JP2002075771A - Laminated electronic component and conductive paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component, capable of improving an electrostatic capacity and an insulation resistance by preventing a crack or a delamination and to provide a conductive paste. SOLUTION: A through hole 35 is formed in the thickness direction of an internal electrode layer 15. Dielectric layers 17 for interposing the layer 15 are exposed within the hole 35 to form a cavity 25, and protrusions 27 are formed on the layer 15 around the cavity 25.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a multilayer electronic component and a conductive paste, and more particularly to a multilayer electronic component and a conductive paste suitable for a multilayer ceramic capacitor.

[0002]

2. Description of the Related Art A multilayer ceramic capacitor has a structure in which dielectric layers and internal electrode layers are alternately laminated, and each internal electrode layer is sandwiched between dielectric layers. In recent years, multilayer ceramic capacitors have been increasingly required to be smaller and have higher capacitance. For this reason, the thickness of the dielectric layers and the number of stacked layers have been increased. It is thinner.

Further, when the internal electrode layer is formed of a conductive paste for internal electrodes containing a noble metal such as Pd as a main component, the cost of forming the electrode is significantly increased with an increase in the number of layers. Has been developed, and a multilayer ceramic capacitor having an internal electrode layer formed with the paste has been put to practical use.

When a base metal such as Ni is used as an internal electrode layer in a multilayer ceramic capacitor having an increased number of layers for the purpose of increasing the capacity, Ni is partially oxidized at the time of debinding, and the internal electrode layer is formed. There has been a problem that the laminate expands and delamination or cracks occur in the laminate during binder removal.

As a method of preventing the occurrence of such delamination and cracks, a method of forming a circulation path for volatile components inside the multilayer ceramic capacitor is considered.

With respect to such a structure, for example, it is preferable to mix resin particles made of polyvinyl butyral with a conductive paste used for an internal electrode layer to form a through hole that becomes a cavity in the internal electrode layer after firing. Kaihei 7-3265
No. 37 is disclosed.

Another method for preventing the occurrence of delamination and cracks is disclosed in Japanese Patent Application Laid-Open No. 10-172855.
The one disclosed in Japanese Patent Application Laid-Open Publication No. H10-260, 1993 is known. The multilayer ceramic capacitor disclosed in this publication uses a common material made of ceramic particles of the same quality as the dielectric layer contained in the conductive paste to firmly connect the dielectric layers existing above and below the internal electrode layer to each other. The stacked electronic components can prevent cracks and delaminations.

[0008]

However, in the multilayer electronic component disclosed in Japanese Unexamined Patent Publication No. Hei 7-326537, as shown in FIG. And internal electrode pattern 43
Are alternately stacked, and 10 to 10
Resin particles 4 composed of 40% by volume of polyvinyl butyral
5, there is a problem that the effective area of the internal electrode layer is greatly reduced, and the capacitance is reduced in a multilayer ceramic capacitor having an increased number of layers for higher capacitance.

In the multilayer ceramic capacitor disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 10-172855,
As shown in FIG. 4B, the internal electrode pattern 43
The co-material 47 made of ceramic powder having a particle size of 1 to 4 μm
15 to 33%, there is a problem that the capacitance decreases due to a decrease in the effective area of the internal electrode layer.

In a multilayer ceramic capacitor using a BaTiO ₃ material as a dielectric and a base metal such as Ni as an internal electrode layer, the multilayer ceramic capacitor is fired at a temperature of 1200 to 1300 ° C. in a reducing atmosphere. In order to increase the capacitance and insulation resistance of the capacitor, it is necessary to perform an oxidation treatment at a temperature of 800 to 1100 ° C. in a weak reducing atmosphere, but when the internal electrode layers are thinned and laminated, In addition, the oxygen diffusion path becomes narrow, and sufficient oxidation treatment cannot be performed, so that not only the capacitance and insulation resistance cannot be improved, but also because the oxidation of the internal electrode layer surface is poor, the interface with the dielectric layer cannot be improved. There is a problem that the bonding strength is low, and in a solder dip or thermal shock test assuming mounting, delamination and cracks are easily generated in the laminate.

