JP4696410B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

【００３１】
（表１）に示すように、本発明の方法では完成品外観、内部構造の検査で構造欠陥不良が発生しておらず、比較例と比べて良好な結果が得られていることがわかる。
【００３２】
以上のように、本実施の形態の積層セラミック電子部品の製造方法を用いることにより、セラミックグリーンシートと導電体層の接着を確実に行うことができ、ヒビやデラミネーション等の構造欠陥不良の少ない積層セラミック電子部品を得ることができた。
【００３３】
なお、本実施の形態では積層セラミックコンデンサの製造方法を例に説明したが、積層構造を有する積層バリスタ、積層コイル及び多層基板等のセラミック電子部品の製造方法にも本発明を適用することができるものである。
【００３４】
【発明の効果】
以上のように本発明は、第１のキャリアフィルムからセラミックグリーンシートを引き剥がし、この前記セラミックグリーンシートの前記第１のキャリアフィルムに接していた面が前記導電体層と接着するように第２のキャリアフィルム上の導電体層上に貼り合わせることにより、第２のキャリアフィルム上に導電体層付きセラミックグリーンシートを得るセラミック電子部品の製造方法であり、セラミックグリーンシートと導電体層の接着を容易にかつ確実に行うことができるため、ヒビやデラミネーション等の構造欠陥不良を低減し電気特性が良好で信頼性の優れた積層セラミック電子部品を得ることができるという優れた効果を奏するものである。
【図面の簡単な説明】
【図１】 本発明の実施の形態における積層セラミック電子部品を製造する積層工程図
【図２】 同実施の形態における積層工程の第１工程を示す説明図
【図３】 同実施の形態における積層工程の第２工程を示す説明図
【図４】 同実施の形態における積層工程の第３工程を示す説明図
【図５】 同実施の形態における導電体層付きセラミックグリーンシートの平面図
【図６】 同実施の形態における積層工程の第４工程を示す説明図
【図７】 積層セラミック電子部品の断面図
【図８】 従来例におけるセラミックグリーンシートと導電体層とを貼り合わせる工程を示す図
【符号の説明】
１ 第１のキャリアフィルム
２ セラミックグリーンシート
３ 第２のキャリアフィルム
４ 導電体層
５ 第１のローラ
６，７ 一対のローラ
８ 導電体層付きセラミックグリーンシート
９ 無効層
１０ グリーンブロック
１１ 積層セラミックコンデンサ
１２ 積層体
１３ 誘電体セラミック層
１４ 内部電極層
１５ 外部電極
１６ 無効層
１７ 支持台[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer ceramic electronic component used in an electronic device or the like.
[0002]
[Prior art]
As a conventional method for manufacturing a multilayer ceramic electronic component, a multilayer ceramic capacitor described in JP-A-7-263271 is known. FIG. 7 is a cross-sectional view of the multilayer ceramic capacitor, and FIG. 8 is a diagram illustrating a process of bonding a ceramic green sheet for manufacturing the multilayer ceramic capacitor and a conductor layer.
[0003]
7 and 8, 11 is a multilayer ceramic capacitor, in which dielectric ceramic layers 13 formed using ceramic green sheets 24 and internal electrode layers 14 formed using conductor layers 26 are alternately stacked, A layered body 12 is formed by stacking an ineffective layer 16 on the upper and lower stages, and external electrodes 15 are formed on both end faces of the layered body 12 and connected to the internal electrode layer 14.
[0004]
A method for manufacturing the multilayer ceramic capacitor 11 configured as described above will be described below.
[0005]
In FIG. 8, 21 and 22 are a pair of rollers that rotate in the A and B directions. Between the rollers 21 and 22, the ceramic green sheet 24 and the second carrier film 25 formed on the first carrier film 23. A step of pressing the ceramic green sheet 24 and the conductor layer 26 by passing the formed conductor layer 26 so as to overlap is constituted.
[0006]
First, a dielectric material powder such as barium titanate is kneaded by adding a resin binder such as polyvinyl butyral, a plasticizer such as phthalate ester, a solvent such as butyl acetate, etc., and then using a doctor blade method or the like. Then, the slurry is applied to the upper surface of the first carrier film 23 made of polyethylene terephthalate and dried to produce the ceramic green sheet 24. Next, a conductive paste mainly composed of a conductive metal is screen printed on the upper surface of the second carrier film 25 such as polyethylene terephthalate to form the conductor layer 26 having a predetermined shape.
