JP2000269074A - Multilayer ceramic capacitor and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent delaminations or cracks of the interior of a laminate caused by unbalance of stresses generated during stacking operation in the laminate or by unbalance of sintering properties or shrinkabilities during baking operation, and also to prevent the deformation of the laminate. SOLUTION: This multilayer ceramic capacitor has a laminate 3, having ceramic layers 7 and internal electrodes 5, 6 stacked alternately and also has external electrodes 2 and 2 provided at ends of the laminate 3. The internal electrodes 5 and 6 reach any one of at least one of pairs of opposing edges of the ceramic layers 7, whereby the internal electrodes 5 and 6 are led out to opposing end faces of the laminate 3 and are connected at the end faces of the body 3 to the external electrodes 2 and 2 respectively. Conductor films 8, 8, etc., are formed in a margin zone m, where the internal electrodes 5 and 6 between the ceramic layers 7 are not present.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic capacitor having, for example, a laminate of an internal electrode pattern and a ceramic layer, and an external electrode provided at an end of the laminate so as to be electrically connected to the internal electrode. More particularly, the present invention relates to a multilayer ceramic capacitor having low internal stress and a method for manufacturing the same.

[0002]

2. Description of the Related Art In a multilayer ceramic capacitor, a plurality of ceramic layers made of a dielectric material having internal electrodes are laminated in layers, and the internal electrodes face each other inside the multilayer body. Are drawn out alternately. An external electrode is formed at an end including the end face of the laminate from which these internal electrodes are drawn, and the external electrodes are connected to the internal electrodes facing each other inside the laminate.

The multilayer body of such a multilayer ceramic capacitor is formed by stacking a plurality of ceramic layers on which no internal electrodes are formed on both sides of a dielectric ceramic layer having internal electrodes. That is, ceramic layers made of a dielectric material having internal electrodes are sequentially stacked, and a plurality of ceramic layers on which no internal electrodes are formed are stacked on both sides thereof. Internal electrodes are alternately exposed at the ends of the laminate having such a layer structure, and the external electrodes are formed at the ends of the laminate.

[0004] Such a multilayer ceramic capacitor is
It is not always the case that individual parts are manufactured individually. In practice, a method of simultaneously manufacturing a plurality of multilayer ceramic capacitors by stacking ceramic green sheets having a size corresponding to a plurality of multilayer ceramic capacitors is adopted. That is, first, a fine ceramic powder and an organic binder are kneaded to prepare a slurry, which is thinly spread on a carrier film made of a polyethylene terephthalate film or the like by a doctor blade method, and dried to produce a ceramic green sheet. Next, the ceramic green sheet is cut into a desired size with a cutting head while being placed on the support film, and a conductive paste is printed on one surface thereof by a screen printing method and dried. Thereby, a ceramic green sheet in which a plurality of sets of internal electrode patterns are arranged vertically and horizontally is obtained.

[0005] Next, a plurality of ceramic green sheets having the internal electrode pattern are stacked, and several ceramic green sheets having no internal electrode pattern are stacked one on top of the other. create. Here, the ceramic green sheets in which the internal electrode patterns are shifted by a half length in the longitudinal direction are alternately stacked. Thereafter, the laminate is cut into a desired size to produce a laminated green chip, and the green chip is fired. Thus, a fired laminate is obtained.

Next, a conductive paste is applied to both ends of the fired laminate, baked, and the surface of the baked conductor film is plated or the like, whereby a multilayer ceramic capacitor having external electrodes formed at both ends is provided. Is completed. As the conductive paste for forming the internal electrodes in the multilayer ceramic capacitor as described above, a paste mainly composed of Ni powder to which a binder and a solvent are added is used.

[0007]

In the process of manufacturing the conventional multilayer ceramic capacitor as described above, when the ceramic green sheets are laminated and pressed, the internal electrode pattern printed by the conductive paste on the ceramic green sheets is formed. Depending on the presence or absence of the internal electrode pattern, a difference occurs in the internal compressive stress at the time of lamination and pressing between a certain portion and a so-called margin region where there is no internal electrode pattern. For this reason, the packing density of the ceramic becomes coarse in the margin region after the compression, and the packing density of the ceramic becomes high in the portion where the internal electrode pattern where the compressive stress is concentrated exists. As a result, when the laminate is fired, a difference occurs in sinterability, shrinkage ratio, and the like, which causes defects such as delamination and cracks due to distortion inside the laminate.

