JP4547876B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a method for manufacturing a multilayer ceramic electronic component.To the lawIn particular, how to form external electrodes for multilayer ceramic electronic componentsTo the lawIt is about the improvement about.
[0002]
[Prior art]
As a multilayer ceramic electronic component of interest to the present invention, there is a multilayer ceramic capacitor 1 as shown in FIG. 4 (see, for example, Patent Document 1).
[0003]
The multilayer ceramic capacitor 1 includes a rectangular parallelepiped multilayer body 2. The laminated body 2 has a structure in which a plurality of dielectric ceramic layers 3 are laminated.
[0004]
A plurality of first and second inner electrodes 4 and 5 are formed in the multilayer body 3 so as to extend along a specific interface between the plurality of dielectric ceramic layers 3. Further, first and second via-hole conductors 6 and 7 are provided so as to be located at the respective ends in the longitudinal direction of the multilayer body 2 and to penetrate the dielectric ceramic layer 3.
The first internal electrode 4 is connected to the first via-hole conductor 6, the second internal electrode 5 is connected to the second via-hole conductor 7, and the first and second internal electrodes 4 and 5 are The dielectric ceramic layers 3 are alternately arranged so as to form a capacitance between them.
[0005]
First and second external electrodes 8 and 9 connected to the first and second via-hole conductors 6 and 7, respectively, are formed at the respective longitudinal ends of the multilayer body 2 and on the respective main surfaces. Has been.
[0006]
In such a multilayer ceramic capacitor 1, the capacitance formed between the first and second internal electrodes 4 and 5 passes through the first and second via-hole conductors 6 and 7, and the first and second via-hole conductors 6 and 7. Two external electrodes 8 and 9 are taken out.
[0007]
Unlike the general multilayer ceramic capacitor, the multilayer ceramic capacitor 1 shown in FIG. 4 does not require an external electrode to be formed on each end face of the multilayer body 2, and the multilayer body 2 can be obtained by a method such as screen printing. Since the external electrodes 8 and 9 can be formed on the main surface, the thickness direction dimension of the multilayer ceramic capacitor 1 can be reduced to, for example, 300 μm or less, further 200 μm or less, or 100 μm or less. Have a structure.
[0008]
In Patent Document 1, in order to manufacture the multilayer ceramic capacitor 1 as described above, the following method is described as an example.
[0009]
First, a plurality of ceramic green sheets to be the dielectric ceramic layer 3 are prepared, and a conductive paste is printed to form the internal electrodes 4 and 5 on a specific ceramic green sheet. Then, by laminating a plurality of ceramic green sheets, a green laminate corresponding to the raw state of the laminate 2 is produced. The green laminate is then pressed in the lamination direction.
[0010]
Next, in order to form the via-hole conductors 6 and 7, the green laminate is provided with through holes and filled with conductive paste in the through holes.
[0011]
Next, in order to form the external electrodes 8 and 9 on each main surface of the green laminate, a conductive paste film made of a conductive paste is formed by printing and then dried.
[0012]
Thereafter, the green multilayer body is cut as necessary to form a chip for each multilayer ceramic capacitor 1, and then the green multilayer body is electrically conductive to become the external electrodes 8 and 9. The laminated ceramic capacitor 1 is completed by firing together with the paste film.
[0013]
As described above, in the firing process of the green laminate, the simultaneous baking of the conductive paste film to be the external electrodes 8 and 9 is originally intended to improve the production efficiency. In addition, when the thickness of the dielectric ceramic layer 3 is reduced to, for example, 5 μm or less, when the heat treatment such as baking for forming the external electrodes 8 and 9 is performed again after the green laminated body is fired, the internal electrode 4 Further, since the structure 2 may have structural defects due to the expansion and contraction of 5 and 5, it is also intended to prevent this.
[0014]
Even when the conductive paste film for the external electrodes 8 and 9 is formed at the stage of the ceramic green sheet, the baking for forming the external electrodes 8 and 9 as described above is performed by firing the green laminate. It can be done at the same time.