[0007]
Next, the ceramic green sheet 24 on the upper surface of the first carrier film 23 and the conductor layer 26 on the upper surface of the second carrier film 25 are overlaid and heated and pressure bonded, and then the first carrier film 23 is peeled off. Then, the ceramic green sheet 24 with the conductor layer 26 is obtained on the upper surface of the second carrier film 25. Next, the ceramic green sheet 24 with the conductor layer 26 obtained here is laminated a plurality of times by a hot press, cut into desired dimensions and fired to form a laminate 12, and both sides of the laminate 12 are formed. The external electrode 15 is formed by applying and baking an electrode paste.
[0008]
[Problems to be solved by the invention]
However, in the conventional method for manufacturing a multilayer ceramic electronic component, in the step of pressing the ceramic green sheet 24 and the conductor layer 26, the dried surface of the ceramic green sheet 24 and the dried surface of the conductor layer 26 are used. Since this is a configuration in which the two are stacked and pressed together, a sufficient adhesion state cannot be obtained at the crimped portion. This is because the dry surfaces of the ceramic green sheet 24 and the conductor layer 26 have poor adhesion, and in the laminate 12 obtained by this manufacturing method, the gap between the ceramic green sheet 24 and the conductor layer 26 is obtained. In this case, sufficient adhesion cannot be obtained, and structural defects such as cracks and delamination are generated in the fired laminated body 12, which impairs the electrical characteristics of the laminated ceramic capacitor 11.
[0009]
The present invention solves the above-mentioned conventional problems, and prevents the occurrence of structural defects and the like in a laminate obtained by firing, stabilizes electrical characteristics, and provides a highly reliable multilayer ceramic electronic component manufacturing method. Is to provide.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
[0011]
In the invention described in claim 1 of the present invention, in particular, a first step of forming a ceramic green sheet on the first carrier film and a conductor layer serving as an internal electrode are formed on the second carrier film. The second step, the ceramic green sheet is peeled from the first carrier film, and the surface of the ceramic green sheet from which the first carrier film has been peeled is overlapped with the conductor layer on the second carrier film. A third step of forming a ceramic green sheet with a conductor layer by bonding together, and a ceramic green sheet with a conductor layer formed through the third step is disposed on the ineffective layer so that the ceramic green sheet surface is in contact with the third step And repeatedly peeling the carrier film after heating and pressurizing from the carrier film side to form a plurality of conductive layers It has a fourth step of forming a laminate by laminating the ceramic green sheets can, stack the width of the conductor layer in the second step is larger than the width dimension of the ceramic green sheet in the first step This is a method for manufacturing a ceramic electronic component, which prevents adhesion failure that tends to occur at the edge of the ceramic green sheet in the width direction, further prevents structural defects such as delamination and adhesion, There is an effect that a multilayer ceramic electronic component having a small capacitance variation and stable electrical characteristics can be manufactured.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
A multilayer ceramic capacitor is taken as an example of the multilayer electronic ceramic component, and the invention described in claim 1 of the present invention will be described below using an embodiment.
[0013]
FIG. 1 is a lamination process diagram for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention. FIGS. 2, 3, 4, and 6 are a first process, a second process, and a lamination process, respectively, according to the embodiment. Explanatory drawing which shows a 3rd process and a 4th process, FIG. 5 is a top view of the ceramic green sheet with a conductor layer in the same embodiment. Note that the configuration of the multilayer ceramic capacitor in this embodiment is the same as that in FIG. 7 showing the conventional example, and a detailed description thereof is omitted here.
[0014]
In FIG. 1, 1 is a first carrier film, 2 is a ceramic green sheet formed on the upper surface of the carrier film 1, 3 is a second carrier film, and 4 is an upper surface of the second carrier film 3. The conductive layer 5 is a first roller, and 6 and 7 are a pair of rollers, which rotate in the L, M, and N directions, respectively.
[0015]
Hereinafter, a method for manufacturing a multilayer ceramic capacitor according to an embodiment of the present invention will be described with reference to FIGS.
[0016]
First, as a first step, a dielectric material powder such as barium titanate is mixed with polyvinyl butyral as a binder component, phthalate ester as a plasticizer component, butyl acetate as a solvent component, and mixed to produce a slurry. As shown, the slurry was applied to the upper surface of the first carrier film 1 made of polyethylene terephthalate using a doctor blade method and dried to prepare a ceramic green sheet 2 having a thickness of 9 μm.
[0017]
Next, as a second step, as shown in FIG. 3, a plurality of conductor layers 4 having a thickness of 2.5 μm are formed on the upper surface of the second carrier film 3 using a conductive paste mainly composed of nickel. Printed in parallel and dried. At this time, the carrier film 3 having a width wider than that of the ceramic green sheet 2 was formed so that the formation range of the conductor layer 4 in the width direction was wider than the width of the ceramic green sheet 2.
