JP4565349B2 - Manufacturing method of multilayer piezoelectric ceramic component - Google Patents

Description

The present invention relates to a method for producing a laminated piezoelectric ceramic component such as a laminated piezoelectric actuator and the laminated piezoelectric sounding body.

  Conventionally, as shown in FIG. 5, this type of multilayer piezoelectric ceramic component has piezoelectric ceramic layers 101a to 101g and internal electrode layers 102a to 102f alternately stacked to form a ceramic body 103. External electrodes 104 a and 104 b are formed on the end face of the element body 103.

  The multilayer piezoelectric ceramic component is required to have a large amount of displacement at low cost. For this purpose, it is effective to make the internal electrode layers 102a to 102f thinner.

  That is, in this type of multilayer piezoelectric ceramic component, when an electric field is applied, the ceramic layers 101b to 101f expand and contract, but when the internal electrode layers 102a to 102f are thick, the gap between the ceramic layers 101b to 101f is the internal electrode layer. Since it is restrained by 102a-102f, it will inhibit expansion-contraction of this ceramic layer 101b-101f. That is, the thinner the internal electrode layers 102a to 102f, the easier the ceramic layers 101b to 101f expand and contract, and the amount of displacement increases.

  However, in the multilayer piezoelectric ceramic component described above, when the internal electrode layers 102a to 102f are thinned, the coverage of the internal electrodes is reduced, so that the electrode area is reduced, a potential drop occurs, and the amount of displacement is reduced. There is.

  On the other hand, as a technique for eliminating the potential drop, the ratio of the total area of the through holes formed in the internal electrode to the total area of the internal electrode is 40 to 0%, and the ceramic material having the same or similar composition as the ceramic layer A multilayer electronic component in which an internal electrode is formed using a paste containing 10 to 30% by weight is proposed (Patent Document 1).

  In Patent Document 1, the internal electrode is formed using a ceramic material having the same or similar composition as the ceramic layer, that is, a paste containing 10 to 30% by weight of a ceramic co-material, whereby the film thickness is 2.5 μm or less. In the internal electrode layer, the coverage is increased to 60 to 100% to increase the electrode area, thereby avoiding a decrease in the capacitance, and suppressing the shrinkage of the internal electrode layer to prevent structural defects after firing. I try to avoid it as much as possible.

  Further, as a technique for controlling the covering rate, a laminated layer in which the negative electrode of the internal electrode contains Ag element and the positive electrode does not contain Ag element, and the thickness of the internal electrode is 1 to 3 μm and the covering rate is controlled to 50 to 99%. A type piezoelectric element has also been proposed (Patent Document 2).

  In this patent document 2, the occurrence of migration and delamination is suppressed and reliability is improved by controlling the coverage to 50 to 99%.

  As another conventional technique, the internal electrode layer is made of a metal material containing Pd and / or Pt as a main component and has a plurality of holes penetrating in the stacking direction. There has been proposed a laminated piezoelectric actuator made of a material and provided with a common material for connecting respective piezoelectric ceramic plates facing each other through internal electrodes (Patent Document 3).

  In Patent Document 3, a non-electrode portion and an electrode in which a through hole having a minimum inner diameter dimension of 1/2 or less with respect to the thickness of the ceramic layer is provided and the through hole is filled with a ceramic co-material, and the through hole is further formed. By making the area ratio with the portion 1: 1 or less, the strain at the time of polarization is suppressed, and the occurrence of interface peeling is avoided.

JP 2002-164248 A JP 2001-250994 A JP 63-142875 A

  However, when the technique of Patent Document 1 is applied to a multilayered piezoelectric ceramic component, variation in the size of the non-conductive portion in which the electrode in the internal electrode layer is not formed simply by controlling the coverage rate, There is a problem that the potential drop due to the non-conductive portion becomes large, so that a desired large displacement cannot be obtained.

  Moreover, although patent document 2 is suppressing generation | occurrence | production of migration and delamination by controlling a coverage to 50 to 99%, like patent document 1, when applied to a multilayer piezoelectric ceramic component, There is a problem that the control of the coverage rate causes variations in the size of the non-conductive portion, and the potential drop due to the non-conductive portion increases, and thus a desired large displacement cannot be obtained.

  In Patent Document 3, although a through hole having a minimum inner diameter dimension of 1/2 or less with respect to the thickness of the ceramic layer is provided, a potential drop occurs only with this, and a desired large displacement cannot be obtained. If the ratio of the electrode part (non-conductive part) to the electrode part (conductive part) is 1: 1 or less, sufficient coverage cannot be obtained, and interface peeling may occur between the internal electrode layer and the ceramic layer. There was a problem that there was.

The present invention has been made in view of such circumstances, even the internal electrode layer is a thin layer, has a large displacement amount, and the bonding strength superior method of fabricating the multilayer piezoelectric ceramic unit products The purpose is to provide.

  Multilayer piezoelectric ceramic parts require a large amount of displacement at a low cost, but the main factors that hinder the improvement of the amount of displacement are (1) potential drop, (2) residual stress, and (3) displacement inhibition force. The following three are conceivable. here,

(1) A potential drop is a displacement amount defined by the product of an electric field and a piezoelectric constant, as a result of a non-conductive part such as a through hole being formed in the internal electrode layer, resulting in a potential drop due to the non-conductive part. In particular, when the internal electrode layer is thinned, the non-conductive portion increases structurally, so that the potential drop at the non-conductive portion becomes significant.

(2) Residual stress is a phenomenon in which stress remains due to the difference between the thermal expansion coefficient of the ceramic layer and the thermal expansion coefficient of the internal electrode layer, and displacement of the ceramic layer is suppressed.

(3) Displacement inhibition force means that when a voltage is applied, the ceramic layer expands and contracts. However, since the ceramic layer is sandwiched between internal electrode layers, the displacement of the ceramic layer is inhibited by the internal electrode layer. It is a phenomenon.

  And, by reducing the thickness of the internal electrode layer and reducing the coverage of the internal electrode layer on the ceramic layer, it is possible to reduce the residual stress and displacement inhibition force and to improve the displacement amount. However, when the internal electrode is thinned or the coverage is reduced, the non-conductive portion increases, so that the potential drop increases and the displacement amount may decrease.