[0015]
However, in this case, the process for providing the via-hole conductors 6 and 7 is performed in a state where the conductive paste film for the external electrodes 8 and 9 exists. Therefore, if the through holes for the via-hole conductors 6 and 7 are to be formed by laser light irradiation, the laser light is also applied to the conductive paste film for the external electrodes 8 and 9. The conductive paste film is burned out or melted, and the conductive paste film disappears around the through-hole. In the obtained multilayer ceramic capacitor 1, an appropriate amount is obtained between the via-hole conductors 6 and 7 and the external electrodes 8 and 9. Electrical connection cannot be obtained.
[0016]
Furthermore, not only the conductive paste film for the internal electrodes 4 and 5 but also the conductive paste film for the external electrodes 8 and 9 and the via-hole conductors 6 and 7 may be formed at the stage of the ceramic green sheet. In this case, in the step of laminating a plurality of ceramic green sheets, it is not easy to align each of the via-hole conductors 6 and 7 in the laminating direction. The electrical connection within the range may be insufficient.
[0017]
From these points, the method as described above is employed to manufacture the multilayer ceramic capacitor 1.
[0018]
[Patent Document 1]
Japanese Unexamined Patent Publication No. Hei 6-1112099
[0019]
[Problems to be solved by the invention]
When the manufacturing method as described above is carried out, the via-hole conductors 6 and 7 are formed, the conductive paste is applied for the external electrodes 8 and 9, and the chip-like one is fixed in a state where the green laminate is fixed to the adhesive sheet. Cuts have been made to obtain. And after a cut, a chip-like green laminated body is peeled from an adhesive sheet, and a baking process is then implemented.
[0020]
However, since the conductive paste to be the external electrodes 8 and 9 is merely applied and dried on the main surface of the green laminate, a part of the conductive paste film is peeled off from the adhesive sheet. In an extreme case, there may be a problem that about 50% of the whole part is peeled off from the green laminate and taken away to the adhesive sheet side.
[0021]
In addition, as an adhesive sheet, the foaming peeling sheet is normally used. The foam release sheet, for example, has an extremely low adhesive strength at a temperature of 100 ° C., for example. However, since the adhesive strength is not lost at all, the above-described problems occur.
[0022]
Further, in the manufacturing method described above, there is no opportunity to press the conductive paste for forming the via-hole conductors 6 and 7 after the via-hole conductors 6 and 7 are provided on the green laminated body. The filling rate of the paste may be insufficient.
[0023]
The above problems can be encountered in general multilayer ceramic electronic components having the same structure as the multilayer ceramic capacitor 1.
[0024]
Accordingly, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component that can solve the above-described problems.
[0026]
[Means for Solving the Problems]
In the method for manufacturing a multilayer ceramic electronic component according to the present invention, the following steps are performed in order to solve the technical problem described above.
[0027]
  First, as a first step, a plurality of laminated ceramic green sheets, an internal electrode extending along a specific interface between the ceramic green sheets, and a specific internal electrode are connected.,oneMain faceFrom the other main surfaceAnd reachallTo penetrate the ceramic green sheetLinear along the stacking direction of ceramic green sheetsA step of producing a green laminate including an extended via-hole conductor is performed.In the first step, the through hole filled with the conductive paste for forming the via-hole conductor is integrally formed so as to penetrate the green laminate.
[0028]
After the first step, a second step of pressing the green laminate in the laminating direction is performed.
[0029]
  After the second step, the ceramic green laminateBothOn the main surface, an external electrode connected to the via-hole conductorMultiple eachTo formTo cover each end face of the via-hole conductor,A third step is performed in which a conductive paste film made of a conductive paste is formed and dried.
[0030]
  After the third step, a fourth step is performed in which the green laminate and the conductive paste film are pressed in the stacking direction.In the fourth step, a recess for positioning at least a part of the conductive paste film in the thickness direction is formed on each main surface of the green laminate.
[0031]
After the fourth step, a fifth step of firing the green laminate is performed.
[0032]
In the method for manufacturing a multilayer ceramic electronic component according to the present invention, from the first step to the fourth step, a mother state capable of providing a plurality of green laminates for obtaining a plurality of multilayer ceramic electronic components is provided. It is preferable to be performed on the green laminate. In this case, a step of cutting the mother green laminate is further performed between the fourth step and the fifth step in order to obtain a chip-like green laminate for each multilayer ceramic electronic component. Is done.
