JP2003077756A - Method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce positional discrepancies and distortions of conductor films, etc., in a green laminated unit which is obtained by layering a plurality of ceramic green sheets and pressing them in order to make a laminated ceramic electronic components. SOLUTION: A plurality of ceramic green sheets 1 to be layered are divided into a plurality of groups, and a plurality of ceramic green sheets 1 are layered in the respective groups to form a plurality of preparatory laminated units 4-6. Then a step in which the plurality of preparatory laminated units 4-6 are layered is employed and, in order to make the preparatory laminated unit 4-6, the plurality of ceramic green sheets 1 are layered between elongation preventive sheets 3 provided in a layered direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated ceramic electronic component, and more particularly to improvements in a lamination process and a pressing process of a plurality of ceramic green sheets.

[0002]

2. Description of the Related Art As a conventional technique which is of interest to the present invention, there is one disclosed in Japanese Patent Laid-Open No. 4-28812.

According to this conventional technique, in producing a raw laminate for a multilayer ceramic electronic component, a plurality of ceramic green sheets to be laminated are divided into a plurality of groups, and a plurality of ceramic green sheets are provided for each group. To produce a plurality of preliminary laminates by laminating and pressing, and then obtaining a final raw laminate for a laminated ceramic electronic component by laminating and pressing a plurality of preliminary laminates. I have to.

According to this prior art, in order to obtain a final green laminate, the positional accuracy in lamination is improved as compared with the case where a method of laminating and pressing all of a plurality of ceramic green sheets at once is adopted. In addition, there is an advantage that the distortion of the conductor film formed on the ceramic green sheet can be reduced. Further, when the ceramic green sheet is provided with via-hole conductors or through-hole conductors, it is possible to prevent the via-hole conductors or through-hole conductors from being displaced.

Similar or similar techniques are also disclosed in, for example, Japanese Patent Laid-Open Nos. 3-283595 and 9-12.
It is also described in Japanese Patent No. 9486.

[0006]

However, the above-mentioned prior art has the following problems to be solved.

As a result of the pressing process, a plurality of pre-laminates may be produced due to variations in the press conditions for obtaining each pre-laminate and differences in the arrangement state of the conductor film, the via-hole conductor and / or the through-hole conductor between the pre-laminates. The pre-laminate may exhibit different deformations such as elongation and strain that are different from each other. Also, when a via-hole conductor or a through-hole conductor is formed, due to thermal influence in the process of providing a through-hole for the via-hole conductor or the through-hole conductor or filling the through-hole with a conductive paste, etc. However, the preliminary laminate may be distorted.

As a result, in order to obtain the final raw laminate, after laminating and pressing a plurality of preliminary laminates,
Misalignment may occur between the preliminary laminates.

As described above, when the positional deviation occurs between the preliminary laminated bodies, when the obtained laminated ceramic electronic component is a laminated ceramic capacitor, variations in capacitance occur, or via hole conductors or through holes are formed. In a multilayer ceramic substrate provided with a conductor, connection failure may occur in the via-hole conductor or the through-hole conductor.

To solve these problems, for example,
If there is a margin in the design, such as increasing the size of the land for connection, it will hinder the increase in capacity while reducing the size of the monolithic ceramic capacitor and the increase in wiring density while reducing the size of the multilayer ceramic substrate. Not preferable.

Therefore, an object of the present invention is to provide a method of manufacturing a multilayer ceramic electronic component which can solve the above problems.

[0012]

The present invention is directed to a process for producing a plurality of ceramic green sheets, a process for producing a green sheet, a process for forming a conductor film on a specific ceramic green sheet, and a process for forming a plurality of ceramics. It is directed to a method for producing a multilayer ceramic electronic component, which comprises a green laminate laminated raw laminate, a laminate producing step, and a raw laminate firing step, which comprises a firing step, In order to solve the above-mentioned technical problem, the following features are provided.

In the present invention, an elongation prevention sheet is prepared.

