JP2003115416A - Conductive paste, method of manufacturing laminated ceramic electronic component, and laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide conductive paste that is improved in surface smoothness so that the paste may satisfactorily cope with the thinning of a dielectric ceramic layer performed for reducing the size of a laminated ceramic capacitor and increasing the capacitance of the capacitor and, in addition, is suitable for the formation of a high-coverage internal conductor film. SOLUTION: Ceramic powder having a mean particle diameter which is equal to or smaller than that of conductive metallic powder, such as nickel powder, etc., contained in the paste is added to the conductive paste in an amount of 1.5-12.5 wt.% while a mean particle diameter of the metallic powder is adjusted to <=0.2 μm.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a conductive paste, a method for manufacturing a laminated ceramic electronic component which is carried out by using the conductive paste for forming an internal conductor film, and a conductive paste. The present invention also relates to a monolithic ceramic electronic component, and more particularly, to an improvement for advantageously achieving thinning and multi-layering in a monolithic ceramic electronic component.

[0002]

2. Description of the Related Art A monolithic ceramic capacitor as an example of a monolithic ceramic electronic component is generally manufactured as follows.

First, a dielectric ceramic raw material having an inner conductor film having a desired pattern formed on its surface by a film made of a conductive metal powder and a conductive paste containing an organic vehicle composed of an organic binder and a solvent is prepared. A ceramic green sheet containing is prepared.

Next, a plurality of ceramic green sheets including the above-mentioned ceramic green sheet having the conductive paste film formed thereon are laminated and thermocompression-bonded to each other, thereby producing an integrated raw laminate.

Next, the green laminate is fired, thereby obtaining a sintered laminate. This laminated body has a laminated structure including a plurality of ceramic layers provided by the above-mentioned ceramic green sheet, and the internal conductor film provided by the above-mentioned sintered body of the conductive paste film is provided inside the laminated body. , Are arranged to generate capacitance through the ceramic layer.

Next, an external electrode electrically connected to a specific one of the internal conductor films is formed on the outer surface of the laminated body in order to extract the electrostatic capacitance.

In this way, the monolithic ceramic capacitor is completed.

[0008] In such a monolithic ceramic capacitor, in recent years, for the purpose of downsizing and increasing the capacity, ceramic layers have been made thinner and multilayered.

However, in order to make the ceramic layer thin and multi-layered, it is an important issue to match the shrinkage behavior during firing between the ceramic layer and the internal conductor film as much as possible.

Usually, in the temperature rising process during firing, the contraction start temperature of the conductive metal powder contained in the internal conductor film is significantly lower than the contraction start temperature of the ceramic layer. In this way, if there is a difference in shrinkage behavior between the two, a relatively large stress is generated inside the monolithic ceramic capacitor, and the thermal shock resistance is reduced. Peeling occurs with the conductor film.

In order to solve these problems, ceramic powder is added to the conductive paste used to form the inner conductor film, whereby the shrinkage behavior of the inner conductor film approximates that of the ceramic layer. A method is proposed, for example, in Japanese Patent Laid-Open No. 6-290985.

According to the above method, the ceramic powder is
It is possible to suppress the sintering of the conductive metal powder contained in the conductive paste and bring the shrinkage behavior closer to the shrinkage behavior in the ceramic layer, which causes cracks and peeling between the ceramic layer and the internal conductor film. It can be made difficult to occur.

The above-described effect of suppressing sintering by the ceramic powder is that the ceramic powder having a melting point higher than that of the conductive metal powder is uniformly dispersed in the conductive paste so that a so-called pinning effect is exhibited. It is supposed that

[0014]

With the recent development of electronics technology, miniaturization of electronic parts is rapidly progressing, and even in the case of a monolithic ceramic capacitor, there is an increasing demand for miniaturization and large capacity. There is. For example, in a monolithic ceramic capacitor, a ceramic layer having a thickness of about 2 μm is about to be put into practical use.

As described above, the thickness of the ceramic layer is 2 μm.
In order to reduce the layer thickness to m or less, considering the smoothness and the sintered density of the dielectric ceramic after sintering, for example, a finely divided ceramic having an average particle size of 0.2 μm or less is used. It is necessary to produce a ceramic green sheet using the raw material powder. The ceramic green sheet containing such a finely divided ceramic raw material powder has improved surface smoothness as compared with the ceramic green sheet containing the ceramic raw material powder having a relatively large particle diameter, that is, the surface roughness Ra. Becomes smaller.

