JPH06124848A - Manufacture of laminated ceramic capacitor - Google Patents
Manufacture of laminated ceramic capacitorInfo
- Publication number
- JPH06124848A JPH06124848A JP3177991A JP3177991A JPH06124848A JP H06124848 A JPH06124848 A JP H06124848A JP 3177991 A JP3177991 A JP 3177991A JP 3177991 A JP3177991 A JP 3177991A JP H06124848 A JPH06124848 A JP H06124848A
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- film
- internal electrode
- dielectric
- dielectric green
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は積層セラミックコンデン
サの製造方法に係り、特に積層圧粉体の多層成膜方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a monolithic ceramic capacitor, and more particularly to a method for forming multi-layered green compacts.
【0002】[0002]
【従来の技術】積層セラミックコンデンサは、小型大容
量、長寿命、高周波数特性など、そのすぐれた特性から
広い範囲の回路に適用されており、特に小型化、軽量化
を目的とした表面実装に対応すべくリード線タイプから
チップタイプへの移行が速い速度で進んでいる。2. Description of the Related Art Multilayer ceramic capacitors are applied to a wide range of circuits due to their excellent characteristics such as small size and large capacity, long life, and high frequency characteristics, and are especially suitable for surface mounting for downsizing and weight reduction. In order to cope with this, the transition from the lead wire type to the chip type is progressing at a high speed.
【0003】従来積層セラミックコンデンサの製造は誘
電体セラミック粉末と、有機バインンダを混合分散させ
たスラリーをドクターブレード等を用い、離型処理を行
ったキャリアフィルム上に一定の厚みでグリーンシート
の成形を行い、その上にAg、Pd等を導体成分とする
ペーストを内部電極としてスクリーン印刷等で一定のパ
ターンに印刷して内部電極膜を形成する。こうして得ら
れたグリーンシートを打ち抜き積層し、さらに熱プレス
を行うことでコンデンサ素子を成形し、脱バインダ、焼
成、端子電極成形を行うことで製品を得ていた。Conventionally, in the manufacture of a monolithic ceramic capacitor, a dielectric sheet and an organic binder are mixed and dispersed in a slurry such as a doctor blade to form a green sheet with a certain thickness on a release-treated carrier film. Then, a paste containing Ag, Pd, or the like as a conductor component is printed thereon in a predetermined pattern by screen printing or the like to form an internal electrode film. The green sheets thus obtained were punched and laminated, and then hot pressed to form a capacitor element, which was then subjected to binder removal, firing, and terminal electrode molding to obtain a product.
【0004】従来のドクターブレードを用いたグリーン
シート成形では、10μm以下の膜厚を安定に製造する
のは難しく、又スラリー中に存在する気泡やキャリアフ
ィルム上の異物やブレード部での巻き込み乾燥条件など
の要因によりピンホールが発生しやすく、かつ、従来の
多層成膜を行っても膜厚の関係から発生したピンホール
を除去しきれず積層後対向電極間にピンホール欠陥が残
り、ショートするなどの欠点があった。又内部電極の印
刷乾燥後次層の積層を行うため層を重ねた場合、内部電
極の厚みの分だけグリーンシート間に厚みの差を生じ、
熱プレス時に内部電極パターン周辺部に空気を内在した
まま成形されることとなり、このため焼成後の層間剥離
の発生の原因となり信頼性を低下させるという問題があ
った。In the conventional green sheet molding using a doctor blade, it is difficult to stably produce a film thickness of 10 μm or less, and air bubbles existing in the slurry, foreign matters on the carrier film, and entrainment drying conditions at the blade portion. Pinholes are likely to occur due to factors such as the above, and even if conventional multi-layer film formation is performed, the pinholes that are generated cannot be completely removed due to the film thickness relationship, and pinhole defects remain between opposing electrodes after lamination, causing a short circuit, etc. There was a drawback. In addition, when the layers are stacked in order to stack the next layer after the printing and drying of the internal electrodes, a difference in thickness between the green sheets is caused by the thickness of the internal electrodes,
During the hot pressing, the molding is carried out with the air existing in the peripheral portion of the internal electrode pattern, which causes the occurrence of delamination after firing, and there is a problem that the reliability is lowered.