Further, in the above-mentioned laminated body manufacturing process, a plurality of ceramic green sheets are divided into a plurality of groups,
A step of laminating a plurality of ceramic green sheets for each group to produce a plurality of preliminary laminates, and then a step of laminating a plurality of preliminary laminates to obtain a raw laminate are performed.

In the step of producing the above-mentioned preliminary laminate, a plurality of ceramic green sheets are pressed in a state of being sandwiched by elongation-preventing sheets in the laminating direction.

Further, in the step of laminating a plurality of preliminary laminates, a step of peeling only the stretch-preventing sheets located on the mutually opposing surfaces of the two preliminary laminates to be laminated to expose the mutually opposing surfaces. And a step of joining the two preliminary laminates to be laminated to each other with the exposed surfaces being in contact with each other.

In the present invention, the entire raw laminate obtained in the step of laminating the preliminary laminate is pressed under the pressing conditions in the step of pressing the plurality of ceramic green sheets in the step of producing the preliminary laminate. It is preferable to further carry out a final pressing step of finally pressing at.

In addition, before the final pressing step described above, a step of peeling off the elongation-preventing sheet located on at least one end face of the green laminated body in the laminating direction, and after the final pressing step, It is preferable to further carry out the step of planarly polishing at least one of the end faces in the stacking direction.

In the step of pressing a plurality of ceramic green sheets in the step of producing the preliminary laminate, it is preferable to apply pressing conditions of a pressure of 500 kgf / cm ² or less and a temperature of 100 ° C. or less.

When the present invention is applied to, for example, a method for manufacturing a multilayer ceramic substrate having a via-hole conductor and / or a through-hole conductor, the preliminary laminated body sandwiched in the laminating direction by an elongation preventing sheet is used. Forming a full-through passage having both ends opened and / or a half-through passage having only one end opened for providing a via-hole conductor or a through-hole conductor; and a full-through passage and / or a half-through passage It is preferable to further carry out the step of filling the conductive paste with the conductive paste.

Instead of the above-described preferred embodiment, or in addition to this embodiment, a through hole for providing a via-hole conductor or a through-hole conductor in a specific ceramic green sheet before stacking the ceramic green sheets. You may make it perform the process of forming and the process of filling a through-hole with a conductive paste.

At the same time as the step of forming the full-through passages and / or the half-through passages described above, it is preferable to form the through-holes for alignment in the preliminary laminated body sandwiched by the elongation preventing sheets in the laminating direction. In this case, in the step of stacking the preliminary laminates, the plurality of preliminary laminates are aligned with each other based on the alignment through holes.

The stretch-preventing sheet is preferably composed of a resin film.

The surface of the elongation-preventing sheet that contacts the ceramic green sheet is preferably roughened.

A pressure-sensitive adhesive may be applied to the surface of the elongation-preventing sheet that contacts the ceramic green sheet.

In the present invention, before the step of joining the two preliminary laminates to be laminated to each other, a quick-drying adhesive may be applied to the peripheral portions of the surfaces of the preliminary laminates that contact each other. Good.

In the present invention, at least one of the plurality of preliminary laminates may be composed of only a plurality of ceramic green sheets on which no conductor is formed.

[0028]

1 to 3 are sectional views sequentially showing typical steps included in a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention. Here, a method for manufacturing a multilayer ceramic substrate is shown.

First, as shown in FIG. 1 (1), a plurality of ceramic green sheets 1 are produced. In the production of the ceramic green sheet 1, as is well known, for example, a doctor blade method is applied on a carrier film made of polyethylene terephthalate or the like to form the ceramic slurry into a sheet shape.

Next, the specific ceramic green sheet 1
The conductor film 2 is formed thereon with a desired pattern.
The conductor film 2 is formed by applying a conductive paste containing a conductive metal powder such as nickel, silver or copper onto the corresponding ceramic green sheet 1 by a screen printing method or the like.

