JP2001217140A - Laminated electronic component and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component, which is superior in oxidation resistance and can prevent generation of cracks in a laminated ceramic capacitor, and the manufacturing method of the laminated electronic component. SOLUTION: This laminated electronic component is provided with a laminate 35, formed by alternately laminating ceramic layers 31 and rectangular internal electrodes 33, which respectively have a long side 33a and a short side 33b, and end surface ceramic layers 36 and 37 formed on the upper and lower surfaces of the body 35. The side end of the long side 33a of the electrode 33 of one part of the electrodes 35 is projected more than the side ends of the long sides 33a of the electrodes 33 adjacent to the electrode 33, and a cavity part 71 is formed in the projected side end of the long side 33a of the electrode 33.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a multilayer electronic component and a method of manufacturing the same, and more particularly to a multilayer electronic component suitable for a multilayer ceramic capacitor and a method of manufacturing the same.

[0002]

2. Description of the Related Art A conventional multilayer ceramic capacitor is shown in FIG.
10, a plurality of ceramic layers 1 and a plurality of rectangular internal electrodes 3 having a long side 3a and a short side 3b.
The upper end face ceramic layer 6 and the lower end face ceramic layer 7 are formed on the upper and lower surfaces of a laminated body 5 formed by alternately laminating the electronic component main body 8, and both ends of the electronic component main body 8 are formed. And an external electrode 9 was provided.

[0003] Such a multilayer ceramic capacitor includes:
For example, first, ceramic powder on a PET film,
A ceramic slurry containing an organic binder and a solvent is applied, dried at 40 to 80 ° C. for 10 to 20 seconds, and then separated from the PET film to form a plurality of ceramic green sheets. An upper end face green ceramic sheet is formed. This lower end face ceramic green sheet is arranged on a base plate, and is bonded by pressing with a press machine.

On the other hand, the same ceramic slurry as described above is applied on a PET film,
After drying for 0 second, an internal electrode paste containing, for example, one of Ni, Cu, and Ag-Pd is applied on the ceramic green sheet, and a rectangular internal shape having a long side and a short side is formed on the ceramic green sheet. After forming a plurality of electrode patterns, the green sheet on which the internal electrode patterns are formed is peeled from the PET film.

[0005] Thereafter, a predetermined number of green sheets on which a plurality of internal electrode patterns are formed are laminated on the lower end face ceramic green sheet, and then an upper end face ceramic green sheet is laminated on the lower end ceramic green sheet. And, on the upper and lower surfaces of a laminate formed by alternately laminating a plurality of rectangular internal electrode patterns having long sides and short sides,
An electronic component molded body in which the end face ceramic green sheet layers are laminated is produced.

[0006] Next, the electronic component molded body is pressed and pressed by a press machine from the laminating direction, and a rubber mold is arranged on the upper part of the electronic component molded body, followed by hydrostatic molding. After this, cut into a predetermined chip shape, by applying an external electrode paste to both end surfaces of the chip-shaped molded body, and by firing,
A multilayer ceramic capacitor was formed. The external electrodes were also formed by applying and baking external electrode paste to both end surfaces of the fired chip-shaped sintered body.

[0007]

However, since the green sheets on which the internal electrode patterns are formed are laminated, a step is generated between the portion on which the internal electrode patterns are printed and the portion on the green sheet where the internal electrode patterns are not printed. As the number of steps increases, the steps are superimposed, and the laminated molded body becomes significantly deformed, causing structural defects such as cracks after firing and cracks in a thermal shock test.

[0008] In particular, when the thickness of the green sheet is reduced, particularly when the thickness is reduced to 10 μm or less, structural defects such as cracks are generated after firing, and cracks are easily generated in a thermal shock test. Was.

The present invention has been made in view of the above problems, and has as its object to provide a laminated electronic component capable of suppressing the occurrence of structural defects such as cracks and cracks in a thermal shock test, and a method of manufacturing the same.

[0010]

According to the present invention, there is provided a laminated electronic component comprising: a laminated body in which ceramic layers and rectangular internal electrodes are alternately laminated; and end ceramics formed on upper and lower surfaces of the laminated body. And a long-side end of some of the internal electrodes is protruded from a long-side end of the adjacent internal electrode, and the protruding internal electrode A cavity is formed at the long side end.