On the other hand, in a conductive paste conventionally used to form an internal conductor film provided in a monolithic ceramic capacitor, the conductive metal powder contained therein is an average of those synthesized by a vapor phase method or a liquid phase method. Nickel powder having a particle size of more than 0.4 μm is often used.

However, as described above, when the conductive paste containing nickel powder having an average particle size of more than 0.4 μm is used, the conductivity after drying to be an internal conductor film is higher than that of the ceramic green sheet as described above. The smoothness of the surface of the paste film deteriorates, that is, the surface roughness Ra increases. Therefore, a plurality of ceramic green sheets on which a conductive paste film is formed are stacked, and in a raw laminate obtained by pressure bonding, the unevenness of the surface of the conductive paste film presses the ceramic green sheets, The variation of the thickness of the ceramic green sheet becomes large, and in some cases, a defect such as a protrusion of the conductive paste film penetrating the ceramic green sheet may occur.

Further, if the conductive paste containing nickel powder having a large average particle size of, for example, 0.4 μm or more is used and the coating thickness of the conductive paste is thinned for the purpose of thinning the internal conductor film, the firing is performed. The subsequent coverage (coverage) of the internal conductor film becomes low, and it becomes impossible to obtain a sufficient capacitance in the obtained multilayer ceramic capacitor.

Further, when the nickel powder contained in the conductive paste is made fine in order to simply improve the smoothness of the surface, the nickel powder is burned as the specific surface area of the nickel primary particles increases. The contraction start temperature is lowered,
This leads to a decrease in the coverage of the internal conductor film due to oversintering of the nickel powder.

In order to prevent over-sintering of the nickel powder as described above, it is effective to add the ceramic powder to the conductive paste as described above. In this case, this ceramic is added. The particle size of the powder also becomes a problem. That is, if the particle size of the ceramic powder is large, as in the case where the particle size of the nickel powder is large, the problem that the smoothness of the conductive paste film for the internal conductor film after drying is deteriorated occurs.

[0021] Against this background, even if the ceramic layer is made thinner by downsizing and increasing the capacity of the monolithic ceramic capacitor, the ceramic green sheet to be the ceramic layer causes problems such as thickness variation and penetration. Therefore, it is desired to realize a conductive paste for forming the internal conductor film, which does not reduce the coverage of the internal conductor film.

The same applies not only to the above-mentioned monolithic ceramic capacitor but also to other monolithic ceramic electronic parts.

Therefore, an object of the present invention is to provide a conductive paste capable of satisfying the above-mentioned demand, a method for manufacturing a laminated ceramic electronic component which is carried out by using this conductive paste for forming an internal conductor film, and An object of the present invention is to provide a monolithic ceramic electronic component configured by using a conductive paste.

[0024]

In order to solve the above-mentioned technical problems, a conductive paste according to the present invention has a conductive metal powder having an average particle size of 0.2 μm or less, and an average particle of the conductive metal powder. Has an average particle size not larger than the diameter and is 1.5 to 1
It is characterized by containing a ceramic powder and an organic vehicle, which are contained at a content of 2.5% by weight.

As the above-mentioned conductive metal powder, nickel powder is preferably used.

The ceramic powder is ABO ₃ (A
Is at least one of Ba, Sr, and Ca, and B is at least one of Ti, Zr, and Hf.
It is a seed. ) Is a main component.

The present invention is also directed to a method of manufacturing a monolithic ceramic electronic component comprising a plurality of ceramic layers and an inner conductor film extending along a specific interface between said ceramic layers.

The method for manufacturing a laminated ceramic electronic component according to the present invention comprises the steps of preparing a ceramic green sheet containing a ceramic raw material powder for a substrate, and laminating a plurality of ceramic green sheets so as to provide a ceramic layer. A step of producing a raw laminate in which a film made of the above-described conductive paste according to the present invention is formed along a specific interface between the ceramic green sheets so as to provide an internal conductor film; And a step of firing the body.