The ceramic green sheet 1 (a) shown at the top in FIG. 1 (1) is, so to speak, a dummy ceramic green sheet that is at least partially polished and removed in a later step. . Also in this dummy ceramic green sheet 1 (a), the conductor film 2 is the second ceramic green sheet 1 from the top.
It is formed with the same pattern as the upper conductor film 2. This is to serve as a positioning mark when a through hole for a via-hole conductor or the like is provided in a later step.

On the other hand, as shown in FIG. 1 (2), an elongation preventing sheet 3 is prepared. The elongation-preventing sheet 3 preferably has a thickness of 10 to 250 μm, and as an example, 5
It is composed of a film made of polyethylene terephthalate having a thickness of 0 μm. The elongation-preventing sheet 3 may be made of polyethylene terephthalate, a resin film made of polyethylene naphthalate, polypropylene, polyethylene, or the like, or may be made of a thin metal plate made of stainless steel or the like.

As shown in FIG. 1 (2), the plurality of ceramic green sheets 1 are divided into a plurality of groups, for example, three groups, and the plurality of ceramic green sheets 1 are laminated in each group to obtain three spares. Stacks 4, 5
And 6 are made.

Next, each of these preliminary laminates 4 to 6 is pressed in a state in which a plurality of ceramic green sheets 1 are sandwiched by extension preventing sheets 3 in the laminating direction.
In this pressing step, a pressing condition of a pressure of 500 kgf / cm ² or less and a temperature of 100 ° C. or less, for example, a pressing condition of a pressure of 100 kgf / cm ² and a temperature of 75 ° C. is applied.

A plurality of ceramic green sheets 1
In order to obtain a state in which the sheet is sandwiched in the stacking direction by the stretch-preventing sheet 3, one of the stretch-preventing sheet 3 is usually provided on the stacking stage for carrying out the stacking process of the ceramic green sheet 1.
Is set, the ceramic green sheets 1 are laminated thereon, and the other elongation preventing sheet 3 is set on the uppermost ceramic green sheet 1.
In the lamination process of this ceramic green sheet 1,
Each time one ceramic green sheet 1 is laminated, preliminary pressing may be performed to press the ceramic green sheet 1 onto the previously laminated ceramic green sheet 1.

The stretch-preventing sheet 3 is used as the preliminary laminate 4
To a plurality of ceramic green sheets 1 to 6 respectively
After stacking, the preliminary stacks 4 to 6 may be arranged so as to be sandwiched in the stacking direction.

The carrier film used for molding the ceramic green sheet 1 is directly
You may make it use as the elongation prevention sheet 3. In this case, the carrier film is left without being peeled off only for the ceramic green sheet 1 located at the end of each of the preliminary laminates 4 to 6 in the laminating direction.

The stretch-preventing sheet 3 restrains each of the preliminary laminates 4 to 6 and suppresses stretching and distortion of these. In order to exert the effect of the elongation-preventing sheet 3 more effectively, it is preferable that the surface of the elongation-preventing sheet 3 that contacts the ceramic green sheet 1 be roughened. By this roughening, the surface roughness Rz (10-point average roughness) of the elongation-preventing sheet 3 is preferably 2 to 5 μm, and is 3 μm as an example.

Instead of or in addition to the above-described roughening, a pressure-sensitive adhesive is applied to the surface of the elongation-preventing sheet 3 that comes into contact with the ceramic green sheet, whereby the elongation-preventing sheet 3 is used. The restraining action on the preformed bodies 4 to 6 may be more reliably exerted.

The preliminary laminates 4 to 6 are handled in the subsequent steps with the stretch-preventing sheet 3 attached,
This state of the pre-laminates 4 to 6 is maintained until the stretch-preventing sheet 3 needs to be peeled off.

The stretch prevention sheet 3 is, for example, as shown in FIG.
It is preferable that the plane size thereof is slightly smaller than the plane size of each of the preliminary laminates 4 to 6, as shown in FIG. As a result, it is possible to prevent the stretch-preventing sheet 3 from being carelessly turned over in the subsequent handling of the preforms 4 to 6.

