JPH07106760A - Manufacture of mutlilayered substrate - Google Patents
Manufacture of mutlilayered substrateInfo
- Publication number
- JPH07106760A JPH07106760A JP25284993A JP25284993A JPH07106760A JP H07106760 A JPH07106760 A JP H07106760A JP 25284993 A JP25284993 A JP 25284993A JP 25284993 A JP25284993 A JP 25284993A JP H07106760 A JPH07106760 A JP H07106760A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- prepreg sheet
- plastic
- aramid
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、両面に金属箔を有する
多層基板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multi-layer substrate having metal foils on both sides.
【０００２】[0002]
【従来の技術】近年、電子機器の小型化、高密度化に伴
い、産業用にとどまらず民生用の分野においても多層基
板が強く要望されるようになってきた。2. Description of the Related Art In recent years, with the miniaturization and high density of electronic devices, there has been a strong demand for multilayer substrates not only in industrial fields but also in consumer fields.
【０００３】このような多層基板では、複数層の回路パ
ターンの間をインナビアホール接続する接続方法と信頼
度の高い接続構造が必要である。In such a multilayer substrate, a connection method for connecting inner layer vias between circuit patterns of a plurality of layers and a highly reliable connection structure are required.
【０００４】以下、従来の多層基板の製造方法における
プリプレグシートとプラスチックシートとの接着工程に
ついて説明する。The process of bonding the prepreg sheet and the plastic sheet in the conventional method for manufacturing a multi-layer substrate will be described below.
【０００５】図２（ａ）〜（C）は従来の多層基板の製
造方法おけるプリプレグシートとプラスチックシートと
の接着工程断面図である。2 (a) to 2 (C) are sectional views showing a step of adhering a prepreg sheet and a plastic sheet in a conventional method for manufacturing a multilayer substrate.
【０００６】まず、図２（ａ）〜（ｃ）における構成要
素について説明する。１は５００ｍｍ角、厚さ２００〜
３００μｍのプリプレグシート１であり、例えば不織布
の芳香族ポリアミド繊維に熱硬化性エポキシ樹脂を含浸
させた、内部に空孔を有する複合材からなる基材（以下
アラミド−エポキシシートと称する）が用いられる。First, the components shown in FIGS. 2A to 2C will be described. 1 is 500mm square, thickness 200 ~
A prepreg sheet 1 having a thickness of 300 μm, for example, a base material (hereinafter referred to as an aramid-epoxy sheet) made of a composite material having pores inside, which is obtained by impregnating a non-woven aromatic polyamide fiber with a thermosetting epoxy resin is used. .
【０００７】２は、片面にＳｉ系の離型剤を塗布した幅
５５０ｍｍ、厚さ１０μｍのロール状のプラスチックシ
ートであり、例えばポリエチレンテレフタレート（以下
ＰＥＴシートと称する）が用いられる。Reference numeral 2 is a roll-shaped plastic sheet having a width of 550 mm and a thickness of 10 μm, one side of which is coated with a Si-based release agent, and for example, polyethylene terephthalate (hereinafter referred to as PET sheet) is used.
【０００８】６はＰＥＴシート２の切断に用いるカッタ
ーであり、７は熱プレスで加熱加圧して接着する際に用
いる５００ｍｍ角、厚さ１ｍｍの、例えばステンレスな
どの金属板である。Reference numeral 6 is a cutter used for cutting the PET sheet 2, and reference numeral 7 is a metal plate of 500 mm square and 1 mm thick, for example, a stainless steel plate or the like, which is used when heating and pressurizing with a hot press.
【０００９】まず、図２（ａ）に示すように、アラミド
−エポキシシート１の長さより３０〜５０ｍｍ長くなる
ようにＰＥＴシート２をカッター６で切断する。ＰＥＴ
シート２は１枚のアラミド−エポキシシート１に対して
２枚用意される。First, as shown in FIG. 2 (a), the PET sheet 2 is cut by a cutter 6 so as to be longer than the length of the aramid-epoxy sheet 1 by 30 to 50 mm. PET
Two sheets 2 are prepared for one aramid-epoxy sheet 1.
【００１０】次に図２（ｂ）に示すように、金属板７上
にアラミド−エポキシシート１の表裏をＰＥＴシート２
の離型剤塗布面で狭持するように重ねられ、さらに前記
金属板７を重ねる。Next, as shown in FIG. 2B, the front and back of the aramid-epoxy sheet 1 are placed on the metal plate 7 and the PET sheet 2
The release agent application surface is stacked so as to sandwich it, and the metal plate 7 is further stacked.
【００１１】そして、図２（ｃ）に示すように、熱プレ
スで１００℃、２０Ｋｇ／ｃｍ2で１０分間加熱加圧し
てアラミド−エポキシシート１の表裏にＰＥＴシート２
が接着される。Then, as shown in FIG. 2 (c), the PET sheet 2 is applied to the front and back of the aramid-epoxy sheet 1 by applying heat and pressure at 100 ° C. and 20 Kg / cm 2 for 10 minutes.