[0039]
DETAILED DESCRIPTION OF THE INVENTION
  The multilayer ceramic electronic part according to the present invention will be described below.GoodsThe embodiment of the manufacturing method will be described for the multilayer ceramic capacitor having the same elements as those of the multilayer ceramic capacitor 1 shown in FIG.
[0040]
  FIG. 1 shows an embodiment of the present invention.Manufactured by applying the manufacturing method1 is a cross-sectional view showing a multilayer ceramic capacitor 11. FIG.
[0041]
The multilayer ceramic capacitor 11 includes a rectangular parallelepiped multilayer body 12 as in the multilayer ceramic capacitor 1 shown in FIG. The laminated body 12 has a structure in which a plurality of dielectric ceramic layers 13 are laminated.
[0042]
  A plurality of first and second internal electrodes 14 and 15 extending along a specific interface between the plurality of dielectric ceramic layers 13 are formed inside the multilayer body 12. In addition, it is positioned at each end of the laminate 12 in the longitudinal direction.PutAs shown, first and second via-hole conductors 16 and 17 are provided.. FirstThe first and second via-hole conductors 16 and 17 areReaching from one main surface 20 of the laminate 12 to the other main surface 21;So as to penetrate all the dielectric ceramic layers 13Linearly along the laminating direction of the dielectric ceramic layer 13Therefore, it extends so as to penetrate the laminated body 12 in the thickness direction.
[0043]
The first internal electrode 14 is connected to the first via-hole conductor 16, but is positioned with respect to the second via-hole conductor 17 via the first gap 18. On the other hand, the second internal electrode 15 is connected to the second via-hole conductor 17, but is positioned with respect to the first via-hole conductor 16 via the second gap 19. The first and second internal electrodes 14 and 15 are alternately arranged via the dielectric ceramic layer 13 so as to form a capacitance between them.
[0044]
  First and second ends connected to the first and second via-hole conductors 16 and 17, respectively, on the two major surfaces 20 and 21 opposite to each other in the longitudinal direction of the laminate 12 External electrodes 22 and 23Multiple eachIt is formed. Therefore, in the multilayer ceramic capacitor 11, the capacitance formed between the first and second internal electrodes 14 and 15 passes through the first and second via hole conductors 16 and 17. The external electrodes 22 and 23 are taken out.External electrodes 22 and 23 are formed so as to cover the end faces of via-hole conductors 16 and 17.
[0045]
As a characteristic configuration of this embodiment, recesses 24 and 25 are formed on each of the main surfaces 20 and 21 of the laminate 12, and the external electrodes 22 and 23 are at least partially recessed in the thickness direction. Each is located within. That is, the external electrodes 22 and 23 are partially embedded in the laminate 12. The first and second external electrodes 22 and 23 are positioned so as to face the above-described second and first gaps 19 and 18, respectively.
[0046]
According to this embodiment, since at least a part of the thickness direction of the external electrodes 22 and 23 is embedded in the multilayer body 12, compared with the multilayer ceramic capacitor 1 shown in FIG. When the thicknesses of the multilayer bodies 12 and 2 are the same, the thickness of the multilayer ceramic capacitor 11 as a whole can be reduced.
[0047]
On the other hand, when the thickness of the multilayer ceramic capacitor 11 as a whole is the same as the thickness of the multilayer ceramic capacitor 1 as a whole, the thickness of the multilayer body 12 may be made larger than the thickness of the multilayer body 2. it can. When the thickness of the laminate 12 is increased, multilayering is facilitated, and the capacitance can be increased. On the other hand, when the same capacitance is sufficient, the thickness of the outer layer portion (the portion close to the main surfaces 20 and 21 of the laminate 12) without the internal electrodes 14 and 15 can be increased, so that the reliability of the element itself Can be improved.
[0048]
The effects as described above are maximized when the entire thickness of the external electrodes 22 and 23 is embedded in the laminate 12. When the entire thickness direction of the external electrodes 22 and 23 is embedded in the laminate 12, the main surfaces 20 and 21 of the laminate 12 are excluded except for the thickness of the plating film that may be formed on the laminate 12. This step can be substantially prevented. This also makes it difficult to cause problems such as breakage of the multilayer ceramic capacitor 11 due to an impact received from a chuck holding the multilayer ceramic capacitor 11 when the multilayer ceramic capacitor is mounted on an appropriate wiring board. enable.