Next, as shown in FIG. 1C, a step of forming a through hole 7 for providing a via hole conductor or a through hole conductor in each specific ceramic green sheet 1 is carried out.

In this embodiment, for each of the preliminary laminates 4 to 6 sandwiched by the stretch prevention sheet 3 in the laminating direction, all the through passages 8 whose both ends are to be the through holes 7 are opened. And the semi-penetrating passage 9 having only one end opened is formed all at once. As a result, the through holes 7 provided in each ceramic green sheet 1 will not be displaced between the adjacent ceramic green sheets 1.

When forming all the through passages 8 in the preliminary laminate 4, as described above, the conductor film 2 formed on the uppermost dummy ceramic green sheet 1 (a) serves as a positioning mark. To be done.

Since the full-through passage 8 and the half-through passage 9 are provided so as to penetrate the stretch-preventing sheet 3 as well, the thickness and material of the stretch-preventing sheet 3 should be suitable for such drilling. Is preferred.

In order to form the full through passage 8 and the half through passage 9, for example, laser or drilling is applied. In particular, when forming the semi-penetrating passage 9, it is preferable to apply a method of irradiating laser light. This is because, in the case of the semi-penetrating passage 9, it is necessary to control the depth accurately, but with the irradiation of the laser light, such depth control is relatively easy.

Next, as shown in FIG. 1 (4), the conductive paste 10 is filled in all the through passages 8 and the half through passages 9. The conductive paste 10 may be substantially the same as the conductive paste used to form the conductor film 2 described above.

When filling the conductive paste 10,
For example, a method of embedding the conductive paste 10 in the full-through passages 8 and the semi-through passages 9 by applying the conductive paste 10 on the stretch prevention sheet 3 and operating a squeegee (not shown) or the like, Alternatively, a method of using a dispenser (not shown) to inject the conductive paste 10 into the entire through passages 8 and the half through passages 9 can be applied.

In particular, when the conductive paste 10 is to be filled in all the through passages 8, vacuum suction is performed from one opening side of each of all the through passages 8 while the conductive paste 10 is embedded or injected from the other opening side. If you do
The conductive paste 10 can be efficiently filled in all the through passages 8.

In the step of filling the conductive paste 10 as described above, the stretch prevention sheet 3 functions to prevent the surfaces of the preliminary laminates 4 to 6 from being soiled by the conductive paste 10.

Next, as shown sequentially in FIGS. 2A to 2D, a step of laminating a plurality of preliminary laminates 4 to 6 is carried out. When laminating the preliminary laminates 4 to 6, instead of laminating the preliminary laminates 4 to 6 at once, the lamination of two items selected from the preliminary laminates 4 to 6 is performed.
Repeated as many times as necessary.

That is, as shown in FIGS. 2 (1) and (2), the preliminary laminates 5 and 6 are laminated, and then, as shown in FIGS. 2 (3) and (4), the preliminary laminates 4 and 5 are stacked.

More specifically, first, referring to FIG.
As shown in (1), only the stretch-preventing sheets 3 located on the surfaces of the preliminary laminates 5 and 6 facing each other are peeled off, and the surfaces facing each other are exposed.

Next, as shown in FIG. 2 (2), the two preliminary laminates 5 and 6 are joined to each other with the above-mentioned exposed surfaces being in contact with each other.

The above-mentioned joining is accomplished by crimping the preliminary laminates 5 and 6 to each other, but if necessary, a quick-drying adhesive is applied to the peripheral portions of the surfaces of the preliminary laminates 5 and 6 that contact each other. If an agent, for example, an instant adhesive agent is applied by a dispenser or the like, a more reliable joined state can be obtained.

As described above, the area to which the quick-drying adhesive is applied is defined as the peripheral portion of the surfaces of the preliminary laminates 5 and 6 which are in contact with each other. This is because a gap portion that does not affect the product is provided.