Accordingly, an object of the present invention is to provide a laminated electronic component and a conductive paste which can prevent the occurrence of cracks and delamination and can improve the capacitance and insulation resistance.

[0012]

According to the present invention, there is provided a multilayer electronic component comprising a dielectric layer and internal electrode layers alternately stacked, wherein a through hole is formed in a thickness direction of the internal electrode layer. A cavity formed by exposing the dielectric layer sandwiching the internal electrode layer to the inside of the through hole, and forming a protrusion in the internal electrode layer around the cavity. It is.

In the multilayer electronic component of the present invention, first, a cavity is formed in the internal electrode layer between which the dielectric layer is sandwiched, thereby promoting the evaporation of the volatile component at the time of de-buying through the cavity. Absorbs internal stress caused by firing and thermal shock,
Can be relaxed. In addition, by forming the protruding portion formed in the internal electrode layer around the cavity, the protruding portion of the internal electrode layer forms a low-density portion. Can be increased.

In the multilayer electronic component, it is preferable that the thickness of the raised portion of the internal electrode layer is twice or less the thickness of the internal electrode layer in other portions.

If the thickness of the raised portion of the internal electrode is not more than twice the thickness of the internal electrode layer in the other portions, the diffusion of oxygen by the oxidation treatment using a weak reducing atmosphere can be enhanced, and the internal electrode can be enhanced. The flatness of the layer can be maintained.

In the above-mentioned laminated electronic component, the maximum diameter of the cavity is 1
It is desirable that the thickness be 0 μm or less. If the maximum diameter of the cavity formed in the internal electrode layer is 10 μm or less, a decrease in capacitance due to a decrease in the effective area of the internal electrode layer can be reduced by forming the cavity, and the cavity can be removed at the time of debuying. And promotes evaporation of volatile components, and further enhances oxidation of the dielectric porcelain by the weak reducing atmosphere.

In the multilayer electronic component, it is desirable that the exposed surface of the dielectric layer exposed to the cavity protrudes toward the inside of the cavity. The dielectric layer exposed in the cavity protrudes toward the cavity formed in the internal electrode layer,
Since the bonding area at the bonding end between the internal electrode layer and the dielectric layer can be increased, the bonding strength between the internal electrode layer and the dielectric layer can be increased.

The above-mentioned laminated electronic component can be suitably used when the thickness of the internal electrode layer other than the raised portions formed on the internal electrode layer is 2 μm or less. In this case, a portion having a low filling density of the internal electrode layer is formed around the cavity formed in the internal electrode layer. Can increase the diffusion.

The conductive paste of the present invention comprises: a metal particle; an organic solvent comprising a mixture of an aliphatic hydrocarbon and a higher alcohol; an organic binder comprising ethyl cellulose soluble in the organic solvent; And an organic binder made of an epoxy resin that is hardly soluble in an organic solvent.

In the present invention, an organic binder which is dissolved in an organic solvent used for the conductive paste to secure viscosity characteristics, printability, drying properties and workability of the conductive paste, By containing an organic binder that is hardly soluble in the organic solvent, the conductive paste is applied to a dielectric green sheet, and the organic solvent contained in the conductive paste is dried. A through-hole is formed in the internal electrode pattern applied to the substrate, and a protrusion is formed in the internal electrode pattern.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A multilayer electronic component according to the present invention will be described with reference to a multilayer ceramic capacitor as an example. As shown in FIG. 1, the multilayer ceramic capacitor of the present invention is configured by forming external electrodes 13 on both ends of an electronic component body 11. The electronic component body 11 includes the internal electrode layer 1
An insulating layer 21 made of the same material as that of the dielectric layer 17 is formed on both sides in the stacking direction of the capacitance section 19 in which the dielectric layers 5 and the dielectric layers 17 are alternately stacked.