In addition, there is a great difference in the sinterability during firing between the portion of the internal electrode containing a large amount of conductor and the portion of the ceramic layer composed of only ceramic particles. for that reason,
As a result, a deformed laminate is obtained in which the laminated body after firing is deformed, the dimension in the thickness direction of the margin region is small, and the dimension in the thickness direction of the portion where the internal electrode is present is large. Chip-shaped circuit components made of such a laminate not only have a bad shape, but also become unstable when mounted on a circuit board, causing mounting defects such as the chip-shaped circuit components standing up on the circuit board. Becomes

In view of the above-mentioned problems of the prior art, the present invention has been developed in view of the above-mentioned problems of the prior art, and there is an imbalance in stress during laminating and crimping, or an imbalance in sintering and shrinkage during firing. It is an object of the present invention to provide a multilayer ceramic capacitor in which lamination, cracks, and deformation of a multilayer body are less likely to occur, and a method for manufacturing the same.

[0010]

According to the present invention, in order to achieve the above object, in a multilayer ceramic capacitor as described above, a so-called margin region m having no internal electrodes 5 and 6 of a ceramic layer 7 is also provided. The conductor films 8 having a sintering control effect were formed. Thereby, stress imbalance at the time of lamination between the portion having the internal electrodes 5 and 6 of the multilayer body 3 constituting the multilayer ceramic capacitor and the margin region m having no internal electrodes 5 and 6 or the sintering property at the time of firing. And the difference in shrinkage ratio can be reduced to prevent the deformation of the laminate and the occurrence of delamination and cracks in the laminate.

That is, the multilayer ceramic capacitor according to the present invention comprises a laminate 3 in which ceramic layers 7 and internal electrodes 5 and 6 are alternately laminated, and external electrodes 2 and 2 provided at the ends of the laminate 3. And the internal electrodes 5 and 6 reach at least one of a pair of opposing edges of the ceramic layer 7, respectively. Derived and the same laminate 3
The internal electrodes 5 and 6 led out to the end faces of the external electrodes 2 and
2 are formed in a margin region m where there is no internal electrode 5, 6 between the ceramic layers 7, and conductor films 8, 8,... For sintering control are formed. It is.

In such a multilayer ceramic capacitor, since the conductor films 8, 8... Are also present in the margin region m of the ceramic layer 7 where the internal electrodes 5, 6 serving as conductor films are not present, the internal electrodes 5, 8 There is no imbalance in stress at the time of laminating and crimping between the portion where 6 exists and the margin region m where the internal electrodes 5 and 6 do not exist. In addition, even when the laminate 3 is fired, the sinterability and shrinkage rate during firing are equalized, and distortion inside the laminate 3 due to uneven sinterability and shrinkage rate during firing does not occur. For this reason, the deformation | transformation of the laminated body 3 and the defect, such as a delamination and a crack in the inside, can be reduced.

To prevent the sintering control conductor films 8, 8... From distorting the laminate 3 at the time of lamination and firing as described above, the sintering control conductor films 8, 8. , 6 are preferably equal. More specifically, the ratio of the thickness of the conductor films 8, 8,... For controlling sintering to the thickness of the internal electrodes 5, 6 needs to be 60 to 100%. If there is a further difference in the film thickness between the conductor films 8, 8... For sintering control and the internal electrodes 5, 6, the portion where the internal electrodes 5, 6 which are the conductor films of the laminate 3 are present, Stress collection at the time of lamination occurs in the margin region m where no 5 or 6 exists, or sinterability or shrinkage rate at the time of firing becomes unbalanced, and the laminate 3
Cannot be prevented.

In order to prevent the sintering control conductor films 8, 8... From distorting the laminated body 3 during lamination or firing as described above, the sintering control conductor films 8, 8. Area m
It is necessary to have some occupancy for
More specifically, the width of the sintering control conductor films 8, 8,.
It is necessary that the width is 25 to 75% of the width of the margin region m where the internal electrodes 5 and 6 are not provided on the ceramic layer 7. The width of the conductive films 8, 8,... For sintering control is 25 times the width of the margin region m.
%, Stress concentration at the time of lamination and pressure bonding occurs between the portion where the internal electrodes 5 and 6 are present and the margin region m, and imbalance in the sinterability of the laminate 3 during firing and the shrinkage rate during firing. Is generated. For this reason, distortion of the laminate 3 during firing cannot be prevented. On the other hand, the conductor film 8 for sintering control,
.. Exceeds 75% of the width of the margin region m, it is difficult to keep a gap between the internal electrodes 5 and 6 and the sintering control conductor films 8, 8. Becomes unstable. Further, by setting the above ratio, the distortion of the sheet when the base film is peeled at the time of molding is reduced, and the lamination accuracy is improved. This is because, when the printing area of the internal power is increased, the deformation of the sheet of the printing unit is reduced.