As described above, since the cavity is formed at the long side end of some of the internal electrodes so as to protrude from the long side end of the adjacent internal electrode, the portion where the internal electrode pattern is printed is formed. Even if a step is formed between the unprinted green sheet and the margin portion only, since that portion is hollow, distortion and deformation due to firing are absorbed and reduced in this hollow portion, and after firing, Can be suppressed, and the occurrence of cracks in a thermal shock resistance test can be prevented. Further, since the cavity is formed at the long side end of the protruding internal electrode, the capacitance does not decrease.

It is preferable that the long side end of the internal electrode is curved toward the center in the stacking direction.

Further, it is desirable that the amount of metal in the cavity is 0.6 times or less the amount of metal in the center of the internal electrode. This is because there is almost no electrode in the cavity even if it is curved, so there is no short circuit between the internal electrodes.

According to the method for manufacturing a laminated electronic component of the present invention, a ceramic green having a rectangular internal electrode pattern formed by applying an internal electrode paste containing metal particles having an average particle size of 0.1 to 0.3 μm is applied. A step of producing a laminated molded body formed by laminating a plurality of sheets, and protruding a long side end of a part of the internal electrode patterns from a long side end of the other internal electrode patterns; And a step of performing

As described above, by forming the laminated molded body in which the long side end of a part of the internal electrode patterns protrudes from the long side end of the adjacent internal electrode pattern, part of the internal electrode pattern after firing is partially removed. The internal electrode paste containing metal particles having an average particle diameter of 0.1 to 0.3 μm can have a longer side end of the internal electrode protruded than a longer side end of the adjacent internal electrode. Since the internal electrode pattern is formed by using, the metal particles are sintered after firing, and a cavity is formed at a long side end of a part of the protruding internal electrode.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A multilayer electronic component according to the present invention will be described with reference to a multilayer ceramic capacitor as an example. As shown in FIGS. 1 to 3, the multilayer ceramic capacitor of the present invention has a multilayer structure in which a plurality of ceramic layers 31 and a plurality of rectangular internal electrodes 33 having a long side 33 a and a short side 33 b are alternately stacked. On the upper and lower surfaces of the body 35, an upper end face ceramic layer 36 and a lower end face ceramic layer 37 are formed to form an electronic component body 38, and external electrodes 39 are provided at both ends of the electronic component body 38. Have been.

As shown in FIG. 1, the ends of the short sides 33b of the internal electrodes 33 are alternately exposed at both end faces of the laminated body 35, and the ends of the short sides 33b are connected to the external electrodes 39. ing.

Then, as shown in FIG.
The end of the long side 33a of the internal electrode 33 at the center in the stacking direction protrudes outward by a distance x, that is, 20 to 70 μm outside the upper and lower ends of the long side 33a of the internal electrode 33. When the protruding distance x is smaller than 20 μm, the end face ceramic layers 36 and 37 tend to be thin, and when it is larger than 70 μm, the ceramic layer 31 at the center in the stacking direction tends to be thin. For such a reason, it is desirable that the protruding distance x is 30 to 50 μm.

The long side 33a of the internal electrode 33 at the upper and lower ends.
The ends are curved toward the center in the stacking direction, and the radius of curvature R ₂ is set to 50 μm or more. Radius of curvature 50
If it is less than μm, the internal electrodes 33 having different polarities are likely to be short-circuited. From the viewpoint of preventing short-circuit, the radius of curvature is desirably 100 μm or more.

The thickness of the plurality of ceramic layers 31 is 3 μm
Hereinafter, the thickness is particularly set to 2.5 μm or less, and the thickness difference is desirably within 0.2 μm. As described above, as the thickness of the ceramic layer 31 decreases, the internal electrodes having different polarities come closer to each other, so that a short circuit and a decrease in insulation resistance are more likely to occur. Further, when the thickness difference is within 0.2 μm, short-circuit failure and insulation failure can be suppressed.

In the multilayer electronic component of the present invention, as shown in FIG. 4, the long side 33a end of some of the internal electrodes 33 protrudes from the long side 33a side end of the adjacent internal electrode 33. A cavity 71 is formed at the end of the protruding internal electrode 33 on the long side 33a side. The hollow portion 71 is more likely to be generated as the shrinkage of the metal particles in the internal electrode paste is larger. Therefore, as the thickness of the ceramic layer 31 decreases, the shrinkage due to sintering of the metal particles increases. 0.5 to 3 μm is desirable.