  Therefore, the present inventors conducted intensive research to reduce the above three factors that hinder the improvement of the displacement amount, that is, the potential drop, the residual stress, and the displacement inhibition force. The ratio x / y of the average diameter x to the ceramic layer thickness y when the cross-sectional area of the film is converted into a circle is controlled to 0.08 to 0.33, and the thickness z of the internal electrode layer and the thickness of the ceramic layer The ratio of y to z / y is controlled to 0.04 to 0.40, and the coverage of the internal electrode layer on the ceramic layer is controlled to 60 to 95%, thereby minimizing the decrease in displacement due to potential drop. Multi-layered piezoelectric that can reduce residual stress and displacement inhibition force while suppressing to the limit, thereby improving both displacement and reliability even when the internal electrode layer is thin. Acquired knowledge that ceramic parts can be obtained .

For that purpose, a fine ceramic powder having a specific surface area 5 to 20 times that of the metal powder is mixed with the metal powder so that the content thereof is 20 to 50% by weight based on the total amount of the metal powder and the ceramic powder. It has been found that it is necessary to produce a low oxygen concentration of 0.1 to 15% by volume by dispersing in an electrically conductive paste and firing.

The present invention has been made on the basis of such knowledge, and the manufacturing method of the multilayer piezoelectric ceramic component according to the present invention is a predetermined method in which a conductive paste is applied to the surface of a ceramic green sheet to form an internal electrode layer. After forming the conductive pattern and laminating the ceramic green sheet on which the conductive pattern is formed, it is sandwiched between the ceramic green sheets on which the conductive pattern is not formed and pressed to form a laminated body. In the method for manufacturing a multilayer piezoelectric ceramic component, the ceramic body and the internal electrode layer are alternately laminated to form a ceramic body, and an external electrode is formed on an end face of the ceramic body. The paste contains a metal powder and a ceramic powder having a specific surface area 5 to 20 times that of the metal powder, and the ceramic The powder content is adjusted so as to be 20 to 50% by weight with respect to the total amount of the metal powder and the ceramic powder, and the firing treatment is performed in an oxygen atmosphere having an oxygen concentration of 0.1 to 15% by volume, The internal electrode layer is formed so that the internal electrode layer has a conductive portion and a non-conductive portion.

In addition, the ceramic powder contained in the conductive paste diffuses to the ceramic green sheet side during firing, so from the standpoint of preventing characteristic fluctuations, use at least the material whose main component has the same component composition as the ceramic green sheet. It is preferable to do this.

That is, the method for manufacturing a multilayer piezoelectric ceramic component according to the present invention is characterized in that the ceramic powder has at least a main component having the same component composition as the ceramic green sheet.

In the method for manufacturing a multilayer piezoelectric ceramic component of the present invention, the ratio x / y between the average diameter x and the thickness y of the ceramic layer when the cross-sectional area of the non-conductive portion is converted into a circle is 0.08 to 0. The non-conductive portion is formed so as to be .33, and the ratio z / y of the thickness z of the internal electrode layer to the thickness y of the ceramic layer is 0.04 to 0.40, and the internal electrode layer The internal electrode layer is formed so that the coverage of the ceramic layer is 60 to 95%.

Also, the internal electrode layer is formed using a conductive paste containing metal powder and ceramic powder as a solid content as described above from the viewpoint of improving the bonding strength between the ceramic layer and the internal electrode layer. Therefore, the non-conductive portion has a void portion and a ceramic portion filled with ceramic powder. As a result of analyzing the structure of the non-conductive portion by the present inventors, the displacement amount is further improved without deteriorating the bonding strength by setting the porosity in the non-conductive portion to 60% or more. I found out that

That is, in the method for manufacturing a multilayer piezoelectric ceramic component according to the present invention, the non-conductive portion has a void portion and a ceramic portion filled with ceramic powder, and the void portion is 60% or more of the non-conductive portion. The non-conductive portion is formed so as to occupy the area.

According to the method for producing a laminated piezoelectric ceramic component, the conductive paste contains a metal powder and a ceramic powder having a specific surface area 5 to 20 times that of the metal powder, and the content of the ceramic powder. Is prepared so as to be 20 to 50% by weight with respect to the total amount of the metal powder and the ceramic powder, the firing treatment is performed in an oxygen atmosphere having an oxygen concentration of 0.1 to 15% by volume, and the internal electrode layer Since the internal electrode layer is formed so as to have a conductive part and a non-conductive part, the fine ceramic powder is effectively diffused into the ceramic green sheet during sintering, and the ceramic green of the metal component in the internal electrode layer Diffusion into the sheet can be suppressed, and a large number of minute nonconductive portions can be formed in the internal electrode layer. In particular, firing in a low oxygen concentration atmosphere suppresses the sintering of through-holes that can be formed in the internal electrode layer, so that minute voids are distributed substantially uniformly in the internal electrode layer, thereby covering the coverage ratio. Can be reduced and the amount of displacement can be improved. In addition, since the amount of conductive paste used can be reduced by reducing the coverage of the internal electrodes and making it thinner, the cost can be reduced.

In addition, since the ceramic powder has at least the same component composition as the ceramic green sheet, even if the ceramic powder diffuses to the ceramic green sheet side during firing, fluctuations in characteristics can be prevented.

Further, the non-conductive portion is formed so that a ratio x / y of an average diameter x and a thickness y of the ceramic layer when the cross-sectional area of the non-conductive portion is converted into a circle is 0.08 to 0.33. Furthermore, the ratio z / y between the thickness z of the internal electrode layer and the thickness y of the ceramic layer is 0.04 to 0.40, and the coverage of the internal electrode layer on the ceramic layer is 60 to 95%. The internal electrode layer is formed so that a large number of non-conductive portions are formed, and the thickness of the ceramic layer is moderately thin relative to the thickness of the internal electrode layer. The effect of reducing the residual stress and the displacement inhibition force due to the applied internal electrode layer is increased. As a result, it is possible to reduce the residual stress and the displacement inhibition force of the ceramic layer due to the internal electrode layer while suppressing the decrease in the displacement amount due to the potential drop, and thus have a large displacement amount and good bonding strength. A multilayer piezoelectric ceramic component having excellent reliability can be obtained.

  Further, the non-conductive portion has a void portion and a ceramic portion filled with ceramic powder, and the non-conductive portion is formed so that the void portion occupies 60% or more of the non-conductive portion. It is possible to effectively reduce the residual stress and the displacement inhibition force due to the internal electrode layer, and to obtain a multilayer piezoelectric ceramic component that can further improve the displacement amount and the bonding strength.

1 is a cross-sectional view showing an embodiment of a multilayer piezoelectric ceramic component according to the present invention. It is the B section expanded sectional view of FIG. It is a figure which shows an example of the SEM image of this invention Example. It is a figure which shows an example of the SEM image of a prior art example. It is sectional drawing which shows the prior art example of a laminated type piezoelectric ceramic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ceramic layer 2 Internal electrode layer 5 Conductive part 6 Nonconductive part 6a Ceramic part 6b Space | gap part

  Next, an embodiment of the present invention will be described in detail.

