JP3741007B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to an improvement in a stacking process and a pressing process of a plurality of ceramic green sheets.
[0002]
[Prior art]
As a prior art interesting to the present invention, for example, there is one described in Japanese Patent Laid-Open No. 4-282812.
[0003]
In this prior art, when producing a raw laminate for a multilayer ceramic electronic component, a plurality of ceramic green sheets to be laminated are divided into a plurality of groups, and a plurality of ceramic green sheets are laminated for each group. A plurality of preliminary laminated blocks are produced by temporary pressing, and then a plurality of preliminary laminated blocks are laminated and finally pressed to obtain a final raw laminated body for a multilayer ceramic electronic component. ing.
[0004]
According to this prior art, in order to obtain a final raw laminated body, the positional accuracy in the lamination is improved as compared with the case of adopting a method of laminating and pressing all of the ceramic green sheets all at once. There is an advantage that the distortion of the conductor film formed on the ceramic green sheet can be reduced.
[0005]
Further, as similar to the above-described prior art, for example, in Japanese Patent Laid-Open No. 3-283595, a pre-laminated block is obtained by previously laminating and temporarily pressing a plurality of ceramic green sheets that are part of a raw laminate. It is described that a hole for providing a via-hole conductor or a through-hole conductor is provided so as to penetrate through the preliminary laminated block and the hole is filled with a conductive paste.
[0006]
According to the technique described in the above-mentioned JP-A-3-283595, for a part of the raw laminate, a hole is formed for each ceramic green sheet, and the hole is filled with a conductive paste, Thereafter, since it is not necessary to go through a process of laminating, the number of hole forming processes and conductive paste filling processes can be reduced, and in the case of the technique described in Japanese Patent Laid-Open No. 4-282812 described above. As in the case of, the positional accuracy in the multilayer is improved and the distortion can be reduced, so that the problem of misalignment in the multilayer can be reduced for each of the conductor film and the via-hole conductor or the through-hole conductor, and the via-hole conductor or the through-hole conductor. The problem of poor conduction can be reduced.
[0007]
[Problems to be solved by the invention]
In the above-described conventional technique, particularly the technique described in Japanese Patent Laid-Open No. 4-282812, a plurality of preliminary laminated blocks are manufactured, and temporary pressing is separately performed on each of the plurality of preliminary laminated blocks. At this time, in order to efficiently complete the temporary pressing of a plurality of preliminary laminated blocks, a plurality of dies for temporary pressing are prepared, and each preliminary laminated block is separately loaded into each mold and temporarily pressed. In order to improve efficiency, temporary pressing of these plurality of preliminary laminated blocks is performed at the same time.
[0008]
However, when the above-described method is employed, different press strains may be caused between the plurality of preliminary laminated blocks. As the cause, firstly, a difference in the arrangement state of the conductor film between the plurality of preliminary laminated blocks or a difference in the arrangement state of the via-hole conductor and / or the through-hole conductor can be considered. In many cases, so-called “skinning” of a mold or a press device is used.
[0009]
As described above, when different press strains occur between the plurality of preliminary laminated blocks, in the final raw laminated body obtained by laminating these, the conductor film or via-hole conductor and / or through-hole conductor There is a high possibility that misalignment and distortion occur in different modes. As a result, when the multilayer ceramic electronic component obtained from the raw multilayer body is a multilayer ceramic capacitor, the capacitance varies, or the multilayer ceramic substrate is provided with via-hole conductors or through-hole conductors. May cause poor conduction in via-hole conductors or through-hole conductors.
[0010]
Therefore, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component that can solve the above-described problems.
[0011]
[Means for Solving the Problems]
The present invention relates to a green sheet production process for producing a plurality of ceramic green sheets, a conductor film formation process for forming a conductor film on a specific ceramic green sheet, and a raw lamination in which a plurality of ceramic green sheets are laminated. The present invention is directed to a method for manufacturing a multilayer ceramic electronic component, which includes a laminate manufacturing step for manufacturing a body and a firing step for firing a raw laminate.
[0012]
The laminate manufacturing process described above includes dividing a plurality of ceramic green sheets into a plurality of groups, laminating a plurality of ceramic green sheets for each group to prepare a plurality of preliminary lamination blocks, and a plurality of preliminary lamination blocks. A step of temporarily pressing in the stacking direction, a step of stacking a plurality of pre-pressed pre-laminated blocks to obtain a raw laminate, and a stacking direction of the raw laminate in a press condition that is equal to or higher than the press condition in the temporary press And a step of performing a final pressing.