.. And the internal electrodes 5 and 6 are preferably made of the same material. Then, the conductor patterns 8a, 8b for forming the conductor films 8, 8,... For controlling sintering and the internal electrode patterns 2a, 2b for forming the internal electrodes 5, 6 can be simultaneously printed. The conductor films 8, 8,... For controlling sintering are preferably formed by being divided into a plurality over the longitudinal direction of the internal electrodes 5, 6. As a result, the whole of the margin region m is not covered with the conductor films 8, 8,.
Are partially settled, so that the ceramic layers 7, 7,.

Are preferably formed so as to reach the ends of the laminate 3 on which the external electrodes 2 are formed. .. And the external electrodes 2 and 2 are coupled to each other at the end face of the laminate 3, and the adhesion of the external electrodes 2 and 2 at the end face of the laminate 3 is improved. However, the sintering control conductor films 8, 8,... Formed so as to be electrically connected to the external electrodes 2, 2 are the other sintering control conductor films 8, 8 formed on the other adjacent ceramic layers 7.
8 are preferably formed so as not to face each other. .. Do not contribute to the acquisition of the capacitance, so that there is no need to acquire an extra capacitance or generate a stray capacitance.

The method for manufacturing a multilayer ceramic capacitor as described above comprises the steps of obtaining ceramic green sheets 1, 1a, 1b for forming a ceramic layer 7, and adding a conductive paste to a part of these ceramic green sheets 1a, 1b. A step of printing the internal electrode patterns 2a and 2b using the above, a step of laminating the ceramic green sheets 1, 1a and 1b in a predetermined order, and a step of cutting the laminated ceramic green sheets 1, 1a and 1b. Firing the laminate of ceramic green sheets 1, 1 a, 1 b to obtain a fired laminate 3 having internal electrodes 5, 6; Forming the electrodes 2 and 2.

In such a method for manufacturing a multilayer ceramic capacitor, before firing the laminate, the internal electrode patterns 2a, 2b of the ceramic green sheets 1a, 1b are formed.
Conductive patterns 8a and 8b for sintering control are printed on the margin area where 2b is not formed by using a conductive paste. At the time of printing, as described above, the conductor patterns 8a and 8b for sintering control are formed by the internal electrode patterns 2a and
It is efficient to print on the ceramic green sheets 1a and 1b simultaneously with the internal electrode patterns 2a and 2b by using the same conductive paste as that of 2b.

[0019]

Embodiments of the present invention will now be described specifically and in detail with reference to the drawings. First, a dielectric ceramic raw material powder such as barium titanate is uniformly dispersed in an organic binder such as acryl dissolved in a solvent such as ethanol to prepare a ceramic slurry. This ceramic slurry is applied on a base film such as a polyethylene terephthalate film or the like in a uniform thickness of 10 μm or less, and dried to form a film-like ceramic green sheet. Thereafter, the ceramic green sheet is cut into an appropriate size.

Next, as shown in FIG. 6, two kinds of internal electrode patterns 2a, 2b are formed on the cut ceramic green sheets 1a, 1b by using a conductive paste.
Conductive control conductor patterns 8a and 8b are printed on both sides thereof. For example, conductive paste is Ni, Cu, Ag,
For 100% by weight of Pd, Ag-Pd powder, etc., 3 to 12% by weight of ethyl cellulose, acrylic, polyester, etc. as a binder, butyl carbitol as a solvent,
80 to 120% by weight of butyl carbitol acetate, terpineol, ethyl cellosolve, hydrocarbon or the like is added, and the mixture is uniformly mixed and dispersed.