【0005】[0005]
【発明が解決しようとする課題】本発明の課題は、これ
らの欠点を除去するため積層圧粉体の成膜方法及び積層
方式を改善し、ピンホールの発生や層間剥離のない信頼
性にすぐれた積層セラミックコンデンサの製造方法を提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to improve the film forming method and lamination method of laminated green compacts in order to eliminate these drawbacks, and to have excellent reliability without generation of pinholes or delamination. Another object of the present invention is to provide a method for manufacturing a laminated ceramic capacitor.
【0006】[0006]
【課題を解決するための手段】本発明は誘電体セラミッ
クス粉末のスラリーを用いてキャリアフィルム上にグラ
ビヤロールを用い10μm以下の厚みのグリーンシート
を塗布成膜し、更にその上に繰返しグリーンシートの成
膜を同様な方法で少なくとも2回以上行う方法で誘電体
グリーンシートを形成し、1回目に発生したピンホール
を2回目以降の成膜で埋めることによりピンホールのな
い誘電体グリーンシートの成形を行い、かつ、該誘電体
グリーンシート上に内部電極を印刷成膜する場合も同様
に繰返し2回以上印刷成膜して内部電極膜に残るピンホ
ール等を埋め込み完全に連続した電極膜で積層し、か
つ、印刷厚み分の積層の位置合わせを行うために、2回
目以降の誘電体グリーンシートの成膜でかくれてしまう
内部電極のほかに内部電極膜の一部を誘電体グリーンシ
ートの外側のキャリアフィルム上に印刷成膜させ、該キ
ャリアフィルム上の内部電極膜の一部を位置合わせ用マ
ーカとし、2層目以降の内部電極印刷に際し、容易に位
置合わせが出来ることを可能とし、積層ずれの無い印刷
積層が行えるようにしたことを特徴とするもので、従来
のバッチ式ではなく、連続的な印刷成膜積層を可能とし
た製造方法である。即ち、本発明は、離型処理を施した
キャリアフィルム上に誘電体セラミック粉末のグリーン
シートとその上に内部電極として導体ペースト膜を印刷
成膜し、更にその上に誘電体グリーンシートと導体ペー
スト膜の成膜を繰返して得られた積層圧粉体を焼結し、
外部電極を加工して作る積層セラミックコンデンサの製
造方法における積層圧粉体の製造方法において、誘電体
グリーンシートをグラビヤロールを用いて10μm以下
の厚さの膜を繰返し2回以上印刷塗布する方法で成膜
し、かつ、該誘電体グリーンシート上に導体ペーストか
ら成る内部電極膜を2回以上の繰返し印刷により成膜
し、かつ、内部電極膜の印刷時にその一部を次の内部電
極膜の印刷時の位置決め案内となるよう誘電体グリーン
シートの外側のキャリアフィルム上に印刷することを特
徴とする積層セラミックコンデンサの製造方法である。According to the present invention, a slurry of dielectric ceramic powder is used to form a green sheet having a thickness of 10 μm or less on a carrier film by using a gravure roll, and a green sheet is repeatedly formed thereon. A dielectric green sheet is formed by performing the film formation in the same manner at least twice, and the pinhole generated in the first time is filled with the film formation in the second time and thereafter to form a dielectric green sheet having no pinhole. In the same manner as above, when the internal electrodes are printed by film formation on the dielectric green sheet, the film is printed repeatedly twice or more times to fill the pinholes remaining in the internal electrode film and laminated by a completely continuous electrode film. In addition to the internal electrodes that are hidden by the second and subsequent formation of the dielectric green sheet in order to align the lamination of the printed thickness, A part of the electrode film is printed on the carrier film outside the dielectric green sheet to form a film, and a part of the internal electrode film on the carrier film is used as a positioning marker to print the second and subsequent internal electrodes. The manufacturing method is characterized in that it is possible to perform alignment easily, and printing lamination without stacking deviation can be performed, and continuous printing film formation lamination is possible instead of the conventional batch type. Is. That is, according to the present invention, a dielectric ceramic powder green sheet and a conductor paste film as an internal electrode are printed and formed on a release-treated carrier film, and the dielectric green sheet and the conductor paste are further formed thereon. Laminated green compact obtained by repeating film formation is sintered,
In the method for producing a laminated green compact in the method for producing a monolithic ceramic capacitor produced by processing external electrodes, a method of printing a dielectric green sheet by using a gravure roll and repeatedly applying a film having a thickness of 10 μm or less twice or more. A film is formed, and an internal electrode film made of a conductor paste is formed on the dielectric green sheet by repeating printing two or more times, and at the time of printing the internal electrode film, a part of the internal electrode film of the next internal electrode film is formed. A method of manufacturing a monolithic ceramic capacitor, which comprises printing on a carrier film outside a dielectric green sheet so as to serve as a positioning guide during printing.