[0049]
Next, a method for manufacturing the multilayer ceramic capacitor 11 will be described. FIG. 2 is a flowchart showing typical steps of the method for manufacturing the multilayer ceramic capacitor 11 according to the embodiment of the present invention. 3 is a cross-sectional view showing a typical structure obtained in the middle of the manufacturing method shown in FIG. 2 in the order of steps.
[0050]
First, in order to obtain the mother green laminate 31 shown in FIG. 3A, a plurality of ceramic green sheets 32 to be the dielectric ceramic layer 13 are prepared, and then the internal electrode forming step shown in FIG. S1 is performed. That is, in order to form the internal electrodes 14 and 15 on a specific ceramic green sheet 32, a conductive paste is applied on the ceramic green sheet by printing.
[0051]
Next, the ceramic green sheet stacking step S2 shown in FIG. 2 is performed.
That is, a plurality of ceramic green sheets 32 are laminated.
[0052]
Next, a temporary pressing step S3 of the green laminate shown in FIG. 2 is performed. That is, the green laminated body 31 is pressed in the lamination direction. This temporary pressing step S3 is for preventing the green laminated body 31 from being displaced between the ceramic green sheets 32 when handling the green laminate 31 in the subsequent steps. For example, a press with a relatively low pressure such as 15 MPa is sufficient. is there.
[0053]
When the above steps S1 to S3 are completed, a mother-state green laminate 31 as shown in FIG. 3A is obtained.
[0054]
  Next, a via hole conductor forming step S4 shown in FIG. 2 is performed. That is, as shown in FIG. 3B, by irradiating the mother green laminate 31 with, for example, laser light, the through holes 33 are formed.IntegrallyThen, the via-hole conductors 16 and 17 are formed by filling the through holes 33 with a conductive paste.LinearlyIt is formed.
[0055]
Next, the main pressing step S5 of the green laminate shown in FIG. 2 is performed. That is, the mother green laminate 31 shown in FIG. 3B is pressed in the stacking direction. This press step S5 is performed in order to completely press the ceramic green sheet 32 and increase the filling rate of the conductive paste in the through hole 33, that is, to eliminate the gap in the green laminate 31. Is. For this reason, in the main pressing step S5, a pressure higher than the pressure in the temporary pressing step S3 is applied, for example, 60 MPa or more, preferably about 60 to 130 MPa.
[0056]
Note that if the pressure in the pressing step S5 is insufficient, for example, about 20 MPa, the shrinkage that occurs during drying of the conductive paste film 34 (see FIG. 3 (3)) to be the external electrodes 22 and 23 described later. Therefore, the green laminated body 31 may be deformed in the main surface direction, and the green laminated body 31 may exhibit a contraction rate of about 0.1% at the maximum, for example. Thus, when relatively large shrinkage is brought about in the green laminated body 31, a large number of chip-like green laminated bodies 31a obtained by performing the green laminated body cutting step S8 described later (see FIG. 3 (5)). ) About half of the total number may be defective.
[0057]
  Next, step S6 of forming a conductive paste film for the external electrode shown in FIG. 2 is performed. That is, as shown in FIG. 3 (3), in order to form the external electrodes 22 and 23 connected to the via-hole conductors 16 and 17 on the main surfaces 35 and 36 of the green laminate 31, respectively, The conductive paste film 34 isSo as to cover the end faces of the via-hole conductors 16 and 17Formed and then dried. The conductive paste film 34 is positioned so as to face the gaps 18 and 19 formed between the internal electrodes 14 and 15 and the via-hole conductors 17 and 16, respectively.
[0058]
This conductive paste film forming step S6 is performed on the green laminate 31 whose density has been increased by finishing the pressing step S5, so that the penetration of the solvent contained in the conductive paste film 34 is performed. The green laminate 31 can be prevented from swelling and the green laminate 31 from being deformed during drying.
[0059]
Since the green laminated body 31 shown in FIG. 3 (3) is in a mother state, the conductive paste film 34 has a strip-like pattern extending relatively long in the direction perpendicular to the paper surface of FIG. 3 (3). Have.
[0060]
Next, the pressing step S7 of the green laminate and the conductive paste film shown in FIG. 2 is performed. That is, the green laminate 31 and the conductive paste film 34 are pressed in the lamination direction. In this pressing step S7, it is sufficient to apply a relatively low pressure of, for example, about 15 MPa.
