JP3846241B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to an improvement in a stacking process and a pressing process of a plurality of ceramic green sheets.
[0002]
[Prior art]
As a prior art interesting to the present invention, for example, there is one described in Japanese Patent Laid-Open No. 4-282812.
[0003]
In this prior art, when producing a raw laminate for a multilayer ceramic electronic component, a plurality of ceramic green sheets to be laminated are divided into a plurality of groups, and a plurality of ceramic green sheets are laminated for each group. A plurality of pre-laminates are produced by pressing, and then a plurality of pre-laminates are laminated and pressed to obtain a final raw laminate for a multilayer ceramic electronic component .
[0004]
According to this prior art, in order to obtain a final raw laminated body, the positional accuracy in the lamination is improved as compared with the case of adopting a method of laminating and pressing all of the ceramic green sheets all at once. There is an advantage that the distortion of the conductor film formed on the ceramic green sheet can be reduced. Further, when the via hole conductor or the through hole conductor is provided on the ceramic green sheet, it is possible to make it difficult for the via hole conductor or the through hole conductor to be displaced.
[0005]
Similar or similar techniques are also described in, for example, Japanese Patent Laid-Open Nos. 3-283595 and 9-129486.
[0006]
[Problems to be solved by the invention]
However, the above-described prior art has the following problems to be solved.
[0007]
Due to variations in pressing conditions for obtaining each pre-laminated body and differences in arrangement of conductor films, via-hole conductors and / or through-hole conductors between pre-laminated bodies, a plurality of pre-laminated bodies are obtained as a result of the pressing process. May show different deformation modes such as elongation and distortion. Also, when via-hole conductors or through-hole conductors are formed, due to thermal effects in the process of providing through holes for via-hole conductors or through-hole conductors, or filling through holes with conductive paste However, the pre-laminate may be distorted.
[0008]
As a result, in order to obtain a final raw laminated body, after a plurality of preliminary laminated bodies are laminated and pressed, misalignment may occur between the preliminary laminated bodies.
[0009]
As described above, when the misalignment occurs between the pre-laminated bodies, when the obtained multilayer ceramic electronic component is a multilayer ceramic capacitor, a variation in capacitance occurs, or a via-hole conductor or a through-hole conductor is provided. In the multilayer ceramic substrate, the connection failure in the via hole conductor or the through hole conductor may occur.
[0010]
In order to solve these problems, for example, if there is a margin in the design, such as increasing the connecting land, while reducing the size of the multilayer ceramic capacitor while reducing the size of the multilayer ceramic substrate, This is not preferable because the density of the wiring is hindered.
[0011]
Therefore, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component that can solve the above-described problems.
[0012]
[Means for Solving the Problems]
The present invention relates to a green sheet production process for producing a plurality of ceramic green sheets, a conductor film formation process for forming a conductor film on a specific ceramic green sheet, and a raw lamination in which a plurality of ceramic green sheets are laminated. In order to solve the above-mentioned technical problem, the present invention is directed to a method for manufacturing a multilayer ceramic electronic component, comprising a laminate manufacturing step for producing a body, and a firing step for firing a raw laminate. It is characterized by having the following configuration.
[0013]
In this invention, an elongation preventing sheet is prepared.
[0014]
Further, in the above-described laminated body production step, a plurality of ceramic green sheets are divided into a plurality of groups, a plurality of ceramic green sheets are laminated for each group, and a plurality of preliminary laminated bodies are produced. In order to obtain a laminated body, a process of laminating a plurality of preliminary laminated bodies is performed.
[0015]
  In the step of producing the above-mentioned pre-laminated body, pressing is performed in a state where a plurality of ceramic green sheets are sandwiched between the stretch prevention sheets in the laminating direction.After that, the entire through-passage in which both ends for providing via-hole conductors or through-hole conductors were opened and / or only one end was opened in the pre-laminated body sandwiched in the stacking direction by the stretch prevention sheet. A step of forming the semi-penetrating passage so as to penetrate the stretch preventing sheet and a step of filling the entire penetrating passage and / or the semi-penetrating passage with the conductive paste via the stretch preventing sheet are further performed.