【0007】[0007]
【作用】積層セラミックコンデンサの積層圧粉体の製造
において、誘電体グリーンシートをグラビヤロールによ
り繰返し、塗布成膜して製造することで、小型大容量を
得るに十分な薄いグリーンシートが得られ、しかもピン
ホール、気泡、欠陥の少ない誘電体グリーンシートが得
られ、かつ内部電極膜も同様に繰返し印刷法を用いて成
膜することによりピンホール、気泡、欠陥のないものが
得られるので焼結した製品の耐圧不良や層間剥離等の不
良が少なく、しかも内部電極膜をマーカとして誘電体グ
リーンシートの外側まで印刷することにより連続的に多
数個の多層積層圧粉体の製造が可能となる。[Function] In the production of a laminated green compact of a monolithic ceramic capacitor, a dielectric green sheet is repeatedly coated with a gravure roll to form a thin film which is sufficiently thin to obtain a small capacity. Moreover, a dielectric green sheet with few pinholes, bubbles, and defects can be obtained, and by similarly forming the internal electrode film by the repeated printing method, pinholes, bubbles, and defects can be obtained. There are few defects such as pressure resistance and delamination of the produced product, and moreover, by printing the inner electrode film as a marker to the outside of the dielectric green sheet, it is possible to continuously manufacture a large number of multilayer laminated green compacts.
【0008】[0008]
【実施例】以下、本発明の一実施例を図面を参照して説
明する。図1(a)に示すように離型処理を施したキャ
リアフィルム1上にグラビヤロールを用いて膜厚約3μ
mの1回目の誘電体グリーンシート2を形成した。図1
(a)の外観斜視図及び図1(b)の側面断面図に示す
通り貫通型のピンホール7が多数発生している。この1
回目の誘電体グリーンシート上に、さらに重ね塗りする
形で繰返し2回目の誘電体グリーンシートの成形を行
う。このように繰返しグラビヤロールにより塗布成膜す
ることにより、ピンホール7は図2に示す通り、2回目
のスラリーが侵入し、誘電体スラリーで埋め込まれたピ
ンホール8を埋める形で2回目の誘電体グリーンシート
3が成膜される。この場合、予め成膜されたグリーンシ
ート厚が10μm以上の場合、ピンホール部への2回目
のスラリーの侵入が完全に行われないことがあり、グリ
ーンシート厚みを薄くし、気泡が抜け易くする必要があ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1A, a gravure roll is used on the carrier film 1 that has been subjected to a mold release treatment to have a film thickness of about 3 μm.
m first dielectric green sheet 2 was formed. Figure 1
As shown in the external perspective view of FIG. 1A and the side sectional view of FIG. 1B, a large number of through-type pinholes 7 are formed. This one
On the second dielectric green sheet, the second dielectric green sheet is repeatedly formed by repeatedly coating. As shown in FIG. 2, by repeatedly coating and forming the film by the gravure roll, the second slurry invades into the pinhole 7 to fill the pinhole 8 filled with the dielectric slurry. The body green sheet 3 is deposited. In this case, if the thickness of the green sheet formed in advance is 10 μm or more, the second infiltration of the slurry into the pinhole portion may not be completed, and the thickness of the green sheet may be reduced to facilitate the escape of air bubbles. There is a need.