The long side 3 of the internal electrode 33 which does not protrude
At the 3a side end, cavities may be generated during firing,
The size of the cavity is determined by the long side 33 of the protruding internal electrode 33.
It is smaller than the cavity 71 at the a-side end. The hollow portion 71 protrudes from the long side 33a side end of the protruding internal electrode 33 more than the long side 33a side end of the adjacent internal electrode 33, and thus is easily affected by the atmosphere. Occurs at The cavity which does not protrude has almost no function of absorbing and relaxing the stress.

In the reoxidation process, the outermost end of the internal electrode is easily oxidized, and at least a part of the long side end of the internal electrode layer protrudes from the short side end of the adjacent internal electrode layer. In this case, the cavity 71 is easily formed.

The end of the long side 33a of some of the internal electrodes 33 is
The amount of protrusion L from the long side 33a side end of the other adjacent internal electrode 33 is desirably 1/3 or less of the thickness of the margin region on the long side 33a side, and particularly desirably 10 μm or less. The length of the cavity 71 is desirably 10 μm or less, which is the same as the protrusion amount L.

The end on the long side 33a side of the internal electrode 33 in which the cavity 71 is formed is also curved toward the center in the stacking direction as described above. Thereby, since the stress to the central part in the laminating direction can be dispersed, distortion caused by deformation due to lamination and pressing can be reduced.

The amount of metal in the cavity 71 depends on the internal electrode 3
(3) It is desirable that the amount of the metal in the central portion is 0.6 times or less. In particular, it is desirable that metal does not exist in the cavity 71. After firing, the metal present in the cavity 71 is oxidized by the reoxidation treatment and solid-dissolves in the ceramic layer, so that the abundance of the metal in the cavity is further reduced than after firing. Therefore, it is desirable that the amount of metal in the cavity 71 be 0.6 times or less the amount of metal in the center of the laminate.

The amount of metal in the cavity 71 depends on the internal electrode 3
3 When the amount of metal in the central part is more than 0.6 times,
The effect of alleviating the strain caused by the deformation due to the lamination and the pressurization is reduced, and the enlarged electrode is likely to be present, thereby causing a short circuit.

In the above-mentioned laminated ceramic capacitor, for example, first, a ceramic slurry containing a ceramic powder, an organic binder and a solvent is applied on a PET film and dried in a dryer at 40 to 80 ° C. for 10 to 20 seconds. This is peeled to form a plurality of ceramic green sheets, and a plurality of these are laminated to form an end face ceramic green sheet.

Thereafter, the end face ceramic green sheet is dried at a temperature higher than the drying temperature of the green sheet and for a long time, for example, by drying at 60 to 120 ° C. for 10 to 60 minutes to sufficiently dry and shrink. Allow to cure. This end face ceramic green sheet has 50
As shown in FIG. 5, such an end face ceramic green sheet 40 is arranged on a base plate 41, and is bonded by pressing with a press machine on the base plate 41.

As the ceramic powder, for example, BaT
A mixture of MgO ₃ , MnCO ₃ , and Y ₂ O ₃ powders in iO ₃ powder is used. For example, a butyral resin is used as an organic binder, and toluene is used as a solvent.

On the other hand, the same ceramic slurry as described above is applied on a PET film, and is dried at 40 to 80 ° C. in a dryer.
After drying for 10 to 20 seconds, for example, an internal electrode paste containing Ni is applied to the ceramic green sheet having a thickness of 3 to 10 μm to form a rectangular internal electrode pattern having long sides and short sides on the green sheet. After forming and drying,
Peel off. The internal electrode paste is applied by a well-known printing method such as a screen printing method, a gravure printing, and an offset printing method. It is desirable that the thickness be 2 μm or less, particularly 1 μm or less from the viewpoint of miniaturization and high reliability of the capacitor. Incidentally, the ceramic slurry does not need to be the same as the end face ceramic green sheet layer,
Different compositions may be used.

In the method of manufacturing a laminated electronic component of the present invention, it is important that the average particle size of the metal particles used in the internal electrode paste is 0.1 to 0.3 μm.

If the average particle size of the metal particles is smaller than 0.1 μm, the surface of the particles becomes active, resulting in oversintering, which may cause enlargement of the metal and cause a short circuit. If the average particle size is larger than 0.3 μm, the shrinkage of the metal particles of the internal electrode becomes smaller than the shrinkage of the sintering of the green sheet, so that it is difficult to form a cavity during firing.