[0016]
Further, in the step of laminating a plurality of preliminary laminates, the step of peeling only the stretch prevention sheets located on the mutually opposing surfaces of the two preliminary laminates to be laminated to expose the mutually opposing surfaces, and this exposure The step of joining the two preliminary laminated bodies to be laminated together is performed in a state where the surfaces that have been brought into contact with each other.
[0017]
In this invention, the entire raw laminate obtained by the step of laminating the preliminary laminate is finally subjected to pressing conditions equal to or higher than the pressing conditions in the step of pressing a plurality of ceramic green sheets in the step of producing the preliminary laminate. It is preferable to further carry out a final pressing step.
[0018]
In addition, before the above-described final pressing step, after the final pressing step, the step of peeling the stretch prevention sheet located on at least one end surface in the stacking direction of the raw laminate, and the stacking direction of the raw laminate It is preferable to further carry out the above-described step of planar polishing at least one of the end faces.
[0019]
In the step of pressing a plurality of ceramic green sheets in the step of producing the preliminary laminate, the pressure is 500 kgf / cm.²It is preferable that press conditions of 100 ° C. or less are applied.
[0022]
Simultaneously with the step of forming the full through-passage and / or the semi-through-passage described above, it is preferable to form the alignment through-hole in the pre-laminated body sandwiched in the laminating direction by the stretch prevention sheet. In the step of laminating the preliminary laminated body, the plurality of preliminary laminated bodies are aligned with each other based on the alignment through holes.
[0023]
The elongation preventing sheet is preferably composed of a resin film.
[0024]
Moreover, it is preferable that the surface which contacts the ceramic green sheet of an elongation prevention sheet is roughened.
[0025]
Moreover, the adhesive may be provided to the surface which contacts a ceramic green sheet of an elongation prevention sheet.
[0026]
In this invention, you may make it provide a quick-drying adhesive to the peripheral part of the surface which mutually contacts the preliminary | backup laminated body before the process of joining two preliminary | backup laminated bodies which should be laminated | stacked mutually.
[0027]
In the present invention, at least one of the plurality of pre-laminated bodies may be composed of only a plurality of ceramic green sheets on which no conductor is formed.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
1 to 3 are cross-sectional views sequentially showing typical steps included in a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention. Here, a method for manufacturing a multilayer ceramic substrate is shown.
[0029]
First, as shown in FIG. 1 (1), a plurality of ceramic green sheets 1 are produced. In producing the ceramic green sheet 1, as is well known, for example, a ceramic slurry is formed into a sheet by applying a doctor blade method on a carrier film made of polyethylene terephthalate or the like.
[0030]
Next, the conductor film 2 is formed on the specific ceramic green sheet 1 with a desired pattern. The conductive film 2 is formed by applying a conductive paste containing a conductive metal powder such as nickel, silver or copper onto the corresponding ceramic green sheet 1 by a screen printing method or the like.
[0031]
In FIG. 1A, the uppermost ceramic green sheet 1 (a) is a so-called dummy ceramic green sheet in which at least a part thereof is polished and removed in a later step. Also for this dummy ceramic green sheet 1 (a), the conductor film 2 is formed with the same pattern as the conductor film 2 on the second ceramic green sheet 1 from the top. This is for the purpose of alignment when providing a through hole for a via-hole conductor or the like in a later step.
[0032]
On the other hand, as shown in FIG. 1 (2), an elongation preventing sheet 3 is prepared. The elongation preventing sheet 3 is preferably composed of a film made of polyethylene terephthalate having a thickness of 10 to 250 μm, for example, and having a thickness of 50 μm. In addition to polyethylene terephthalate, the elongation preventing sheet 3 may be composed of a resin film made of, for example, polyethylene naphthalate, polypropylene, polyethylene or the like, or may be made of a metal thin plate made of stainless steel or the like.