【0009】本実施例では、図8及び図9に示すように
約3μmずつ計3回グリーンシートを繰返し塗布成膜す
ることにより、約9μmの厚さで、ピンホールのない誘
電体グリーンシートを得ることができた。この場合2回
目の塗布成膜で大部分のピンホールが解消していること
がわかる。図3に示すように、このようにして得られた
誘電体グリーンシート4上にAgとPd粉末を混合して
作成した導体ペーストを用いてスクリーン印刷法を繰返
し2回行い内部電極膜5を約3μm厚に印刷成膜した。
図4に示すように、更に、その上に2段目の誘電体グリ
ーンシート10をグラビヤロールにより塗布成膜する。
塗布成膜された2段目の誘電体のグリーンシート10は
スラリー状で重ね塗りされる状態のため、1段目の誘電
体グリーンシート9上の内部電極膜5のない部分にも成
膜されるので、積層圧粉体を形成し、プレス成形を行う
とき空気の層が内在しない状態で圧縮され脱バインダ、
焼結後の層間剥離不良の発生が減少することができた。
但し、図5に示すようにこの場合印刷された内部電極の
パターンが2段目の誘電体グリーンシート10により隠
されてしまうので2段目の内部電極パターンを印刷成膜
するとき位置ずれが発生するため内部電極膜を使用して
マーカ6を1段目の誘電体グリーンシート9の外側のキ
ャリアフィルム1上にはみ出して印刷し、2段目の内部
電極膜5形成時の位置合わせの目じるしに使用してい
た。In this embodiment, as shown in FIGS. 8 and 9, by repeatedly coating and forming a green sheet about 3 μm in total, a dielectric green sheet having a thickness of about 9 μm and having no pinhole is formed. I was able to get it. In this case, it can be seen that most of the pinholes are eliminated by the second coating film formation. As shown in FIG. 3, a screen printing method was repeated twice using a conductive paste prepared by mixing Ag and Pd powder on the dielectric green sheet 4 thus obtained, and the internal electrode film 5 was formed by repeating the screen printing method twice. A printed film was formed to a thickness of 3 μm.
As shown in FIG. 4, a second-stage dielectric green sheet 10 is further applied and formed thereon by a gravure roll.
The second-stage dielectric green sheet 10 formed by coating is in a state of being overlaid in the form of a slurry, so that it is also formed on a portion of the first-stage dielectric green sheet 9 where the internal electrode film 5 is absent. Therefore, when the laminated green compact is formed and the press molding is performed, the binder is compressed with the air layer not existing,
The occurrence of delamination failure after sintering could be reduced.
However, as shown in FIG. 5, in this case, the pattern of the printed internal electrodes is hidden by the second-stage dielectric green sheet 10, so that a positional deviation occurs when the second-stage internal electrode patterns are formed by printing. In order to do so, the marker 6 is printed on the carrier film 1 outside the first-stage dielectric green sheet 9 by using the internal electrode film, and the marker is used for alignment when forming the second-stage internal electrode film 5. I used it for the sushi.
【0010】本実施例では2段目以降の内部電極膜5を
印刷する際、前記マーカ6を画像認識装置にて確認し位
置合わせを行い、印刷成膜した所、焼結上がりのチップ
を切断して内部電極の位置ずれを測定した所0.1mm
以下のずれにすることができた。この位置合わせはスク
リーン印刷以外の転写式や輪転式でも同等の結果を得る
ことができた。又、図7(b)に示すように、内部電極
膜は1層置きに若干位置をずらせ、焼結後チップに切断
したとき対向する内部電極13が両側に1層置きに各々
露出するよう印刷成膜されている。In this embodiment, when the internal electrode film 5 of the second and subsequent stages is printed, the marker 6 is confirmed by an image recognition device for alignment, and when the printed film is formed, the sintered chip is cut. Then, the position deviation of the internal electrode was measured and it was 0.1 mm.
The following deviations were possible. With regard to this alignment, the same result could be obtained by a transfer type or a rotary type other than the screen printing. In addition, as shown in FIG. 7B, the internal electrode films are printed such that the positions of the internal electrodes are slightly shifted every other layer, and when the chips are cut into pieces after sintering, the internal electrodes 13 facing each other are exposed at every other layer. It has been formed into a film.
【0011】図6(1a)、図6(1b)に示すよう
に、キャリアシート1上に一段目の誘電体グリーンシー
ト9をグラビヤロールにより繰返し重ね塗りにより成膜
し、図6(2a)、図6(2b)の如く、その上に更に
内部電極膜5及びマーカ6を成膜し、次に図6(3
a)、図6(3b)の如く、その上に2段目の誘電体グ
リーンシートを成膜し、次に図6(4a)、図6(4
b)の如く、図6(2a)で加工したマーカ6を案内に
して、その上に2段目の内部電極膜5を成膜し、次に図
6(5a)、図6(5b)の如く、その上に3段目の誘
電体グリーンシート15を成膜する。以上の工程を繰返
し行い多層の積層圧粉体を得る。これをプレスしブロッ
クに切断後焼結し、焼結後チップに切断し、図7に示す
ようにチップ14の側面を絶縁処理し両端に端子電極1
1を加工して積層セラミックコンデンサを得る。As shown in FIGS. 6 (1a) and 6 (1b), the first-stage dielectric green sheet 9 is repeatedly formed on the carrier sheet 1 by a gravure roll to form a film. As shown in FIG. 6 (2 b), an internal electrode film 5 and a marker 6 are further formed thereon, and then FIG.
a), as shown in FIG. 6 (3b), a second-stage dielectric green sheet is formed thereon, and then, FIG. 6 (4a), FIG.
