JP3196713B2 - Manufacturing method of ceramic electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component such as a multilayer ceramic capacitor.

[0002]

2. Description of the Related Art FIG. 4 is a cutaway perspective view showing a part of a general multilayer ceramic capacitor as an example of a ceramic electronic component as a background of the technology relating to the present invention. In FIG. 4, 1 is a ceramic dielectric layer, 2 is an internal electrode, 3 is an external electrode, and the internal electrode 2 is connected to each external electrode 3.

Hereinafter, a method for manufacturing a conventional multilayer ceramic capacitor will be described. First, the ceramic dielectric layer 1
The ceramic sheet becomes a dielectric material such as barium titanate and a binder component such as polyvinyl butyral,
A plasticizer component such as benzyl butyl phthalate and a solvent component are mixed and slurried, and then formed on a support such as PET using a doctor blade method. Usually, the thickness of the dried ceramic sheet is about 5 to 50 μm.

Next, a plurality of conductor layers are formed on a support such as a polyethylene terephthalate film (hereinafter referred to as a PET film) by a printing method using a conductor paste to be the internal electrode 2 such as palladium or nickel, and dried. .
When the thickness of the conductor layer is small, the conductor layer becomes discontinuous due to sintering shrinkage during firing and may cause a decrease in capacitance. Then PET
Conductive layers and ceramic sheets formed on the film are alternately stacked by thermal transfer to obtain a laminate. The laminate was cut into a desired size, fired, and provided with external electrodes 3 on both end faces (for example, see Japanese Patent Publication No. 25381/1993).

[0005]

However, when the conductive layer formed on the support is thermally transferred onto the ceramic sheet, the conductive layer may not be completely transferred and transferred from the support onto the ceramic sheet. is there. In this case, after firing, the internal electrodes 2 are in a discontinuous state, resulting in a failure of quality as a multilayer ceramic capacitor such that sufficient capacitance cannot be obtained or variation occurs.

Accordingly, an object of the present invention is to provide a ceramic electronic component having stable electrical characteristics by completely transferring and transferring a conductive layer from a support onto a ceramic sheet.

[0007]

To achieve this object, a method for manufacturing a ceramic electronic component according to the present invention comprises the steps of: preparing a ceramic sheet comprising a ceramic component and at least one or more organic substances; Forming a conductive layer made of a metal component and at least one or more organic substances via a release layer, transferring the conductive layer onto the ceramic sheet, and further forming the ceramic sheet and the multiple rotating copy a conductor layer alternately, possess obtaining a laminate, and a step of firing the laminated body, contained in the conductive layer
The organic matter is an organic matter contained in the ceramic sheet.
Characterized in that at least one kind is the same
And than, releasability from the support is improved over conventional, completely transferred onto the ceramic sheet a conductor layer from the support,
The transition can be made, and the above object can be achieved.

[0008]

The invention according to claim 1 of the embodiment of the present invention includes the steps of preparing a ceramic sheet made of at least one or more organic material and ceramic component, a metal component via a release layer on a support Forming a conductor layer made of at least one or more organic substances, transferring the conductor layer onto the ceramic sheet, and alternately rotating the ceramic sheet and the conductor layer a plurality of times on the ceramic sheet. copy, obtaining a laminate, and a step of firing the laminate possess, the conductive
Organic substances contained in the body layer are contained in the ceramic sheet.
A method for manufacturing a ceramic electronic component in which at least one kind is the same as an organic substance contained therein , wherein a conductive layer is formed on a support via a release layer , and the conductive layer
At least one of the organic substances contained in the
To be the same as the organic substance contained in Kushito, conductive
The adhesion between the body layer and the ceramic sheet is improved,
The transfer to the ceramic sheet becomes easier, the releasability from the support is improved compared to the conventional type, and the conductive layer can be completely transferred and transferred from the support to the ceramic sheet, resulting in stable electrical characteristics Can be obtained.

[0009]

[0010]

According to a second aspect of the present invention, there is provided the method for manufacturing a ceramic electronic component according to the first aspect, wherein the size of the release layer is made larger than that of the ceramic sheet. When transferring onto a sheet, adhesion between the ceramic sheet and the support can be prevented, and peeling between the ceramic sheets can be suppressed.

[0012]

An embodiment of the present invention will be described below with reference to the drawings, taking a multilayer ceramic capacitor as an example.

(Embodiment 1) FIG. 1 shows a conductive layer 14 formed on a base film 12 as a support such as a PET film via a release layer 13 in the present embodiment.
FIG.

FIG. 2 is a sectional view showing the ceramic sheet 11 formed on the base film 12.

FIG. 3 is a process diagram showing a lamination process. After transferring the plurality of ceramic sheets 11 onto the support 15, the conductor layer 14 formed on the base film 12 via the release layer 13 is transferred onto the ceramic sheet 11.

FIG. 4 is a cutaway perspective view of a multilayer ceramic capacitor shown as an example of a ceramic electronic component.
1 is a ceramic dielectric layer, 2 is an internal electrode, 3 is an external electrode, and the internal electrode 2 is connected to each external electrode 3.