Thereafter, as shown in FIG. 5, a predetermined number of green sheets on which the internal electrode patterns are formed are stacked on the end face ceramic green sheet layer 40, and thereafter, the end face ceramic green sheets 43 are stacked. End ceramic green sheet layers 40 and 43 are laminated on the upper and lower surfaces of a laminated molded body 45 in which a plurality of ceramic green sheets and a plurality of rectangular internal electrode patterns having long sides and short sides are alternately laminated. An electronic component molded body 47 is manufactured.

According to the present invention, the green sheet on which the internal electrode patterns are formed is formed such that the long side ends of some of the internal electrode patterns protrude from the long side ends of the adjacent internal electrode patterns. It is important to stack. An internal electrode pattern formed on an adjacent green sheet;
The positions at which the green sheets having the same shape of the internal electrode patterns are laminated are shifted so that the long side ends of some of the internal electrode patterns protrude from the long side ends of the adjacent internal electrode patterns. Although it can be laminated, an internal electrode pattern whose shorter side is longer than the adjacent internal electrode pattern is formed on the green sheet, and by laminating this, the area where the internal electrode pattern overlaps becomes large, and the capacitance is reduced. Can be larger.

Next, the electronic component molded body 47 is connected to the electronic component molded body 47 shown in FIG.
As shown in the figure, the base plate 4 on which the electronic component molded body 47 is formed
1 is placed on a mold 51 and pressed by a pressing plate 53 of a press machine from the laminating direction to be pressed. Thereafter, as shown in FIG. 57
, And then subjected to hydrostatic molding. Thereafter, the electronic component molded body 47 is peeled from the base plate 41. Note that the electronic component molded body 47 may be subjected to hydrostatic pressure molding using a rubber mold from above and below.

Thereafter, the electronic component molded body 47 is cut into a predetermined chip shape, and an external electrode paste containing, for example, Ni is applied to both end surfaces of the chip-shaped molded body, and demolding and firing are performed. Thereby, a multilayer ceramic capacitor is formed. De-buying may be performed, for example, by heating the electronic component molded body 47 at 250 to 300 ° C.
The firing is performed at 500 to 800 ° C. in a low oxygen atmosphere of 1 to 1 Pa, for example, at 1200 to 1300 ° C. in a non-oxidizing atmosphere.
For 2-3 hours. Furthermore, if desired, the oxygen partial pressure is 900 to 1 under a low oxygen partial pressure of about 0.1 to 10-4 Pa.
By performing the reoxidation treatment at 100 ° C. for 5 to 15 hours, the reduced ceramic layer is oxidized to form a ceramic layer having good insulating properties.

The external electrodes can also be formed by applying and baking external electrode paste to both end surfaces of the fired chip-shaped sintered body. For example, a Cu paste is applied to each end face of the obtained laminated
/ Sn plating is applied to form external electrodes electrically connected to the internal electrodes, whereby a multilayer ceramic capacitor can be manufactured.

In the multilayer ceramic capacitor configured as described above, when pressure is applied from the laminating direction by the pressing plate 53 of the press machine, as shown in FIG. Although it extends in the direction,
Since the end face ceramic green sheet layers 40 and 43 are difficult to extend, these end face ceramic green sheet layers 4
A state where the long sides of the internal electrode patterns at the upper and lower ends are suppressed by being dragged toward 0 and 43, and the long sides of the internal electrode patterns protrude beyond the long sides of the internal electrode patterns at the upper and lower ends at the center in the stacking direction. Becomes

After that, when hydrostatic pressure molding is performed using the rubber mold 57, as shown in FIG. 7, the vicinity of the long side of the internal electrode pattern is in a curved state having a larger radius of curvature than the conventional one, and is located below. The distance between the internal electrode patterns having different polarities can be made longer than before, and short-circuit failure and reduction in insulation resistance can be suppressed.

In the central part in the stacking direction, although the vicinity of the long side of the internal electrode pattern extends in the lateral direction, the end face ceramic green sheet layers 40 and 43 are difficult to extend. The extension of the electronic component molded body 47 in the horizontal direction is suppressed, and peeling and cracking between the ceramic green sheets can be prevented, whereby the occurrence of delamination and cracking of the multilayer electronic component can be suppressed.

In the multilayer electronic component of the present invention, a cavity 71 is formed at the long side 33a end of some of the internal electrodes 33 so as to protrude beyond the long side 33a end of the adjacent internal electrode 33. Therefore, even if a step is formed between the portion on which the internal electrode pattern is printed and the margin portion of only the unprinted green sheet, the portion is the hollow portion 71, and the hollow portion 71 is formed. Strain and deformation due to firing are absorbed and alleviated in the portion 71, so that cracks after firing can be suppressed, and the occurrence of cracks in a thermal shock resistance test can be prevented. The cavity 7
1 is formed at the end of the protruding internal electrode 33 on the long side 33a side, so that the capacitance does not decrease.

