JP4201882B2 - Laminate production method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for producing a laminated board using a resin foil with resin for producing a laminated board having a conductor circuit on its outer surface or inside. More specifically, the present invention relates to a method for manufacturing a laminated board that improves handling and shortens the manufacturing period in the process of manufacturing the laminated board .
[0002]
[Prior art]
Conventionally, in order to manufacture a laminated board, a conductor foil with a resin whose one side is a conductor foil and whose back side is a resin layer is used. As shown in FIG. 10, the conventional conductor foil with resin has a copper foil 91 and an epoxy layer 95. And the manufacture of the laminated board using this conductor foil with resin is performed as follows. That is, the patterning and lamination of the conductor foil and the resin layer are repeated to increase the number of layers.
[0003]
[Problems to be solved by the invention]
However, there are the following problems in the manufacture of such a conventional laminated board. That is, since one side of the conductor foil with resin used as the raw material is an epoxy resin, the adjacent epoxy resin and the copper foil are easily bonded to each other when stored in a stacked state. For this reason, it is difficult to separate the conductor foils with resin one by one. Moreover, even if it isolate | separates, a part of epoxy resin may peel and may remain on the surface of copper foil. As a result, the adhered epoxy resin piece becomes a dent during pressing, which causes pattern defects. This is because the epoxy resin-only layer that does not contain glass cloth is easy to break and generate powder. For this reason, in order to stack and store a large number of conductor foils with resin, it is inconvenient that a special stacking jig is required so that the conductor foils with resin do not contact each other.
[0004]
Furthermore, since it is necessary to repeat lamination and patterning one layer at a time for multilayering, the number of man-hours increases as the number of layers increases, and the time required for manufacturing increases. For this reason, if the conductor circuit in the inner layer part is a custom specification, there is a problem that the period from the order to the shipment becomes long even if the conductor circuit in the outer layer part has a standard specification. Further, by repeating the lamination and patterning, the flatness of the layer is impaired as it goes to the upper layer, and it becomes difficult to obtain high patterning accuracy, and the solderability at the time of mounting the component tends to deteriorate.
[0005]
The present invention has been made for the purpose of solving the problems of the prior art described above. That is, the problem is to improve the handleability of the resin-coated conductor foil to facilitate the production of the laminate, and to shorten the period required for the production of the laminate and improve the flatness.
[0006]
[Means for Solving the Problems]
The manufacturing method of the laminated board of this invention made | formed for the solution of this subject is a conductor foil with resin which has conductor foil (1) and the resin layer of the single side | surface, a support board, conductor foil (2), , Wherein the conductor foil (2) is partially bonded to both surfaces of the support plate , and the resin layer side surface of the resin foil with resin is placed on each conductor foil (2). A step (1) of creating a laminate by bonding, a step of patterning the conductor foil (1) to form a circuit pattern on the resin layer, and an inner core on the laminate including the conductor foil (1) The process of laminating the laminated board for use, and removing the supporting board from the laminated body by cutting the part where the supporting board and the conductive foil (2) are laminated from the other part, the conductive foil (2) , resin Step (2) of taking out the laminated board including the laminated board for the layer, the circuit pattern, and the inner layer core Including.
[0007]
According to this manufacturing method, first, a laminated body in which the support plate, the conductive foil (2), and the conductive foil with resin are bonded together is created in step (1). In this laminate, the support plate and the conductor foil with resin are laminated with the conductor foil (2) interposed therebetween. Here, the surface on the resin layer side of the conductor foil with resin is bonded to the conductor foil (2). Further, the bonding of the support plate and the conductor foil (2) is performed partially rather than the entire surface. The bonding location is preferably the peripheral portion of the support plate. Further, either the bonding of the support plate and the conductive foil (2) or the bonding of the conductive foil (2) and the conductive foil with resin may be performed first. And a pattern process is given by a well-known method suitably about the part of conductor foil with resin among laminated bodies. Further, an upper layer is further laminated thereon as necessary.