Next, a method of manufacturing a multilayer ceramic capacitor using nickel as the internal electrode 2 will be described.

First, a dielectric material such as barium titanate;
After mixing a polyvinyl butyral-based binder component, dibutyl phthalate as a plasticizer component, and butyl acetate as a solvent component to form a slurry, a ceramic sheet 11 is formed on the base film 12 shown in FIG. 2 using a doctor blade method. . On the other hand, as shown in FIG.
Is prepared, and a nickel paste is formed on the release layer 13 as a conductor layer 14 to be the internal electrode 2 in a predetermined pattern by screen printing or gravure printing, or the like. dry. The nickel paste contains an organic binder component in addition to the nickel powder and the solvent. It is common to use aliphatic naphtha, aromatic naphtha, terpineol as a solvent, and ethyl cellulose as an organic binder component. Most of the organic solvent is scattered in the dried nickel paste, leaving only the metal component and the organic binder component. Next, the laminating step will be described with reference to FIG. First, after laminating a plurality of ceramic sheets 11 on the support 15, the conductor layer 14 is transferred onto the ceramic sheet 11 by pressing and heating from the side where the conductor layer is formed. Next, the ceramic sheet 11 and the conductor layer 14 are alternately transferred a desired number of times, and a plurality of ceramic sheets 11 are stacked thereon to obtain a laminate before cutting. The transfer of the conductor layer 14 means that the organic components in the conductor layer 14 and the ceramic sheet are slightly softened by heating, the contact area between the two is increased by pressurization, and the adhesion between the two is induced. 13 to promote separation. When a general ethylcellulose-based organic binder is used as an organic binder contained in the nickel paste, the organic binder may be 60 ° C to 140 ° C.
° C., it is possible to perform efficient transcription under conditions of ^{50kg / cm 2 ~150kg / cm 2} . When the temperature is lower than 60 ° C., sufficient softening of the organic component cannot be expected.
The base film 12 such as a film is deteriorated.
Furthermore, mixing the same organic component as that contained in the ceramic sheet 11 into the conductor layer 14 can increase the adhesive force between the conductor layer 14 and the ceramic sheet 11, so that the conductor layer 14 Can be easily transferred. As described above, the present invention is carried out by using a metal paste such as a nickel paste, and the metal paste exhibits an effect only when it is composed of a metal component and an organic component. However, when manufacturing a high-laminated product, heat during transfer accumulates inside the laminated body, and the ceramic sheet 11 is stretched to induce softening of the organic component, which may prevent the lamination from being performed accurately. is there.
Therefore, it is preferable that the temperature of the laminate at the time of transfer be lower than the softening point of the organic component in the laminate. Also,
When the release layer 13 is smaller than the base film 12 and smaller than the ceramic sheet 11, the base film 12 and the ceramic sheet 11 come into direct contact when the conductor layer 14 is transferred, and the ceramic sheet 11 is peeled off. There are cases. As a result, the sintered body has structural defects,
It is important to make the size of the release layer 13 larger than that of the ceramic sheet 11 because a good product cannot be obtained.

Thereafter, the laminate is cut into chips, degreased in air at 350 ° C., and fired at 1300 ° C. in a reducing atmosphere composed of nitrogen and hydrogen. By this firing, a sintered body is obtained in which the ceramic dielectric layer 1 mainly containing barium titanate and the internal electrode 2 mainly containing nickel are sintered simultaneously. The size of the sintered body after firing was about 3.
The thickness of the ceramic dielectric layer 1 between the internal electrodes 2 is 5 μm, and the thickness of the internal electrodes 2 is 1.8 μm.
m. Next, copper external electrodes 3 are formed on the exposed end faces of the internal electrodes 2 of the sintered body, and the multilayer ceramic capacitor shown in FIG. 4 is obtained. As an embodiment of the present invention, a ceramic sheet 11 having a thickness of 9 μm and a thickness of 2.5 μm
Using 100 m of the conductive layers 14, transfer and lamination of 100 sheets were performed, and the transferability of the conductive layers 14 onto the ceramic sheet 11 and the capacitance of the laminated ceramic capacitor after firing were measured and evaluated. Was done. For comparison, a base film 12 having no release layer 13 was also prepared,
Similarly, the transferability and the capacitance are compared with the case where the release layer 13 is formed. Regarding the transferability, the ratio of the conductive layer 14 remaining on the base film 12 side after the transfer of the conductive layer 14 is shown as a ratio to the total pattern weight. The measurement results of the transferability and the capacitance are shown in (Table 1).

[0021]

[Table 1]

In the case where the release layer 13 is provided, it can be seen that the transfer is almost completely performed. On the other hand, when the release layer 13 was not provided, sufficient capacitance was not obtained because the transfer of the conductor layer 14 was insufficient. From this result, the release layer 13 was formed on the base film 12.
It can be said that the transferability can be sufficiently improved by forming the conductive layer 14 containing an organic component through the layer and transferring the layer onto the ceramic sheet 11. As a result, it is possible to suppress a fatal failure as a multilayer ceramic capacitor such as a variation or a decrease in capacitance due to a transfer failure of the conductor layer 14, which has a great effect on improving the yield.