Immediately before the step of joining the preliminary laminates 5 and 6 to each other, if the stretch-preventing sheet 3 located on the surfaces of the preliminary laminates 5 and 6 to be brought into contact with each other is peeled off, these sheets are brought into contact with each other. It is possible to prevent the surfaces from drying and obtain a good bonding state. Further, it is possible to reduce the possibility that dust or the like will adhere to the surfaces that come into contact with each other.

Next, as shown in FIG. 2C, only the stretch-preventing sheets 3 located on the surfaces of the preliminary laminates 4 and 5 facing each other are peeled off to expose the surfaces facing each other. .

Next, as shown in FIG. 2 (4), the preliminary laminates 4 and 5 are processed in the same manner as the preliminary laminates 5 and 6 described above, with the exposed surfaces being in contact with each other. , Bonding to each other is performed.

In this way, the raw laminate 11 for the multilayer ceramic substrate as the laminated ceramic electronic component to be obtained is obtained.

Next, as shown in FIG. 3 (1), the stretch-preventing sheet 3 left so as to be positioned on both end faces of the raw laminate 11 in the laminating direction is peeled off.

Next, the raw laminate 11 shown in FIG.
The whole is finally pressed. In this final pressing step, pressing conditions equal to or higher than the pressing conditions in the step of pressing the plurality of ceramic green sheets 1 in the step of producing the preliminary laminates 4 to 6 described above are applied. As an example, in the final pressing step, the pressure is 750 kgf / cm.
Press conditions of ² and a temperature of 80 ° C. are applied.

Next, in order to smooth both end surfaces of the raw laminated body 11 in the laminating direction, planar polishing is performed using, for example, a grinder. As a result of this planar polishing, as shown in FIG. 3B, the dummy ceramic green sheet 1
In (a), at least part of the thickness of the conductor film 3 is removed together with the conductor film 3 formed thereon. At this time, the second ceramic green sheet 1 from the top of the raw laminate 11
The dummy ceramic green sheet 1 (a) may be planarly polished and removed until the conductor film 2 formed thereon is exposed.

Further, flat polishing is also performed on the lower surface side of the green laminate 11. As a result, at least a part of the thickness of the lowermost ceramic green sheet 1 is removed.

The peeling of the stretch-preventing sheet 3 described above is performed only on the stretch-preventing sheet 3 located on one end face in the stacking direction of the green laminate 11, and then the final pressing step is performed. After that, the above-described flat surface polishing step may be performed only on the end surface from which the stretch prevention sheet 3 has been peeled off.

Further, as shown in FIG. 2 (4), the final pressing step may be carried out in a state in which the stretch-preventing sheet 3 is located on both end faces of the green laminate 11 in the laminating direction. Also in this case, preferably, the flattening step described above is performed after the elongation-preventing sheet 3 is peeled off.

Next, as shown in FIG. 3 (2), the green laminate 11 after the flat polishing is cut if necessary, and then fired to obtain the intended multilayer ceramic substrate. . This multilayer ceramic substrate includes a ceramic layer provided by a ceramic green sheet 1, a conductor film 2 and a full through passage 8 or a half through passage 9.
The via-hole conductor and the through-hole conductor provided by the conductive paste 10 filled in.

FIG. 4 is a view corresponding to FIG. 1 (3) for explaining another embodiment of the present invention. In FIG. 4, elements corresponding to the elements shown in FIG. 1 (3) are designated by the same reference numerals, and redundant description will be omitted.

In the embodiment shown in FIG. 4, all through passages 8
At the same time as the step of forming the semi-penetrating passage 9 and the step of forming the through holes 13 for alignment in each of the preliminary laminates 4 to 6 sandwiched by the stretch prevention sheet 3 in the laminating direction. It has a feature.

The alignment through hole 13 is provided in the preliminary laminated body 4
It is preferable to provide them at the peripheral edge portions of each of 6 to 6. This is because the peripheral edge portion of each of the preliminary laminates 4 to 6 is a gap portion that does not affect the product.