Are glued together.
【００１２】以上のような方法でＰＥＴシート２が表裏
に接着されたアラミド−エポキシシート１を用い、多層
化のベースとなる２層基板の製造方法を説明する。Using the aramid-epoxy sheet 1 in which the PET sheet 2 is adhered to the front and back by the above method, a method for producing a two-layer substrate which is a base for multi-layering will be described.
【００１３】図３（ａ）〜（ｆ）は２層基板の製造方法
を示す工程断面図である。まず、ＰＥＴシート２が接着
されたアラミド−エポキシシート１（図３（ａ））の所
定の箇所に図３（ｂ）に示すようにレーザ加工法などを
利用して貫通孔１３を形成する。3A to 3F are process sectional views showing a method for manufacturing a two-layer substrate. First, as shown in FIG. 3B, a through hole 13 is formed at a predetermined position of the aramid-epoxy sheet 1 (FIG. 3A) to which the PET sheet 2 is adhered, as shown in FIG. 3B.
【００１４】次に図３（ｃ）に示すように、貫通孔１３
に導電性ペースト１４が充填される。導電性ペースト１
４を充填する方法としては、貫通孔１３を有するアラミ
ド−エポキシシート１を印刷機（図示せず）のテーブル
上に設置し、直接に導電性ペースト４がＰＥＴシート２
の上から印刷されて、貫通孔１３に導電性ペースト１４
が重点される。Next, as shown in FIG. 3C, the through hole 13
Is filled with the conductive paste 14. Conductive paste 1
4 is filled with the aramid-epoxy sheet 1 having the through holes 13 on a table of a printing machine (not shown), and the conductive paste 4 is directly transferred to the PET sheet 2.
Printed from above, the conductive paste 14 is applied to the through holes 13.
Is emphasized.
【００１５】このとき、上面のＰＥＴシート２は印刷マ
スクの役割と、アラミド−エポキシシート１の表面の汚
染防止の役割を果たしている。At this time, the PET sheet 2 on the upper surface plays a role of a printing mask and a role of preventing contamination of the surface of the aramid-epoxy sheet 1.
【００１６】次に図３（ｄ）に示すように、アラミド−
エポキシシート１の両面からＰＥＴシート２を剥離す
る。Next, as shown in FIG. 3 (d), aramid-
The PET sheet 2 is peeled off from both sides of the epoxy sheet 1.
【００１７】次に図１（ｅ）に示すように、アラミド−
エポキシシート１の両面に銅箔などの金属箔１５を張り
付ける。Next, as shown in FIG. 1 (e), aramid-
A metal foil 15 such as a copper foil is attached to both surfaces of the epoxy sheet 1.
【００１８】この状態で加熱加圧することにより、図１
（ｆ）に示すように、アラミド−エポキシシート１の厚
みが圧縮される（ｔ１＞ｔ２）とともに、アラミド−エ
ポキシシート１と金属箔５とが接着される。そして表裏
の金属箔５を選択的にエッチングして回路パターンが形
成されて２層基板が得られる。By heating and pressurizing in this state, as shown in FIG.
As shown in (f), the thickness of the aramid-epoxy sheet 1 is compressed (t1> t2), and the aramid-epoxy sheet 1 and the metal foil 5 are bonded together. Then, the metal foils 5 on the front and back are selectively etched to form a circuit pattern to obtain a two-layer substrate.
【００１９】次に、図４（ａ）〜（ｅ）は、従来の多層
基板の製造方法を示す工程断面図であり、４層基板を例
として示している。Next, FIGS. 4 (a) to 4 (e) are process cross-sectional views showing a conventional method for manufacturing a multilayer substrate, showing a four-layer substrate as an example.
【００２０】まず図４（ａ）、（ｂ）に示すように、図
３（ａ）〜（ｆ）に示した工程によって、第１の回路パ
ターン１６を形成した第１の２層基板２１と第２の回路
パターン１７を形成した第２基板２２が製造される。並
行して図４（ｃ）に示す、中間接続体２３が図３（ａ）
〜（ｄ）に示す工程により製造される。First, as shown in FIGS. 4A and 4B, a first two-layer substrate 21 having a first circuit pattern 16 is formed by the steps shown in FIGS. 3A to 3F. The second substrate 22 on which the second circuit pattern 17 is formed is manufactured. In parallel, the intermediate connector 23 shown in FIG. 4C is shown in FIG.
To (d).
【００２１】次に図４（ｄ）に示すように、第１の２層
基板２１の上に中間接続体２３を重ね、その上に第２の
２層基板２２を重ねる。Next, as shown in FIG. 4 (d), the intermediate connector 23 is laid on the first two-layer substrate 21, and the second two-layer substrate 22 is laid on it.