[0033]
As shown in FIG. 1 (2), the plurality of ceramic green sheets 1 are divided into a plurality of groups, for example, three groups. A plurality of ceramic green sheets 1 are laminated for each group, and three preliminary laminates 4 are stacked. 5 and 6 are made.
[0034]
Next, each of the preliminary laminated bodies 4 to 6 is pressed in a state where the plurality of ceramic green sheets 1 are sandwiched by the elongation preventing sheets 3 in the laminating direction. In this pressing process, the pressure is 500 kgf / cm.²And press conditions of 100 ° C. or less, for example, pressure 100 kgf / cm²And press conditions at a temperature of 75 ° C. are applied.
[0035]
In order to obtain a state in which a plurality of ceramic green sheets 1 are sandwiched between the stretch prevention sheets 3, one of the stretch prevention sheets 3 is usually set on a lamination stage for performing the lamination process of the ceramic green sheets 1. Then, the ceramic green sheets 1 are laminated, and the other elongation preventing sheet 3 is set on the uppermost ceramic green sheet 1. In the step of laminating the ceramic green sheets 1, each time one ceramic green sheet 1 is laminated, a preliminary press is performed to press the ceramic green sheet 1 against the previously laminated ceramic green sheet 1. Also good.
[0036]
Further, the elongation preventing sheet 3 may be arranged so that each of the preliminary laminated bodies 4 to 6 is sandwiched in the laminating direction after the plurality of ceramic green sheets 1 provided in each of the preliminary laminated bodies 4 to 6 are laminated.
[0037]
Moreover, you may make it use the above-mentioned carrier film used when shape | molding the ceramic green sheet 1 as the elongation prevention sheet 3 as it is. In this case, the carrier film is left without being peeled only with respect to the ceramic green sheet 1 located at the end in the stacking direction of each of the preliminary stacked bodies 4 to 6.
[0038]
The elongation preventing sheet 3 restrains each of the preliminary laminated bodies 4 to 6 and prevents them from stretching or distorting. In order to exhibit the effect of the elongation preventing sheet 3 more effectively, the surface of the elongation preventing sheet 3 that contacts the ceramic green sheet 1 is preferably subjected to roughening. By this rough surface processing, the surface roughness Rz (10-point average roughness) of the elongation preventing sheet 3 is preferably 2 to 5 μm, and as an example, 3 μm.
[0039]
Instead of the rough surface processing described above or in addition to the rough surface processing, a pressure-sensitive adhesive is applied to the surface of the elongation preventing sheet 3 that contacts the ceramic green sheet. You may make it make the restraint effect | action to 4-6 work more reliably.
[0040]
In the subsequent steps, the preliminary laminates 4 to 6 are handled in a state in which the stretch prevention sheet 3 is adhered, and this state of the preliminary laminates 4 to 6 is until the stretch prevention sheet 3 needs to be peeled off. Maintained.
[0041]
For example, as shown in FIG. 1 (2), the elongation preventing sheet 3 preferably has a plane dimension slightly smaller than the plane dimension of each of the preliminary laminated bodies 4 to 6. Thereby, it is possible to prevent the stretch preventing sheet 3 from being turned up carelessly in the subsequent handling of the preforms 4 to 6.
[0042]
Next, as shown in FIG. 1 (3), a step of forming a through hole 7 for providing a via hole conductor or a through hole conductor in each of the specific ceramic green sheets 1 is performed.
[0043]
In this embodiment, with respect to each of the preliminary laminated bodies 4 to 6 sandwiched between the stretch prevention sheets 3 in the laminating direction, all through passages 8 having both ends to be the above-described through holes 7 are opened and one end. A semi-through passage 9 having only an opening is formed at once. Thereby, each through-hole 7 provided in each ceramic green sheet 1 is not displaced between adjacent ceramic green sheets 1.