As shown in FIG. 2, the internal electrode layers 15 alternately stacked with the dielectric layers 17 are formed with through holes in the thickness direction to form cavities 25. A raised portion 27 is formed in the internal electrode layer 15, and is thicker than the internal electrode layer 15 in a portion other than the raised portion 27. Then, toward the cavity 25, the dielectric layer 17
By protruding, a joint end 29 where the internal electrode layer 15 and the dielectric layer 17 are joined is formed on the periphery of the cavity 25.

The thickness t1 of the raised portion 27 is
The thickness t2 of the internal electrode layer 15 other than 7 is desirably twice or less. The thickness t1 of the raised portion 27 is equal to the thickness t of the internal electrode layer 15.
When the thickness is larger than twice the thickness of the internal electrode layer 15 and the dielectric layer 17, the unevenness of the internal electrode layer 15 and the dielectric layer 17 increases, and a large gap is formed near the cavity 25.
In this case, the strength of the joint is weakened, and the protruding portion 27 compresses the thinned dielectric layer 17 to easily cause a short circuit. For this reason, the thickness t1 of the raised portion 27 is desirably 1.2 to 1.8 times the internal electrode layer 15.

The protruding portion 27 of the internal electrode layer 15 formed around the cavity 25 around the cavity 25 has a low packing density of metal particles, and is subjected to oxidation treatment in a weak reducing atmosphere performed after the main firing. The diffusion of oxygen can be increased, and after the oxidation treatment, the Ni metal constituting the internal electrode layer 15 is oxidized, so that the volume expands and the dielectric layer 1
7 and can be joined by solid solution.

The maximum diameter R of the cavity 25 is set to 10 μm or less, and when the maximum diameter R is larger than 10 μm, the dielectric layers 1 located above and below the internal electrode layer 15
7 adhere to each other inside the cavity 25, and not only the cavity 25 is not formed, but also the capacitance decreases due to the decrease in the effective area of the internal electrode layer 15. Therefore, in order to reduce the decrease in the effective area of the internal electrode layer 15 and promote debuoyability and diffusion of oxygen, the maximum diameter of the cavity 25 is preferably 2 to 2.
10 μm is desirable.

Further, since the exposed surface of the dielectric layer 17 exposed to the cavity 25 protrudes toward the inside of the cavity 25, the bonding area between the internal electrode layer 15 and the dielectric layer 17 can be increased. The joining strength can be increased.

In the multilayer electronic component of the present invention, the thickness of the internal electrode layer 15 is 2 μm or less, particularly 1.8 μm or less, and the thickness difference is preferably used when the thickness difference is within 0.2 μm. Can be

In this case, the cavity 25 formed in the internal electrode layer 15 and the raised portion 27 around it form the internal electrode layer 15.
Even in the case of laminated molded articles and porcelain densified for the purpose of thinning, gas channels can be formed inside them, preventing the occurrence of cracks and delamination due to de-buying, The effect of the oxidation treatment by the reducing atmosphere can be enhanced. The thickness of the internal electrode layer 15 is 2 μm
If it is larger, the ridge 27 formed of the internal electrode layer 15 around the cavity 25 becomes thicker, and the dielectric layer 17
Cause short circuit and insulation resistance failure.

The thickness of the dielectric layer 17 is preferably 3 μm or less. In order to improve the small size, large capacity, and insulation reliability,
In particular, 0.5 to 2 μm or less is desirable.

In the multilayer electronic component of the present invention, as shown in FIG. 3, an internal electrode pattern 33 to be the internal electrode layer 15 is formed on the surface of the dielectric green sheet 31 to be the dielectric layer 17. In this step, the through hole 35 serving as the cavity 25 and the internal electrode pattern 33 around the through hole 35 are formed.
A swelling portion 37 serving as the protruding portion 27 is formed on the upper portion.