As shown in b), the marker 6 processed in FIG. 6 (2a) is used as a guide, and the second-stage internal electrode film 5 is formed thereon, and then the markers 6 in FIGS. 6 (5a) and 6 (5b) are formed. As described above, the third-stage dielectric green sheet 15 is formed on the film. The above steps are repeated to obtain a multi-layer laminated green compact. This is pressed and cut into blocks and then sintered, and after sintering, cut into chips, and the side surfaces of the chips 14 are insulated as shown in FIG.
1 is processed to obtain a monolithic ceramic capacitor.
【0012】[0012]
【発明の効果】以上述べたように、本発明によれば、ピ
ンホールや層間剥離の発生しない高い信頼性を持つ、小
型大容量積層セラミックコンデンサの製造が可能とな
り、特に積層圧粉体の製造が連続的に生産でき、製造コ
ストを低減できる。As described above, according to the present invention, it is possible to manufacture a small-sized and large-capacity monolithic ceramic capacitor having high reliability in which pinholes and delamination do not occur, and in particular, the manufacture of laminated green compacts. Can be continuously produced, and the manufacturing cost can be reduced.
【図1】本発明の実施例の方法を説明する説明図でキャ
リアフィルム上に形成した1回目の誘電体グリーンシー
トを示し、図1(a)は外観斜視図、図1(b)は図1
(a)のA−A線断面を示す側面断面図。FIG. 1 is an explanatory diagram illustrating a method of an embodiment of the present invention, showing a first dielectric green sheet formed on a carrier film, FIG. 1 (a) is an external perspective view, and FIG. 1 (b) is a diagram. 1
The sectional side view which shows the AA line cross section of (a).
【図2】図1で作成した1回目の誘電体グリーンシート
上に2回目の誘電体グリーンシートを成膜した状態を示
し、図1(b)に対応した位置の側面断面図。FIG. 2 is a side sectional view showing a state in which a second dielectric green sheet is formed on the first dielectric green sheet prepared in FIG. 1 and at a position corresponding to FIG. 1 (b).
【図3】図1で作成した誘電体グリーンシート上に内部
電極膜を形成した状態を示し、図3(a)は平面図、図
3(b)は図3(a)のB−B線での側面断面図、図3
(c)は図3(a)のC−C線での側面断面図。3 shows a state in which an internal electrode film is formed on the dielectric green sheet prepared in FIG. 1, FIG. 3 (a) is a plan view, and FIG. 3 (b) is a line BB in FIG. 3 (a). Side cross-sectional view at FIG.
FIG. 3C is a side sectional view taken along the line CC of FIG.
【図4】図3に示す内部電極膜を成膜した誘電体グリー
ンシート上に2段目の誘電体グリーンシートを成膜した
状態を示す側面断面図で、図4(a)は図3(b)に対
応した位置を示し、図4(b)は図3(c)に対応した
位置を示す。FIG. 4 is a side sectional view showing a state in which a second-stage dielectric green sheet is formed on the dielectric green sheet having the internal electrode film shown in FIG. 3, and FIG. 4B shows the position corresponding to FIG. 4B, and FIG. 4B shows the position corresponding to FIG.
【図5】位置合わせのためのマーカとして内部電極膜を
使用する状態を説明する説明図。FIG. 5 is an explanatory diagram illustrating a state where an internal electrode film is used as a marker for alignment.