[0013]
Then, in order to solve the technical problem described above, the present invention, in the step of temporarily pressing the preliminary laminated blocks, orients each preliminary laminated block in a plane direction that coincides with the plane direction taken in the raw laminate, and A plurality of pre-laminated blocks are simultaneously pre-pressed in the same mold as being stacked with an adhesion preventing sheet interposed therebetween.
[0014]
In the present invention, in the step of laminating the preliminary laminated blocks, when the adhesion preventing sheet is located between the preliminary laminated blocks, the adhesion preventing sheet is removed.
[0015]
Moreover, it is preferable that the process of temporarily pressing a preliminary | backup laminated block is implemented in the state which has arrange | positioned the sheet | seat for adhesion prevention on the both end surfaces in the lamination direction of each preliminary | backup laminated block.
[0016]
Further, in the step of temporarily pressing the preliminary laminated blocks, the plurality of preliminary laminated blocks are preferably stacked with a stacking order that matches the stacking order taken in the raw laminate.
[0017]
In addition, as the adhesion preventing sheet, a resin film that can be easily deformed is preferably used.
[0018]
When the present invention is applied to, for example, a method for manufacturing a multilayer ceramic substrate including a via-hole conductor and / or a through-hole conductor, a via hole is formed on a specific preliminary laminated block after the step of temporarily pressing the preliminary laminated block. It is preferable to further perform a step of forming a hole for providing a conductor or a through-hole conductor and a step of filling the hole with a conductive paste.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
1 to 4 are cross-sectional views sequentially showing typical steps included in a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention. Here, a manufacturing method of a multilayer ceramic capacitor having a through conductor, that is, a via-hole conductor and a through-hole conductor as described in Japanese Patent Application Laid-Open No. 2001-118746, which can reduce the equivalent series inductance is shown. .
[0020]
First, as shown in FIG. 1 (1), a plurality of ceramic green sheets 1 are produced. In producing the ceramic green sheet 1, as is well known, for example, a ceramic slurry is formed into a sheet by applying a doctor blade method on a carrier film made of polyethylene terephthalate or the like.
[0021]
Next, the conductor film 2 is formed on the specific ceramic green sheet 1 with a desired pattern. The conductor film 2 is formed by applying a conductive paste containing a conductive metal powder such as silver, copper or nickel onto the corresponding ceramic green sheet 1 by a screen printing method or the like.
[0022]
Next, as also shown in FIG. 1 (1), a plurality of ceramic green sheets 1 are divided into a plurality of groups, for example, two groups, and a plurality of ceramic green sheets 1 are laminated in each group. Preliminary laminated blocks 3 and 4 are produced.
[0023]
Next, as shown in FIG. 1 (2), adhesion preventing sheets 5, 6, 7 and 8 are prepared. The adhesion preventing sheets 5 to 8 prevent the preliminary laminated blocks 3 and 4 from adhering to each other and the preliminary laminated blocks 3 and 4 from adhering to a press die or the like in the subsequent processes. belongs to.
[0024]
The adhesion preventing sheets 5 to 8 are preferably composed of a resin film that can be easily deformed, and more preferably a surface that contacts at least the pre-laminated block 3 or 4 of the resin film in order to enhance the adhesion preventing function. A mold release agent is applied to the film.
[0025]
As the resin film constituting the adhesion preventing sheets 5 to 8, for example, those made of polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyethylene, or the like are advantageously used. Further, the adhesion preventing sheets 5 to 8 may be formed of a thin metal plate made of, for example, stainless steel.
[0026]
As shown in FIG. 1 (2), the adhesion preventing sheets 5 to 8 are disposed so as to be located on both end faces in the stacking direction of each of the preliminary stacking blocks 3 and 4, and will be described later with reference to FIG. Is loaded into the mold 9 shown in FIG. One of the two anti-adhesion sheets 6 and 7 located between the preliminary laminated blocks 3 and 4 may be omitted.
[0027]
As described above, the carrier film used when the ceramic green sheet 1 is formed may be used as it is as the adhesion preventing sheets 5 to 8. In this case, the carrier film is left without being peeled only with respect to the ceramic green sheet 1 located at the end in the stacking direction of each of the preliminary stack blocks 3 and 4.