[0008]
And a support plate is removed from a laminated body by process (2). Thereby, a laminated board (1) is taken out. It includes a conductor foil (2) and a conductor foil with resin. Thus, a laminated board is manufactured. Of the laminated board thus manufactured, the part derived from the conductor foil (2) is not formed on the lower layer pattern but is originally flat. Therefore, even if a via hole or the like is formed in this portion, the flatness is very high. Therefore, pattern processing can be performed with high accuracy. Further, high processing accuracy can be obtained also when an upper layer is formed thereon and pattern processing is performed.
[0009]
In step (2), the laminate (1) and the support plate are easily separated by cutting the portion where the support plate and the conductive foil (2) are bonded together from the other portion. Then, the laminated plate (1) is taken out.
[0010]
Moreover, in the manufacturing method of the laminated board of this invention, the said conductor foil (2) is partially bonded together on both surfaces of the said support board at the said process (1), and the said resin is attached on each conductor foil (2). Bond the resin layer side of the conductor foil. If it does in this way, in a process (1), the laminated body which has a laminated board (1) on both surfaces of a support plate will be created. Therefore, two laminates (1) can be obtained by appropriately patterning and laminating the upper layer on both sides of this laminate and performing step (2). For this reason , production efficiency is high.
[0011]
Further, if a laminated plate (2) is prepared separately from the laminated plate (1) and the laminated plate (2) is bonded to the laminated plate (1), a laminated plate having a further multilayered structure can be obtained. In this way, a multilayer substrate can be manufactured without prolonging the period required for manufacturing. The lamination plate (1) and the lamination plate (2) may be bonded together before the lamination plate (1) is separated from the support plate, or the lamination plate (1) is separated from the support plate. It may be done after. However, it is more advantageous to first laminate the laminated plate (1) and the laminated plate (2) because the total number of steps can be reduced.
[0012]
Further, the laminated plate (2) may be prepared in advance, or may be manufactured in parallel with the steps (1) to (2). In particular, it is beneficial to prepare a substrate including a standard specification circuit pattern in advance as a laminate (2) and to include a custom specification circuit pattern in the laminate (1). This is because the period from the order to the shipment can be significantly shortened compared with the conventional manufacturing method in which all layers are manufactured after the order is received.
[0013]
As the conductive foil with resin, it is preferable to use a conductive foil having a release material layer on the surface opposite to the resin layer. That is, this release material layer prevents the resin layer and the copper foil from adhering to each other between the adjacent conductor foils with resin when stacked. Therefore, even if a large number of conductor foils with resin are stacked and stored, they can be easily separated and taken out one by one for use in the production of a laminated board. In this case, there is no need for a special storage method such as providing a gap between the conductor foils with resin to be stacked. If an adhesive layer is provided between the conductor foil and the release material layer, the conductor foil and the release material layer do not peel off.
[0014]
The resin layer is usually an epoxy resin layer. The release material is a material having low adhesiveness such as PET (polyethylene terephthalate) resin, PPS (polyphenylene sulfide) resin, PPO (polyphenylene oxide) resin, acrylic resin or fluororesin.
[0015]
A conductor foil with resin of this structure may be manufactured by forming a release layer on one side of the conductor foil and then forming a resin layer on the other side, or conversely forming a resin layer on one side. Then, a release material layer may be formed on the other side. The resin layer may be formed by applying a resin to the conductor foil and drying it. The release material layer may be formed by bonding a release material film to the conductor foil via an adhesive.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments embodying the present invention will be described in detail with reference to the drawings.
[0017]
First, a resin-attached copper foil (hereinafter referred to as “RCC (Resin Coated Copper)”) according to the present embodiment will be described with reference to a cross-sectional view of FIG. The RCC 10 shown in FIG. 1 is obtained by forming an epoxy resin layer 5 on one surface of a copper foil 1 and sticking a PET film 4 on the other surface. An adhesive layer 3 is interposed between the copper foil 1 and the PET film 4. Here, the copper foil 1 is subjected to pattern processing later and becomes a circuit pattern in the laminated board. Here, a 12-micrometer-thick thing is used. The reason why such a thin material can be used is that the RCC 10 is used as a conductor foil with the PET film 4 and is easy to handle. The epoxy resin layer 5 is obtained by applying an epoxy resin to an appropriate thickness on one surface of the copper foil 1 and drying it.