The present invention is also directed to a monolithic ceramic electronic component that includes a plurality of ceramic layers and an internal conductor film extending along a particular interface between the ceramic layers. The monolithic ceramic electronic component according to the present invention is characterized in that the above-mentioned internal conductor film is made of a sintered body obtained by firing the conductive paste according to the present invention.

The monolithic ceramic electronic component is preferably applied to a monolithic ceramic capacitor. In this case, the inner conductor film is arranged so that capacitance can be obtained through the ceramic layer, and further, the multilayer ceramic electronic component is formed on the outer surface of the multilayer body including a plurality of ceramic layers, In addition, an external electrode electrically connected to a specific one of the inner conductor films is provided for extracting the capacitance.

[0031]

FIG. 1 is a sectional view schematically showing a monolithic ceramic capacitor 1 as an example of a monolithic ceramic electronic component constructed by using a conductive paste according to an embodiment of the present invention.

The laminated ceramic capacitor 1 has a laminated body 2
Is equipped with. The laminated body 2 includes a plurality of laminated dielectric ceramic layers 3 and a plurality of internal conductor films 4 and 5 respectively formed along a plurality of specific interfaces between the plurality of dielectric ceramic layers 3. ing.

The inner conductor films 4 and 5 are formed so as to reach the outer surface of the laminate 2, but the inner conductor films 4 and the other end face 7 that are drawn to one end face 6 of the laminate 2 are formed. The internal conductor films 5 that are drawn up to are alternately arranged inside the laminated body 2 so that capacitance can be obtained via the dielectric ceramic layers 3.

In order to take out the above-mentioned capacitance, the laminated body 2
External electrodes 8 and 9 are formed on the outer surfaces of and on the end surfaces 6 and 7 so as to be electrically connected to specific ones of the internal conductor films 4 and 5. Further, first plating layers 10 and 11 made of nickel, copper or the like are formed on the external electrodes 8 and 9, respectively, and a second plating layer 12 made of solder, tin or the like is further formed thereon. 13 are formed respectively.

In such a monolithic ceramic capacitor 1, as the base ceramics constituting the dielectric ceramic layer 3, ABO ₃ (A is Ba, Sr and Ca) is used.
B is at least one of Ti, Zr, and Hf. ) Is the main component, and a perovskite-type ceramic is often used.

On the other hand, the internal conductor film 4 is composed of a sintered body obtained by firing a conductive paste having the following composition.

That is, the conductive paste contains conductive metal powder, ceramic powder, and organic vehicle.

As the above-mentioned conductive metal powder, one having an average particle diameter of 0.2 μm or less is used. Further, the ceramic powder has an average particle size equal to or smaller than the average particle size of the conductive metal powder. Further, the ceramic powder is contained in the conductive paste with a content of 1.5 to 12.5% by weight.

As described above, even if the conductive metal powder is refined to have an average particle size of 0.2 μm or less, the conductive metal powder further contains the ceramic powder.
It is possible to prevent the sintering shrinkage starting temperature from being lowered due to the increase in the specific surface area of the secondary particles, and as a result, it is possible to prevent the coverage of the internal conductor films 4 and 5 from being lowered due to oversintering of the conductive metal powder. be able to. Therefore, sufficient capacitance can be obtained in the monolithic ceramic capacitor 1.

Further, since the ceramic powder added to the conductive paste has an average particle size equal to or smaller than the average particle size of the conductive metal powder, the smoothness of the surface of the conductive paste film after drying is deteriorated. Not only does it not occur, but the ceramic powder can be evenly dispersed between the conductive metal powders, and the effect of suppressing the sintering by the ceramic powder can be satisfactorily exerted.

As described above, the ceramic powder is contained in the conductive paste at a content of 1.5 to 12.5% by weight. If this content is less than 1.5% by weight, a sufficient sintering suppressing effect may not be obtained. On the other hand, if the content exceeds 12.5% by weight, conversely,
This may lead to a decrease in the coverage of the internal conductor films 4 and 5,
In the firing process, the dielectric ceramic layer 3 is enlarged due to the diffusion of the ceramic component from the conductive paste film to be the internal conductor films 4 and 5 into the dielectric ceramic layer 3, whereby the electrical conductivity of the monolithic ceramic capacitor 1 is increased. The characteristics may be adversely affected.