【００２２】そして図４（ｅ）に示すように、加熱加圧
して第１の２層基板２１と第２の２層基板２２とが中間
接続体２３で接着するとともに、第１の回路パターン１
６と第２の回路パターン１７は、導電性ペースト１４に
よりインナビアホール接続されて多層基板が得られる。Then, as shown in FIG. 4E, the first two-layer substrate 21 and the second two-layer substrate 22 are bonded by the intermediate connecting body 23 by heating and pressurizing, and the first circuit pattern 1 is formed.
6 and the second circuit pattern 17 are connected to the inner via hole by the conductive paste 14 to obtain a multilayer substrate.
【００２３】以上述べたように、多層基板の製造の中
で、アラミド−エポキシシート１の表裏に接着されたＰ
ＥＴシート２はレーザー加工等で貫通孔１３を形成し、
導体ペースト１４印刷時のマスクとして使用され、印刷
後は剥離される。As described above, in the manufacture of the multi-layer substrate, the P bonded to the front and back sides of the aramid-epoxy sheet 1 was used.
The ET sheet 2 has through holes 13 formed by laser processing,
It is used as a mask when printing the conductor paste 14, and is peeled off after printing.
【００２４】したがって、アラミド−エポキシシート１
面にはＰＥＴシート２が均一に接着され、このＰＥＴシ
ートは、レーザー加工時や印刷時に剥離しないことが必
要である。Therefore, the aramid-epoxy sheet 1
The PET sheet 2 is evenly adhered to the surface, and it is necessary that this PET sheet does not peel off during laser processing or printing.
【００２５】また、アラミド−エポキシシート１は、後
の加熱加圧によって金属箔１５や２層基板２１、２２間
の接着に用いられるため、加熱加圧時の樹脂成分の流れ
性が接着力を左右する。Further, since the aramid-epoxy sheet 1 is used for adhesion between the metal foil 15 and the two-layer substrates 21, 22 by heating and pressurizing later, the flowability of the resin component at the time of heating and pressurizing the adhesive strength. It depends.
【００２６】アラミド−エポキシシート１の樹脂成分は
Ｂステージ状態にあり、温度と時間によって硬化が進行
し流れ性が低下する。The resin component of the aramid-epoxy sheet 1 is in the B stage state, and curing proceeds and the flowability deteriorates depending on temperature and time.
【００２７】例えば、アラミド−エポキシシートの流れ
性が１５％のものが、１００℃１０分間で１０％に低下
する。For example, when the flowability of the aramid-epoxy sheet is 15%, it decreases to 10% at 100 ° C. for 10 minutes.
【００２８】樹脂成分の流れ性が低下すると、後の多層
基板の製造工程で、樹脂不足による接着力の弱い箇所や
空洞部が発生し、品質上大きな問題となるため、アラミ
ド−エポキシシート１にＰＥＴシート２を接着する際の
熱履歴を短くして、アラミド−エポキシシート１の樹脂
成分の流れ性を確保することが重要となる。When the flowability of the resin component is lowered, in the subsequent manufacturing process of the multi-layer substrate, a portion having weak adhesive force or a hollow portion is generated due to lack of resin, which causes a serious problem in quality. It is important to shorten the heat history when bonding the PET sheet 2 and ensure the flowability of the resin component of the aramid-epoxy sheet 1.
【００２９】[0029]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、プリプレグシートの全面を同時に加熱加
圧するため、プラスチックシートとプリプレグシート間
の空気溜まりが除去できず、プラスチックシートにシワ
の発生や密着性のばらつきを招きやすい。そして、この
密着が不十分で、プラスチックシートとプリプレグシー
ト間に間隙部が発生すると、貫通孔開け後の導電ペース
ト充填時に、導電ペーストがこの隙間部に入り込み貫通
孔径が見かけ上大きくなり、微細化の妨げや隣接パター
ンや隣接貫通孔と短絡するなどの問題があった。However, in the above-mentioned conventional structure, since the entire surface of the prepreg sheet is heated and pressed at the same time, the air pocket between the plastic sheet and the prepreg sheet cannot be removed, and wrinkles or adhesion are adhered to the plastic sheet. It tends to cause variations in sex. If this adhesion is insufficient and a gap is generated between the plastic sheet and the prepreg sheet, the conductive paste enters this gap when the conductive paste is filled after the through holes are opened, and the through hole diameter is apparently increased, resulting in a finer size. However, there are problems such as hindrance to the contact and short-circuit with the adjacent pattern or the adjacent through hole.
【００３０】また、接着時の熱履歴が長く、プラスチッ
クシートの樹脂成分の流れ性が低下して、多層基板の製
造過程で樹脂不足を招き品質上大きな問題となってい
た。Further, the heat history at the time of bonding is long, the flowability of the resin component of the plastic sheet is lowered, and a resin shortage is caused in the manufacturing process of the multilayer substrate, which is a serious quality problem.