Hereinafter, important points regarding the present invention will be described. (1) The release layer 13 prevents the occurrence of repelling during printing of the nickel paste, and the conductor layer 1 is formed on the release layer 13 with high accuracy.
In order to form No. 4, it is necessary that the solvent component in the nickel paste and the release layer 13 have good wettability. (2) It is desired that the release layer 13 does not cause a chemical reaction with the solvent component in the nickel paste in order to prevent the releasability of the conductor layer 14 during transfer from being significantly deteriorated. (3) Further, in order to improve lamination accuracy, the release layer 13 is required to have a performance of not being softened or deteriorated by pressure and heat during lamination. (4) Further, it is necessary to form the release layer 13 and the base layer 12 so that the bond strength between the release layer 13 and the conductor layer 14 can be smaller than the bond strength between the release layer 13 and the base film 12. (5) In the present embodiment, a release layer 13 having a thickness of 1 μm was formed on a base film 12 having a thickness of 75 μm, and a conductor layer 14 having a thickness of 5 μm was formed thereon. Release layer 13
Has little influence on the transferability of the conductor layer 14. What is important is that the conductive layer 14 and the base film 12 are always in a non-contact state, that is, the release layer 13 between the conductive layer 14 and the base film 12 has no defect or the like. The surface on which the conductor layer 14 is formed is to be as smooth and horizontal as possible. (6) It is effective to use an acrylic resin, an epoxy resin, a melamine resin or a mixed resin thereof as the release layer 13 in order to satisfy the performances of the above (1) to (5). When using an acrylic resin, it is preferable to use a mixture with an epoxy resin and a melamine resin in order to improve thermal stability. (7) As described in (4) above, in order to improve the bonding strength between the release layer 13 and the base film 12, unevenness is provided on the surface of the base film 12 where the release layer 13 is formed, and the release layer 13 is formed. It is preferable to increase the contact area with the metal. (8) In order to prevent the release layer 13 from softening, the temperature at the time of drying the conductive layer 14 and the temperature at the time of transfer need to be lower than the softening point of the release layer 13. (9) It is desirable that the temperature at the time of de-buying be such that the solvent can be removed from the laminate, and the oxidation of the metal component (nickel in the present embodiment) in the conductor layer 14 does not proceed too much. Specifically, it is desirable to carry out at 350 ° C. or lower. (10) Although nickel is used as the material of the conductor layer 14, a base metal such as copper or a noble metal such as palladium or silver-palladium may be used. (11) When sintering the laminate, a reducing atmosphere is used to prevent the metal component (nickel in the present embodiment) in the conductor layer 14 from being excessively oxidized and not functioning as the internal electrode 2. It is done in. (12) In the above embodiment, a multilayer ceramic capacitor has been described as an example. However, the present invention is a general ceramic electronic component having a step of laminating a ceramic sheet and a conductor layer formed using a metal paste, for example, a multilayer ceramic capacitor. Varistors, multilayer thermistors, multilayer filters, ferrite parts,
Similar effects can be obtained in the manufacture of a ceramic multilayer substrate.

[0024]

As described above, according to the present invention , a conductor layer is formed on a support via a release layer, and the conductor layer is contained in the conductor layer.
At least one type of organic material
By using the same organic material as that contained in the support, the conductive layer is easily released from the support, and the transferability of the conductive layer onto the ceramic sheet is improved.

As a result, it is possible to reduce defective characteristics due to poor transfer of the conductor layer to the ceramic sheet, and to manufacture ceramic electronic components having stable electric characteristics with a high yield.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a conductor layer formed on a release layer according to an embodiment of the present invention.

FIG. 2 is a sectional view of a ceramic sheet formed on a base film according to one embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a transfer lamination process in one embodiment of the present invention.

FIG. 4 is a partially cutaway perspective view of a general multilayer ceramic capacitor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic dielectric layer 2 Internal electrode 3 External electrode 11 Ceramic sheet 12 Base film 13 Release layer 14 Conductor layer 15 Support

──────────────────────────────────────────────────の Continued on the front page (72) Inventor Mahito Omiya 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. In-company (56) References JP-A-6-295841 (JP, A) JP-A-6-232000 (JP, A) JP-A-62-257790 (JP, A) (58) Fields investigated (Int. . ^7, DB name) H01G 4/00 - 4/40

Claims (2)

(57) [Claims] A step of preparing a ceramic sheet comprising a ceramic component and at least one or more kinds of organic substances; and a step of preparing at least one metal component on a support via a release layer.
A step of forming a conductor layer made of at least one kind of organic substance, a step of transferring the conductor layer onto the ceramic sheet, and a step of alternately transferring the ceramic sheet and the conductor layer a plurality of times thereon, and laminating the same. obtaining a body, and a step of firing the laminate possess, before
The organic substance contained in the conductor layer is the ceramic sheet.
At least one kind is the same as the organic matter contained in the
A method of manufacturing a certain ceramic electronic component. 2. The size of the release layer is smaller than that of the ceramic sheet.
The method for manufacturing a ceramic electronic component according to claim 1, wherein