[0044]
In forming all the through-passages 8 in the preliminary laminated body 4, as described above, the conductor film 2 formed on the uppermost dummy ceramic green sheet 1 (a) is used as a mark for alignment.
[0045]
Since the full penetration passage 8 and the half penetration passage 9 are provided so as to penetrate the elongation preventing sheet 3, it is preferable that the thickness and material of the elongation preventing sheet 3 are suitable for such drilling.
[0046]
In order to form the full through passage 8 and the half through passage 9, for example, laser or drilling is applied. In particular, in forming the semi-through passage 9, it is preferable to apply a method of irradiating a laser beam. This is because, in the case of the semi-through passage 9, it is necessary to accurately control the depth thereof, but such control of the depth is relatively easy by laser light irradiation.
[0047]
Next, as shown in FIG. 1 (4), the conductive paste 10 is filled in the full through passage 8 and the half through passage 9. As the conductive paste 10, substantially the same conductive paste as that used to form the conductive film 2 described above can be used.
[0048]
In filling the conductive paste 10, for example, by applying the conductive paste 10 on the stretch prevention sheet 3 and operating a squeegee (not shown) or the like, the conductive paste 10 is made to pass through the entire through-passage 8 and A method of embedding in the semi-through passage 9 or a method of injecting the conductive paste 10 into the entire through-passage 8 and the half-through passage 9 using a dispenser (not shown) can be applied.
[0049]
In particular, when filling the entire through passage 8 with the conductive paste 10, the conductive paste 10 is embedded or injected from the other opening side while performing vacuum suction from one opening side of each of the all through passages 8. By doing so, it is possible to efficiently fill the conductive paste 10 in all the through passages 8.
[0050]
In such a filling process of the conductive paste 10, the elongation preventing sheet 3 acts so as to prevent the surfaces of the preliminary laminates 4 to 6 from being soiled by the conductive paste 10.
[0051]
Next, as shown sequentially in FIGS. 2 (1) to (4), a step of laminating a plurality of preliminary laminated bodies 4 to 6 is performed. In laminating the preliminary laminated bodies 4 to 6, the preliminary laminated bodies 4 to 6 are not laminated at once, but the lamination of two things selected from the preliminary laminated bodies 4 to 6 is repeated as many times as necessary. It is.
[0052]
That is, as shown in FIGS. 2 (1) and (2), the preliminary laminated bodies 5 and 6 are laminated, and then, as shown in FIGS. 2 (3) and (4), the preliminary laminated bodies 4 and 5 are laminated. Is done.
[0053]
More specifically, first, as shown in FIG. 2 (1), only the stretch prevention sheets 3 positioned on the mutually opposing surfaces of the preliminary laminated bodies 5 and 6 are peeled off, and thereby these are opposed to each other. The surface is exposed.
[0054]
Next, as shown in FIG. 2 (2), the two preliminary laminated bodies 5 and 6 are joined to each other in a state where the exposed surfaces are in contact with each other.
[0055]
The above-described joining is achieved by pressing the pre-laminates 5 and 6 together. If necessary, a quick-drying adhesive, for example, may be applied to the peripheral portions of the surfaces of the pre-laminates 5 and 6 that are in contact with each other. If the instantaneous adhesive or the like is applied by a dispenser or the like, a more reliable joining state can be obtained.
[0056]
As described above, the region where the quick-drying adhesive is applied is defined as the peripheral portion of the surfaces of the preliminary laminates 5 and 6 that are in contact with each other. This is because a gap portion or the like that is not affected is provided.
[0057]
Moreover, if the stretch prevention sheet 3 located on the surfaces of the preliminary laminates 5 and 6 that are brought into contact with each other is peeled off immediately before the step of joining the preliminary laminates 5 and 6 to each other, the surfaces that are brought into contact with each other are dried. Can be prevented and a good bonding state can be obtained. In addition, the possibility that dust or the like adheres to the surfaces brought into contact with each other can be reduced.