【００３１】また、従来の製造方法では、プラスチック
シート切断、プリプレグシートとの重ね合わせ、熱プレ
スでの加熱加圧と、各工程が不連続であるため生産性の
面でも問題があった。Further, in the conventional manufacturing method, there is a problem in terms of productivity because the respective steps of cutting the plastic sheet, stacking with the prepreg sheet, heating and pressing with a hot press are discontinuous.
【００３２】本発明は上記従来の課題を解決するもの
で、プリプレグとプラスチックシートを短時間で安定し
て接着し、高性能、高品質の多層基板を実現するための
多層基板の製造方法を提供することを目的とするもので
ある。The present invention solves the above-mentioned conventional problems, and provides a method for manufacturing a multi-layer substrate for stably adhering a prepreg and a plastic sheet in a short time to realize a high-performance, high-quality multi-layer substrate. The purpose is to do.
【００３３】[0033]
【課題を解決するための手段】上記目的を達成するため
に、本発明の多層基板の製造方法は、プラスチックシー
トとプリプレグシートとの接着工程において、プリプレ
グシートの表裏を片面に離型剤を塗布したプラスチック
シートの離型剤塗布面で狭持する形で配置し、所定の温
度と圧力を加えることのできる回転ロールを通過させて
プリプレグシートの樹脂成分を軟化させ加圧して接着す
るものである。In order to achieve the above object, in the method for producing a multilayer substrate of the present invention, a releasing agent is applied to one surface of the front and back surfaces of the prepreg sheet in the step of adhering the plastic sheet and the prepreg sheet. It is arranged so as to be sandwiched by the release agent application surface of the plastic sheet, and is passed through a rotating roll capable of applying a predetermined temperature and pressure to soften the resin component of the prepreg sheet and pressurize it for adhesion. .
【００３４】[0034]
【作用】上記のように構成された本発明によれば回転ロ
ールによって順次均一に加熱加圧することで空気溜まり
を押し出しながらプリプレグシートとプラスチックシー
トを接着するため、空気残りによるシワの発生がなくな
ると同時に密着性が安定して、貫通孔あけ後の導電ペー
ストが貫通穴内に収まりプリプレグシートとプラスチッ
クシートの間隙に入り込んで発生する隣接パターンや隣
接貫通孔との短絡を防止できる。According to the present invention configured as described above, since the prepreg sheet and the plastic sheet are bonded while pushing out the air pocket by heating and pressurizing them in order by the rotating rolls, wrinkles due to air remaining can be eliminated. At the same time, the adhesiveness is stable, and it is possible to prevent a short circuit between an adjacent pattern and an adjacent through hole, which occurs when the conductive paste after the through hole is opened is contained in the through hole and enters the gap between the prepreg sheet and the plastic sheet.
【００３５】また、回転ロールでの接着は線接触で数秒
で順次完了するため、接着後のプリプレグシートの樹脂
成分の流れ性の低下がなく、多層基板の製造過程での樹
脂不足をなくすことができる。また、回転ロールで連続
して接着することが可能となり生産性の向上が図れる。Further, since the bonding with the rotating roll is completed in a line contact in a few seconds, the flowability of the resin component of the prepreg sheet after bonding is not deteriorated, and the lack of resin in the manufacturing process of the multilayer substrate can be eliminated. it can. In addition, since it is possible to continuously bond with a rotating roll, productivity can be improved.
【００３６】[0036]
【実施例】以下、本発明の多層基板の製造方法の一実施
例における、プリプレグシートとプラスチックシートと
の接着工程について説明する。EXAMPLES The step of adhering the prepreg sheet and the plastic sheet in one example of the method for producing a multilayer substrate of the present invention will be described below.
【００３７】図１はプリプレグシートとプラスチックシ
ートとの接着に用いるラミネータのロール構成と接着工
程断面図である。FIG. 1 is a roll configuration of a laminator used for bonding a prepreg sheet and a plastic sheet and a sectional view of the bonding process.
【００３８】１は、例えば不織布の芳香族ポリアミド繊
維に熱硬化性エポキシ樹脂を含浸させた、内部に空孔を
有する複合材からなる５００ｍｍ角に加工した厚さ２０
０〜３００μｍのアラミド−エポキシシート（プリプレ
グシート）であり、２は片面にＳｉ系の離型剤を塗布し
た幅５００ｍｍ、厚さ１０μｍのロール状のＰＥＴシー
ト（プラスチックシート）である。Numeral 1 is a thickness of 20 mm, which is made of, for example, a composite material obtained by impregnating a non-woven aromatic polyamide fiber with a thermosetting epoxy resin and having pores inside, into a 500 mm square.