[0061]
As a result of this pressing, as shown in FIG. 3 (4), at least a part of the conductive paste film 34 in the thickness direction is embedded in the green laminate 31, and the main surfaces 35 and 36 of the green laminate 31 are formed. A recess 37 for receiving the conductive paste film 34 is formed. Here, it should be noted that the conductive paste film 34 is positioned so as to face the gaps 18 and 19 as described above. According to this configuration, it is easy to form the recess 37 that receives the conductive paste film 34 deeper.
[0062]
By this pressing step S7, the adhesiveness of the conductive paste film 34 to the green laminate 31 is improved, and the adhesiveness to the via-hole conductors 16 and 17 is also improved.
[0063]
Next, the green laminated body cutting step S8 shown in FIG. 2 is performed. The process up to the above-described pressing step S7 of the green laminate and the conductive paste film is performed on the green laminate 31 in the mother state, as shown in FIGS.
In FIG. 3, a cut line 38 is illustrated by a one-dot chain line in the green laminate 31 in the mother state. In this cutting step S8, in order to obtain a chip-like green laminate 31a for each multilayer ceramic capacitor 11, the mother green laminate 31 is cut. The chip-shaped green laminated body 31a after cutting is shown in FIG.
[0064]
Next, the firing step S9 shown in FIG. 2 is performed. That is, the chip-like green laminate 31a is fired. At this time, not only the ceramic green sheet is sintered, but also the conductive paste for forming the internal electrodes 14 and 15 and the via-hole conductors 16 and 17 is sintered, and further the conductive paste that becomes the external electrodes 22 and 23 The film 34 is also sintered at the same time.
[0065]
As described above, the multilayer ceramic capacitor 11 shown in FIG. 1 is obtained. In this multilayer ceramic capacitor 11, the concave portion 37 that received the conductive paste film 31 becomes the concave portions 24 and 25, and the first and second external electrodes 22 and 23 are received therein. Yes.
[0066]
In carrying out such a manufacturing method, as described above, the green laminate 31 is fixed to the pressure-sensitive adhesive sheet, and in that state, the cutting process S8 is performed and the firing process S9 is performed. Even when the green laminated body 31a is peeled off, the pressing step S7 of the green laminated body and the conductive paste film is performed, so that the adhesiveness between the conductive paste film 34 and the green laminated body 31 or 31a is high. Therefore, the problem that a part of the conductive paste film 34 is taken away to the pressure-sensitive adhesive sheet side can be made difficult to occur.
[0067]
Further, as described above, when the adhesion of the conductive paste film 34 to the green laminate 31 or 31a is improved by the pressing step S7 of the green laminate and the conductive paste film, the conductive paste film 34 includes the conductive paste film 34. Since a part of the conductive metal powder to be eaten into the surface of the green laminate 31 or 31a, the adhesion of the sintered external electrodes 22 and 23 to the laminate 12 can also be increased.
[0068]
The multilayer ceramic capacitor 11 obtained as described above is then subjected to chamfering treatment by barrel polishing, if necessary, and then subjected to, for example, nickel plating and tin plating, so that the external A plating film is formed on the electrodes 22 and 23.
[0069]
Although the present invention has been described above with reference to the illustrated multilayer ceramic capacitor 11, various other modifications are possible within the scope of the present invention.
[0071]
  For exampleAs long as the present invention has a structure in which the internal electrode and the via-hole conductor are connected and the external electrode is connected to the via-hole conductor, other multilayer ceramic capacitors such as multilayer ceramic capacitors or multilayer ceramic substrates having other structures It can also be applied to electronic components.
[0072]
Next, experimental examples carried out to confirm the effects of the present invention will be described.
[0073]
(Experimental example 1)
Experimental Example 1 was carried out in order to confirm the effect of improving the external electrode fixing force according to the present invention.
[0074]
As Example 1 within the scope of the present invention, steps S1 to S9 shown in FIG. 2 are performed to obtain each intermediate structure as shown in FIG. 3, while having a structure as shown in FIG. A type ceramic capacitor was obtained.