  FIG. 1 is a sectional view showing an embodiment of a multilayer piezoelectric actuator as a multilayer piezoelectric ceramic component according to the present invention. The multilayer piezoelectric actuator includes a ceramic layer 1 (1a to 1g) and an internal electrode layer 2 ( 2a to 2f) are alternately laminated to form the piezoelectric ceramic body 3, and an external electrode made of a conductive material such as Ag having an L-shaped cross section extending from the upper surface or the lower surface of the piezoelectric ceramic body 3 to the end surface. 4 (4a, 4b) is formed.

  That is, in the laminated piezoelectric actuator, one end of the internal electrodes 2a, 2c, and 2e is electrically connected to one external electrode 4b, and one end of the internal electrodes 2b, 2d, and 2f is electrically connected to the other external electrode 4a. Has been. The polarization direction of the laminated piezoelectric actuator is perpendicular to the surface of the internal electrode 2 and is polarized in opposite directions to each other. When a voltage is applied between the external electrode 4a and the external electrode 4b, it is displaced in the longitudinal direction indicated by the arrow A due to the piezoelectric lateral effect.

  FIG. 2 is an enlarged cross-sectional view of a portion B in FIG. In this embodiment, a part of the internal electrode layers 2b to 2d is enlarged, but the other parts have the same structure.

  That is, the internal electrode layer 2 (2b to 2d) includes a conductive portion 5 formed by sintering metal powder and a nonconductive portion 6 in which no metal powder exists, and the nonconductive portion 6 includes at least a main component. It has a ceramic portion 6a in which ceramic powder having the same composition as the ceramic layer 1 (1b to 1e) is present, and a void portion 6b in which no solid is present. In addition, as shown to the C part in the figure, the space | gap part 6b does not necessarily need to penetrate. Further, for example, ceramic powder may be included in a part of the gap 6b. In addition, as shown in part D in the figure, the ceramic part 6 a does not necessarily need to straddle the internal electrode layer 2, and may exist in a part of the internal electrode layer 2.

  And in this Embodiment, it controls so that ratio x / y of the average diameter x at the time of converting the cross-sectional area of the nonelectroconductive part 6 into a circle and the thickness y of the ceramic layer 1 may be 0.08-0.33. In addition, the coverage of the internal electrode layer 2 to the ceramic layer 1 is controlled to be 60 to 95%, whereby the size of the non-conductive portion 6 is reduced and the potential at the non-conductive portion 6 is reduced. It is possible to suppress a decrease in the amount of displacement due to the lowering, and it is possible to reduce the coverage of the internal electrode layer 2 by providing a large number of minute non-conductive portions 6. As a result, it is possible to reduce the residual stress and the displacement inhibition force due to the internal electrode layer 2, and it is possible to improve the displacement amount and the bonding strength of the laminated piezoelectric actuator.

  The ratio x / y has a correlation with the potential drop, and when the ratio x / y becomes small, the average diameter x becomes relatively small with respect to the thickness of the ceramic layer 1, so that the potential drop becomes small and the displacement is improved. . On the other hand, when the ratio x / y is increased, the average diameter x is relatively increased with respect to the thickness of the ceramic layer 1, so that the potential drop is increased and the displacement is decreased. When the coverage is less than 60%, the non-conductive portion 6 increases excessively, so that the potential drop increases and the displacement amount decreases, and the bonding strength between the ceramic layer 1 and the internal electrode layer 2 is increased. And the interfacial peeling is likely to occur. On the other hand, when the covering ratio exceeds 95%, the covering ratio becomes excessive, and the displacement inhibition force that the internal electrode layer 2 restrains the expansion / contraction movement of the ceramic layer 1 increases, resulting in a decrease in the amount of displacement. Further, there is a risk that the bonding strength is reduced due to the residual stress caused by the difference between the thermal expansion coefficient of the ceramic layer 1 and the thermal expansion coefficient of the internal electrode layer 2 during co-sintering.

  Therefore, it is necessary to control the coverage of the internal electrode layer 2 on the ceramic layer 1 to 60 to 95%.

  The reason why the ratio x / y is set to 0.08 to 0.33 is as follows.

  When the ratio x / y is less than 0.08, the average diameter x of the non-conductive portion 6 becomes small, so that the coverage is difficult to control and the coverage becomes high. For this reason, the internal electrode layer 2 of the ceramic layer 1 The displacement inhibition force increases to the displacement amount. On the other hand, when the ratio x / y exceeds 0.33, the average diameter x of the non-conductive portion 6 increases, so that the potential drop caused by the non-conductive portion 6 increases, and a desired large displacement amount can be obtained. become unable.

  Therefore, in the present embodiment, the ratio x / y between the average diameter x and the ceramic layer y of the nonconductive portion 6 is controlled to be 0.08 to 0.33.

  The ratio z / y between the thickness z of the internal electrode layer 2 and the thickness y of the ceramic layer 1 is preferably 0.04 to 0.40.

  That is, as the thickness y of the ceramic layer 1 is made thinner than the thickness z of the internal electrode layer 2, the residual stress and the displacement inhibiting force due to the internal electrode layer 2 loaded on the ceramic layer 1 are relatively increased, and the sufficient displacement There is a possibility that an increase in the amount cannot be obtained. From this viewpoint, the ratio z / y is preferably 0.04 or more. On the other hand, if the ratio z / y exceeds 0.40, the thickness z of the internal electrode layer 2 becomes relatively thick with respect to the thickness of the ceramic layer 1, and as a result, the displacement inhibiting force of the internal electrode layer 2 becomes large. There is a risk of causing a decrease in the amount of displacement. Accordingly, the ratio z / y is preferably 0.04 to 0.40.

  Note that, as the thickness z of the internal electrode layer 2 is reduced, the residual stress and the displacement inhibition force due to the internal electrode layer 2 are reduced. Therefore, the thickness z of the internal electrode layer 2 is desirably as thin as possible, preferably the thickness. It is desirable to control z to be in the range of 1 to 2.4 μm.

  Moreover, it is preferable that the space | gap part 6b formed in the internal electrode layer 2 occupies 60% or more in the nonelectroconductive part 6 (the ceramic part 6a and the space | gap part 6b).