As the conductive metal powder contained in the conductive paste, nickel powder is preferably used. As described above, when nickel is used, the material cost can be reduced as compared with the case where a precious metal such as palladium or platinum or an alloy thereof is used, and when relatively inexpensive cobalt or copper is used. Can provide better oxidation resistance than

When nickel powder is used as the conductive metal powder contained in the conductive paste, a neutral or reducing atmosphere must be applied in the firing step for obtaining the laminated body 2 after sintering. However, since various dielectric ceramic materials having excellent reduction resistance have been developed, there is no problem even if firing is limited to a neutral or reducing atmosphere.

The ceramic powder contained in the conductive paste is ABO ₃ (A is at least one of Ba, Sr and Ca, and B is at least one of Ti, Zr and Hf). 2) as a main component, that is, a perovskite type ceramic.

At present, the dielectric ceramic material for forming the dielectric ceramic layer of the monolithic ceramic capacitor, which is being miniaturized and has a large capacity, is the above-mentioned ABO ₃
The main component is. In the firing process,
It is highly possible that the components of the ceramic powder added to the conductive paste forming the internal conductor film will diffuse from the internal conductor film to the dielectric ceramic layer. When a completely different ceramic material or a ceramic material composed of components having different ionic radii is added to the conductive paste, it affects the sintering behavior of the dielectric ceramics constituting the dielectric ceramic layer, and as a result, the dielectric It is likely to affect the dielectric and temperature characteristics of the ceramic layer. For these reasons, the ceramic powder added to the conductive paste used to form the internal conductor film may be the same perovskite-type ceramic as the dielectric ceramic forming the dielectric ceramic layer. preferable.

Next, a method of manufacturing the monolithic ceramic capacitor 1 as shown in FIG. 1 will be described.

First, a slurry containing a ceramic raw material powder for a substrate that provides a ceramic such as a perovskite type ceramic is prepared, and this slurry is formed into a sheet to prepare a ceramic green sheet.

Next, using a conductive paste having the above-mentioned specific composition on the ceramic green sheet,
A conductive paste film for the internal conductor films 4 and 5 having a desired pattern is formed by printing or the like.

Next, as described above, the required number of the ceramic green sheets each having the conductive paste film formed thereon are stacked, and the ceramic green sheets having no conductive paste film formed thereon are stacked above and below the ceramic green sheets. The laminated body 2 integrated by thermocompression bonding
The raw state of is obtained.

The green laminate 2 is then fired, for example in a reducing atmosphere, whereby the laminate 2 is
Is sintered. In this laminated body 2 after sintering, the above-mentioned ceramic green sheet is sintered to give the dielectric ceramic layer 3, and the conductive paste film is sintered to give the internal conductor films 4 and 5. There is.

Next, external electrodes 8 and 9 are formed on the end faces 6 and 7 of the laminated body 2 so as to be electrically connected to specific ones of the internal conductor films 4 and 5, respectively. The external electrodes 8 and 9 are formed, for example, by applying a conductive paste containing silver, copper, nickel or palladium, or an alloy containing these as a conductive component, and baking this.

Next, the external electrodes 8 and 9 are plated with nickel, copper or the like to form the first plated layers 10 and 11, and further plated with solder, tin or the like, and secondly. The monolithic ceramic capacitor 1 is completed by forming the plating layers 12 and 13 of.

Although the present invention has been described above with respect to a laminated ceramic capacitor, the conductive paste according to the present invention has a plurality of ceramic layers made of ceramics for a substrate and an internal conductor film extending along a specific interface between the ceramic layers. The provided monolithic ceramic electronic component can be advantageously used for forming the internal conductor film in a monolithic ceramic electronic component other than the monolithic ceramic capacitor.

Next, in order to clarify the preferable range of the composition of the conductive paste according to the present invention and the average particle diameter of the conductive metal powder and the ceramic powder contained therein, and to confirm the effect of the present invention. An example of the experiment carried out will be described.

[0055]

[Experimental Example] First, in order to prepare a ceramic green sheet for providing a dielectric ceramic layer, as a ceramic raw material powder for a substrate, a reduction-resistant dielectric ceramic material powder containing barium titanate having an average particle diameter of 0.2 μm as a main component is used. Prepared.

