive layer 4 can be conducting resinl, be pasted on the regional area on 3 surface of prepreg；It may be conductive paste, be printed in semi-solid preparation
The localized area on 3 surface of piece.
In subsequent lamination process, if the second core plate 2 is the outer layer core plate positioned at top, only it is being intended to be stacked in
Conductive layer 4 is set on the prepreg 3 of second core plate, 2 bottom surface；If the second core plate 2 is the outer layer core plate positioned at the bottom,
Conductive layer 4 is then only set on the prepreg 3 for being intended to be stacked in 2 top surface of the second core plate；If the second core plate 2 is internal layer core
Then conductive layer 4 need to be respectively set on two prepregs 3 for being intended to be stacked in 2 bottom surface of the second core plate and top surface in plate.
Step 105, after the accommodation groove that the second core plate 2 is embedded in the first daughter board, will embedded second core plate 2 the first daughter board
It is stacked with other core plates and prepreg according to the preset sequence that stacks.
By taking the first daughter board shown in fig. 5 as an example, first daughter board and other core plates and prepreg stack after structure such as
Shown in Figure 10.
Step 106 carries out stitching operation.
Laminate structure shown in Fig. 10 is as shown in figure 11 after pressing working procedure.After stitching operation, conductive layer 4 is by the second core
The internal layer circuit of plate 2 is connected to the internal layer circuit of the first daughter board.Simultaneously as do not carry out curing process before pressing, it is conductive
Layer 4 has certain mobility, thus conductive layer 4 can partially flow into the surrounding of the second core plate 2 and the first daughter board after pressing
In gap, being reliably connected for the two internal layer circuit is realized.
Step 107 carries out drilling and the plating of heavy copper, carries out other routine operations after production outer-layer circuit figure.Figure 11
Shown in pressing structure drilling plating after as shown in figure 12.
It is apparent that in above-mentioned process, the cutting action and semi-solid preparation of the production process of the first daughter board, the second core plate 2
The setting process of conductive layer 4, does not limit sequencing on piece 3, can be adjusted flexibly.
So far, in the present embodiment, the first core plate 1 is different from 2 thickness of the second core plate, before pressing first by the first core plate 1 with
Prepreg and copper foil pressing are made the first daughter board with 2 uniform thickness of the second core plate, and be intended to be stacked in 2 top surface of the second core plate and/
Or conductive layer 4 is added on the prepreg 3 of bottom surface, then the first daughter board of embedded second core plate 2 is pressed with other core plates
It closes, is connected to the first core plate 1 of different materials with the junction of the internal layer circuit of the second core plate 2 using conductive layer 4 after pressing,
The quality of PCB has been effectively ensured.
Embodiment two
On the basis of example 1, the present embodiment two provides another PCB production method for realizing internal layer connection, should
PCB includes the first core plate 1 and the second core plate 2 being made from a different material, and the thickness of the second core plate 2 is greater than the first core plate 1
Thickness；Please refer to Figure 13, specific production method comprising steps of
Step 201, according to normal process, after completing inner line figure production, by the first core plate 1 and prepreg and
Copper foil pressing be made with odd-level metallic circuit and with the first daughter board and the second daughter board of 2 uniform thickness of the second core plate, the first daughter board
With the second daughter board laminated construction having the same.
In subsequent lamination process, the default stacked position of the first daughter board and the second daughter board is in symmetrical above and below, so that
Manufactured final products are able to maintain good flatness after the processes such as pressing.Specifically, the first daughter board is as top plate
When (as shown in Figure 2), the second daughter board will be used as bottom plate (as shown in Figure 3)；(such as Fig. 4 institute when first daughter board is as inner plating
Show), the second daughter board will also be used as inner plating (as shown in Figure 4).The thickness of first daughter board and the second daughter board need to be consistent, but interior
Sandwich circuit figure can make according to design requirement, may be the same or different.
Step 202, predeterminated position opens up accommodation groove on the first daughter board.
In this step, the accommodation groove opened up on the first daughter board will be used to accommodate the second core plate 2.At this point, on the second daughter board not
Fluting.