[0018]
Next, as shown in FIGS. 1, 4, and 5 as a third step, the ceramic green sheet 2 is peeled off from the carrier film 1 with the first roller 5, and at the same time, the surface of the peeled ceramic green sheet 2 A ceramic green sheet 8 with a conductor layer was prepared by placing the conductor layer 4 in contact with each other and passing between a pair of rollers 6 and 7 having a heating and pressurizing mechanism. . At this time, the ceramic green sheet 2 was peeled off and pasted onto the conductor layer 4 at a constant speed S, so that the tension applied to the ceramic green sheet 2 was kept constant.
[0019]
The heating temperature of the pair of rollers 6 and 7 is 40 ° C. which is lower than the softening point temperature of polyvinyl butyral which is a binder component contained in the ceramic green sheet 2, and the pressure applied between the rollers 6 and 7 is 100 kPa. did.
[0020]
Here, after the dielectric ceramic slurry is formed on the carrier film 1, the ceramic green sheet 2 peeled from the carrier film 1 is disposed so as to be in contact with the conductor layer 4 and bonded. After drying, the binder component in the dielectric ceramic slurry moves a lot in the direction of the carrier film 1, and in the ceramic green sheet 2 after drying, the surface in contact with the carrier film 1 is compared with the other dry surface. More than the binder component, and after the formation of the ceramic green sheet 2, the volatilization of the plasticizer component is promoted on the dry surface exposed to the atmosphere, compared with the surface in contact with the carrier film 1 Therefore, the ceramic green sheet 2 peeled off from the carrier film 1 is a carrier because there is little plasticizer component. Release surface from the film 1 is more excellent in adhesion. Therefore, the ceramic green sheet 2 and the conductor layer 4 can be securely bonded by bonding the surface of the ceramic green sheet 2 that is in contact with the carrier film 1 to the upper surface of the conductor layer 4.
[0021]
When the ceramic green sheet 2 is bonded to the conductor layer 4 on the carrier film 3, the surface where the conductor layer 4 is not formed and the carrier film 3 is exposed is the same as the ceramic green sheet. Therefore, the ceramic green sheet 2 may turn over from the end in the width direction of the ceramic green sheet 2 or may be broken and fall off. Therefore, by making the formation range of the conductor layer 4 on the carrier film 3 wider than the width of the ceramic green sheet 2, it is possible to prevent adhesion failure at the end in the width direction of the ceramic green sheet 2, A combination can be obtained.
[0022]
Further, when the ceramic green sheet 2 is peeled from the carrier film 1, the ceramic green sheet 2 is bonded while holding the peeling speed constant and holding the tension applied to the ceramic green sheet 2 constant. Thus, the thickness variation of the ceramic green sheet 2 can be further reduced, and a laminate with less pinholes and distortion can be obtained.
[0023]
Furthermore, by performing the bonding at a temperature lower than the softening point temperature of the organic matter contained in the ceramic green sheet 2, it is possible to suppress the compression of the ceramic green sheet 2 during the bonding. If the ceramic green sheet 2 is compressed in the third step, the compressibility of the ceramic green sheet 2 at the time of transfer lamination in the fourth step is inferior, and this is due to the accumulated level difference in the plane direction due to the presence of the conductor layer 4. It is possible to prevent difficulty in securing adhesiveness between the ceramic green sheets 2 and to reduce structural defect defects such as cracks after firing.
[0024]
Next, as shown in FIG. 6, as a fourth step, first, 10 ceramic green sheets 2 are heated and laminated on the support base 17 to produce a block of the ineffective layer 9. The ceramic green sheet 8 with a conductor layer is stacked with the carrier film 3 as an upper surface, and the carrier film 3 is peeled after being thermocompression-bonded from the upper surface of the carrier film 3 at a temperature of 85 ° C. and a pressure of 12 MPa.
[0025]
Next, a ceramic green sheet 8 with a second conductor layer is stacked on the carrier film 3 as an upper surface, followed by thermocompression bonding. Subsequently, the ceramic green sheets 8 with the conductor layer are sequentially laminated in this way, and after 100 layers are heat-pressed, a block of the ineffective layer 9 is further laminated on the upper surface, and the green block 10 is manufactured by heat-pressure bonding. .