【図6】多層積層圧粉体を連続的に製造する手順を説明
する説明図で、図6(1a)はキャリアシート上に1段
目の誘電体グリーンシートを形成した状態を示す平面
図、図6(1b)は図6(1a)の側面断面図、図6
(2a)は、図6(1a)上に内部電極膜及びマーカを
形成した状態を示す平面図、図6(2b)は図6(2
a)の内部電極部近傍の側面断面図。図6(3a)は図
6(2a)上に2段目の誘電体グリーンシートを形成し
た状態を示す平面図、図6(3b)は図6(3a)の側
面断面図、図6(4a)は図6(3a)の2段目の誘電
体グリーンシートの上に2段目の内部電極膜及びマーカ
を形成した状態を示す平面図、図6(4b)は図6(4
a)の側面断面図、図6(5a)は図6(4a)の2段
目内部電極膜の上に3段目の誘電体グリーンシートを形
成した状態を示す平面図、図6(5b)は図6(5a)
の側面断面図。FIG. 6 is an explanatory view illustrating a procedure for continuously producing a multilayer laminated green compact, and FIG. 6 (1a) is a plan view showing a state in which a first-stage dielectric green sheet is formed on a carrier sheet, 6 (1b) is a side sectional view of FIG. 6 (1a).
6 (2a) is a plan view showing a state in which the internal electrode film and the marker are formed on FIG. 6 (1a), and FIG. 6 (2b) is shown in FIG.
FIG. 3A is a side sectional view in the vicinity of the internal electrode portion of FIG. 6 (3a) is a plan view showing a state in which a second-stage dielectric green sheet is formed on FIG. 6 (2a), FIG. 6 (3b) is a side sectional view of FIG. 6 (3a), and FIG. 6A is a plan view showing a state in which the second-stage internal electrode film and the marker are formed on the second-stage dielectric green sheet of FIG. 6C, and FIG.
FIG. 6 (5a) is a side sectional view of FIG. 6 (a), and FIG. 6 (5a) is a plan view showing a state in which a third-stage dielectric green sheet is formed on the second-stage internal electrode film of FIG. 6 (4a). Figure 6 (5a)
FIG.
【図7】端子電極を取りつけた状態の積層セラミックコ
ンデンサを示し、図7(a)は外観斜視図、図7(b)
は図7(a)のD−D線側面断面図。FIG. 7 shows a monolithic ceramic capacitor with terminal electrodes attached, FIG. 7 (a) is an external perspective view, and FIG. 7 (b).
Is a side sectional view taken along the line D-D of FIG.
【図8】グラビヤロールを用いて誘電体グリーンシート
を形成した際、繰返し成膜回数とグリーンシートの厚み
の関係を示す図。FIG. 8 is a diagram showing the relationship between the number of times of repeated film formation and the thickness of a green sheet when a dielectric green sheet is formed using a gravure roll.
【図9】グラビヤロールを用いて誘電体グリーンシート
を形成した際の繰返し成膜回数と誘電体グリーンシート
5000cm2当りのピンホールの数の関係を示す図。FIG. 9 is a diagram showing the relationship between the number of times of repeated film formation when a dielectric green sheet is formed using a gravure roll and the number of pinholes per 5000 cm 2 of the dielectric green sheet.
1 キャリアフィルム 2 1回目誘電体グリーンシート 3 2回目誘電体グリーンシート 4 誘電体グリーンシート 5 内部電極膜 6 マーカ 7 ピンホール 8 誘電体スラリーで埋込まれたピンホール 9 1段目の誘電体グリーンシート 10 2段目の誘電体グリーンシート 11 端子電極 12 誘電体層 13 内部電極 14 チップ 15 3段目の誘電体グリーンシート 1 Carrier Film 2 1st Dielectric Green Sheet 3 2nd Dielectric Green Sheet 4 Dielectric Green Sheet 5 Internal Electrode Film 6 Marker 7 Pinhole 8 Pinhole Embedded with Dielectric Slurry 9 1st Stage Dielectric Green Sheet 10 Second-stage dielectric green sheet 11 Terminal electrode 12 Dielectric layer 13 Internal electrode 14 Chip 15 Third-stage dielectric green sheet
Claims (1)
誘電体セラミック粉末のグリーンシート(以下誘電体グ
リーンシートと記す)とその上に内部電極として導体ペ
ースト膜を印刷成膜し、更にその上に誘電体グリーンシ
ートと導体ペースト膜の成膜を繰返して得られた積層圧
粉体を焼結し、外部電極を加工して作る積層セラミック
コンデンサの製造方法における積層圧粉体の製造方法に
おいて、誘電体グリーンシートをグラビヤロールを用い
て10μm以下の厚さの膜を繰返し2回以上印刷塗布す
る方法で成膜し、かつ、該誘電体グリーンシート上に導
体ペーストから成る内部電極膜を2回以上の繰返し印刷
により成膜し、かつ、内部電極膜の印刷時にその一部を
次の内部電極膜の印刷時の位置決め案内となるよう誘電
体グリーンシートの外側のキャリアフィルム上に印刷す
ることを特徴とする積層セラミックコンデンサの製造方