[0028]
Next, with the stacking order shown in FIG. 1 (2), as shown in FIG. 2 (1), the preliminary stack blocks 3 and 4 are loaded into the mold 9 together with the adhesion preventing sheets 5-8. . The mold 9 includes a bottom plate 10 that receives the preliminary laminated blocks 3 and 4 and a frame 11 that surrounds the preliminary laminated blocks 3 and 4.
[0029]
In FIG. 2 (1) and FIG. 2 (2) described later, the preliminary laminated blocks 3 and 4 are omitted, but the positional relationship with the adhesion preventing sheets 5 to 8 is clearly understood. It is shown to obtain.
[0030]
In the mold 9, each of the preliminary laminated blocks 3 and 4 is oriented in a plane direction that coincides with the plane direction taken in the final raw laminate 12 to be obtained (see FIG. 4 (2)). . That is, each of the preliminary laminated blocks 3 and 4 is oriented in a plane direction, for example, 180 degrees or 90 degrees in a non-rotating direction from the posture taken in the final raw laminated body 12 to be obtained. Yes. Also preferably, the pre-lamination blocks 3 and 4 are stacked in a stacking sequence that matches the stacking sequence taken in the final raw stack 12.
[0031]
Next, as shown in FIG. 2 (2), a step of temporarily pressing the preliminary laminated blocks 3 and 4 in the lamination direction is performed.
[0032]
More specifically, the punch 13 operates toward the mold 9 as indicated by an arrow 14, and a pressing pressure of, for example, 100 to 200 kgf / cm ² is applied, whereby the two preliminary laminated blocks 3 and 4 are In the same mold 9, they are temporarily pressed simultaneously.
[0033]
In this way, by pre-pressing the two preliminary laminated blocks 3 and 4 simultaneously in the same mold 9, the difference in press distortion between the preliminary laminated blocks 3 and 4 can be reduced.
[0034]
Next, as shown in FIG. 2 (3), the preliminary laminated blocks 3 and 4 after the temporary pressing are taken out from the mold 9 together with the adhesion preventing sheets 5 to 8.
[0035]
Next, as shown in FIG. 3 (1), a step of forming a hole 15 for providing a via-hole conductor or a through-hole conductor is performed on each of the preliminary laminated blocks 3 and 4.
[0036]
For example, punching, laser, drilling, or the like is applied to form the hole 15 described above. In the illustrated embodiment, all of the holes 15 are through-holes that are open at both ends. However, when only one end is a hole that is open, It is preferable to apply a method of irradiating laser light.
[0037]
Further, in the illustrated embodiment, the hole 15 is provided so as to penetrate through the adhesion preventing sheets 5 to 8. Therefore, it is preferable that the thickness and material of the adhesion preventing sheets 5 to 8 are suitable for such drilling. Prior to the step of forming the holes 15 shown in FIG. 3 (1), the adhesion preventing sheets 5 to 8 may be peeled off from the preliminary laminated blocks 3 and 4.
[0038]
Next, as shown in FIG. 3B, the hole 15 is filled with the conductive paste 16. As the conductive paste 16, substantially the same conductive paste as that used for forming the conductive film 2 described above can be used.
[0039]
In filling the conductive paste 16, for example, the conductive paste 16 is applied on the adhesion preventing sheet 5 or 6 and 7 or 8, and a squeegee (not shown) is operated to thereby form the conductive paste 16. A method of embedding the conductive paste 16 in the holes 15 or a method of injecting the conductive paste 16 into the holes 15 using a dispenser (not shown) can be applied.
[0040]
Also, when filling the hole 15 with the conductive paste 16, if the conductive paste 16 is embedded or injected from the other opening side while performing vacuum suction from the one opening side of the hole 15, the hole 15 The conductive paste 16 can be filled efficiently.
[0041]
Moreover, if the filling process of the conductive paste 16 is carried out while leaving the adhesion preventing sheets 5 to 8 as in this embodiment, the adhesion preventing sheets 5 to 8 are formed in each of the preliminary laminated blocks 3 and 4. It acts to prevent the surface from being soiled by the conductive paste 16.
[0042]
Next, as shown in FIG. 4 (1), two preliminary laminated blocks 3 and 4 are laminated, and then a main pressing process is performed in the lamination direction.