[0026]
Then, each green block was cut | disconnected to the predetermined shape dimension, and the green chip was produced. Each of the obtained green chips has a structure in which one end portion of the conductor layer 4 is alternately exposed on opposite end surfaces of the ceramic green sheet 2 between both end surfaces in the longitudinal direction. .
[0027]
Next, each green chip was debindered at a temperature of 350 ° C. in the atmosphere, and then fired at a temperature of 1300 ° C. in a reducing atmosphere made of green gas to produce a laminate.
[0028]
Next, the paste of the external electrode 15 mainly composed of copper is applied and baked so as to be electrically connected to the end portions of the internal electrode layer 14 exposed at both end faces of the multilayer body, and the multilayer ceramic capacitor shown in FIG. Completed.
[0029]
Next, as described above, the multilayer ceramic capacitor formed by the manufacturing method of the multilayer ceramic electronic component according to the embodiment of the present invention and the multilayer ceramic capacitor formed by the conventional manufacturing method are free from structural defects such as cracks and delamination. The incidences are compared and shown in (Table 1). Here, the appearance of 1000 finished multilayer ceramic electronic components was inspected by microscopic observation to count the number of appearance structural defects, and the internal structure was inspected by microscopic observation of the internal cross section of 100 multilayer ceramic electronic components. The number of occurrences of defects was counted to indicate this occurrence rate.
[0030]
[Table 1]

[0031]
As shown in Table 1, it can be seen that in the method of the present invention, structural defect defects did not occur in the inspection of the appearance of the finished product and the internal structure, and favorable results were obtained as compared with the comparative example.
[0032]
As described above, by using the method for manufacturing a multilayer ceramic electronic component according to the present embodiment, the ceramic green sheet and the conductor layer can be securely bonded, and there are few structural defect defects such as cracks and delamination. A multilayer ceramic electronic component could be obtained.
[0033]
In the present embodiment, the method for manufacturing a multilayer ceramic capacitor has been described as an example. However, the present invention can also be applied to a method for manufacturing a ceramic electronic component such as a multilayer varistor having a multilayer structure, a multilayer coil, and a multilayer substrate. Is.
[0034]
【The invention's effect】
As described above, according to the present invention, the ceramic green sheet is peeled off from the first carrier film, and the surface of the ceramic green sheet that is in contact with the first carrier film is bonded to the conductor layer. A ceramic green sheet having a conductor layer on a second carrier film by bonding to a conductor layer on the carrier film of the ceramic film, wherein the ceramic green sheet and the conductor layer are bonded to each other. Since it can be carried out easily and reliably, it has the excellent effect of reducing the structural defects such as cracks and delamination and obtaining a multilayer ceramic electronic component having good electrical characteristics and excellent reliability. is there.
[Brief description of the drawings]
FIG. 1 is a lamination process diagram for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention. FIG. 2 is an explanatory diagram showing a first process of the lamination process according to the embodiment. Explanatory drawing which shows the 2nd process of a process [FIG. 4] Explanatory drawing which shows the 3rd process of the lamination | stacking process in the same embodiment [FIG. 5] The top view of the ceramic green sheet with a conductor layer in the same embodiment [FIG. FIG. 7 is an explanatory view showing the fourth step of the lamination step in the same embodiment. FIG. 7 is a sectional view of the laminated ceramic electronic component. FIG. 8 is a view showing the step of bonding the ceramic green sheet and the conductor layer in the conventional example. Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 1st carrier film 2 Ceramic green sheet 3 2nd carrier film 4 Conductor layer 5 1st roller 6,7 A pair of roller 8 Ceramic green sheet with a conductor layer 9 Invalid layer 10 Green block 11 Multilayer ceramic capacitor 12 Laminated body 13 Dielectric ceramic layer 14 Internal electrode layer 15 External electrode 16 Invalid layer 17 Support base

Claims (1)

A first step of forming a ceramic green sheet on the first carrier film, a second step of forming a conductor layer serving as an internal electrode on the second carrier film, and a ceramic from the first carrier film The green sheet is peeled off, and the surface of the ceramic green sheet from which the first carrier film is peeled and the conductor layer on the second carrier film are stacked and bonded together to form a ceramic green sheet with a conductor layer. The ceramic green sheet with the conductor layer formed through the third step and the third step is disposed on the ineffective layer so that the ceramic green sheet surface is in contact with the carrier, and is heated and pressed from the carrier film side to be bonded after being pressed. Repeatedly peeling off the film, laminating multiple ceramic green sheets with conductive layers Fourth a step possess, the second multilayer ceramic electronic component of the width of the conductor layer in the step is larger than the width of the ceramic green sheet in the first step of forming a lamina Manufacturing method.

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