[0058]
Next, as shown in FIG. 2 (3), only the stretch preventing sheets 3 positioned on the mutually opposing surfaces of the preliminary laminated bodies 4 and 5 are peeled off to expose the mutually opposing surfaces.
[0059]
Next, as shown in FIG. 2 (4), the preliminary laminates 4 and 5 are joined to each other in the same manner as in the preliminary laminates 5 and 6 described above with the exposed surfaces in contact with each other. Is done.
[0060]
In this way, the raw laminate 11 for the multilayer ceramic substrate as the multilayer ceramic electronic component to be obtained is obtained.
[0061]
Next, as shown in FIG. 3 (1), the elongation preventing sheet 3 left so as to be positioned on both end faces in the stacking direction of the raw laminate 11 is peeled off.
[0062]
Next, the entire raw laminate 11 shown in FIG. 3A is finally pressed. In this final pressing step, pressing conditions equal to or higher than the pressing conditions in the step of pressing the plurality of ceramic green sheets 1 in the step of manufacturing the preliminary laminates 4 to 6 described above are applied. As an example, in the final pressing step, the pressure is 750 kgf / cm.²And press conditions at a temperature of 80 ° C. are applied.
[0063]
Next, in order to smooth the both end surfaces in the stacking direction of the raw laminate 11, planar polishing is performed using, for example, a grinder. As a result of this planar polishing, as shown in FIG. 3 (2), at least part of the thickness of the dummy ceramic green sheet 1 (a) is removed together with the conductor film 3 formed thereon. At this time, the dummy ceramic green sheet 1 (a) may be planarly polished and removed until the conductor film 2 formed on the second ceramic green sheet 1 from the raw laminated body 11 is exposed. .
[0064]
Further, planar polishing is also performed on the lower surface side of the raw laminate 11. As a result, at least a part of the thickness of the lowermost ceramic green sheet 1 is removed.
[0065]
In addition, peeling of the elongation prevention sheet 3 mentioned above is implemented only with respect to the elongation prevention sheet 3 located on one end surface in the lamination direction of the raw laminate 11, and then a final pressing step is performed. The above-described planar polishing process may be performed only on the end surface from which the stretch prevention sheet 3 has been peeled off.
[0066]
Further, as shown in FIG. 2 (4), the final pressing step may be performed in a state where the stretch preventing sheets 3 are positioned on both end faces in the stacking direction of the raw laminate 11. Also in this case, preferably, after the elongation preventing sheet 3 is peeled off, the above-described planar polishing step is performed.
[0067]
Next, the raw laminated body 11 after planar polishing as shown in FIG. 3 (2) is cut as necessary, and then fired, whereby the intended multilayer ceramic substrate is obtained. The multilayer ceramic substrate includes a ceramic layer provided by the ceramic green sheet 1, a conductor film 2, and via-hole conductors and through-hole conductors provided by the conductive paste 10 filled in the full through passage 8 or the half through passage 9. ing.
[0068]
FIG. 4 is a view corresponding to FIG. 1 (3) for explaining another embodiment of the present invention. In FIG. 4, elements corresponding to the elements shown in FIG. 1 (3) are denoted by the same reference numerals, and redundant description is omitted.
[0069]
In the embodiment shown in FIG. 4, simultaneously with the step of forming the full through-passage 8 and the semi-through-passage 9, the preliminary laminated body 4 to the state where the alignment through-hole 13 is sandwiched in the stacking direction by the stretch prevention sheet 3. The process of forming in each of 6 is implemented.
[0070]
The alignment through-hole 13 is preferably provided at each peripheral portion of the preliminary laminates 4 to 6. This is because the peripheral portion of each of the preliminary laminated bodies 4 to 6 is a gap portion that does not affect the product.