  That is, by forming the internal electrode layer 2 using a conductive paste containing finer ceramic powder than the metal powder, the ceramic powder is dispersed in the ceramic layer 1 during co-sintering. And the bonding strength between the internal electrode layers 2 can be improved. However, when the ratio of the gap 6b in the non-conductive portion 6 is less than 60%, a large number of ceramic portions 6a are formed in the internal electrode layer 2, and therefore, the bonding strength becomes too high and the displacement amount may be reduced. There is. Therefore, the gap 6b preferably occupies 60% or more of the non-conductive portion 6.

  Further, the conductive portion 5 can contain Ag as a main component, and can be formed of, for example, Ag—Pd containing 70% by weight or more of Ag.

  That is, in the internal electrode layer 2 containing Ag as a main component, since Ag is a low-melting-point material, the covering rate generally decreases and the bonding strength is likely to decrease. However, the structure of the internal electrode layer 2 is as described above. By doing so, it is possible to suppress a decrease in bonding strength, and it is possible to use a relatively inexpensive metal powder containing Ag as a main component, thereby reducing manufacturing costs.

  Further, the multilayer piezoelectric actuator can be obtained with a larger displacement by being driven by a high electric field that is 1/10 or more of the coercive electric field of the ceramic layer 1. This is because the amount of displacement increases as the drive electric field increases, so that the effect of reducing residual stress and displacement inhibition force by the internal electrode layer 2 loaded on the ceramic layer 1 appears more prominently.

  Next, a manufacturing method of the multilayer piezoelectric actuator will be described in detail.

First, a predetermined amount of Pb ₃ O ₄ , ZrO ₂ , TiO ₂ , and Nb ₂ O ₅ , NiO as required is weighed as a ceramic raw material, and then the weighed product is a ball mill containing a grinding medium such as zirconia balls And thoroughly mixed and pulverized. And after that, the obtained mixed powder is calcined at a predetermined temperature (for example, 700 to 1000 ° C.) to obtain a calcined product, a solvent and a dispersant are added to the calcined product, and wet pulverized again in a ball mill, A PZT ceramic raw material powder is produced.

  Next, an organic binder and a plasticizer are added to the ceramic raw material powder thus produced, and a wet mixing process is performed to form a slurry. Thereafter, a molding process is performed using a doctor blade method, etc. Make a green sheet.

  On the other hand, a conductive paste is produced as follows.

First, an organic vehicle in which an organic binder is dissolved in an organic solvent is prepared. Next, a metal powder having a predetermined specific surface area (for example, 1 to ³ m ² / g) is prepared, the metal powder is mixed with the organic vehicle, and kneaded with a three-roll mill or the like, thereby obtaining a metal paste.

  Next, a ceramic raw material having at least the same component as the ceramic raw material powder is prepared, and the ceramic raw material is put into a forced stirring device such as a bead stirring type pulverizer to perform a pulverization treatment, thereby making a metal A ceramic powder (ceramic co-material) having a specific surface area S2 of 5 to 20 times the specific surface area S1 of the powder is produced.

  Next, the ceramic powder and the organic vehicle are mixed, and the ceramic powder is sufficiently dispersed in the organic vehicle using a forced stirring device such as the bead stirring pulverizer, thereby obtaining a ceramic paste.

  Here, the reason why the specific surface area S2 of the ceramic powder is 5 to 20 times the specific surface area S1 of the metal powder as described above is as follows.

  That is, when the specific surface area S2 of the ceramic powder is less than 5 times the specific surface area S1 of the metal powder, the average particle size of the ceramic powder is increased and the dispersibility of the ceramic powder in the conductive paste is reduced, Since the diameter of the non-conductive portion 6 of the electrode layer 2 is increased or the coverage is lowered, there is a possibility that a sufficient amount of displacement and bonding strength cannot be obtained. On the other hand, when the specific surface area S2 of the ceramic powder exceeds 20 times the specific surface area S1 of the metal powder, the average particle size of the ceramic powder ceramic powder contained in the conductive paste becomes excessively fine. As a result, the ceramic powder does not sufficiently diffuse into the ceramic layer, and the diameter of the non-conductive portion 6 of the internal electrode layer 2 becomes large, which may cause a reduction in displacement and bonding strength.

  For this reason, in the present embodiment, the specific surface area S2 of the ceramic powder is set to 5 to 20 times the specific surface area S1 of the metal powder.

  Next, the metal paste and the ceramic paste are kneaded with a three-roll mill or the like so that the content of the ceramic powder in the solid content (metal powder and ceramic powder) is 20 to 50% by weight. A paste is made.

  Thus, by making content of ceramic powder into 20 to 50 weight% with respect to solid content, ceramic powder can be effectively spread | diffused to the ceramic green sheet side at the time of baking.

  The ceramic powder content is set to 20 to 50% by weight. When the ceramic powder content is less than 20% by weight, the diameter of the non-conductive portion in the internal electrode layer is increased and the coverage is reduced. , It becomes difficult to ensure a coverage of 60% or more. On the other hand, if the content exceeds 50% by weight, the ceramic powder that has not diffused into the ceramic layer 1 forms the ceramic portion 6a, so that the bonding strength becomes excessively large, which may lead to a decrease in displacement. is there.

  Next, using the conductive paste described above, screen printing is performed on the ceramic green sheet to form a conductive pattern.

  In the present embodiment, the ceramic powder contained in the conductive paste uses a ceramic raw material having at least the main component having the same composition as the ceramic material forming the ceramic green sheet. Need not be the same compositional component. However, since the ceramic powder contained in the conductive paste diffuses to the ceramic layer side during firing, at least the main component has the same composition component as the ceramic material forming the ceramic green sheet from the viewpoint of preventing characteristic fluctuations. More preferably, ceramic raw materials are used.

  Next, after laminating ceramic green sheets on which these electrode patterns are screen-printed, they are sandwiched between ceramic green sheets on which the electrode patterns are not screen-printed, and pressed to produce a laminate. Next, the laminate is cut to a predetermined size, accommodated in an alumina cocoon, and after a binder removal treatment at a predetermined temperature (for example, 200 to 500 ° C.), the oxygen concentration is 0.1 to 15 A firing process is performed at a predetermined temperature (for example, 950 to 1100 ° C.) in an oxygen concentration atmosphere of volume% to form the piezoelectric ceramic body 3 in which the ceramic layers 1 and the internal electrode layers 2 are alternately stacked.

  Here, the reason why the firing atmosphere is the low oxygen atmosphere is as follows.