According to this embodiment, the through holes 13 for alignment are sensed by a camera or the like in the step of laminating a plurality of preliminary laminates 4 to 6 to be performed later, so that these through holes for alignment can be detected. Based on 13, the preliminary laminates 4-6 are aligned with each other. Therefore, the alignment accuracy can be improved.

FIG. 5 is a diagram corresponding to FIG. 1 (2) for explaining still another embodiment of the present invention.

This embodiment is intended for manufacturing a monolithic ceramic capacitor.

In this embodiment, the produced plurality of ceramic green sheets 21 are divided into, for example, four groups, the plurality of ceramic green sheets 21 are laminated in each group, and four preliminary laminates 22, 23,
24 and 25 are made.

Of the preliminary laminates 22 to 25, the preliminary laminates 22 and 25 located at both ends are the ceramic green sheets 21 in which no conductor is formed.
Composed of only.

On the other hand, with respect to the preliminary laminated bodies 23 and 24 located in the middle portion, the ceramic green sheets 21 on which the conductor films 26 which will be the internal electrodes for forming electrostatic capacitance are formed are laminated.

Each of the preliminary laminates 22 to 25 is pressed while being sandwiched by the stretch-preventing sheets 27, and the two of the preliminary laminates 22 to 25 to be laminated are located on the surfaces facing each other. For peeling only the stretch prevention sheet 27 to expose the surfaces facing each other and joining the preliminary laminates 22 to 25 with the exposed surfaces in contact with each other, and the like,
This is substantially the same as the case of the above-described embodiment.

Although the present invention has been described above with reference to the illustrated embodiment, the present invention is directed to a multilayer ceramic substrate,
It can also be applied to a method for manufacturing a multilayer ceramic electronic component other than the multilayer ceramic capacitor. For example,
It can also be applied to a method for manufacturing a laminated inductor and a method for manufacturing a ceramic capacitor having a laminated structure having a via-hole conductor and / or a through-hole conductor that can reduce the equivalent series inductance.

[0079]

As described above, according to the present invention, a plurality of ceramic green sheets to be laminated are divided into a plurality of groups, and a plurality of ceramic green sheets are laminated for each group to form a plurality of preliminary laminates. Then, the final raw laminate comprising the plurality of preliminary laminates is obtained. Therefore, at the stage of obtaining the preliminary laminate, only a relatively small number of ceramic green sheets are handled, so that the displacement of the lamination of the ceramic green sheets and the distortion or displacement of the conductor film, the via-hole conductor or the through-hole conductor occur. Can be hardened.

Further, when a plurality of ceramic green sheets are pressed in order to produce the preliminary laminate, the plurality of ceramic green sheets are sandwiched by the elongation preventing sheets in the laminating direction. Therefore, it is possible to suppress variations in deformation modes such as elongation and distortion among the plurality of preliminary laminates.

When laminating a plurality of preliminary laminates,
Only the stretch-preventing sheets located on the mutually facing surfaces of the two preliminary laminates to be laminated are peeled off to expose the mutually opposing surfaces, and the exposed surfaces should be in contact with each other to be laminated. Since the two preliminary laminates are bonded to each other, it is possible to prevent drying on the surfaces of the preliminary laminates that are in contact with each other and to prevent dust and the like from adhering, and as a result, obtain a good bonded state. You can Further, since the stretch-preventing sheet is positioned on the outer end face of the preliminary laminate during and after the joining step, the preliminary laminate is also used at this stage. It is possible to suppress undesired elongation and distortion of the.

From these facts, as described above, a plurality of ceramic green sheets are divided into a plurality of groups,
The effect of adopting the process of stacking a plurality of ceramic green sheets for each group to manufacture a plurality of preliminary laminates can be maximized without being hindered.