[0043]
More specifically, in the preliminary laminated blocks 3 and 4 after being temporarily pressed, only the adhesion preventing sheets 6 and 7 located on the surfaces facing each other are peeled off and removed, and then the mold 17 is removed. Loaded in. The mold 17 includes a bottom plate 18 and a frame 19 as in the case of the mold 9 used in the temporary press described above.
[0044]
In FIG. 4 (1), as in the case of FIGS. 2 (1) and (2), the preliminary laminated blocks 3 and 4 are omitted.
[0045]
Next, as shown in FIG. 4 (1), the step of pressing the preliminary laminated blocks 3 and 4 in the laminating direction by operating the punch 20 toward the mold 17 as indicated by an arrow 21 To be implemented. In this press process, press conditions higher than the press conditions in the temporary press process described above are applied, and for example, a press pressure of 650 to 750 kgf / cm ² is applied.
[0046]
In addition, in this press process shown to FIG. 4 (1), although the adhesion prevention sheets 5 and 8 were used as they were, as mentioned above, when the adhesion prevention sheets 5-8 are peeled off after a temporary press process. Alternatively, another adhesion preventing sheet may be used.
[0047]
The raw laminated body 12 taken out from the metal mold 17 after the above-described main pressing step is performed is shown in FIG.
[0048]
This raw laminated body 12 is cut as necessary, and then fired, whereby a multilayer ceramic electronic component such as a target multilayer ceramic capacitor is obtained. This multilayer ceramic electronic component includes a ceramic layer provided by the ceramic green sheet 1, a conductor film 2, and via-hole conductors and through-hole conductors provided by a conductive paste 16 filled in the holes 15.
[0049]
In such a multilayer ceramic electronic component, as described above, it is possible to reduce the difference in press strain between the preliminary laminated blocks 3 and 4 generated after the temporary pressing step. It is possible to make it difficult for poor conduction between the via-hole conductor and the through-hole conductor.
[0050]
While the present invention has been described with reference to the illustrated embodiments, various other modifications are possible within the scope of the present invention.
[0051]
For example, the illustrated embodiment exemplifies a method of manufacturing a multilayer ceramic capacitor including a via-hole conductor and a through-hole conductor. However, the present invention provides a multilayer ceramic capacitor that does not include a via-hole conductor or a through-hole conductor. The present invention can also be applied to a manufacturing method or a manufacturing method of a multilayer inductor or a multilayer ceramic substrate.
[0052]
In the case of a method for manufacturing a multilayer ceramic electronic component that does not include either a via-hole conductor or a through-hole conductor, the steps shown in FIGS. 3 (1) and 3 (2) may be omitted.
[0053]
In the illustrated embodiment, the plurality of ceramic green sheets 1 to be stacked are divided into two groups, but the number of groups can be arbitrarily changed.
[0054]
【The invention's effect】
As described above, according to the present invention, a plurality of ceramic green sheets to be laminated are divided into a plurality of groups, and a plurality of ceramic green sheets are laminated for each group to obtain a plurality of preliminary laminated blocks. The plurality of preliminary laminated blocks are laminated to obtain a final raw laminated body. Therefore, at the stage of obtaining the pre-laminated block, only a relatively small number of ceramic green sheets are handled, and therefore, the misalignment of the ceramic green sheets and the distortion or misalignment of the conductor film, the via-hole conductor or the through-hole conductor occur. Can be difficult.
[0055]
Also, in the step of pre-pressing the preliminary laminated blocks, each preliminary laminated block is oriented in a surface direction that coincides with the surface direction taken in the raw laminated body, and stacked while interposing an adhesion preventing sheet therebetween As described above, since a plurality of preliminary laminated blocks are temporarily pressed simultaneously in the same mold, a difference in press strain between the preliminary laminated blocks can be reduced after the temporary pressing step.
[0056]
Therefore, when a raw laminate is obtained by laminating a plurality of pre-lamination blocks, it is difficult to cause positional deviation and distortion of the conductor film, via-hole conductor or through-hole conductor due to the above-described difference in press distortion. As described above, the effect of adopting a process of dividing a plurality of ceramic green sheets into a plurality of groups and laminating a plurality of ceramic green sheets for each group to produce a plurality of preliminary laminated blocks, It can be maximized without being disturbed.