  By actively diffusing a ceramic powder having a specific surface area larger than that of the metal powder into the ceramic layer, a large number of minute non-conductive portions 6 can be formed in the internal electrode layer 2. By firing in an oxygen concentration atmosphere with a low oxygen concentration of 0.1 to 15% by volume, the metal component in the internal electrode is prevented from diffusing into the ceramic layer, and the void portion 6b in the non-conductive portion 6 is sintered. As a result, the minute gap portion 6b can be made 60% or more with respect to the entire non-conductive portion 6, and thus the laminated piezoelectric element having the internal electrode layer 2 described above can be prevented. An actuator can be manufactured.

  Furthermore, when firing in a low oxygen atmosphere, the oxidative expansion and reduction shrinkage during the temperature rise and fall of the internal electrode layer 2 can be suppressed, so that the bonding strength at the interface between the ceramic layer 1 and the internal electrode layer 2 can be maintained firmly. Is possible.

  And, by such a synergistic effect of strengthening the bonding strength and forming the minute non-conductive portion 6, it is possible to obtain a laminated piezoelectric actuator with further improved displacement and reliability.

  Further, the reason why the oxygen concentration is 0.1 to 15% by volume is that when the oxygen concentration is less than 0.1% by volume, the coverage tends to decrease, and the control of the gap 6b becomes difficult. On the other hand, if the oxygen concentration exceeds 15% by volume, the firing atmosphere becomes close to the air, and the gap 6b is easily blocked by sintering, so that the desired internal electrode layer 2 described above cannot be formed, and the displacement This is because the amount cannot be improved and the bonding strength cannot be improved.

  In addition, in the low oxygen atmosphere mentioned above, when Ag-Pd powder containing Pd is used as the metal powder, the Pd oxidation-reduction reaction itself can be suppressed. Deterioration of this can be suppressed, and thereby the joint strength can be further improved without causing a decrease in displacement.

  After that, the same conductive paste for external electrode made of Ag or the like is applied to a predetermined region of the end face of the piezoelectric ceramic body 3, and subjected to a baking process at a predetermined temperature (for example, 750 ° C. to 850 ° C.) to thereby form external electrodes 4a 4b is formed, and a predetermined polarization process is further performed, whereby a laminated piezoelectric actuator is manufactured. The external electrodes 4a and 4b may be formed by a thin film forming method such as a sputtering method or a vacuum vapor deposition method as long as the adhesion is good.

  Thus, in this Embodiment, the electrically conductive paste which contains 20-50 weight% of ceramic powder which has 5-20 times specific surface area S2 of metal powder specific surface area S1 with respect to solid content (metal powder and ceramic powder). Is used, and the baking process is performed in a low oxygen concentration atmosphere having an oxygen concentration of 0.1 to 15% by volume. Therefore, the internal electrode layer 2 is formed in a state where the nonconductive portions 6 are scattered in the conductive portions 5. In addition, the ratio x / y between the average diameter x of the non-conductive portion 6 and the thickness y of the ceramic layer 2 is 0.08 to 0.33, and the coverage of the internal electrode layer 2 is 60 to 95%. Further, the ratio z / y between the thickness z of the internal electrode layer 2 and the thickness y of the ceramic layer 1 is 0.04 to 0.40, and the gap 6b occupies 60% or more in the non-conductive portion 6. Since the internal electrode layer is formed, the displacement is large and the ceramic It is possible to produce a laminated piezoelectric actuator joint strength excellent strong reliability between the click layer 1 and the internal electrode layer 2.

  The present invention is not limited to the above embodiment. In the above embodiment, the conductive paste is prepared by kneading the metal paste and the ceramic paste. However, the metal powder and the ceramic co-material are mixed in a predetermined amount and then kneaded with the organic vehicle. Thus, a conductive paste may be produced.

  In the above embodiment, the multilayer piezoelectric actuator is described as an example of the multilayer piezoelectric ceramic component. However, the multilayer piezoelectric actuator is suitable for a multilayer piezoelectric sounding body or multilayer piezoelectric sensor that requires a high piezoelectric constant, and has a multilayer structure and element shape. Further, the direction of displacement or force, the direction of polarization, and the direction of voltage application are not limited to the above embodiment.

Furthermore, in the above embodiment, using an oxide such as Pb ₃ O ₄ as a ceramic raw materials, it is needless to say it is also possible to use carbonates or hydroxides.

  Next, examples of the present invention will be specifically described.

First, a predetermined amount of Pb ₃ O ₄ , ZrO ₂ , TiO ₂ , NiO, and Nb ₂ O ₅ was weighed as a ceramic raw material, and the weighed material was put into a ball mill containing a grinding medium such as zirconia. Mix and grind for hours. Then, the obtained mixed powder was calcined at a temperature of 900 ° C. to obtain a calcined product. Then, after that, a solvent and a dispersant are added to the calcined product, and wet pulverized again by a ball mill for 24 hours, and the composition formula 0.25Pb (Ni _1/3 Nb _2/3 ) O ₃ −0.35PbZrO ₃ −0. A PZT ceramic raw material powder represented by 40 PbTiO ₃ was produced.

  Next, an ethyl cellulose resin as an organic binder and a polycarboxylate solution as a dispersant are added to the ceramic powder raw material, a slurry is prepared using water as a solvent, and a doctor blade method is used. A sheet was produced. The thickness of the ceramic green sheet was molded so that the thickness y of the sintered ceramic layer was 20 μm or 40 μm.

Next, a metal powder having a specific surface area of 1 to ³ m ² / g, in which the weight ratio Ag / Pd of Ag to Pd is 7/3 to 9/1, and the same composition component as the PZT ceramic raw material powder Ceramic powder (ceramic co-material) having a specific surface area of 15 to 40 m ² / g so that the content of the ceramic co-material is 0 to 50% by weight with respect to the total solid content (metal powder and ceramic co-material) It mix | blended and this compound was disperse | distributed in the terpene-type solvent (organic solvent) with ethylcellulose resin (organic binder), and, thereby, the electrically conductive paste was produced.

Next, the conductive paste for internal electrodes was screen-printed on the ceramic green sheet while adjusting the thickness of the coating film so that the thickness z of the internal electrode layer after sintering was 1 to 3 μm. Then, a predetermined number of the screen-printed ceramic green sheets were laminated, and then sandwiched between the ceramic green sheets that were not screen-printed, followed by pressure bonding to produce a laminate. Next, after these laminates were accommodated in an alumina pod and subjected to a binder removal treatment, the firing temperature was 960 ° C. to 1040 ° C. and the oxygen concentration was 0.3 to 21% by volume in a firing atmosphere. A timed baking treatment was performed, whereby a ceramic body having a thickness y of 20 μm or 40 μm and a total thickness of 0.1 to 0.6 mm was produced. The oxygen concentration during sintering was adjusted with N ₂ gas and O ₂ gas.