An aramid-epoxy sheet (prepreg sheet) having a thickness of 0 to 300 μm, and 2 is a roll-shaped PET sheet (plastic sheet) having a width of 500 mm and a thickness of 10 μm, one side of which is coated with a Si-based release agent.
【００３９】ラミネーターの上下に配置したＰＥＴシー
ト取り付けロールには、ロール状の前記ＰＥＴシート２
が離型剤塗布面でアラミド−エポキシシート１を狭持す
る形で取り付けている。For the PET sheet mounting rolls arranged above and below the laminator, the rolled PET sheet 2 is used.
Is attached so that the aramid-epoxy sheet 1 is sandwiched by the release agent application surface.
【００４０】そして、進行方向には、予熱ロール３と加
熱ロール４の順でそれぞれ上下に配置している。予熱ロ
ール３と加熱ロール４は、φ７０ｍｍの金属ロールに厚
さ５ｍｍ、ゴム硬度７０の耐熱シリコンゴムをライニン
グした、径φ８０ｍｍ、長さ７００ｍｍのロールであ
り、予熱ロール３の表面温度を８０〜９０℃、加熱ロー
ル４の表面温度を１２０℃にコントロールし、前記予熱
ロール３と加熱ロール４は２Ｋｇ／ｃｍ2のエアー圧で
加圧している。ロールの送り速度は２ｍ／ｍｉｎであ
る。The preheating roll 3 and the heating roll 4 are arranged in the vertical direction in the traveling direction. The preheating roll 3 and the heating roll 4 are rolls having a diameter of 80 mm and a length of 700 mm obtained by lining a heat-resistant silicon rubber having a thickness of 5 mm and a rubber hardness of 70 on a metal roll having a diameter of 70 mm and a surface temperature of the preheating roll 3 of 80 to 90. C., the surface temperature of the heating roll 4 is controlled to 120.degree. C., and the preheating roll 3 and the heating roll 4 are pressurized with an air pressure of 2 Kg / cm.sup.2. The roll feed rate is 2 m / min.
【００４１】この装置の初期動作は、まず、上下に配置
されたＰＥＴシート２のみが互いに重ね合わさった状態
で予熱ローラ３、加圧ローラ４間に挿入される。このと
き、ＰＥＴシート２は、離型剤塗布面が互いに接触する
ように重ね合わされる。In the initial operation of this apparatus, first, only the PET sheets 2 arranged above and below are inserted between the preheating roller 3 and the pressure roller 4 in a state of being superposed on each other. At this time, the PET sheets 2 are stacked so that the release agent application surfaces are in contact with each other.
【００４２】次に、重ね合わされたＰＥＴシート２の先
端が加熱ロール４を通過した状態で、アラミド−エポキ
シシート１を予熱ロール３の回転部に挟持されたＰＥＴ
シート２の間に投入する。投入されたアラミド−エポキ
シシート１は、ＰＥＴシート２と共に移動して加熱ロー
ル４を通過するが、ローラの加熱によってアラミド−エ
ポキシシート４の樹脂成分は軟化し、さらにローラの加
圧によってＰＥＴシート２との接着が行われる。Next, the aramid-epoxy sheet 1 was sandwiched between the rotating parts of the preheating roll 3 with the PET sheet 2 superposed on the heating roll 4 at the front end thereof.
Put between sheets 2. The charged aramid-epoxy sheet 1 moves along with the PET sheet 2 and passes through the heating roll 4, but the resin component of the aramid-epoxy sheet 4 is softened by the heating of the roller, and the PET sheet 2 is further pressed by the pressing of the roller. Is adhered to.
【００４３】２枚目以降のアラミド−エポキシシート１
とＰＥＴシートとの接着については、アラミド−エポキ
シシート１を、予熱ロール３の回転部に挟持されたＰＥ
Ｔシート２の間に順次投入してやれば連続的にＰＥＴシ
ートに接着でき、ＰＥＴシート２の切断は接着が完了し
だい順次行える。Second and subsequent aramid-epoxy sheets 1
As for the adhesion between the PET sheet and the PET sheet, the aramid-epoxy sheet 1 is sandwiched between the rotating parts of the preheating roll 3 and PE.
If they are sequentially charged between the T sheets 2, they can be continuously bonded to the PET sheet, and the cutting of the PET sheet 2 can be performed sequentially after the bonding is completed.
【００４４】本実施例の接着工程は、回転ロールによっ
て順次均一に加熱加圧が行われるので、ＰＥＴシート２
とアラミド−エポキシシート１との押圧は確実に行わ
れ、両者の間の空気は確実に排除されるので、空気溜ま
りやシワの発生は生じることがなく、極めて密着性に優
れた接合が安定して実現できる。In the bonding step of this embodiment, the PET sheet 2 is heated and pressed in order by the rotating rolls.