In the above example, an example was described in which the multilayer electronic component of the present invention was applied to a multilayer ceramic capacitor. However, the present invention is not limited to the above example.
For example, it goes without saying that it may be used for a laminated inductor, a piezoelectric transformer, a piezoelectric actuator, and the like.

[0044]

EXAMPLE First, BaTiO3 was placed on a PET film._Three,
MgCO_Three, MnCO_ThreeAnd Y_TwoO _ThreePowder, butyral tree
Preparation of ceramic slurry consisting of fat and toluene
And apply it by the doctor blade method.
After drying at 60 ° C. for 15 seconds, this was peeled off and the thickness was 9 μm
Of ceramic green sheets of 10
Lamination was performed to form an end face ceramic green sheet layer.
And these end face ceramic green sheet layers,
It was dried at 90 ° C. for 30 minutes.

The ceramic green sheet layer at the end face was placed on the base plate 41, pressed by a press machine and adhered on the base plate 41.

On the other hand, the same ceramic slurry as described above was applied on a PET film by a doctor blade method, dried at 60 ° C. for 15 seconds, and a number of ceramic green sheets having a thickness of 3 μm were prepared.

Next, Ni powder 45 having an average particle size shown in Table 1 was used.
The internal electrode paste was prepared by kneading 55% by weight of a vehicle composed of 5.5% by weight of ethyl cellulose and 94.5% by weight of octyl alcohol with respect to 3% by weight with a three-roll mill.

Thereafter, the above-mentioned internal electrode paste is printed in an internal electrode pattern on one main surface of the obtained ceramic green sheet using a screen printing apparatus, and has a long side and a short side on the green sheet. A plurality of rectangular internal electrode patterns were formed, dried, and then peeled off.

Thereafter, as shown in FIG. 5, 400 green sheets on which the internal electrode patterns are formed are stacked on the end face ceramic green sheet layer 40, and thereafter, the end face ceramic green sheets 43 are stacked. An electronic component molded body 47 was produced.

When laminating the green sheets on which the internal electrode patterns are formed, some of the long sides of the internal electrode patterns are shifted so as to protrude from the long sides of the adjacent internal electrode patterns. Laminated. Table 1 shows the presence or absence of displacement of the internal electrode pattern.

Next, the electronic component molded body 47 is inserted into the electronic component molded body 47 as shown in FIG.
As shown in FIG. 6B, the plate is placed on a mold 51, and the pressure is increased stepwise from the laminating direction by a pressing plate 53 of a press machine to perform pressure bonding. Thereafter, as shown in FIG. A rubber mold 57 was arranged on the upper part of the component molded body 47, and was subjected to isostatic pressing.

Thereafter, the electronic component molded body 47 is cut into a predetermined chip shape, and is then cut at 300 ° C. or 0.1 P
Heating was performed at 500 ° C. in an oxygen / nitrogen atmosphere of a to perform a debubbling treatment. Further, in an oxygen / nitrogen atmosphere of 10 ^-7 Pa,
It was fired at 1300 ° C. for 2 hours, and further re-oxidized at 1000 ° C. in an oxygen-nitrogen atmosphere of 10 ⁻² Pa to obtain a sintered body. After firing, a Cu paste is applied to the end face of the sintered body 90 times.
Baking was performed at 0 ° C., and further, Ni / Sn plating was performed to form external electrodes connected to the internal electrodes.

The external dimensions of the multilayer ceramic capacitor thus obtained are 1.25 mm in width and 2.0 m in length.
m, the thickness was 1.25 mm, and the thickness of the ceramic layer interposed between the internal electrodes was 2 μm. The effective number of stacked ceramic layers was 400.

Regarding the obtained multilayer ceramic capacitor, 1,000 samples were observed with a 40 × binocular microscope to check for cracks. Table 1 shows the number of cracks. Further, a thermal shock resistance test was performed using the multilayer ceramic capacitor obtained as described above in accordance with JIS standards, and the temperature (Δ
(T = 225 ° C.), the number of cracks generated was calculated. The results are also shown in Table 1.

The amount of metal is calculated by image analysis (image analyzer made by Luzex Co.) by fracturing the protruding inner electrode on the long side and calculating the occupied portion and unoccupied portion of the metal. The ratio with the amount of metal was calculated, and the results are also shown in Table 1.