  Subsequently, the ceramic body is cut into a length of 3 mm and a width of 13 mm, a sputtering process is performed using Ni—Cu as a target, a Ni—Cu film is formed on both sides of the ceramic body from the upper and lower sides, and Ag is further targeted. Sputtering was performed, and an Ag film was formed on the Ni—Cu film, thereby forming an external electrode having a two-layer structure of the Ni—Cu film and the Ag film.

  Then, a polarization process was performed for 20 minutes by applying an electric field of 3 kV / mm in insulating oil at 60 ° C., thereby producing laminated piezoelectric elements of sample numbers 1 to 24.

Next, the piezoelectric constants | d ₃₁ | and tensile strength X of the sample numbers 1 to 24 were measured, and the displacement amount and the bonding strength, that is, the reliability of the laminated piezoelectric element were evaluated.

Here, the piezoelectric constant | d ₃₁ | is measured with a contact displacement meter when the electric field of 1/2 of 1000 V / mm, ie, 500 V / mm, which is the coercive electric field of the ceramic material used this time, is applied. Calculated.

  Further, the tensile strength X is obtained by bonding metal pieces to both main surfaces of the laminated piezoelectric element, pulling the metal pieces with a tensile tester, and peeling off the joint surface between the ceramic layer and the internal electrode layer. It was. In this example, the bonding strength between the internal electrode layer and the ceramic layer was evaluated based on the tensile strength.

In addition, the increase rate Δ | d ₃₁ | of the piezoelectric constant and the increase rate ΔX of the tensile strength were calculated using the sample number 1 or the sample number 12 as a reference.

  Next, the bonding surface of the ceramic layer and the internal electrode layer is observed with a scanning electron microscope (SEM), and the average diameter x when the coverage of the internal electrode and the cross-sectional area of the non-conductive portion are converted into a circle is analyzed by image analysis. The ratio x / y and the ratio z / y were calculated.

  Table 1 shows the manufacturing conditions of the laminated piezoelectric elements of sample numbers 1 to 24, and Table 2 shows the measurement results.

  Sample numbers 1 to 11 are cases where the thickness y of the ceramic layer is 40 μm. Sample No. 1 is a conventional example in which the ceramic electrode material is not contained in the internal electrode layer and the baking treatment is performed in an air atmosphere having an oxygen concentration of 21% by volume. Sample No. 1 and Sample No. By comparing 2 to 10, the displacement amount and bonding strength of each sample number can be evaluated.

That is, in Sample No. 6, since the ratio x / y is as large as 0.37 and the average diameter x of the non-conductive portion is as large as 14.7 μm, the coverage is reduced to 49%, and therefore the piezoelectric constant | d ₃₁ | Is as low as 324 pC / N, which is 1.5% lower than Sample No. 1. Moreover, since the coverage is as low as 49%, the tensile strength X is also as low as 7.9 MPa, and the tensile strength X is decreased by 7.1% with respect to the sample number 1.

In Sample No. 10, since the ratio x / y is as large as 0.41 and the average diameter x of the non-conductive portion is as large as 16.5 μm, the coverage is reduced to 45%, and therefore the piezoelectric constant | d ₃₁ | is 315 pC. / N, which is 4.3% lower than Sample No. 1. Moreover, since the coverage is as low as 45%, the tensile strength X is also as low as 7.4 MPa, which is 12.9% lower than the sample number 1.

On the other hand, sample numbers 2 to 5, 7 to 9, and 11 have a ratio x / y of 0.08 to 0.33 and a coverage of 60 to 94%. Therefore, the piezoelectric constant | d ₃₁ | It was as large as ˜362 pC / N and increased by 2.7 to 10.0% with respect to Sample No. 1, indicating that the amount of displacement was improved. Further, the tensile strength X is 8.5 to 9.8 MPa, the sample number 11 is equal to the sample number 1 and the tensile strength X, but the sample numbers 2 to 5 and 7 to 9 are 1 with respect to the sample number 1. .2 to 21.2%, which indicates that the bonding strength is improved.

  Sample numbers 12 to 24 are cases in which the thickness y of the ceramic layer is 20 μm. Sample No. 12 is a conventional example in which a ceramic co-material is not contained in the internal electrode layer and the baking treatment is performed in an air atmosphere having an oxygen concentration of 21% by volume. Sample No. 12 and Sample No. By comparing 13 to 24, the displacement amount and bonding strength of each sample number can be evaluated.

That is, in the sample number 17, the ratio x / y is as large as 0.65 and the average diameter x of the non-conductive portion is as large as 13.1 μm, so that the coverage is 48%, which is 0.6% with respect to the sample number 12. The piezoelectric constant | d ₃₁ | is as low as 313 pC / N, and the tensile strength X is 8.4 MPa, which is 4.5% lower than that of the sample number 12 and the bonding strength is reduced. This is because the ratio S2 / S1 of the specific surface area S2 of the ceramic co-material to the specific surface area S1 of the metal powder is as small as “2”, and thus the average particle size of the ceramic co-material is large. As a result, as described above, the diameter of the non-conductive portion of the internal electrode layer is increased, the coverage is lowered, and various characteristics are deteriorated.

In Sample No. 20, the ratio x / y is as large as 0.73 and the average diameter x of the non-conductive portion is as large as 14.7 μm, so that the coverage is reduced to 48%, and therefore the piezoelectric constant | d ₃₁ | is 309 pC. / N, which is 1.9% lower than Sample No. 12. Moreover, since the coverage is as low as 48%, the tensile strength X is also as low as 8.0 MPa, and the tensile strength X is decreased by 9.1% with respect to the sample number 12.

In Sample No. 23, since the ratio x / y is as large as 0.85 and the average diameter x of the non-conductive portion is as large as 17.0 μm, the coverage is reduced to 41%, and thus the piezoelectric constant | d ₃₁ | is 295 pC. / N, which is 6.3% lower than Sample No. 12. Moreover, since the coverage is as low as 41%, the tensile strength X is also as low as 7.1 MPa, which is 19.3% lower than the sample number 12.

On the other hand, sample numbers 13 to 16, 18, 19, 21, 22, and 24 have a ratio x / y of 0.16 to 0.33 and a coverage of 61 to 95%. ₃₁ | is as large as 324 to 357 pC / N, which is increased by 2.9 to 13.3% with respect to Sample No. 12, indicating that the amount of displacement is improved. Further, the tensile strength X is also 8.8 to 10.8 MPa, the sample number 24 is equal to the sample number 12 and the tensile strength X, but the sample numbers 13 to 16, 18, 19, 21, and 22 are the samples. It increased by 1.1 to 22.7% with respect to No. 12, indicating that the bonding strength was improved.