The aramid-epoxy sheet 1 and the aramid-epoxy sheet 1 are surely pressed, and the air between the two is surely removed, so that air pockets and wrinkles do not occur, and bonding with excellent adhesion is stable. Can be realized.
【００４５】実際に１００枚のアラミド−エポキシシー
ト１に接着したが、全数ともＰＥＴシート２のシワの発
生や密着性のばらつきはなかった。Actually, 100 pieces of aramid-epoxy sheet 1 were adhered to each other, but there were no wrinkles or variations in adhesiveness of PET sheets 2 in all of them.
【００４６】また、多層基板の製造法で大きな課題とな
るアラミド−エポキシシート１の樹脂成分の流れ性も、
回転ロールでの接着が線接触で数秒で順次完了するため
熱履歴が短く、接着前後とも１５％と変化がないことを
確認した。Also, the flowability of the resin component of the aramid-epoxy sheet 1 which is a major problem in the method of manufacturing a multilayer substrate,
It was confirmed that the thermal history was short because the adhesion with the rotating roll was completed linearly in a few seconds by line contact, and there was no change of 15% before and after the adhesion.
【００４７】また、生産性も実施例の２ｍ／ｍｉｎの速
度でも５００ｍｍ角アラミド−エポキシシート１を４枚
／分で連続的に接着でき、飛躍的に生産性が向上した。Further, with respect to the productivity, the 500 mm square aramid-epoxy sheet 1 can be continuously bonded at 4 sheets / min even at the speed of 2 m / min in the embodiment, and the productivity is dramatically improved.
【００４８】次に、以上のような方法でＰＥＴシート２
を表裏に接着したアラミド−エポキシシート１を用いて
４層基板を製造した。以降の多層化のベースとなる２層
基板の製造方法や多層基板の製造方法は従来例と全て同
一であるため、ここでは説明を省略する。Next, the PET sheet 2 is prepared by the above method.
A four-layer substrate was manufactured using the aramid-epoxy sheet 1 having the front and back surfaces adhered. Since the manufacturing method of the two-layer substrate and the manufacturing method of the multilayer substrate, which will be the base of the subsequent multilayering, are the same as those of the conventional example, the description thereof will be omitted here.
【００４９】この様にして得られた４層基板は、貫通孔
への導電ペースト印刷時のマスクとして使用されるＰＥ
Ｔシート２に空気残りによるシワがなく、均一にアラミ
ド−エポキシシート１に接着されているため、導電ペー
ストが貫通孔内に収まりアラミド−エポキシシート１と
ＰＥＴシート２の間隙に入り込んで発生する隣接パター
ンや隣接貫通孔との短絡現象の発生は皆無となった。The four-layer substrate thus obtained is used as a mask for printing a conductive paste on the through holes.
Since the T sheet 2 has no wrinkles due to residual air and is evenly adhered to the aramid-epoxy sheet 1, the conductive paste is accommodated in the through holes and enters the gap between the aramid-epoxy sheet 1 and the PET sheet 2 to cause the adjacent occurrence. There was no occurrence of a short circuit phenomenon between the pattern and adjacent through holes.
【００５０】また、アラミド−エポキシシート１の樹脂
成分の流れ性の低下がなくなったことで、多層基板製造
時の樹脂不足もなく、高品質の多層基板が得られた。Further, since the flowability of the resin component of the aramid-epoxy sheet 1 was eliminated, there was no shortage of resin during the production of the multilayer substrate, and a high quality multilayer substrate was obtained.
【００５１】以上のように、上記実施例によれば、プリ
プレグシートの表裏にプラスチックシートを接着する工
程において、回転ロールで加熱加圧して接着することに
より、空気残りによるシワの発生がなくなると同時に密
着性が安定して、貫通孔あけ後の導電ペーストが貫通穴
内に収まりプリプレグとプラスチックシートの間隙に入
り込んで発生する隣接パターンや隣接貫通孔との短絡を
防止できる。As described above, according to the above-mentioned embodiment, in the step of adhering the plastic sheets to the front and back of the prepreg sheet, heating and pressurizing with a rotating roll to adhere the prepreg sheet eliminates the generation of wrinkles due to the air remaining. The adhesiveness is stable, and it is possible to prevent a short circuit between an adjacent pattern and an adjacent through hole, which occurs when the conductive paste after the through hole is opened is contained in the through hole and enters the gap between the prepreg and the plastic sheet.
【００５２】また、回転ロールでの接着は線接触で数秒
で完了するため、接着後のプリプレグシートの樹脂成分
の流れ性の低下がなく、多層基板の製造過程での樹脂不
足をなくし高品質の多層基板を実現できる。また、連続
接着が可能となり生産性の向上が図れる。Further, since the bonding with the rotating roll is completed in a few seconds by the line contact, the flowability of the resin component of the prepreg sheet after bonding is not deteriorated, and the lack of resin in the manufacturing process of the multi-layer substrate is eliminated to obtain high quality. A multilayer board can be realized. In addition, continuous adhesion is possible and productivity can be improved.