Next, the ceramic raw material powder for the substrate is
A polyvinyl butyral binder and an organic solvent such as ethanol were added and wet-mixed with a ball mill to prepare a ceramic slurry.

Next, this ceramic slurry was formed into a sheet by the doctor blade method to obtain a rectangular ceramic green sheet in which the thickness of the dielectric ceramic layer after firing was 2 μm. The surface roughness Ra (arithmetic mean roughness defined by JIS B0601) of this ceramic green sheet measured with an atomic force microscope (AFM) was 90 nm.

On the other hand, a conductive paste used for forming the internal conductor film was prepared as follows.

First, as the conductive metal powder contained in the conductive paste, nickel powders having various average particle diameters as shown in Table 1 were prepared.

As the ceramic powder contained in the conductive paste, barium titanate powder, Dy ₂ O ₃ ,
Powders of MgO and MgO were added and those obtained by wet mixing with a ball mill were used. Here, ceramic powders having various average particle diameters as shown in Table 1 were prepared.

Next, the above-mentioned nickel powder was dissolved in 47.5% by weight, ceramic powder in 2.5% by weight, and ethyl cellulose in terpineol so that the former was 10% by weight and the latter was 90% by weight. 35 wt% of the organic vehicle and 15 wt% of terpineol produced by the above are subjected to dispersion mixing treatment by a three-roll mill to produce a conductive paste containing well-dispersed nickel powder and ceramic powder. did.

Incidentally, in Table 1, for the samples described as "none" in the column of "average particle size of ceramic powder", it means that the ceramic powder was not added. For these samples, the ceramic powder content of 2.5% by weight was replaced by terpineol.

Next, various conductive pastes shown in Table 1, that is, the conductive pastes of Examples 1 to 5 and Comparative Examples 1 to 8 were screen-printed on the above-mentioned ceramic green sheets. Then, a conductive paste film to be an internal conductor film was formed to have a thickness of 0.6 μm. The thickness of this conductive paste film is a value measured using a fluorescent X-ray device.

Next, after drying the above-mentioned conductive paste film, the surface roughness Ra (arithmetic mean roughness defined by JIS B0601) of this conductive paste film was measured using an atomic force microscope. The measurement was performed under the conditions of 20 μm × 20 μm and scanning speed of 32 μm / sec. The surface roughness thus measured is shown in Table 1.

Next, a plurality of ceramic green sheets including a ceramic green sheet having a conductive paste film formed thereon were laminated and thermocompression bonded to obtain a green laminate. In this raw laminate, the conductive paste film drawn out to one end face and the conductive paste film drawn out to the other end face were arranged alternately in the stacking direction.

Next, the raw laminate was heated to a temperature of 350 ° C. in a nitrogen atmosphere to burn the binder, and then H ₂ —N ₂ —H _{2 with} an oxygen partial pressure of 10 ⁻⁹ to 10 ⁻¹² MPa was used. In a reducing atmosphere of O 2 gas, firing was performed at a temperature of 1200 ° C. for 2 hours to obtain a sintered laminated body. This laminated body includes a dielectric ceramic layer and an internal conductor film, the dielectric ceramic layer being provided by a sintered body of a ceramic green sheet, and the internal conductor film being a sintered body of a conductive paste film. It is given by the body.

Then, on both end faces of the laminate, B ₂ O ₃
A conductive paste containing a Li ₂ O—SiO ₂ —BaO-based glass frit and containing silver as a conductive component is applied, and baked at a temperature of 600 ° C. in a nitrogen atmosphere,
An outer electrode electrically connected to the inner conductor film was formed.

The external dimensions of the monolithic ceramic capacitor thus obtained are 1.2 mm in width and 2.0 mm in length.
And the thickness was 1.0 mm, and the thickness of the dielectric ceramic layer interposed between the internal conductor films was 2 μm. Also,
The number of effective dielectric ceramic layers was 100, and the effective facing area of the internal conductor film per layer was 1.7 mm ² .

Next, with respect to the laminated ceramic capacitors or the laminated bodies obtained by sintering of the respective samples thus obtained, as shown in Table 1, the results are shown in "Inner conductor film coverage", ""Number of structural defects", "Capacitance"
And "the number of short circuit failures" were evaluated.