Further, as is apparent from Table 1, when the coverage is in the range of 60 to 90%, the increase rate Δ | d ₃₁ | of the piezoelectric constant is significantly increased to 5.8 to 13.3%, and the coverage is It was found that the tensile strength increase rate ΔX was significantly increased to 4.5 to 22.7% in the range of 75 to 95%.

  FIG. 3 is an SEM image of sample number 19 (Example of the present invention), and the non-conductive portion appears black. FIG. 4 is an SEM image of sample number 12 (conventional example).

  As shown in FIG. 4, in the conventional example, the ceramic layer is completely covered with the internal electrode layer, whereas in the embodiment of the present invention shown in FIG. 3, the non-conductive portion is exposed and distributed uniformly. Therefore, by using a conductive paste containing a ceramic co-material and firing in a low oxygen concentration atmosphere, the structure of the internal electrode (coverage and average diameter x of non-conductive part) can be controlled. I understood.

  First, a ceramic green sheet prepared by the same method and procedure as in [Example 1] was prepared.

  Moreover, the weight ratio Ag / Pd of Ag and Pd is blended to 7/3 or 8/2, and the ceramic co-material is blended so as to be 0% by weight or 30% by weight with respect to the total solid content, A conductive paste for internal electrodes was produced by the same method and procedure as in [Example 1].

  Next, the conductive paste for internal electrodes is screen-printed on the ceramic green sheet so that the thickness z of the sintered internal electrode layer is 2.4 μm, and then the same method as in [Example 1] -The laminated body was produced in the procedure. Next, after these laminates are housed in alumina pods and subjected to binder removal treatment, a firing atmosphere in which the firing temperature is 1000 ° C. or 1040 ° C. and the oxygen concentration is 0.5% by volume or 21% by volume. A ceramic body having a thickness y of 6 to 100 μm and a total thickness of 0.1 to 0.6 mm is prepared. Then, the same as in Example 1 is performed. The laminated piezoelectric elements of sample numbers 31 to 41 were produced by the method / procedure.

Next, the piezoelectric constants | d ₃₁ |, the increase rate Δ | d ₃₁ |, the tensile strength X, and the increase rate ΔX of sample numbers _{31 to} 41 were obtained by the same method and procedure as in [Example 1]. The displacement amount and bonding strength of the piezoelectric element, that is, reliability was evaluated. Further, the internal electrode coverage, the ratio x / y, and the ratio z / y were calculated by the same method and procedure as in [Example 1].

  Table 3 shows the manufacturing conditions of the laminated piezoelectric elements of sample numbers 31 to 41, and Table 4 shows the measurement results.

  In Tables 3 and 4, sample numbers 31, 33, 35, 37, and 39 marked with ** differ in the thickness y of the ceramic layer in the range of 6 to 100 μm, but the internal electrode layer contains the ceramic co-material. This is a case where it is made of a metal powder in which Ag / Pd is blended to 7/3 and is fired at a temperature of 1040 ° C. in an air atmosphere (oxygen concentration: 21% by volume), and shows a conventional example.

  Sample numbers 32, 34, 36, 38 and 40 are examples of the present invention corresponding to the above-described conventional example, the internal electrode layer contains 30% by weight of ceramic co-material, and the metal powder is made of Ag / Pd. The case where it mix | blends so that it may become 8/2 and it baked at the temperature of 1000 degreeC in the low oxygen concentration atmosphere whose oxygen concentration is 0.5 volume% is shown.

As is clear from the comparison between the conventional example (marked with **) and the example of the present invention, the example of the present invention contains 30% by weight of ceramic co-material in the internal electrode layer, and the oxygen concentration is 0.5% by volume. Since the ratio x / y is 0.08 to 0.33 and the coverage is reduced to 80 to 94%, the piezoelectric constant | d ₃₁ | increased by 0.9 to 8.4%, and it was found that the amount of displacement was improved. Moreover, the tensile strength X was also increased by 5.0 to 7.8%, and it was found that the bonding strength was improved.

Sample No. 41 contains 30% by weight of a ceramic co-material in the internal electrode layer and fired in a low oxygen concentration atmosphere with an oxygen concentration of 0.5% by volume, but the ratio x / y is 0.00. 38, which exceeds 0.33. Therefore, even if the coverage is as large as 97%, the average diameter x of the non-conductive portion increases, so that the potential drop due to the non-conductive portion increases, and the piezoelectric constant | d ₃₁ | was 270 pC / N, which was lower than the conventional example, and it was found that a desired large displacement could not be obtained.

  First, a ceramic green sheet prepared by the same method and procedure as in [Example 1] was prepared.

  Moreover, the weight ratio Ag / Pd of Ag and Pd was blended to 7/3 or 9/1, and the ceramic co-material was blended so as to be 0% by weight or 40% by weight with respect to the total solid content, A conductive paste for internal electrodes was produced by the same method and procedure as in [Example 1].

  Next, the conductive paste for internal electrodes is screen-printed on the ceramic green sheet so that the thickness z of the sintered internal electrode layer becomes 2 μm or 3 μm, and then the same method as in [Example 1] -The laminated body was produced in the procedure. Next, after these laminates are accommodated in an alumina pod and subjected to a binder removal treatment, a firing atmosphere in which the firing temperature is 960 ° C. or 1040 ° C. and the oxygen concentration is 0.5% by volume or 21% by volume. A ceramic body having a thickness y of each ceramic layer of 20 μm and a total thickness of 0.1 to 0.6 mm was prepared by the above-described method for 8 hours. The laminated piezoelectric element of sample numbers 51-60 was produced by the procedure.

Next, the piezoelectric constants | d ₃₁ | of sample numbers 51 to 60 are measured by changing the driving electric field by the same method and procedure as in [Example 1], and the increase rate Δ | d ₃₁ | The increase rate ΔX was obtained, and the displacement amount and the bonding strength, that is, the reliability of each laminated piezoelectric element were evaluated. Further, the internal electrode coverage, the ratio x / y, and the ratio z / y were calculated by the same method and procedure as in [Example 1].

  Table 5 shows the manufacturing conditions of the laminated piezoelectric elements of sample numbers 51 to 60, and Table 6 shows the measurement results.