法。1. A green sheet of dielectric ceramic powder (hereinafter referred to as a dielectric green sheet) is formed on a release-treated carrier film, and a conductor paste film is printed and formed thereon as an internal electrode, and further formed thereon. In the method for producing a laminated green compact in the method for producing a laminated ceramic capacitor, which is produced by sintering a laminated green compact obtained by repeating the formation of a dielectric green sheet and a conductor paste film, and making an external electrode, A dielectric green sheet is formed by a method in which a film having a thickness of 10 μm or less is repeatedly applied by printing twice or more using a gravure roll, and an internal electrode film made of a conductor paste is formed twice on the dielectric green sheet. The dielectric green sheet is formed by the above repeated printing, and a part of it is used as a positioning guide when printing the next internal electrode film when printing the internal electrode film. Method of manufacturing a multilayer ceramic capacitor, characterized in that the printing on a carrier film side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03031779A JP3131453B2 (en) | 1991-01-30 | 1991-01-30 | Manufacturing method of multilayer ceramic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03031779A JP3131453B2 (en) | 1991-01-30 | 1991-01-30 | Manufacturing method of multilayer ceramic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06124848A true JPH06124848A (en) | 1994-05-06 |
JP3131453B2 JP3131453B2 (en) | 2001-01-31 |
Family
ID=12340546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03031779A Expired - Fee Related JP3131453B2 (en) | 1991-01-30 | 1991-01-30 | Manufacturing method of multilayer ceramic capacitor |
Country Status (1)
Country | Link |
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JP (1) | JP3131453B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0709866A3 (en) * | 1994-10-31 | 1997-09-10 | Tdk Corp | Manufacturing method and manufacturing apparatus for ceramic electronic components |
JP2002210859A (en) * | 2001-01-17 | 2002-07-31 | Dainippon Printing Co Ltd | Release film for manufacturing ceramic capacitor, and manufacturing method therefor |
JP2008141212A (en) * | 2001-08-10 | 2008-06-19 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5637619A (en) * | 1979-09-04 | 1981-04-11 | Tdk Electronics Co Ltd | Method of manufacturing porcelain condenser |
JPS61219125A (en) * | 1985-03-25 | 1986-09-29 | マルコン電子株式会社 | Method and apparatus for manufacturing laminate ceramic electronic component |
JPS639505A (en) * | 1986-06-30 | 1988-01-16 | 株式会社村田製作所 | Manufacture of ceramic green sheet |
JPH02143410A (en) * | 1988-11-24 | 1990-06-01 | Nec Corp | Manufacture of laminated ceramic electronic component |
-
1991
- 1991-01-30 JP JP03031779A patent/JP3131453B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5637619A (en) * | 1979-09-04 | 1981-04-11 | Tdk Electronics Co Ltd | Method of manufacturing porcelain condenser |
JPS61219125A (en) * | 1985-03-25 | 1986-09-29 | マルコン電子株式会社 | Method and apparatus for manufacturing laminate ceramic electronic component |
JPS639505A (en) * | 1986-06-30 | 1988-01-16 | 株式会社村田製作所 | Manufacture of ceramic green sheet |
JPH02143410A (en) * | 1988-11-24 | 1990-06-01 | Nec Corp | Manufacture of laminated ceramic electronic component |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0709866A3 (en) * | 1994-10-31 | 1997-09-10 | Tdk Corp | Manufacturing method and manufacturing apparatus for ceramic electronic components |
JP2002210859A (en) * | 2001-01-17 | 2002-07-31 | Dainippon Printing Co Ltd | Release film for manufacturing ceramic capacitor, and manufacturing method therefor |
JP2008141212A (en) * | 2001-08-10 | 2008-06-19 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
JP4650486B2 (en) * | 2001-08-10 | 2011-03-16 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
Also Published As
Publication number | Publication date |
---|---|
JP3131453B2 (en) | 2001-01-31 |
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