As a result, when the present invention is applied to the method for manufacturing a multilayer ceramic substrate, the density of wiring can be advantageously increased while the multilayer ceramic substrate is downsized, and the multilayer ceramic is also available. When applied to a method of manufacturing a capacitor, it is possible to advantageously reduce the size of the monolithic ceramic capacitor while increasing its capacity.

In the present invention, the entire raw laminate obtained in the step of laminating the preliminary laminate is pressed under the pressing conditions in the step of pressing the plurality of ceramic green sheets in the step of producing the preliminary laminate. If the final pressing step is performed by finally pressing at, it is possible to surely obtain a good joined state between the preliminary laminates.

Before the final pressing step described above, the stretch-preventing sheet located on at least one end face of the green laminate in the laminating direction is peeled off, and after the final pressing step, the green laminate is laminated in the laminating direction. If at least one of the end faces described above is flat-polished, the surface to which the elongation-preventing sheet is attached can be smoothed.

Therefore, the smoothness of the surface of the elongation-preventing sheet is not particularly required, and therefore, as the elongation-preventing sheet, those having a roughened surface or those provided with a pressure-sensitive adhesive can be used without problems. In addition to being able to be used, it is possible to increase the binding force of the elongation-preventing sheet with respect to the ceramic green sheet by the roughening and the adhesive, so that the function of the elongation-preventing sheet can be more effectively exhibited. You can

Further, in the present invention, with respect to the preliminary laminated body sandwiched by the elongation preventing sheet in the laminating direction,
A conductive paste is formed in the full-through passage and / or the semi-through passage by forming a full-through passage having openings at both ends and / or a semi-through passage having only one end opened for providing a via-hole conductor or a through-hole conductor. Can be reduced, the number of steps of forming a through-hole for providing a via-hole conductor or a through-hole conductor and the step of filling a conductive paste can be reduced, and the via-hole conductor or the via-hole conductor due to misalignment of the through-hole can be reduced. The problem of poor connection of the through-hole conductor can be reduced.

Further, in the present invention, at the same time as the step of forming the full-through passage and / or the half-through passage described above, the positioning through-hole is formed in the preliminary laminated body in a state of being sandwiched in the laminating direction by the elongation preventing sheet. Then, in the step of laminating the preliminary laminate, if the plurality of preliminary laminates are aligned with each other based on the through hole for alignment, the alignment accuracy of the preliminary laminate can be improved, Therefore, the formation accuracy of the via-hole conductor or the through-hole conductor can be further improved.

Further, in the present invention, before the step of joining the two preliminary laminates to be laminated to each other, a quick-drying adhesive may be applied to the peripheral edge portions of the surfaces of the preliminary laminates that contact each other. If so, it is possible to surely obtain a good joint state between the preliminary laminates.

[Brief description of drawings]

FIG. 1 is a sectional view sequentially showing typical steps included in a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention.

2A to 2D are cross-sectional views sequentially showing a typical process subsequent to the process shown in FIG.

3A to 3D are cross-sectional views sequentially showing a typical process subsequent to the process shown in FIG.

FIG. 4 is a view for explaining another embodiment of the present invention.
It is a figure equivalent to (3).

FIG. 5 is a diagram corresponding to FIG. 1 (2) for explaining still another embodiment of the present invention.

[Explanation of symbols]

1,21 Ceramic green sheet 2,26 Conductor film 3,27 Stretch prevention sheet 4-6, 22-25 Preliminary laminate 7 through holes 8 all-through passages 9 Half-passage 10 Conductive paste 11 raw laminate 13 Through hole for alignment

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 B28B 11/00 Z (72) Inventor Masaaki Taniguchi 2 26-10 Tenjin, Nagaokakyo, Kyoto Prefecture Murata Manufacturing F-term (reference) 4G055 AA08 AB01 AC01 AC09 BA14 BA22 BA42 BA83 5E001 AB03 AE02 AH01 AH06 AH09 AJ02 5E082 AA01 AB03 EE04 EE35 FF05 FG26 5E346 AA43 CC51 FF24 DD31 CC51 BB24 CC01 CC17