The conductive paste used for the internal electrode pattern 33 includes metal particles, an organic solvent composed of a mixture of an aliphatic hydrocarbon and a higher alcohol, and an organic binder composed of ethyl cellulose soluble in the organic solvent. And an organic binder made of an epoxy resin which is hardly soluble in the organic solvent. The epoxy resin which is hardly soluble in the organic solvent is used for forming the cavity 25 in the internal electrode pattern 33, as is clear from the examples described later. It must be made of a hardly soluble organic resin. Therefore, the material used as the hardly soluble organic resin is basically an organic resin having a phenyl group which is a functional group of bisphenol A constituting the epoxy resin, and in addition, a polyimide resin, a phenol resin, and the like are also effective. It is a target.

Next, the metal particles have an average particle size of 0.1.
Base metal particles of about 0.5 μm are used. Base metals include Ni, Co, and Cu. Ni is desirable because the firing temperature of the metal matches the firing temperature of general dielectrics and the cost is low.

The average particle size of the base metal particles is 0.1 to 0.5 μm.
The range of m is desirable. When the average particle size is less than 0.1 μm, the surface of the base metal particles becomes active, so that aggregation of the metal particles easily occurs, the dispersibility of the metal powder is reduced, and the organic viscosity for dispersing the metal powder is reduced. This is because the amount of carbon remaining in the dielectric layer 17 increases as the amount of the binder used increases. Further, after firing to produce a multilayer ceramic capacitor, the high activity of the metal powder causes oversintering, which causes the internal electrode layer 15 to be enlarged and may cause a short circuit of the internal electrode layer 25. There is. on the other hand,
If the average particle size exceeds 0.5 μm, the surface roughness when the conductive paste is applied to the dielectric green sheet 31 tends to become coarse, and a sufficiently dense electrode film cannot be obtained. In consideration of the kneadability with the organic binder solution, the average particle size of the base metal is desirably 0.15 to 0.3 μm.

In the conductive paste, it is preferable to use a fine dielectric powder as a solid component in addition to the metal powder in order to suppress the sinterability of the internal electrode pattern 33. In order to form a uniform particle size and improve smoothness, the particle size of the dielectric powder is 0.05
０．２0.2 μm is desirable.

The content of the epoxy resin contained in the conductive paste is desirably 0.05 to 1.5% by weight based on the content of the ethyl cellulose. 0.05
If the amount is less than 1.5% by weight, it is difficult to form the through holes 35 in the internal electrode pattern 33. If the amount is more than 1.5% by weight, the dispersibility of the conductive paste is reduced, and the epoxy resin aggregates are reduced. Is formed, so that a uniform internal electrode pattern 33 cannot be formed.

In this case, ethyl cellulose, which is dissolved in the organic solvent used for the conductive paste to secure the viscosity characteristics, printability, drying properties and workability of the conductive paste, is added to the organic solvent. By containing the insoluble epoxy resin, the conductive paste is applied to the dielectric green sheet 31, and immediately after the organic solvent contained in the conductive paste is dried, as shown in FIG. A swollen portion 37 made of the internal electrode pattern 33 thicker than the internal electrode pattern 33 can be formed in the plane of the internal electrode pattern 33 formed by applying to the green sheet 31.

Specific examples of the method for producing the multilayer electronic component of the present invention will be described. First, the dielectric layer 17 has a thickness of 1.5 to
A 2.5 μm dielectric green sheet 31 is produced by using a slip casting method. Specific examples of the slip casting method include a pulling method, a doctor blade method, a reverse roll coater method, a gravure coater method, a screen printing method, a gravure printing method, and a die coater method. This dielectric green sheet is made of, for example, BaTiO ₃ —MnO—MgO—
It can be formed by using a raw material powder mainly composed of Y ₂ O ₃ , and the main raw material BaTiO ₃ powder can be synthesized by a solid-phase method, a liquid-phase method (such as a method passing through an oxalate), or a hydrothermal synthesis. The hydrothermal synthesis method is preferable because of its narrow particle size distribution and high crystallinity. The average particle diameter of the BaTiO ₃ powder is preferably 1.7 to 6.6 (m ² / g).