[0071]
According to this embodiment, in the step of laminating a plurality of preliminary laminated bodies 4 to 6 that will be performed later, the alignment through hole 13 is sensed by a camera or the like, thereby being based on the alignment through hole 13. Thus, the preliminary laminated bodies 4 to 6 are aligned with each other. Therefore, the alignment accuracy can be improved.
[0072]
  FIG. 5 is a view corresponding to FIG. 1 (2) for explaining still another embodiment of the present invention.In this embodiment, neither the step of forming the full through passage and / or the half through passage, nor the step of filling the full through passage and / or the half through passage with the conductive paste is performed. However, this embodiment supports the aspect that at least one of the plurality of pre-laminated bodies to be laminated may be configured only with a plurality of ceramic green sheets on which no conductor is formed. There is significance as.
[0073]
This embodiment is intended for the production of multilayer ceramic capacitors.
[0074]
In this embodiment, the produced plurality of ceramic green sheets 21 are divided into, for example, four groups, and a plurality of ceramic green sheets 21 are laminated for each group, and four preliminary laminated bodies 22, 23, 24, and 25 are stacked. Is produced.
[0075]
Among these preliminary laminated bodies 22 to 25, the preliminary laminated bodies 22 and 25 located at both ends are constituted only by the ceramic green sheet 21 on which no conductor is formed.
[0076]
On the other hand, for the preliminary laminated bodies 23 and 24 located in the intermediate part, the ceramic green sheet 21 on which the conductor film 26 that becomes the internal electrode for forming the capacitance is formed is laminated.
[0077]
Each of the preliminary laminates 22 to 25 is pressed while being sandwiched by the stretch prevention sheet 27, and the stretch prevention located on the mutually opposing surfaces of two of the preliminary laminates 22 to 25 to be laminated. Only the sheet 27 is peeled to expose the surfaces facing each other, and the preliminary laminates 22 to 25 are joined to each other in a state where the exposed surfaces are in contact with each other. It is substantially the same.
[0078]
Although the present invention has been described with reference to the illustrated embodiment, the present invention can also be applied to a method for manufacturing a multilayer ceramic electronic component other than a multilayer ceramic substrate and a multilayer ceramic capacitor. For example, the present invention can also be applied to a manufacturing method of a multilayer inductor and a manufacturing method of a ceramic capacitor having a multilayer structure having via-hole conductors and / or through-hole conductors that can reduce the equivalent series inductance.
[0079]
【The invention's effect】
As described above, according to the present invention, a plurality of ceramic green sheets to be laminated are divided into a plurality of groups, and a plurality of ceramic green sheets are laminated for each group to obtain a plurality of preliminary laminated bodies. A final raw laminate composed of the plurality of preliminary laminates is obtained. Therefore, since only a relatively small number of ceramic green sheets are handled at the stage of obtaining the pre-laminated body, the misalignment of the lamination of the ceramic green sheets and the distortion and misalignment of the conductor film, the via-hole conductor or the through-hole conductor occur. Can be difficult.
[0080]
In addition, when a plurality of ceramic green sheets are pressed in order to produce a pre-laminated body, a plurality of ceramic green sheets are sandwiched between the anti-elongation sheets in the laminating direction, so that extension and distortion of the pre-laminated body can be suppressed. Therefore, it is possible to suppress variations in deformation modes such as elongation and distortion among the plurality of preliminary laminated bodies.
[0081]
Further, when laminating a plurality of pre-laminated bodies, only the anti-elongation sheets located on the mutually opposing surfaces of the two pre-laminated bodies to be laminated are peeled to expose the mutually opposing surfaces, and this exposed surface The two pre-laminates to be laminated are joined to each other in a state where they are in contact with each other, so that drying of the pre-laminates on the surfaces to be brought into contact with each other is prevented, and adhesion of dust and the like is prevented. As a result, a good bonded state can be obtained. Further, even during the bonding process and after the bonding, since the elongation preventing sheet is positioned on the end surface facing the outside of the preliminary laminated body, the preliminary laminated body is also formed by the elongation preventing sheet at this stage. Undesirable elongation and distortion can be suppressed.