Claims (12)

[Claims] 1. A green sheet producing step of producing a plurality of ceramic green sheets, a conductor film forming step of forming a conductor film on a specific ceramic green sheet, and a plurality of the ceramic green sheets are laminated. A method for producing a laminated ceramic electronic component, comprising: a step of producing a raw laminate, a step of producing a laminate, and a step of firing the raw laminate, further comprising the step of preparing an elongation-preventing sheet. The step of producing the laminated body includes a step of dividing the plurality of ceramic green sheets into a plurality of groups, laminating the plurality of ceramic green sheets for each group to produce a plurality of preliminary laminated bodies, and then, Laminating a plurality of the preliminary laminates in order to obtain a raw laminate, the step of producing the preliminary laminate is The method includes a step of pressing the ceramic green sheets sandwiched by the elongation-preventing sheets in the stacking direction, and the step of stacking a plurality of the preliminary laminates faces each other of the two preliminary laminates to be laminated. Peeling off only the stretch-preventing sheet located on the surface to expose the opposing surfaces, and joining the two preliminary laminates to be laminated to each other in a state where the exposed surfaces are in contact with each other. A method of manufacturing a multilayer ceramic electronic component, comprising: 2. The entire raw laminate obtained by the step of laminating the preliminary laminate is pressed under the pressing conditions in the step of pressing the plurality of ceramic green sheets in the step of producing the preliminary laminate. The method for producing a multilayer ceramic electronic component according to claim 1, further comprising a final pressing step of finally pressing under press conditions. 3. A step of peeling off the elongation-preventing sheet located on at least one end face of the green laminate in the laminating direction before the final pressing step, and a step of peeling the green sheet after the final pressing step. The method for manufacturing a multilayer ceramic electronic component according to claim 2, further comprising a step of polishing the at least one end surface of the multilayer body in the stacking direction. 4. A pressure of 500 kgf / cm ² or less and a temperature of 1 in the step of pressing the plurality of ceramic green sheets in the step of producing the preliminary laminate.
The method for manufacturing a multilayer ceramic electronic component according to claim 2, wherein a pressing condition of 00 ° C. or lower is applied. 5. A total through passage having openings at both ends for providing via-hole conductors or through-hole conductors and / or only one end with respect to the preliminary laminated body sandwiched by the stretch prevention sheet in the laminating direction. The stack according to any one of claims 1 to 4, further comprising a step of forming a semi-through passage having an opening formed therein, and a step of filling the full-through passage and / or the semi-through passage with a conductive paste. -Type ceramic electronic component manufacturing method. 6. A step of forming a through hole for alignment in the preliminary laminated body sandwiched in the laminating direction by the stretch prevention sheet at the same time as the step of forming the full through passage and / or the half through passage. The method for manufacturing a multilayer ceramic electronic component according to claim 5, further comprising: in the step of stacking the preliminary laminate, a plurality of the preliminary laminates are aligned with each other based on the alignment through hole. . 7. A step of forming a through hole for providing a via-hole conductor or a through-hole conductor in a specific ceramic green sheet before stacking the ceramic green sheets, and a conductive paste in the through hole. The method for manufacturing a multilayer ceramic electronic component according to claim 1, further comprising a filling step. 8. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the stretch prevention sheet is made of a resin film. 9. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein a surface of the elongation prevention sheet that comes into contact with the ceramic green sheet is roughened. . 10. The method for producing a multilayer ceramic electronic component according to claim 1, wherein a pressure-sensitive adhesive is applied to a surface of the stretch prevention sheet that comes into contact with the ceramic green sheet. 11. The method further comprises the step of applying a quick-drying adhesive to the peripheral portions of the surfaces of the pre-laminates that contact each other before the step of joining the two pre-laminates to be laminated together. A method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 10. 12. At least one of the plurality of pre-laminates.
12. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein one is composed of only a plurality of the ceramic green sheets on which no conductor is formed.