More specifically, "inner conductor film coverage"
Is quantified by peeling the sintered laminated body along the inner conductor film, taking a micrograph of a state in which holes are formed in the inner conductor film, and subjecting this to image analysis processing.

Further, by observing the cross section of the monolithic ceramic capacitor with a microscope, it is visually judged whether or not structural defects such as cracks or delaminations occur.
With respect to 200 samples, the number of samples having structural defects was counted, and the “number of structural defects generated” was obtained.

Further, 200 samples were randomly sampled from the obtained monolithic ceramic capacitors, the "capacitance" was measured under the conditions of a temperature of 25 ° C., 1 kHz and 1 Vrms, and a short circuit was made. The number of defective samples was counted and calculated as the “number of short circuit defects”.

[0073]

[Table 1]

From Table 1, the average particle diameter of the nickel powder is 0.
According to Examples 1 to 5 in which the average particle diameter of the ceramic powder is 2 μm or less and the average particle diameter of the ceramic powder is equal to or less than the average particle diameter of the nickel powder, the “surface roughness of the conductive paste film after drying” is Ra ”is not so large or smaller than the surface roughness Ra of the ceramic green sheet described above of 90 nm, and the“ inner conductor film coverage ”is as high as 70% or more. It can be seen that the "number of defects generated" is 0 and the "number of short-circuit defects" is extremely small.

On the other hand, when a conductive paste having an average particle diameter of nickel powder of more than 0.2 μm is used as in Comparative Examples 1 to 4, “surface roughness of the dried conductive paste film” is used. "Ra" is much larger than the surface roughness Ra of the ceramic green sheet, which is 90 nm, and the "inner conductor film coverage" is as small as less than 70%. Therefore, the "capacitance" is also low. Moreover, the “number of structural defects generated” is relatively large, and the “number of short-circuit defects” is also considerably large.

As in Comparative Examples 5 and 6, even if the average particle diameter of the nickel powder is 0.2 μm or less, if the average particle diameter of the ceramic powder is larger than the average particle diameter of the nickel powder, The “surface roughness Ra” of the conductive paste film after drying is larger than that of the nickel powders of Examples 1 to 5 having the same average particle diameter. It is speculated that this is because the addition of the ceramic powder having a large average particle size reduced the filling property of the particles such as the nickel powder and the ceramic powder in the conductive paste film. In addition, in Comparative Examples 5 and 6, the “inner conductor film coverage” is low, the “number of structural defects generated” is large, the “capacitance” is low, and The number of short circuit failures is increasing.

Further, according to Comparative Examples 7 and 8, since the average particle size of the nickel powder is as small as 0.2 μm or less, the “surface roughness Ra” of the conductive paste film after drying has a relatively small value. As shown, since the ceramic powder is not contained, the effect of suppressing sintering on the nickel powder does not work, and as a result, the “number of structural defects generated” such as delamination and cracks has a high value.

Next, the conductive paste prepared by changing the content of the ceramic powder variously while using the nickel powder and the ceramic powder having the respective average particle diameters adopted in Example 2 shown in Table 1 The “surface roughness Ra”, “inner conductor film coverage”, “number of structural defects generated” and “capacitance” of the dried conductive paste film were evaluated by the same method as described above. The results are shown in Table 2.

[0079]

[Table 2]

In Table 2, Example 7 corresponds to Example 2 shown in Table 1.

From Table 2, as in Examples 6 to 9, according to the conductive paste containing the ceramic powder within the range of 1.5 to 12.5% by weight, "inner conductor film coverage" was obtained. It can be seen that the value is 70% or more, and the "electrostatic capacity" is also a sufficiently high value.

On the other hand, as in Comparative Examples 9 and 10, the content of the ceramic powder was 1.5 to 12.5% by weight.
If the value is out of the range, the “inner conductor film coverage” is low, and as a result, the “capacitance” is lowered. In addition, particularly, as in Comparative Example 9, when the content of the ceramic powder is less than 1.5% by weight, the effect of suppressing the sintering of the nickel powder is low, and as a result, one value in the "number of structural defects generated" Is shown.