[0082]
From these, as described above, the effect of adopting the process of dividing a plurality of ceramic green sheets into a plurality of groups and laminating a plurality of ceramic green sheets for each group to produce a plurality of preliminary laminated bodies Can be maximized without being hindered.
[0083]
As a result, when the present invention is applied to a method for manufacturing a multilayer ceramic substrate, it is possible to advantageously increase the density of wiring while reducing the size of the multilayer ceramic substrate, and to manufacture a multilayer ceramic capacitor. When applied to the method, it is possible to advantageously increase the capacity while reducing the size of the multilayer ceramic capacitor.
[0084]
In this invention, the entire raw laminate obtained by the step of laminating the preliminary laminate is finally subjected to pressing conditions equal to or higher than the pressing conditions in the step of pressing a plurality of ceramic green sheets in the step of producing the preliminary laminate. If the final pressing step is performed, it is possible to reliably obtain a good bonding state between the preliminary laminates.
[0085]
Before the final pressing step described above, the stretch prevention sheet located on at least one end surface in the stacking direction of the raw laminate is peeled off, and after the final pressing step, at least the above-described at least in the stacking direction of the raw laminate is performed. If one end face is subjected to planar polishing, the face to which the stretch prevention sheet is attached can be smoothed.
[0086]
Accordingly, the smoothness of the surface is not particularly required for the elongation preventing sheet, and therefore, as the elongation preventing sheet, it is possible to use a roughened or pressure-sensitive adhesive without problems. In addition to being able to do this, the roughening process and the pressure-sensitive adhesive can increase the restraining force of the elongation preventing sheet on the ceramic green sheet, so that the effect of the elongation preventing sheet can be exhibited more effectively.
[0087]
  Also, in this inventionAccording toThe entire through-passage with both ends opened for providing via-hole conductors or through-hole conductors and / or half with only one end opened for the pre-laminated body sandwiched in the laminating direction by the stretch prevention sheet Through the passage, So as to penetrate the stretch prevention sheetFormed into a full-through passage and / or a half-through passageThrough the stretch prevention sheetLike filling with conductive pasteBecauseThe number of steps for forming a through hole for providing a via hole conductor or a through hole conductor and the number of steps for filling with a conductive paste can be reduced, and a poor connection of a via hole conductor or a through hole conductor due to a poor alignment of the through holes can be reduced. Can make problems less likelyFurthermore, the surface of the pre-laminated body can be prevented from being soiled by the conductive paste.The
[0088]
Further, in the present invention, simultaneously with the step of forming the full through-passage and / or the semi-through-passage described above, the alignment through-hole is formed in the pre-laminated body sandwiched in the laminating direction by the stretch prevention sheet, In the step of laminating the laminated body, if the plurality of preliminary laminated bodies are aligned with each other based on the alignment through holes, the alignment accuracy of the preliminary laminated body can be improved. The formation accuracy of the conductor or the through-hole conductor can be further improved.
[0089]
In the present invention, if a quick-drying adhesive is applied to the peripheral portions of the surfaces of the preliminary laminates that are in contact with each other before the step of joining the two preliminary laminates to be laminated together, A good bonding state can be reliably obtained between the laminated bodies.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view sequentially showing typical steps included in a method of manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view sequentially showing typical steps subsequent to the step shown in FIG.
3 is a cross-sectional view sequentially showing typical steps subsequent to the step shown in FIG. 2; FIG.
FIG. 4 is a view corresponding to FIG. 1 (3) for explaining another embodiment of the present invention.
FIG. 5 is a view corresponding to FIG. 1 (2) for explaining still another embodiment of the present invention.