[0018]
The PET film 4 is 25 to 75 μm (more preferably 38 to 50 μm) thick. This thickness was determined in consideration of the absorbability of dents during pressing (thicker is better), the resistance to tearing during peeling (same), and the conformability to the pressed surface during pressing (thin is better). Is. The adhesive layer 3 was made to have a peel force between the copper foil 1 and the PET film 4 of about 5 to 10 gf / 25 mm by using ST (manufactured by Panac Corporation) adhesive or HP (same) adhesive. Is. The RCC 10 is used as a starting material for manufacturing a multilayer laminate.
[0019]
The RCC 10 has one surface covered with the PET film 4 and is excellent in releasability on this surface. For this reason, as shown in FIG. 2, even if many are stacked and stored without any gap, the epoxy resin layer 5 of the upper RCC 10 does not stick to the RCC 10 directly below. Therefore, the RCCs 10 can be easily taken out one by one from the state of being stacked and stored, and can be used for the production of laminated plates. Further, at that time, the epoxy resin layer 5 is not cracked, and further, the fragments and powders are not used for the production of the laminate in a state where they are stuck to the PET film 4 of the RCC 10.
[0020]
The RCC 10 is manufactured as follows. First, the copper foil 1 is prepared, and the PET film 4 is bonded. This laminating is performed by laminating the copper foil 1 and the PET film 4 with a laminator with an adhesive interposed therebetween. As a result, the copper foil 1 and the PET film 4 are not inadvertently peeled off during handling, but can be easily peeled off when a peel force of about 5 to 10 gf / 25 mm or more is applied. Next, an epoxy resin layer 5 is formed on the back side of the surface to which the PET film 4 is bonded. This formation is performed by dissolving the raw material of the epoxy resin in a solvent, kneading to a viscosity of about 7 Pa · s, and applying this using a roll coater. After application, drying is performed at 60 to 80 ° C. Thus, the RCC 10 of FIG. 1 is manufactured. The order of the bonding of the PET film 4 and the formation of the epoxy resin layer 5 may be reversed, and the formation of the epoxy resin layer 5 may be performed prior to the bonding of the PET film 4.
[0021]
Next, manufacture of the laminated board using RCC10 of FIG. 1 is demonstrated. For this purpose, a support plate (glass epoxy substrate or the like), two copper foils (which may be the same as the copper foil 1 in FIG. 1), and two RCCs 10 (in FIG. 1) are prepared. Further, separately from the RCC 10, two laminated plates to be the inner core are prepared separately. Then, first, as shown in FIG. 3, the copper foil 2 is bonded to both the front and back surfaces of the support plate 11 using the adhesive 12. At this time, the adhesive 12 for bonding exists only in the peripheral portion a, and the other portions b are not bonded. The adhesive 12 at this time may be the same as the adhesive of the adhesive layer 3 in FIG.
[0022]
Next, the RCC 10 of FIG. 1 is laminated on both the front and back surfaces of the state of FIG. 3 to obtain the state of FIG. At this time, the epoxy resin layer 5 of the RCC 10 is placed inside both the front and back sides. That is, the epoxy resin layer 5 and the copper foil 2 are brought into contact with each other. Lamination is performed by pressing for about 60 minutes at a temperature of about 170 to 80 ° C. using a pair of mirror press plates from above and below. The pressurizing pressure is about 30 to 40 kgf / cm ² . As a result, the epoxy resin layer 5 and the copper foil 2 are in close contact with each other and integrated as a whole. This is a laminate. In this laminating operation, since the RCC 10 has the PET film 4, the epoxy resin layer 5 is prevented from being damaged as described above. Further, even if pressing is performed in a state where an epoxy resin or other powder is sandwiched, the shape is absorbed by the PET film 4, and no dent is generated on the copper foil 1 of the RCC 10. Moreover, since the PET film 4 is bonded to the copper foil 1 via the adhesive layer 3 in the RCC 10, it will not be inadvertently peeled off during operations such as pressing.