Step 203 is cut into junior unit after second core plate 2 is completed inner line figure production, as shown in Figure 8.
Step 204, for being intended to be stacked in the prepreg 3 of 2 top surface of the second core plate and/or bottom surface, in the prepreg 3
A conductive layer 4 is arranged in local location on the surface adjacent with the second core plate 2, as shown in Figure 9；Local location therein, corresponds to
Binding site between second core plate 2 internal layer circuit corresponding to the first daughter board.
Step 205, the second core plate 2 be embedded in the first daughter board accommodation groove after, by the first daughter board, the second daughter board, other
Core plate and prepreg are stacked according to preset order, and the stacked position of the first daughter board and the second daughter board is in symmetrical above and below.
For being the second daughter board as the first daughter board, daughter board shown in Fig. 3 using the daughter board shown in fig. 5 after slotting, this
When the first daughter board, the second daughter board, other core plates and prepreg stack after structure can be as shown at 14.
Step 206 carries out stitching operation.
Laminate structure shown in Figure 14 is as shown in figure 15 after pressing working procedure.After stitching operation, conductive layer 4 is by the second core
The internal layer circuit of plate 2 is connected to the internal layer circuit of the first daughter board.Simultaneously as do not carry out curing process before pressing, it is conductive
Layer 4 has certain mobility, thus conductive layer 4 can partially flow into the surrounding of the second core plate 2 and the first daughter board after pressing
In gap, being reliably connected for the two internal layer circuit is realized.
Step 207 carries out drilling and the plating of heavy copper, carries out other routine operations after production outer-layer circuit figure.Figure 15
Shown in pressing structure drilling plating after as shown in figure 16.
It is apparent that in above-mentioned process, the production process of the first daughter board, the production process of the first daughter board, the second core plate 2
The setting process of conductive layer 4, does not limit sequencing on cutting action and prepreg 3, can be adjusted flexibly.
To sum up, in the present embodiment, the first daughter board and the second daughter board of two same thickness are first made, and the first daughter board is embedded
There is the second core plate 2 of same thickness, and is added on the prepreg 3 for being intended to be stacked in 2 top surface of the second core plate and/or bottom surface
Then conductive layer 4 presses the first daughter board, the second daughter board and other core plates, utilize conductive layer 4 by different materials after pressing
First core plate 1 of material is connected to the junction of the internal layer circuit of the second core plate 2, and the quality of PCB has been effectively ensured；Simultaneously as
First daughter board and the second daughter board are same thickness, and stacked position is in symmetrical above and below, thus can keep good after pressing and drilling
Good flatness.
In other embodiments, before pressing, it can also slot simultaneously to the second daughter board, the is embedded in the second daughter board
Two core plates 2, then two daughter boards for being embedded with the second core plate 2 and other core plates and prepreg are stacked into (as shown in figure 17), pressure
Close (as shown in figure 18), drilling plating (as shown in figure 19) and other routine operations.
Embodiment three
The present embodiment three provides a kind of PCB comprising material different the first core plate 1 and the second core plate 2, application implementation
The method of example one or embodiment two is made.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of PCB production method for realizing internal layer connection, the PCB includes the first core plate and second being made from a different material
Core plate, and the thickness of second core plate is greater than the thickness of the first core plate；It is characterized in that, the PCB production method includes:
After completing each inner line figure production, it is made of the pressing of the first core plate, prepreg and copper foil with odd-level gold
Belong to route and the first daughter board with the second core plate uniform thickness；
Predeterminated position on first daughter board opens up accommodation groove, and second core plate is embedded in the accommodation groove；
For being intended to be stacked in the prepreg of second core plate top surface and/or bottom surface, in the prepreg and described second
Conductive layer is arranged in local location on the adjacent surface of core plate；The local location corresponds to second core plate and the first daughter board
Binding site between corresponding internal layer circuit；
It presses, presses after the first daughter board for being embedded with the second core plate is stacked with other plates and each prepreg according to preset order
Afterwards the conductive layer can part flow into the surrounding gap of the second core plate and the first daughter board, the second core plate of realization and the first daughter board
Internal layer circuit connection.