[Explanation of symbols]
1,21 Ceramic green sheet
2,26 Conductor film
3,27 Stretch prevention sheet
4-6, 22-25 Preliminary laminate
7 Through hole
8 All through passages
9 Half-through passage
10 Conductive paste
11 Raw laminate
13 Through-hole for alignment

Claims (11)

Producing a plurality of ceramic green sheets, a green sheet production process;
A conductor film forming step of forming a conductor film on the specific ceramic green sheet;
Producing a raw laminate in which a plurality of the ceramic green sheets are laminated;
A method for producing a multilayer ceramic electronic component comprising: firing the raw laminate;
And further comprising a step of preparing an elongation preventing sheet,
The laminated body production step includes dividing the plurality of ceramic green sheets into a plurality of groups, laminating the plurality of ceramic green sheets for each group to produce a plurality of preliminary laminated bodies, In order to obtain a laminated body, comprising a step of laminating a plurality of the preliminary laminated bodies,
The step of producing the preliminary laminated body includes a step of pressing a plurality of the ceramic green sheets in a state of being sandwiched in the stacking direction by the stretch prevention sheet, and then in a state of being sandwiched in the stacking direction by the stretch prevention sheet The pre-laminated body also penetrates through the anti-elongation sheet through the entire through-passage with both ends opened for providing via-hole conductors or through-hole conductors and / or the semi-through-passage with only one end open. And a step of filling the whole through passage and / or the half through passage with a conductive paste through the stretch prevention sheet,
The step of laminating a plurality of the preliminary laminates is a step of exposing only the opposing surfaces by peeling only the stretch prevention sheets located on the mutually opposing surfaces of the two preliminary laminates to be laminated, Bonding the two preliminary laminates to be laminated together with the exposed surfaces in contact with each other,
Manufacturing method of multilayer ceramic electronic component.   The whole raw laminate obtained by the step of laminating the preliminary laminate is finally subjected to pressing conditions equal to or higher than the pressing conditions in the step of pressing the plurality of ceramic green sheets in the step of producing the preliminary laminate. The method for manufacturing a multilayer ceramic electronic component according to claim 1, further comprising a final pressing step of pressing the ceramic ceramic component.   Before the final pressing step, the step of peeling the stretch prevention sheet located on at least one end surface in the stacking direction of the raw laminate, and the stacking direction of the raw laminate after the final pressing step The method for producing a multilayer ceramic electronic component according to claim 2, further comprising a step of planar polishing the at least one end surface of the multilayer ceramic electronic component. The laminated mold according to claim 2 or 3, wherein in the step of pressing the plurality of ceramic green sheets in the step of producing the preliminary laminated body, press conditions of a pressure of 500 kgf / cm ² or lower and a temperature of 100 ° C or lower are given. Manufacturing method of ceramic electronic components . Simultaneously with the step of forming the full through-passage and / or the semi-through-passage, the method further comprises the step of forming an alignment through hole in the pre-laminated body in a state of being sandwiched by the stretch prevention sheet in the laminating direction, in the step of laminating the laminate, based on the positioning holes, a plurality of the pre-laminate are aligned with each other, the method of manufacturing a multilayer ceramic electronic component according to any of claims 1 to 4 . A step of forming a through-hole for providing a via-hole conductor or a through-hole conductor in the specific ceramic green sheet, and a step of filling the through-hole with a conductive paste in a stage before laminating the ceramic green sheet The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 5 , further comprising: The elongation preventing sheet is formed of a resin film, a manufacturing method of a multilayer ceramic electronic component according to any of claims 1 to 6. The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 7 , wherein a surface of the elongation preventing sheet that is in contact with the ceramic green sheet is roughened. The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 8 , wherein an adhesive is applied to a surface of the elongation preventing sheet that contacts the ceramic green sheet. The method further comprises the step of applying a quick-drying adhesive to the peripheral portions of the surfaces of the preliminary laminates that contact each other before the step of joining the two preliminary laminates to be laminated together. 10. A method for producing a multilayer ceramic electronic component according to any one of 9 above. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 10 , wherein at least one of the plurality of preliminary laminates is configured by only the plurality of ceramic green sheets on which no conductor is formed.

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