Using such a conductive paste such as a Ni paste, the internal electrode patterns 2a and 2b and the conductive patterns 8a and 8b for sintering control are simultaneously printed on the ceramic green sheets 1a and 1b, respectively. Such internal electrode patterns 2a and 2b and sintering control conductor pattern 8
a, ceramic green sheet 1a on which 8b is printed,
As shown in FIG. 6, the ceramic green sheets 1 and 1 which are not printed with the internal electrode patterns 2a and 2b, that is, so-called dummy sheets, are stacked on both sides thereof, and these are pressed to obtain a laminate. . further,
This laminate is cut vertically and horizontally and divided into individual chip-like laminates. Then, by firing these laminates,
A fired laminate 3 having a layer structure as shown in FIG. 3 is obtained.

As shown in FIG. 3, the laminated body 3 is formed by laminating ceramic layers 7, 7,... Made of a dielectric material having internal electrodes 5, 6, and further having no internal electrodes 5, 6 formed on both sides thereof. Each of the layers 7, 7,... Is stacked in a plurality of layers. Such a laminate 3 has a ceramic layer 7
The internal electrodes 5 and 6 facing each other are alternately led out to both end surfaces of the laminate 3.

Further, as shown in FIGS. 3 and 4, the ceramic layer 7 on which the internal electrodes 5 and 6 are formed is provided with a conductor film for sintering control on a so-called margin region m on both sides of the internal electrodes 5 and 6. 8, 8 are formed. The conductor films 8, 8 for controlling sintering are formed of the ceramic green sheets 1a, 1a.
The conductor patterns 8a and 8b for controlling sintering b are formed by firing. The conductor patterns 8a and 8b for sintering control are made of ceramic green sheets 1a and 1b.
Since the conductive films 8 and 8 are simultaneously printed using the same conductive paste as the internal electrode patterns 2a and 2b on b, the sintering control conductive films 8 and 8 are formed by the same conductor as the internal electrodes 5 and 6 to have substantially the same thickness. . However, the conductor films 8 and 8 are the internal electrodes 5 and 6
Since the size of each pattern is smaller than that of the internal electrodes 5, 6, the average film thickness is slightly smaller than that of the internal electrodes 5, 6. It is desirable that the thickness of the conductor films 8, 8 is 80% or more of the thickness of the internal electrodes 5, 6.

The width of the sintering control conductor films 8, 8 is formed to be 25 to 75% of the width of the margin region m. As shown in FIG. 2, a conductor film 8 for controlling sintering is provided.
8 is divided into a plurality of pieces (four in the illustrated example) along the longitudinal direction of the internal electrodes 5 and 6, and a gap is formed between them. In this gap, the laminated ceramics 7 are directly bonded to each other. The endmost conductive films 8 and 8 for sintering control reach the edge of the ceramic layer 7 together with the internal electrodes 5 and 6 and are led out to the end faces of the laminate 3 shown in FIGS. 1 and 3.

As shown in FIG. 1, a conductive paste such as an Ag paste is applied to both ends of the laminated body 3 from which the internal electrodes 5 and 6 and a part of the conductive films 8 and 8 for sintering control are respectively led out. This is burned. In addition, Ni
Plating and Sn or solder plating are applied, and the external electrodes 2,
2 are formed. Thus, the multilayer ceramic capacitor is completed.

The internal electrodes 5 and 6 and a part of the conductor films 8 and 8 for controlling sintering are connected to the external electrodes 2 and 8 shown in FIG.
Combined with 2. However, as shown in FIG. 2, the conductor films 8, 8 for sintering control reaching the edge of the ceramic layer 7 are:
It does not face the conductor films 8 for controlling sintering of the adjacent ceramic layer 7 via the ceramic layer 7. Therefore, the internal electrodes 5 and 6 alternately facing each other with the ceramic layer 7 interposed therebetween.
Only contributes to the acquisition of the capacitance, and the conductor films 8 for sintering control do not contribute to the acquisition of the capacitance.

[0027]

Next, more specific examples of the present invention and comparative examples will be described. (Example) A ceramic slurry was prepared by uniformly dispersing a dielectric ceramic raw material powder such as barium titanate in an organic binder such as acryl dissolved in a solvent such as ethanol, and this was coated on a base film such as a polyethylene terephthalate film to a thickness of 10 μm. It was applied in a uniform thickness and dried to form a film-shaped ceramic green sheet. Thereafter, the ceramic green sheets were peeled off from the base film, and a plurality of 150 mm square ceramic green sheets were produced.