[0057]
As a result, when the present invention is applied to a method for manufacturing a multilayer ceramic electronic component including a via-hole conductor and / or a through-hole conductor, it is difficult to cause a conduction failure in the via-hole conductor and / or the through-hole conductor. When applied to a method of manufacturing a multilayer ceramic substrate, it is possible to advantageously increase the density of wiring while reducing the size of the multilayer ceramic substrate, and to apply to a method of manufacturing a multilayer ceramic capacitor. In this case, it is possible to advantageously increase the capacity while reducing the size of the multilayer ceramic capacitor.
[0058]
In this invention, when the preliminary laminated block is temporarily pressed, when the plurality of preliminary laminated blocks are stacked with a lamination order that matches the lamination order taken in the raw laminated body, each of the adjacent preliminary laminated blocks in the temporary pressing step. Strain can be generated in the same manner in the vicinity of the interface, and each portion in which the strain is generated in this similar mode comes into contact with each other in this press step. The possibility of causing such misalignment can be reduced.
[0059]
In the present invention, when an easily deformable resin film is used as the adhesion preventing sheet, it becomes possible to make the press distortions after the temporary pressing process of the plurality of preliminary laminated blocks more coincident with each other, and the plurality of preliminary laminated blocks It becomes possible to further reduce the difference in press strain between the two.
[0060]
In the present invention, after the step of temporarily pressing the preliminary laminated block, a hole for providing a via-hole conductor or a through-hole conductor is formed in the specific preliminary laminated block, and the hole is filled with the conductive paste. By doing so, it is possible to reduce the number of steps for forming a hole for providing a via-hole conductor or a through-hole conductor and the number of steps for filling with a conductive paste. The problem of poor conduction of via-hole conductors or through-hole conductors due to misalignment can be made less likely to occur.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view sequentially showing typical steps included in a method of manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view sequentially showing typical steps subsequent to the step shown in FIG.
3 is a cross-sectional view sequentially showing typical steps subsequent to the step shown in FIG. 2; FIG.
4 is a cross-sectional view sequentially showing typical steps subsequent to the step shown in FIG. 3;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Ceramic green sheet 2 Conductive film 3, 4 Pre-lamination block 5-8 Adhesion prevention sheet 9, 17 Mold 12 Raw laminated body 13, 20 Punch 15 Hole 16 Conductive paste

Claims (6)

Producing a plurality of ceramic green sheets, a green sheet production process;
A conductor film forming step of forming a conductor film on the specific ceramic green sheet;
Producing a raw laminate in which a plurality of the ceramic green sheets are laminated;
A method for producing a multilayer ceramic electronic component comprising: firing the raw laminate;
The laminate manufacturing process includes
Dividing the plurality of ceramic green sheets into a plurality of groups, and laminating a plurality of ceramic green sheets for each group to produce a plurality of preliminary laminated blocks;
Temporarily pressing a plurality of the preliminary laminated blocks in the lamination direction;
In order to obtain the raw laminate, a step of laminating a plurality of preliminary laminated blocks that have been temporarily pressed;
A step of subjecting the raw laminated body to the lamination direction in the lamination direction under a pressing condition equal to or higher than the pressing condition in the temporary press,
In the step of temporarily pressing the preliminary laminated blocks, the preliminary laminated blocks are oriented in a plane direction that coincides with a plane direction taken in the raw laminate, and stacked while interposing an adhesion preventing sheet therebetween. A method for producing a multilayer ceramic electronic component comprising a step of simultaneously pressing a plurality of the preliminary multilayer blocks simultaneously in the same mold as a state. The method for producing a multilayer ceramic electronic component according to claim 1, wherein the step of laminating the preliminary laminated blocks includes a step of removing the adhesion preventing sheet located between the preliminary laminated blocks. 3. The multilayer ceramic electronic according to claim 1, wherein the step of temporarily pressing the preliminary laminated block is performed in a state where the adhesion preventing sheets are arranged on both end faces in the stacking direction of the preliminary laminated blocks. Manufacturing method of parts. The laminated mold according to any one of claims 1 to 3, wherein, in the step of temporarily pressing the preliminary laminated block, the plurality of preliminary laminated blocks are stacked with a lamination order that coincides with a lamination order taken in the raw laminated body. Manufacturing method of ceramic electronic components. 5. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the adhesion preventing sheet is made of a resin film that can be easily deformed. After the step of temporarily pressing the preliminary laminated block, a step of forming a hole for providing a via-hole conductor or a through-hole conductor in the specific preliminary laminated block, and a step of filling the hole with a conductive paste The method for producing a multilayer ceramic electronic component according to claim 1, further comprising:

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