Next, the dielectric green sheet 31
The conductive paste of the present invention is coated with an internal electrode layer pattern 33 having a thickness of 0.2 to 2 μm, and dried. In this step, the through hole 35 can be formed as follows.

In the conductive paste applied on the dielectric green sheet 31, the organic solvent starts to evaporate immediately after the drying process, and as a result, solids such as metal and dielectric powder contained in the conductive paste are reduced. Together with the epoxy resin, it coagulates cyclically, leaving only the organic solvent inside the ring. afterwards,
The ring-shaped agglomerated epoxy resin absorbs the organic solvent and swells, thereby forming a swelling portion 37 including the internal electrode pattern 33. The maximum diameter of the swelling portion 37 thus formed is 2 to 10 μm.

Next, a plurality of dielectric green sheets 31 to which the conductive paste is applied are laminated, and the temperature is 25 to 80.
The first lamination is performed at a temperature of 4 ° C. and a pressure of 4 to 40 kgf / cm ² to form a temporarily laminated molded body. At this time, the laminated dielectric green sheets 31 are not completely adhered, and a gap is left for sufficient degassing at the next second lamination. This is because the epoxy resin has a high glass transition point Tg (120 ° C.),
This is because plasticization does not occur at the time of heating and pressurizing at ° C.

Next, this temporarily laminated molded body was heated to a temperature of 90 to 13 ° C.
A second laminating press is performed at 0 ° C. and a pressure of 100 to 300 kgf / cm ² to completely adhere to each other to obtain a laminated molded body.

Here, the laminated dielectric green sheets 3
In the cross section of No. 1, plasticizing of the dielectric green sheets 31 stacked above and below the internal electrode patterns 33 occurs in the through holes 35 formed in the plane of the internal electrode patterns 33 in the pressing step, and the dielectric green sheets 31 are formed. Is through hole 35
Then, the internal electrode pattern 33 and the dielectric green sheet 31 are brought into close contact with each other to form a laminate.

This is because the dielectric green sheets 31 are completely adhered to each other by heating to a temperature higher than the glass transition point Tg of the organic binder and further applying pressure.
Further, a portion of the dielectric green sheet 31 is
Can be protruded toward.

Next, the laminated molded body is cut into a lattice to obtain a molded body of the electronic component body 11. Internal electrode patterns 33 to be the internal electrode layers 15 are provided on both end surfaces of the molded body.
Are alternately exposed.

Next, the molded body of the electronic component body 11 is placed in the atmosphere at 250 to 300 ° C. or an oxygen partial pressure of 0.1 to 1 Pa.
And then firing at 1200 to 1300 ° C. for 2 to 3 hours in a non-oxidizing atmosphere. Further, if desired, the oxygen partial pressure is 0.1 to 10
^-4 Pa as low oxygen partial pressure, 5 at 900 to 1100 ° C.
By performing the reoxidation treatment for 15 hours, the reduced electronic component body 11 is oxidized, so that the electronic component body 11 having high capacitance and insulating properties can be obtained.

Finally, a Cu paste is applied to each end face of the obtained electronic component body 11 and Ni / Sn plating is applied to form an external electrode 13 electrically connected to the internal electrode layer 15. A multilayer ceramic capacitor is manufactured.

By using the conductive paste configured as described above, a cavity 25 is formed in the internal electrode layer 15, and a raised portion 27 made of the internal electrode layer 15 is formed around the cavity 25. In addition, it is possible to improve the de-builtability of a multilayer ceramic capacitor having a high lamination, and to suppress cracks and delamination. In addition, by increasing the formation of an oxide film on the surface of the internal electrode layer and the introduction of oxygen into the dielectric porcelain by the weak reducing atmosphere treatment performed after the main firing, the bonding strength between the internal electrode layer and the dielectric layer is increased, and A multilayer capacitor having high capacity and high insulation can be manufactured.