[0083]

As described above, according to the conductive paste of the present invention, the conductive metal powder contained therein has an average particle size of 0.2 μm or less, and further contains ceramic powder. Since the average particle size of the ceramic powder is set to be equal to or smaller than the average particle size of the conductive metal powder and the content of the ceramic powder is set to 1.5 to 12.5% by weight, the conductive paste was formed. Good smoothness can be given to the surface of the conductive paste film after drying, which becomes the internal conductor film, and the over sintering of the conductive metal powder can be surely suppressed by the ceramic powder during firing. .

Therefore, the coverage of the internal conductor film can be kept high, and structural defects such as delamination and cracks are less likely to occur even when the ceramic layer and the internal conductor film are made thinner in the multilayer ceramic electronic component. be able to. Therefore, when the present invention is applied to a laminated ceramic capacitor,
By making the dielectric ceramic layer and the inner conductor film thinner, it is possible to advantageously reduce the size and increase the capacity.

When the conductive metal powder contained in the conductive paste according to the present invention is nickel powder, the material cost of the internal conductor film provided in the laminated ceramic electronic component can be made relatively low, and the internal conductor film can be formed. On the other hand, sufficient oxidation resistance can be provided.

The ceramic powder contained in the conductive paste according to the present invention is ABO ₃ (A is Ba, Sr).
And Ca, and B is T
It is at least one of i, Zr, and Hf. )
When it is mainly composed of, for example, a perovskite-type ceramic similar to the dielectric ceramic for the dielectric ceramic layer provided in the multilayer ceramic capacitor can be provided, the ceramic contained in the conductive paste during firing can be provided. Even if the components of the powder diffuse into the ceramic layer, the influence thereof can be minimized.

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing a monolithic ceramic capacitor 1 as an example of a monolithic ceramic electronic component configured by using a conductive paste according to an embodiment of the present invention.

[Explanation of symbols]

1 Multilayer ceramic capacitors 2 laminate 3 Dielectric ceramic layer 4,5 Internal conductor film 8,9 External electrode

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tomoyuki Nakamura             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. (72) Inventor Harunobu Sano             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. F-term (reference) 5E001 AB03 AC09 AF06 AH01 AH09                       AJ01 AJ02                 5E082 AB03 BC39 EE04 EE19 EE22                       EE23 EE35 FG06 FG26 FG54                       LL01 LL02 MM24 PP03

Claims (6)

[Claims] 1. A conductive metal powder having an average particle size of 0.2 μm or less, and an average particle size not more than the average particle size of the conductive metal powder,
An electrically conductive paste containing a ceramic powder and an organic vehicle, the content of which is 1.5 to 12.5% by weight. 2. The conductive paste according to claim 1, wherein the conductive metal powder is nickel powder. 3. The ceramic powder is ABO ₃ (A
Is at least one of Ba, Sr, and Ca, and B is at least one of Ti, Zr, and Hf.
It is a seed. 3. The conductive paste according to claim 1 or 2, which contains) as a main component. 4. A method of manufacturing a laminated ceramic electronic component, comprising a plurality of ceramic layers and an internal conductor film extending along a specific interface between the ceramic layers, the ceramic green sheet containing a ceramic raw material powder for a substrate. And a step of preparing a plurality of the ceramic green sheets so as to provide the ceramic layer, and to provide the internal conductor film, the conductive paste according to claim 1. A method of manufacturing a laminated ceramic electronic component, comprising: a step of producing a raw laminate in which a film formed is formed along a specific interface between the ceramic green sheets; and a step of firing the raw laminate. 5. A multilayer ceramic electronic component comprising a plurality of ceramic layers and an internal conductor film extending along a specific interface between the ceramic layers, wherein the internal conductor film is defined in any one of claims 1 to 3. Consisting of a sintered body obtained by firing the conductive paste described,
Multilayer ceramic electronic components. 6. The inner conductor film is arranged so that capacitance can be obtained through the ceramic layer, and is formed on an outer surface of a laminate constituted by the plurality of ceramic layers, and The monolithic ceramic electronic component according to claim 6, further comprising an external electrode electrically connected to a specific one of the inner conductor films for extracting the capacitance, thereby forming a monolithic ceramic capacitor.