[0075]
Here, as the ceramic green sheet, BaTiO_ThreeThe thing of 3 micrometers thickness containing a system ceramic was used. The conductive paste for forming the internal electrode and the via-hole conductor and the conductive paste constituting the conductive paste film to be the external electrode were those containing nickel as a conductive component.
[0076]
Further, in the ceramic green sheet laminating step S2, 400 ceramic green sheets on which internal electrodes are formed are laminated, and in the green laminate temporary pressing step S3, a pressure of about 15 MPa is applied, and the green laminated body after the temporary pressing is performed. The thickness was 1.3 mm.
[0077]
In the via hole conductor forming step S4, the through hole was formed by laser processing.
[0078]
Moreover, in this press process S5 of a green laminated body, the pressure of about 60 MPa was provided.
[0079]
In the conductive paste film forming step S6 for the external electrode, the conductive paste film was formed so as to have a thickness of 20 μm after drying.
[0080]
In the pressing step S7 of the green laminate and the conductive paste film, a pressure of about 15 MPa was applied.
[0081]
In the green laminated body cutting step S8, a chip-like green laminated body having a plane dimension of 2.0 mm × 1.2 mm was cut out.
[0082]
In the firing step S9, firing was performed at a temperature of 1300 ° C. in a reducing atmosphere.
[0083]
Further, the laminated ceramic capacitor after firing is subjected to chamfering treatment by wet barrel polishing, and then subjected to nickel plating and tin plating to form a plating film having a total thickness of 5 μm on the external electrode. A multilayer ceramic capacitor was obtained.
[0084]
On the other hand, as Comparative Example 1, a sample stack was obtained by the same method as in Example 1 except that the pressing step S7 of the green laminate and the conductive paste film shown in FIG. A type ceramic capacitor was obtained.
[0085]
Regarding the multilayer ceramic capacitors according to the samples thus obtained, when the adhesion force of the external electrode was evaluated by a shear test, the adhesion force of 0.82 kg was obtained in Example 1, whereas the comparative example In No. 1, only a fixing force of 0.51 kg was obtained. From this, in Example 1, it turns out that the effect by having implemented press process S7 of a green laminated body and a conductive paste film has appeared.
[0086]
(Experimental example 2)
Experimental Example 2 was carried out in order to confirm the effect of reducing the height according to the present invention.
[0087]
As Example 2 within the scope of the present invention, 70 ceramic green sheets on which internal electrodes were formed were laminated in the ceramic green sheet lamination step S2 as compared to Example 1 in Experimental Example 1. As a result of the temporary pressing step S3 of the green laminate, a green laminate having a thickness of 0.3 mm was obtained, and in the cutting step S8 of the green laminate, a chip-like green having a planar dimension of 1.6 mm × 0.8 mm A multilayer ceramic capacitor as a sample was obtained by the same method as in Example 1 in Experimental Example 1 except that the multilayer body was cut out.
[0088]
On the other hand, as Comparative Example 2, as compared with Example 2 above, except that the pressing step S7 of the green laminate and the conductive paste film was not performed, the same method as in Example 2, A multilayer ceramic capacitor as a sample was obtained.
[0089]
With respect to the multilayer ceramic capacitors according to these samples, the thickness direction dimension of the multilayer body was measured. As a result, each of Example 2 and Comparative Example 2 was 240 μm, but the overall thickness direction dimension including the external electrodes Was 250 μm in Example 2, whereas it was 280 μm in Comparative Example 2.
[0090]
From this, it can be seen that Example 2 can be made thinner than Comparative Example 2.
[0091]
When the external electrode fixing force was evaluated by the same shear test as in Experimental Example 1, the same result as in Experimental Example 1 was obtained.
[0092]
【The invention's effect】
As described above, according to the method for manufacturing a multilayer ceramic electronic component according to the present invention, after pressing a green laminated body including a plurality of laminated ceramic green sheets, internal electrodes, and via-hole conductors in a laminating direction, In order to form an external electrode connected to the conductor, a conductive paste film made of a conductive paste is formed and dried, and thereafter, the green laminate and the conductive paste film are pressed in the stacking direction. As a result, the adhesion of the conductive paste film serving as the external electrode to the green laminate can be increased.
[0093]
Therefore, in the middle of manufacturing, for example, the adhesive sheet is deprived of the conductive paste film to be a part of the external electrode, and the external electrode is less likely to be inconvenienced. It is possible to increase the fixing force of the laminated body.