On the other hand, for 100% by weight of the Ni powder,
Ethyl cellulose as a binder was added at 8% by weight, terpineol as a solvent was added at 100% by weight, and barium titanate powder as a so-called co-material was added at 15% by weight, uniformly mixed and dispersed to prepare a conductive paste. Using this Ni paste, internal electrode patterns 1a and 1b each having a thickness of 2.3 μm as shown in FIG. 6 were formed on each ceramic green sheet by a screen printer.

At the same time, the internal electrode patterns 1a, 1a
On both sides of b, conductor patterns 8a and 8b for sintering control having a thickness of 2.1 μm were printed. A predetermined number of such ceramic green sheets on which the internal electrode patterns are printed are alternately stacked, and ceramic green sheets on which the internal electrode patterns are not printed, so-called dummy sheets, are stacked on the upper and lower sides, and these are stacked at a temperature of 120 ° C. in the stacking direction. Under the pressure of 200 tons under pressure, the laminate was pressed to obtain a laminate.

This laminate was cut into a size of 5.3 mm × 5.0 mm, and the laminate was fired at a temperature of 1320 ° C. to obtain a fired laminate 3 as shown in FIG. Further, a Cu paste was applied to both ends of the fired laminate 3 and baked. Thereafter, the chip was placed in an electrolytic barrel plating bath, the Ag film was plated, and a Ni plating and a Sn plating film were sequentially applied on the Ag film. Thus, external electrodes 2 and 2 were formed, and a multilayer ceramic capacitor as shown in FIG. 1 was obtained.

The multilayer body 3 of the multilayer ceramic capacitor
In the so-called margin regions m on both sides of the internal electrodes 5 and 6, conductor films 8 and 8 for sintering control are formed as shown in FIG. The width of the conductor films 8, 8 is set to the margin area m.
Is 60% of the width. With 50 of these multilayer ceramic capacitors embedded and held in acrylic resin,
The multilayer ceramic capacitor is polished from the side surface thereof in a direction orthogonal to the laminating direction of the internal electrodes 5 and 6, the lamination state of the internal electrodes 5 and 6 and the ceramic layer 7 is observed by an optical microscope, and cracks in the multilayer body 3 are observed. The presence or absence of so-called delamination of the ceramic layer 7 was examined. As a result, no crack or delamination was observed.

Further, 50 other laminated ceramic capacitors manufactured at the same time are embedded in acrylic resin and held, and the laminated ceramic capacitor is polished from its end face in a direction perpendicular to the laminating direction of the internal electrodes 5 and 6. Then, the cross-sectional shape was observed. As a result, no deformation due to the difference in the shrinkage rate of the laminate 3 was observed, and the laminate 3 was formed into a substantially rectangular shape whose dimension in the thickness direction was substantially constant over the width direction.

(Comparative Example) In the above embodiment, the ceramic green sheets 1a and 1b were provided with the internal electrode patterns 2a and 2a.
A multilayer ceramic capacitor was manufactured in the same manner as in Example 1, except that the sintering control conductor patterns 8a and 8b were not printed together with 2b, and only the internal electrode patterns 2a and 2b were printed.

With 50 of the laminated ceramic capacitors embedded and held in an acrylic resin, the laminated ceramic capacitor is polished from the side surface thereof in a direction orthogonal to the laminating direction of the internal electrodes 5 and 6. The laminated state of the ceramic layer 6 and the ceramic layer 7 was observed with an optical microscope, and the presence or absence of cracks in the laminated body 3 and peeling of the ceramic layer 7, that is, the presence or absence of so-called delamination was examined. As a result, cracks and delaminations were observed in 12 out of 50 cracks.

Further, 50 other laminated ceramic capacitors manufactured at the same time are embedded in an acrylic resin and held, and the laminated ceramic capacitor is polished from its end face in a direction perpendicular to the laminating direction of the internal electrodes 5 and 6. Then, the cross-sectional shape was observed. As a result, a deformation due to a difference in the shrinkage rate in the width direction of the laminate 3 was observed, and the center portion was thick and both sides were thin. In this embodiment, the external electrodes are baked after the element body is fired. However, the present invention is not limited to this, and the same effect can be obtained by simultaneously firing the element body and the external electrode.

[0036]

As described above, according to the present invention, the imbalance of the stress at the time of laminating the so-called margin region of the laminate and the other portions, or the imbalance of the sintering property and the shrinkage rate at the time of sintering. Accordingly, it is possible to obtain a multilayer ceramic capacitor in which delamination and cracks inside the multilayer body and furthermore, deformation of the multilayer body hardly occurs.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing an example of a multilayer ceramic capacitor according to the present invention.