[0048]

EXAMPLE A multilayer ceramic capacitor, which is one of multilayer electronic components, was manufactured as follows. First, BaT
A predetermined amount of each of the oxides of Y and Mg was mixed with 100 mol% of a composition composed of 99.5 mol% of iO ₃ and 0.5 mol% of MnO, and wet-pulverized by a ball mill using ZrO ₂ balls. . Next, a predetermined amount of a polyvinyl butyral-based organic binder, a phthalate-based plasticizer, a dispersant, and a toluene solvent are mixed and crushed and kneaded using a vibration mill to prepare a slurry. Then, a 2.5 μm-thick dielectric green sheet was formed on a belt-shaped carrier film made of polyester.

Next, Ni powder 7 having an average particle size of 0.25 μm
7.35% by weight, as a co-material, 1 of BaTiO ₃ having an average particle size of 0.15 μm, which is a constituent material of the dielectric ceramic layer,
7.55% by weight and ethyl cellulose 5.1% by weight
Was added to the mixture consisting of the epoxy resin in the amount shown in Table 1 to prepare a total amount of 100% by weight. To this mixture, decyl alcohol was added as a solvent, and the mixture was kneaded with three rolls. Thus, a conductive paste was prepared.

Next, the obtained dielectric green sheet 31
Using a screen printing device, apply the conductive paste described above on the internal electrode pattern 33 to a thickness of 1.2
It was printed to a thickness of μm and dried. In this case, in the plane of the internal electrode pattern 33 formed by printing on the dielectric green sheet 31, the swelling portion 37 is formed by agglomeration of the epoxy resin in a ring shape, and a through hole 35 having a maximum diameter of 1 to 10 μm is formed. Formed.

Next, 400 dielectric sheets to which the conductive paste was applied were laminated, and a temperature of 55 ° C. and a pressure of 10 kgf /
At 1 cm ² , the first lamination was performed to form a temporary laminated molded body. The provisional laminate formed under these conditions is in a state where the dielectric green sheet 31 is not completely adhered,
At the time of the next second lamination press, a gap was left for sufficient degassing.

Next, the temporary laminated molded body was heated at a temperature of 100 ° C.
A second laminating press is performed at a pressure of 200 kgf / cm ² , and the dielectric green sheet 31 coated with the internal electrode pattern 33 and the green sheets made of the same material as the dielectric green sheet 31 above and below the dielectric green sheet 31 are completely adhered. Thus, a laminated molded product was obtained.

In this lamination pressing step, the internal electrode patterns 3 applied to the laminated dielectric green sheets 31
The cavity 25 formed in the plane of No. 3 had a shape in which a part of the dielectric green sheet 31 was curved and entered into the cavity 25 while leaving a gap.

Next, the laminated molded body was cut into a lattice to obtain a molded body of the electronic component body 11. One end of the electrode pattern of the internal electrode layer 15 was exposed alternately on both end surfaces of the laminated molded body.

Next, after removing the molded body of the electronic component body 11 at 300 ° C. in the atmosphere or at 500 ° C. in a low oxygen atmosphere having an oxygen partial pressure of 0.1 to 1 Pa, a non-pressurized product having an oxygen partial pressure of 10 ⁻⁷ Pa Firing at 1300 ° C. for 2 hours in an oxidizing atmosphere;
1 at 1000 ° C under low oxygen partial pressure of 0.01 Pa
The electronic component body 11 was obtained by performing a reoxidation treatment for 0 hour.

Finally, a Cu paste containing glass powder was applied to each end face of the obtained electronic component body 11, and then baked at 900 ° C. in a reducing atmosphere. Thereafter, Ni and Sn plating were performed to form external electrodes 13 electrically connected to the internal electrode layers 15 to produce a multilayer ceramic capacitor.

The external dimensions of the multilayer ceramic capacitor thus obtained are 1.25 mm in width and 2.0 m in length.
m, the thickness was 1.25 mm, and the thickness of the dielectric ceramic layer interposed between the internal electrode layers 15 was 2 μm.