2. the PCB production method according to claim 1 for realizing internal layer connection, which is characterized in that the conductive layer is to lead
Electric glue is pasted on the prepreg to be stacked in the second core plate top surface and/or bottom surface.
3. the PCB production method according to claim 1 for realizing internal layer connection, which is characterized in that the conductive layer is to lead
Plasma-based is printed on the prepreg to be stacked in the second core plate top surface and/or bottom surface.
4. the PCB production method according to claim 1 for realizing internal layer connection, which is characterized in that will be embedded with described
It is described embedded in the step of the first daughter board and other plates of second core plate and each prepreg press after stacking according to preset order
The stacked position for having the first daughter board of the second core plate is internal layer or outer layer.
5. the PCB production method according to claim 4 for realizing internal layer connection, which is characterized in that the PCB production method
In, if the stacked position of first daughter board for being embedded with the second core plate is top, it is being intended to be stacked in the second core plate bottom surface
Prepreg on conductive layer is set；
If the stacked position of first daughter board for being embedded with the second core plate is the bottom, it is being intended to be stacked in the second core plate top surface
Prepreg on conductive layer is set；
If the stacked position of first daughter board for being embedded with the second core plate is internal layer, be intended to be stacked in the second core plate top surface and
Conductive layer is respectively set on the prepreg of bottom surface.
6. the PCB production method according to claim 1 for realizing internal layer connection, which is characterized in that second will be embedded with
Before first daughter board of core plate and other plates and each prepreg are stacked according to preset order, further comprise the steps of: be made with it is described
Second daughter board of the first daughter board uniform thickness and same tier structure；
It is described the first daughter board for being embedded with the second core plate is stacked with other plates and each prepreg according to preset order after press
The step of include: first first daughter board, the second daughter board, other core plates and each prepreg are stacked according to preset order, and
The stacked position of first daughter board and the second daughter board is in symmetrical above and below；It is pressed again.
7. the PCB production method according to claim 1 for realizing internal layer connection, which is characterized in that second will be embedded with
Before first daughter board of core plate and other plates and each prepreg are stacked according to preset order, further comprise the steps of: be made with it is described
Second daughter board of the first daughter board uniform thickness and same tier structure, and second core plate is embedded in second daughter board；
It is described the first daughter board for being embedded with the second core plate is stacked with other plates and each prepreg according to preset order after press
The step of include: first first daughter board, the second daughter board, other core plates and each prepreg are stacked according to preset order, and
The stacked position of first daughter board and the second daughter board is in symmetrical above and below；It is pressed again.
8. the PCB production method according to claim 1 for realizing internal layer connection, which is characterized in that the first daughter board institute
The quantity for the first core plate for including is at least one.
9. the PCB production method according to claim 1 for realizing internal layer connection, which is characterized in that the PCB production method
Further include: after the first daughter board and other plates that will be embedded with the second core plate and the pressing of each prepreg, carry out drilling and electricity
Plating makes outer-layer circuit figure.
10. a kind of PCB, which is characterized in that the PCB is made according to any production method of claim 1 to 9.
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| CN110412450B (en) * | 2019-08-28 | 2021-06-25 | 生益电子股份有限公司 | Connection detection method for heat dissipation medium and conductive medium and PCB |
| CN114585157A (en) * | 2020-12-01 | 2022-06-03 | 深南电路股份有限公司 | Capacitor-embedded circuit board and manufacturing method thereof |
| CN113257747A (en) * | 2021-05-14 | 2021-08-13 | 广州天极电子科技股份有限公司 | Substrate with different dielectric constants for thin film circuit and manufacturing method thereof |
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| CN103857187A (en) * | 2012-12-07 | 2014-06-11 | 深南电路有限公司 | Circuit board and surplus-glue processing method thereof |
| CN103327756A (en) * | 2013-06-03 | 2013-09-25 | 东莞生益电子有限公司 | Multilayer circuit board with partial mixed structure and manufacturing method thereof |
| CN106550538A (en) * | 2015-09-21 | 2017-03-29 | 深南电路股份有限公司 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
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