As a comparative example, Ni having an average particle size of 0.4 μm
The same evaluation was performed in the case where the powder was used and the case where the long sides of the internal electrode patterns were aligned and the internal electrodes protruding from the long sides were not present.

[0057]

[Table 1]

From the results shown in Table 1, the average particle size was 0.10.
μm, 0.15 μm, 0.20 μm, 0.25 μm,
When using any of the 0.30 μm Ni powder samples, there was a cavity protruding from the long side end of the internal electrode, and no cracks occurred after firing and after the thermal shock resistance test. I understand.

Further, as the average particle size of the Ni powder becomes smaller, the amount of metal in the protruding cavity decreases, because the shrinkage of the Ni powder is large.

On the other hand, when Ni powder having an average particle size of 0.4 μm was used, the amount of metal in the protruding cavity was almost equal to the amount of metal in the center of the internal electrode, and cracks were observed in the thermal shock resistance test. Can be Sample No. having no protruding portion of the internal electrode. No. 7 shows that cracks occur after firing, and cracks also occur in the thermal shock resistance test.

[0061]

As described in detail above, according to the present invention,
Since a hollow portion is formed at the long side end of some internal electrodes so as to protrude from the long side end of the adjacent internal electrode, a portion where the internal electrode pattern is printed and a green sheet where no internal electrode pattern is printed are formed. Even if a step is formed between the margin and the margin, only that part is hollow, so that distortion and deformation due to firing can be absorbed and reduced in this hollow part, and cracks after firing can be suppressed. It is possible to prevent the occurrence of cracks in the thermal shock resistance test. Further, since the cavity is formed at the long side end of the protruding internal electrode, the capacitance does not decrease.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a multilayer electronic component of the present invention.

FIG. 2 is a cross-sectional view taken along line aa of FIG.

FIG. 3 is a perspective view illustrating an internal electrode on a ceramic layer according to the present invention.

4 is an enlarged cross-sectional view of a part of FIG. 2, showing a state in which a cavity is formed at a long side end of an internal electrode.

FIG. 5 is a side view showing a state where an electronic component molded body is formed on a base plate.

FIG. 6 is an explanatory diagram for explaining the production method of the present invention;
FIG. 2A is a cross-sectional view showing a state in which pressure molding is performed, and FIG. 2B is a cross-sectional view showing a state in which isostatic pressing is performed using a rubber mold.

FIG. 7 is a cross-sectional view of a molded electronic component.

FIG. 8 is a longitudinal sectional view of a conventional multilayer electronic component.

FIG. 9 is a transverse sectional view taken along the line bb of FIG. 8;

FIG. 10 is a perspective view illustrating an internal electrode on a conventional ceramic layer.

[Explanation of symbols]

 31 ceramic layer 33 internal electrode 33a long side 33b short side 35 laminated body 36, 37 end face ceramic layer 38 electronic component body 45 Laminated molded body 71 ・ ・ ・ Cavity

Continued on the front page F-term (reference) 5E001 AB03 AC00 AC03 AC04 AC09 AD03 AD05 AE00 AE02 AE03 AE04 AF00 AF06 AH01 AH05 AH09 AJ01 AJ02 5E082 AA01 AB03 BC33 EE04 EE11 EE23 EE35 FG01 FG22 GG11 GG27 GG10 LL02 MM22 MM24

Claims (4)

[Claims] 1. A multilayer electronic component comprising: a laminate in which ceramic layers and rectangular internal electrodes are alternately laminated; and end face ceramic layers formed on upper and lower surfaces of the laminate. A long-side end of a part of the internal electrodes protrudes from a long-side end of the adjacent internal electrode, and a cavity is formed at the long-side end of the protruded internal electrode. A multilayer electronic component characterized by the following. 2. The multilayer electronic component according to claim 1, wherein the long side end of the internal electrode is curved toward the center in the stacking direction. 3. The multilayer electronic component according to claim 1, wherein the amount of metal in the cavity is 0.6 times or less the amount of metal in the center of the internal electrode. 4. An internal electrode paste containing metal particles having an average particle size of 0.1 to 0.3 μm is applied and formed by laminating a plurality of ceramic green sheets on which rectangular internal electrode patterns are formed, And, a step of producing a laminated molded body in which a long side end of a part of the internal electrode patterns protrudes from a long side end of the adjacent internal electrode pattern,
Baking a laminated electronic component.