After firing, 1000 samples of the obtained multilayer ceramic capacitor were observed under an optical microscope to check for cracks. Table 1 shows the number of cracked porcelains. Further, a thermal shock resistance test was performed using the multilayer ceramic capacitor obtained as described above. The test was performed based on JIS standards. Table 1 shows the number of cracks at a temperature (ΔT = 340 ° C.) for 300 samples. The maximum diameter of the cavity 25 formed in the internal electrode layer 15 was evaluated by fracturing the sample and observing with a scanning electron microscope. Capacitance is 1kHz, 1V
It was measured under the condition of rms. The results are shown in Table 1.

[0059]

[Table 1]

As is clear from the results in Table 1, as an organic binder contained in the conductive paste, the epoxy resin was adjusted to an appropriate addition amount shown in Table 1 for sample No. 1. In Nos. 2 to 8, since the cavity 25 having an appropriate size was formed, there were no cracks or ΔT cracks after firing, and the capacitance was 9.1.
It was as high as 1 μF or more, and a multilayer ceramic capacitor with a small size and a high capacitance could be manufactured without delamination or cracking even if the dielectric layer was made thin.

On the other hand, the sample No. Sample No. 1 showed a high capacitance of 9.81 μF and no cracks were observed after firing, but in a thermal shock test (ΔT) at 340 ° C., two out of 300 cracks were found.

[0062]

As described in detail above, according to the present invention,
In the conductive paste for forming the internal electrode layer, by containing ethyl cellulose soluble in an organic solvent and a binder mixed with an epoxy resin that is hardly soluble in the organic solvent, Prevents cracks and delamination of laminated electronic components by forming through holes that become cavities in the internal electrode pattern applied to the dielectric green sheet and swelling portions that become ridges around the internal electrode pattern However, for example, it is possible to improve the capacitance and the insulation resistance of the multilayer ceramic capacitor having a higher capacitance.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a multilayer electronic component of the present invention.

FIG. 2 is an enlarged sectional view showing a part of FIG. 1;

FIG. 3 is a cross-sectional view showing a state in which an internal electrode pattern having a through hole is formed on a dielectric green sheet using the conductive paste of the present invention.

FIG. 4A is a cross-sectional view showing an internal structure of a conventional multilayer molded product of a multilayer electronic component, and FIG. 4B is a cross-sectional view showing an internal structure of a conventional multilayer electronic component.

[Explanation of symbols]

 15 Internal Electrode Layer 17 Dielectric Layer 25 Cavity 27 Raised Part 29 Joint End 31 Dielectric Green Sheet 33 Internal Electrode Pattern 35 Through Hole 37 Swelling Part

Claims (6)

[Claims] 1. A laminated electronic component in which dielectric layers and internal electrode layers are alternately laminated, wherein a through hole is formed in a thickness direction of the internal electrode layer, and the dielectric layer sandwiches the internal electrode layer. Wherein a cavity is formed by being exposed in the through hole, and a protrusion is formed in the internal electrode layer around the cavity. 2. The multilayer electronic component according to claim 1, wherein the thickness of the raised portion of the internal electrode layer is not more than twice the thickness of the internal electrode layer in other portions. 3. The multilayer electronic component according to claim 1, wherein the maximum diameter of the cavity is 10 μm or less. 4. The multilayer electronic component according to claim 1, wherein an exposed surface of the dielectric layer exposed to the cavity protrudes toward the inside of the cavity. 5. The internal electrode layer other than the raised portion of the internal electrode layer has a thickness of 2 μm or less.
The multilayer electronic component according to any one of the above. 6. An organic solvent composed of a mixture of metal particles, an aliphatic hydrocarbon and a higher alcohol, an organic binder composed of ethyl cellulose soluble in the organic solvent, and hardly soluble in the organic solvent. An electrically conductive paste comprising an organic binder made of a conductive epoxy resin.