【００５３】なお、ここでは不織布に熱硬化性樹脂を含
浸させたプリプレグシートを用いたが、織布に熱硬化性
樹脂を含浸させたプリプレグシートを用いても同様の結
果を得ている。Although a prepreg sheet obtained by impregnating a non-woven fabric with a thermosetting resin is used here, similar results are obtained by using a prepreg sheet obtained by impregnating a woven fabric with a thermosetting resin.
【００５４】また、ここでは所定形状に加工したプリプ
レグシートを用いたが、連続状のプリプレグシートを用
いても同様の結果を得ている。Although the prepreg sheet processed into a predetermined shape is used here, the same result is obtained by using a continuous prepreg sheet.
【００５５】[0055]
【発明の効果】以上述べたように、本発明によれば、高
信頼性の多層基板を優れた量産性で製造できるという、
工業上優れた効果が得られるものである。As described above, according to the present invention, a highly reliable multilayer substrate can be manufactured with excellent mass productivity.
This is an industrially excellent effect.
【図１】本発明の多層基板の製造方法の一実施例におけ
る、プリブレグシートとプラスチックシートとの接着工
程を示す断面図FIG. 1 is a cross-sectional view showing a step of adhering a prepreg sheet and a plastic sheet in an embodiment of a method for manufacturing a multilayer substrate of the present invention.
【図２】従来例のプリブレグシートとプラスチックシー
トとの接着工程を示す断面図FIG. 2 is a cross-sectional view showing a bonding process between a conventional prepreg sheet and a plastic sheet.
【図３】従来例の２層基板の製造方法を示す工程断面図FIG. 3 is a process sectional view showing a method for manufacturing a two-layer substrate of a conventional example.
【図４】従来例の４層基板の製造方法を示す工程断面図FIG. 4 is a process sectional view showing a method for manufacturing a four-layer substrate of a conventional example.
１、１１ アラミド−エポキシシート（プリプレグシー
ト） ２、１２ ＰＥＴシート（プレスチックシート） ３ 予熱ロール ４ 加熱ロール ５ ＰＥＴシート取り付けロール ６ カッター ７ 金属板 １３ 貫通孔 １４ 導電性ペースト １５ 金属箔 １６ 第１の回路パターン １７ 第２の回路パターン ２１ 第１の２層基板 ２２ 第２の２層基板 ２３ 中間接続体1, 11 Aramid-epoxy sheet (prepreg sheet) 2, 12 PET sheet (plastic sheet) 3 Preheating roll 4 Heating roll 5 PET sheet mounting roll 6 Cutter 7 Metal plate 13 Through hole 14 Conductive paste 15 Metal foil 16 1st Circuit pattern 17 Second circuit pattern 21 First two-layer substrate 22 Second two-layer substrate 23 Intermediate connector
Claims (3)
を備えた被圧縮性を有するプリプレグシートに貫通孔を
あけ、その穴に導体ペーストを充填し、前記プラスチッ
クを剥離した後、プリプレイグシートの表裏に金属材を
加熱圧接し、この金属材にエッチングによって回路形成
したものを複数枚積層する多層基板の製造方法であっ
て、前記プラスチックシートとプリプレグシートとの接
着工程において、所定形状に加工されたあるいは連続状
の被圧縮性を有するプリプレグシートの表裏を片面に離
型剤を塗布したプラスチックシートの離型剤塗布面で狭
持する形で配置し、これを所定の温度と圧力を有する回
転ロールに通過させてプリプレグシートの樹脂成分を軟
化させ加圧して接着する多層基板の製造方法。1. A through hole is formed in a prepreg sheet having compressibility and provided with plastic sheets having releasability on the front and back sides, a conductor paste is filled in the hole, and the plastic is peeled off. A method for manufacturing a multi-layer substrate in which a metal material is heated and pressure-bonded to the front and back, and a plurality of circuits formed by etching the metal material are laminated, and the metal sheet is processed into a predetermined shape in the step of adhering the plastic sheet and the prepreg sheet. Or, the front and back of a continuous prepreg sheet with compressibility are arranged so as to be sandwiched by the release agent application surface of the plastic sheet coated with the release agent on one side, and this is rotated at a predetermined temperature and pressure. A method for manufacturing a multi-layer substrate in which a resin component of a prepreg sheet is passed through a roll to be softened and pressure is applied to bond the resin component.
布と熱硬化性樹脂との複合材であり、かつ多孔質である
請求項１記載の多層基板の製造方法。2. The method for producing a multilayer substrate according to claim 1, wherein the prepreg sheet having compressibility is a composite material of a non-woven fabric and a thermosetting resin and is porous.