FIG. 2 is a plan view showing planes of two types of ceramic layers of the multilayer ceramic capacitor.

FIG. 3 is an exploded perspective view showing layers of the multilayer body of the example of the multilayer ceramic capacitor separately.

FIG. 4 is a sectional view taken along line AA of FIG. 1;

FIG. 5 is a sectional view taken along line BB of FIG. 1;

FIG. 6 is an exploded perspective view of each layer showing a laminated state of ceramic green sheets for manufacturing a multilayer ceramic capacitor.

[Explanation of symbols]

 2 external electrode 3 laminate 5 internal electrode 6 internal electrode 7 ceramic layer 8 conductive film for sintering control

Continued on the front page F-term (reference)

Claims (10)

[Claims] A ceramic layer (7) and an internal electrode (5);
(6) and a laminate (3) alternately laminated, and external electrodes (2) and (2) provided at ends of the laminate (3). , (6) reach each of at least one pair of opposing edges of the ceramic layer (7), so that the internal electrodes (5), (6) are provided on the opposing end faces of the laminate (3). The internal electrodes (5) and (6) which are respectively led out and led to the end face of the laminate (3)
Are connected to the external electrodes (2) and (2), respectively, in the margin region (m) where there is no internal electrode (5) or (6) between the ceramic layers (7). A multilayer ceramic capacitor characterized by forming conductive films (8) for control. 2. The ratio of the thickness of the conductor films (8), (8)... For sintering control to the thickness of the internal electrodes (5), (6) is 60 to 100%.
The multilayer ceramic capacitor according to claim 1, wherein 3. The width of the conductive films (8), (8)... For controlling sintering is such that the internal electrodes (5), (6) are formed on the ceramic layer (7).
3. The multilayer ceramic capacitor according to claim 1, wherein the width is 25% to 75% of the width of the margin region (m) where there is no gap. 4. The sintering controlling conductor films (8), (8)... And the internal electrodes (5), (6) are made of a conductor film of the same material. The multilayer ceramic capacitor according to any one of the above. 5. A conductor film for controlling sintering (8).
Is formed so as to be divided into a plurality over the longitudinal direction of the internal electrodes (5) and (6).
5. The multilayer ceramic capacitor according to any one of 4. 6. A part of the sintering controlling conductor films (8), (8)... Is formed so as to reach an end of the laminated body (3) on which the external electrodes (2) and (2) are formed. The multilayer ceramic capacitor according to any one of claims 1 to 5, wherein 7. The sintering controlling conductor films (8), (8), which are formed so as to be electrically connected to the external electrodes (2), (2),
7. The laminate according to claim 6, wherein the laminate is formed so as not to face other sintering control conductor films (8) formed on another adjacent ceramic layer (7). 8. Ceramic capacitors. 8. A process for obtaining ceramic green sheets (1), (1a) and (1b) for forming a ceramic layer (7), and a process for obtaining these ceramic green sheets (1).
a) printing the internal electrode patterns (2a) and (2b) using a conductive paste on a part of (1b), and ordering the ceramic green sheets (1), (1a) and (1b) in a predetermined order And the step of cutting the laminated ceramic green sheets (1), (1a) and (1b), and the steps of cutting the ceramic green sheets (1), (1a) and (1).
b) firing the laminate to obtain a fired laminate (3) having internal electrodes (5) and (6);
Forming the external electrodes (2) and (2) at the end where the internal electrodes (5) and (6) are led out of the multilayer ceramic capacitor. Ceramic green sheet (1a), (1b)
The conductor patterns (8a) and (8b) for sintering control are printed using a conductive paste on the margin area (m) where the internal electrode patterns (2a) and (2b) are not formed. Manufacturing method of multilayer ceramic capacitor. 9. A conductor pattern (8a) for controlling sintering,
The method according to claim 8, wherein (8b) is printed using the same conductive paste as the internal electrode patterns (2a) and (2b). 10. A conductor pattern (8a) for controlling sintering.
(8b) is a ceramic green sheet (1a), (1b)
The method for manufacturing a multilayer ceramic capacitor according to claim 9, wherein the internal electrode patterns (2a) and (2b) are simultaneously printed on (b).