  In Tables 5 and 6, sample numbers 51, 53, 55, 57 and 59 marked with ** differ in the driving electric field range of 1-1000 V / mm, but the internal electrode layer does not contain ceramic co-material. This is a case where it is made of a metal powder in which Ag / Pd is mixed in 7/3, and is fired at a temperature of 1040 ° C. in an air atmosphere (oxygen concentration: 21% by volume), which shows a conventional example.

  Sample numbers 52, 54, 56, 58 and 60 are examples of the present invention corresponding to the above-described conventional example, and the internal electrode layer contains 40% by weight of ceramic co-material, and the metal powder is Ag / Pd. Is blended in 9/1, and the case where firing is performed at a temperature of 960 ° C. in a low oxygen concentration atmosphere with an oxygen concentration of 0.5 vol% is shown.

As is clear from the comparison between the conventional example (marked **) and the example of the present invention, the example of the present invention contains 40% by weight of the ceramic co-material in the internal electrode layer, and the oxygen concentration is 0.5% by volume. Since the ratio x / y is 0.30 and the coverage is reduced to 82%, the piezoelectric constant | d ₃₁ | is 2.9 for each of the conventional examples. It was found that the displacement was improved by ˜10.7%. Moreover, the tensile strength X was also increased by 3.4%, and it was found that the bonding strength was improved and the reliability was improved.

Further, the coercive electric field of the ceramic layer used in this example is 1000 V / mm, but when driven at an electric field of 1/10 or more of this coercive electric field, that is, 100 to 1000 V / mm (sample number 54, 56, 58 and 60), the piezoelectric constant | d ₃₁ | is greatly increased to 5.0 to 10.7%, and the increase rate ΔX of the tensile strength is the same. It was found that by driving with a high electric field of 1/10 or more, a larger displacement amount can be obtained without impairing the bonding strength (reliability).

  First, a ceramic green sheet prepared by the same method and procedure as in [Example 1] was prepared.

  Moreover, the weight ratio Ag / Pd of Ag and Pd is blended to 7/3 or 8/2, and the ceramic co-material is blended so as to be 0% by weight or 25% by weight based on the total solid content, A conductive paste for internal electrodes was produced by the same method and procedure as in [Example 1].

  Next, the conductive paste for internal electrodes is screen-printed on the ceramic green sheet so that the thickness z of the sintered internal electrode layer is 2.4 μm, and then the same method as in [Example 1] -The laminated body was produced in the procedure. Next, these laminates are accommodated in an alumina pod (sheath) and subjected to a binder removal treatment, followed by a firing treatment for 8 hours in a firing atmosphere at a firing temperature of 1040 ° C. and an oxygen concentration of 0.1 to 21% by volume. As a result, a ceramic body having a thickness y of 20 μm and a total thickness of 0.1 to 0.6 mm was prepared. After that, sample No. 61 was prepared by the same method and procedure as in [Example 1]. -67 laminated piezoelectric elements were produced.

Next, the piezoelectric constants | d ₃₁ |, the increase rate Δ | d ₃₁ |, the tensile strength X, and the increase rate ΔX of Sample Nos. 61 to 67 are obtained by the same method and procedure as in [Example 1]. The displacement amount and bonding strength of the piezoelectric element, that is, reliability was evaluated. Further, the internal electrode coverage, the ratio x / y, and the ratio z / y were calculated by the same method and procedure as in [Example 1]. In addition, the internal electrode layer was observed with an SEM and image analysis was performed to determine the porosity in the non-conductive portion.

  Table 7 shows the production conditions of the laminated piezoelectric elements of sample numbers 61 to 67, and Table 8 shows the measurement results.

  In Tables 7 and 8, Sample No. 61 marked with ** is made of a metal powder in which the internal electrode layer does not contain a ceramic co-material and Ag / Pd is blended in 7/3, and the atmosphere (oxygen) This is a case of baking at a temperature of 1040 ° C. under a concentration of 21% by volume, and shows a conventional example.

On the other hand, sample numbers 62 to 67 contain 25% by weight of ceramic co-material in the internal electrode layer and fired in a low oxygen concentration atmosphere having an oxygen concentration of 0.5 to 15% by volume. / Y is 0.18 to 0.27, the coverage is reduced to 79 to 94%, and the porosity of the non-conductive part is also 62 to 95%, and excessive formation of the ceramic part is suppressed. As a result, the piezoelectric constant | d ₃₁ | increased from 2.5 to 9.2%, and the tensile strength X also increased from 1.1 to 9.2%, compared to the conventional example. It was found that the property was improved.

It was also found that the piezoelectric constant increase rate Δ | d ₃₁ | increased as the oxygen concentration decreased, and the amount of displacement was further improved.

Claims (4)

A ceramic without a conductive pattern formed by applying a conductive paste to the surface of the ceramic green sheet to form a predetermined conductive pattern to be an internal electrode layer, and laminating the ceramic green sheets with the conductive pattern formed thereon The ceramic body is sandwiched between green sheets and pressed to form a laminate, and then the laminate is fired to form a ceramic body in which ceramic layers and internal electrode layers are alternately stacked. In the manufacturing method of the multilayer piezoelectric ceramic component in which the external electrode is formed on the end face,
  The conductive paste contains a metal powder and a ceramic powder having a specific surface area 5 to 20 times that of the metal powder, and the content of the ceramic powder is 20 with respect to the total of the metal powder and the ceramic powder. Prepared to be ~ 50 wt%,
  The firing process is performed in an oxygen atmosphere having an oxygen concentration of 0.1 to 15% by volume, and the internal electrode layer is formed so that the internal electrode layer has a conductive portion and a non-conductive portion. Manufacturing method of multilayer piezoelectric ceramic component. 2. The method of manufacturing a multilayer piezoelectric ceramic component according to claim 1, wherein the ceramic powder has at least a main component having the same composition as that of the ceramic green sheet. Forming the non-conductive portion so that a ratio x / y of the average diameter x and the thickness y of the ceramic layer when the cross-sectional area of the non-conductive portion is converted into a circle is 0.08 to 0.33; The ratio z / y of the thickness z of the internal electrode layer to the thickness y of the ceramic layer is 0.04 to 0.40, and the coverage of the internal electrode layer on the ceramic layer is 60 to 95%. 3. The method for manufacturing a multilayer piezoelectric ceramic component according to claim 1, wherein the internal electrode layer is formed as described above. The non-conductive portion has a void portion and a ceramic portion filled with ceramic powder, and the non-conductive portion is formed so that the void portion occupies 60% or more of the non-conductive portion. A method for manufacturing a multilayer piezoelectric ceramic component according to any one of claims 1 to 3.

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