[0094]
In addition, according to the method for manufacturing a multilayer ceramic electronic component according to the present invention, the green molded body in which the via hole conductor has already been formed is pressed in the stacking direction, so the filling rate of the conductive paste in the via hole conductor can be increased. After that, the conductive paste film for forming the external electrode is formed, and the green laminate and the conductive paste film are pressed again in the stacking direction. In the multilayer ceramic electronic component, the reliability of electrical conduction of the via-hole conductor itself can be enhanced, and the reliability of electrical connection between the via-hole conductor and the external electrode can be enhanced.
[0095]
Further, in the multilayer ceramic electronic component obtained by the manufacturing method according to the present invention, the concave portion is formed on the main surface of the multilayer body, and at least a part of the external electrode in the thickness direction is located in the concave portion. A structure can be obtained.
[0096]
Therefore, the thickness of the entire multilayer ceramic electronic component can be reduced. Further, when the overall thickness is the same as that of the multilayer ceramic electronic component in which the external electrode is not located in the recess, the thickness of the laminate is increased or the thickness of the external electrode is increased. You can do it. Therefore, it is easier to increase the number of layers of the laminate, and it is possible to improve the reliability of electrical connection to the external electrode during mounting.
[0097]
  According to this inventionObtained by the manufacturing methodWhen the multilayer ceramic electronic component constitutes a multilayer ceramic capacitor and the external electrode is positioned so as to face the gap formed between the internal electrode and the via-hole conductor, In the pressing step with the conductive paste film, it becomes easy to form a deeper recess for receiving the external electrode. Therefore, the state where the external electrode is embedded in the laminate can be obtained more easily.
[Brief description of the drawings]
FIG. 1 shows an embodiment of the present invention.Manufactured by applying the manufacturing method1 is a cross-sectional view schematically showing a multilayer ceramic capacitor 11 as a multilayer ceramic electronic component.
FIG. 2 is a flowchart showing typical steps performed in the method of manufacturing the multilayer ceramic capacitor 11 shown in FIG.
3 is a cross-sectional view showing a typical structure obtained in the middle of the manufacturing method shown in FIG. 2 in the order of steps.
FIG. 4 is a cross-sectional view schematically showing a conventional multilayer ceramic capacitor 1 of interest to the present invention.
[Explanation of symbols]
11 Multilayer ceramic capacitor
12 Laminate
13 Dielectric ceramic layer
14,15 Internal electrode
16, 17 Via hole conductor
18, 19 gap
20, 21, 35, 36 Main surface
22, 23 External electrode
24, 25, 37 recess
31 Green laminate in mother state
31a Chip-shaped green laminate
32 ceramic green sheet
33 Through hole
34 Conductive paste film
38 cut lines

Claims (2)

A plurality of laminated ceramic green sheets, an internal electrode extending along a specific interface between the ceramic green sheets, connected to the specific internal electrode, reaching from one main surface to the other main surface, and Producing a green laminate including a via-hole conductor extending linearly along the lamination direction of the ceramic green sheets so as to penetrate all the ceramic green sheets;
After the first step, the second step of pressing the green laminate in the stacking direction;
After the second step, a plurality of external electrodes connected to the via-hole conductor are formed on both main surfaces of the green laminate so as to cover each end face of the via-hole conductor. Forming and drying a conductive paste film made of a conductive paste; and
A fourth step of pressing the green laminate and the conductive paste film in the laminating direction after the third step;
A fifth step of firing the green laminate after the fourth step;
In the first step, a through hole filled with a conductive paste for forming the via-hole conductor is integrally formed so as to penetrate the green laminate,
In the fourth step, a concave portion for positioning at least a part of the thickness direction of the conductive paste film is formed on each main surface of the green laminate.
Manufacturing method of multilayer ceramic electronic component. The first step to the fourth step are performed on a mother green laminate that can provide a plurality of green laminates for obtaining a plurality of multilayer ceramic electronic components. The method further comprises a step of cutting the green laminate in a mother state in order to obtain the chip-like green laminate for each multilayer ceramic electronic component between the step and the fifth step. A method for producing a multilayer ceramic electronic component according to claim 1 .

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