[0023]
Then, the PET films 4 on both the front and back surfaces are peeled off. The PET film 4 can be easily peeled by applying a peel force of about 5 to 10 gf / 25 mm or more. At this time, the thickness of the PET film 4 is 25 μm (more preferably 38 μm) or more, and is not extremely thin. Therefore, the PET film 4 is not extremely thin and does not partly remain on the copper foil 1 of the RCC 10. Thus, the state of FIG. 5 is obtained.
[0024]
Then, an insulating layer and a conductor layer are built up on the front and back surfaces of the laminate shown in FIG. 5 by a known method such as pressing or punching. The laminated body in this state is shown in FIG. In this state, a total of two laminated plates 21 including a plurality of insulating layers and conductor layers are formed on the front and back surfaces of the support plate 11. In this case, a via hole 13 in contact with the copper foil 2 can be included. Needless to say, the number of insulating layers and conductor layers may be larger than that shown in FIG.
[0025]
Then, as shown in FIG. 7, separately prepared laminated plates 22 for the inner layer core are pressed on both the front and back surfaces of the laminated body shown in FIG. 6. At this time, the prepreg 15 is interposed between the laminate shown in FIG. 6 and the upper and lower laminates 22. As a result, as shown in FIG. 8, the laminate plate obtained by laminating the laminate plate 21 obtained by using the RCC 10 and the separately prepared laminate plate 22 for the inner core is formed on both the front and back surfaces of the support plate 11. In total, two sheets are obtained.
[0026]
And this laminated body is cut | disconnected in the position shown to A in FIG. Thereby, the peripheral part to which the support plate 11 and the laminated board 21 of the front and back are adhere | attached with the adhesive agent 12 is removed. In the remaining central portion, the support plate 11 and the front and back laminated plates 21 are not bonded at all, so that two laminated plates 23 shown in FIG. 9 are obtained. The laminated plate 23 is obtained by laminating the laminated plate 21 obtained from the RCC 10 and the inner layer core plate 22. The uppermost conductor layer 14 in FIG. 9 is derived from the copper foil 2 in FIG. Therefore, unlike those formed by plating or the like on an uneven insulating layer, it is essentially flat with no undulations. For this reason, a flat conductor layer 14 having no irregularities on the via hole 13 is obtained. Thereafter, the circuit processing can be performed by performing pattern etching on the conductor layer 14.
[0027]
As described in detail above, according to the present embodiment, not only the epoxy resin layer 5 is formed on one surface of the copper foil 1 but also the PET film 4 is adhered to the back surface thereof, so that they are stacked and stored. However, there will be no adverse effects due to adhesion or cracking of the epoxy resin layer 5 or fragments or powders thereof. In the RCC 10, since the adhesive layer 3 is interposed between the copper foil 1 and the PET film 4, the copper foil 1 and the PET film 4 are not inadvertently peeled off during handling, and a certain amount of peel is caused. The PET film 4 can be easily peeled off by applying force. Furthermore, since the thickness of the PET film 4 is set to 25 μm or more, the PET film 4 is not torn when being peeled and part of the PET film 4 remains on the copper foil 1. Thus, the RCC 10 having excellent handling properties is realized.
[0028]
Then, the RCC 10 is bonded to both the front and back surfaces of the support plate 11 via the copper foil 2 to form the laminated plate 21, and the laminated plate 22 for the inner core is further laminated to form the laminated plate 23. Therefore, by separately preparing the laminated plate 22 for the inner layer core in advance, the time required for production can be greatly shortened, and the number of processes can be halved. Further, since the adhesive 12 between the front and back surfaces of the support plate 11 and the copper foil 2 is only the peripheral portion, the peripheral adhesive portion is cut and removed after the laminated plate 23 is formed. The two laminated plates 23 can be easily separated from the support plate 11 and taken out. Furthermore, since the uppermost conductor layer 14 of the laminated board 23 thus taken out is derived from the copper foil 2 first bonded to the support plate 11, the entire structure including the position immediately above the via hole 13 is essential. Flat. For this reason, pattern processing can be performed with high accuracy, and solderability when mounting components is also good.