と熱硬化性樹脂との複合材である請求項１記載の多層基
板の製造方法。3. The method for producing a multilayer substrate according to claim 1, wherein the prepreg sheet having compressibility is a composite material of a woven cloth and a thermosetting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25284993A JP2768236B2 (en) | 1993-10-08 | 1993-10-08 | Method for manufacturing multilayer substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25284993A JP2768236B2 (en) | 1993-10-08 | 1993-10-08 | Method for manufacturing multilayer substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07106760A true JPH07106760A (en) | 1995-04-21 |
| JP2768236B2 JP2768236B2 (en) | 1998-06-25 |
Family
ID=17243037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25284993A Expired - Lifetime JP2768236B2 (en) | 1993-10-08 | 1993-10-08 | Method for manufacturing multilayer substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2768236B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001056793A1 (en) * | 2000-02-01 | 2001-08-09 | Matsushita Electric Industrial Co., Ltd. | Printing plate, and printing method using the same |
| US6694612B1 (en) | 1999-05-18 | 2004-02-24 | Matsushita Electric Industrial Co., Ltd. | Mask film having a non-parting portion |
| US6700071B2 (en) | 2000-08-17 | 2004-03-02 | Matsushita Electric Industrial Co., Ltd. | Multi-layer circuit board having at least two or more circuit patterns connected |
| US6833042B2 (en) | 2000-10-16 | 2004-12-21 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board |
| US7105277B2 (en) | 2002-09-24 | 2006-09-12 | Matsushita Electric Industrial Co., Ltd. | Printing plate, circuit board and method of printing circuit board |
| JP2007136835A (en) * | 2005-11-17 | 2007-06-07 | Hitachi Chem Co Ltd | Method and apparatus for producing laminate |
| JP2007294644A (en) * | 2006-04-25 | 2007-11-08 | Matsushita Electric Ind Co Ltd | Method of manufacturing prepreg filled with paste, and method of manufacturing circuit board |
| US8211494B2 (en) | 2003-12-26 | 2012-07-03 | Panasonic Corporation | Method and apparatus for manufacturing circuit board |
| CN112118679A (en) * | 2020-09-07 | 2020-12-22 | 劳业鸿 | Pre-buried full hole plugging method for printed circuit board |
-
1993
- 1993-10-08 JP JP25284993A patent/JP2768236B2/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6694612B1 (en) | 1999-05-18 | 2004-02-24 | Matsushita Electric Industrial Co., Ltd. | Mask film having a non-parting portion |
| US7066344B2 (en) | 1999-05-18 | 2006-06-27 | Matsushita Electric Industrial Co., Ltd. | Mask film, its manufacturing method, and manufacturing method of circuit board using the same |
| US6776090B2 (en) | 2000-02-01 | 2004-08-17 | Matsushita Electric Industrial Co., Ltd. | Printing plate, and printing method using the same |
| WO2001056793A1 (en) * | 2000-02-01 | 2001-08-09 | Matsushita Electric Industrial Co., Ltd. | Printing plate, and printing method using the same |
| US6700071B2 (en) | 2000-08-17 | 2004-03-02 | Matsushita Electric Industrial Co., Ltd. | Multi-layer circuit board having at least two or more circuit patterns connected |
| US7754321B2 (en) | 2000-10-16 | 2010-07-13 | Panasonic Corporation | Method of manufacturing clad board for forming circuitry, clad board and core board for clad board |
| US6833042B2 (en) | 2000-10-16 | 2004-12-21 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board |
| US7105277B2 (en) | 2002-09-24 | 2006-09-12 | Matsushita Electric Industrial Co., Ltd. | Printing plate, circuit board and method of printing circuit board |
| CN1318228C (en) * | 2002-09-24 | 2007-05-30 | 松下电器产业株式会社 | Printing plate, circuit board and method of printing circuit board |
| EP1780034A1 (en) | 2002-09-24 | 2007-05-02 | Matsushita Electric Industrial Co., Ltd. | Printing plate, printing board, and printing method for printed board |
| US8211494B2 (en) | 2003-12-26 | 2012-07-03 | Panasonic Corporation | Method and apparatus for manufacturing circuit board |
| JP2007136835A (en) * | 2005-11-17 | 2007-06-07 | Hitachi Chem Co Ltd | Method and apparatus for producing laminate |
| JP2007294644A (en) * | 2006-04-25 | 2007-11-08 | Matsushita Electric Ind Co Ltd | Method of manufacturing prepreg filled with paste, and method of manufacturing circuit board |
| CN112118679A (en) * | 2020-09-07 | 2020-12-22 | 劳业鸿 | Pre-buried full hole plugging method for printed circuit board |
| CN112118679B (en) * | 2020-09-07 | 2021-07-20 | 江西领德辉电路有限公司 | Pre-buried full hole plugging method for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2768236B2 (en) | 1998-06-25 |
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