[0029]
Thus, a method of manufacturing a laminated board that can obtain a laminated board having a highly flat surface conductor layer in a short time with a small number of steps has been realized. In particular, a board including standard circuit patterns is prepared in advance as a laminated board 22 and a custom-made circuit pattern is formed in the laminated board 21 based on the RCC 10, thereby reducing the period from order receipt to shipment. It can be significantly shortened.
[0030]
In addition, the said embodiment is only a mere illustration and does not limit this invention at all. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, instead of the copper foil 1 or the copper foil 2, a conductive material foil other than copper may be used as the conductor foil. The epoxy resin layer 5 and the PET film 4 may be replaced with other materials having similar characteristics.
[0031]
Further, when the laminated plate 23 is produced using the support plate 11 and the RCC 10, the laminated plate 23 does not necessarily have to be formed on both sides of the support plate 11, and only one side may be used. Further, the laminated plate 22 is not necessarily stacked on the laminated plate 21 formed on the support plate 11 based on the RCC 10. Even if the laminated plate 21 is separated from the support plate 11 in the state shown in FIG. 6, the laminated plate 21 having a flat surface conductor layer is obtained, and it is possible to further build up thereafter.
[0032]
【The invention's effect】
As is apparent from the above description, according to the present invention, there is provided a conductor foil with a resin that is excellent in handleability and does not cause adhesion during storage, cracking of the resin layer, and the like along with its manufacturing method. Moreover, the manufacturing method of the laminated board which can manufacture a laminated board with sufficient flatness in a short manufacturing time using this conductor foil with resin is provided.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a resin-coated copper foil (RCC) according to an embodiment.
FIG. 2 is a diagram showing a state where RCCs are stacked and stored.
FIG. 3 is a view showing a state where a copper foil is partially bonded to both surfaces of a support plate.
4 is a diagram showing a state in which the RCC of FIG. 1 is laminated on both sides of what is shown in FIG. 3;
FIG. 5 is a diagram showing a state where the PET films on both sides of what is shown in FIG. 4 are peeled off.
6 is a diagram showing a state in which build-up is performed on both sides of what is shown in FIG. 5;
7 is a diagram for explaining the lamination of inner core layers on both sides of what is shown in FIG. 6; FIG.
FIG. 8 is a view showing what is shown in FIG. 7 after pressing.
FIG. 9 is a view showing a laminated board cut out from the one shown in FIG.
FIG. 10 is a view showing a conventional copper foil with resin.
[Explanation of symbols]
1 Copper foil (Conductor foil (1))
2 Copper foil (Conductor foil (2))
3 Adhesive Layer 4 PET Film (Releasing Material Layer)
5 Epoxy resin layer 10 Copper foil with resin 11 Support plate 21 Laminated plate (Laminated plate (1))
22 Laminated board (Laminated board (2))

Claims (3)

In a method for manufacturing a laminated board using a conductive foil with resin having a conductive foil (1) and a resin layer on one side thereof, a support plate, and a conductive foil (2),
A step of partially laminating the conductor foil (2) on both surfaces of the support plate, and laminating the surface on the resin layer side of the resin foil with resin on each conductor foil (2) (1) )When,
Forming a circuit pattern on the resin layer by patterning the conductor foil (1);
Bonding the laminate for the inner core onto the laminate comprising the conductor foil (1);
The support plate and the conductive foil (2) are removed from the laminated body by cutting a portion where the support foil and the conductive foil (2) are bonded together, and the conductive foil (2) , a resin layer, a circuit pattern, And a step (2) of taking out the laminate including the laminate for the inner core, and a method for producing the laminate. In the manufacturing method of the laminated board of Claim 1,
As the conductor foil with resin, a conductor foil (1) having a release material layer on the surface opposite to the resin layer,
A method for producing a laminated board, wherein the release material layer is removed after the step (1). In the manufacturing method of the laminated board of Claim 2,
A method for producing a laminated board, wherein the conductor foil with resin is one having an adhesive layer between the conductor foil (1) and the release material layer.

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