JP2004055678A - Method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated ceramic electronic component, which will not easily generate delamination, assures proper moisture resistance, and does not easily generate a structural defect such as delamination and crack, even when the number of times of lamination processes of internal electrode increases, and thereby the ceramic layer between the internal electrodes becomes thin. <P>SOLUTION: The method of manufacturing a laminated layer ceramic electronic component comprises the following steps. Namely, a laminate is obtained by laminating a plurality of sheets of ceramic green sheets 6 on an elastic sheet 2, while pressure is applied at least to a sheet of ceramic green sheet 6, on which a conductive paste is printed at the time of manufacturing the laminated layer ceramic electronic component, including a ceramic sintered body obtained by laminating the ceramic green sheets on which the conductive paste 5 is printed and then sintering these ceramic green sheets. On the elastic material sheet 2, the laminate obtained is pressurized in the laminating direction, the ceramic green sheets are pressurized with each other. Next, the laminate is sintered to obtained the ceramic sintered body. <P>COPYRIGHT: (C)2004,JPO

Description

【００４１】
表１の試料番号１〜２９から明らかなように、マザーのセラミックグリーンシートの積層に際し、弾性体シート上においてセラミックグリーンシート１枚毎、３枚毎または５枚毎に圧力を加えつつ複数枚のセラミックグリーンシートを積層した場合、試料番号３３〜３６に比べて耐湿負荷試験による不良が生じ難く、超音波探傷試験による構造欠陥不良の発生も生じ難い、信頼性に優れた積層セラミックコンデンサを安定に提供し得ることがわかる。
【００４２】
また、特に、ショア硬度計（Ａ形）を用いたデュロメータＡ硬度が４０〜８０の弾性体シートを用いた試料番号６〜８、１０〜１８、２０〜２８では、耐湿負荷試験による不良が生じないだけでなく、構造欠陥もより一層生じ難いことがわかる。従って、本発明によれば、好ましくは、硬度４０〜８０の弾性体シートを用いて、複数枚のセラミックグリーンシートが所定の枚数毎に熱圧着され、かつ最終的に得られたマザーの積層体が該弾性体シート上において厚み方向に加圧されることが望ましい。
【００４３】
なお、上記製造方法は、積層セラミックコンデンサを例にとり説明したが、積層セラミックコンデンサ以外の積層セラミック電子部品、例えばセラミック多層基板や積層型サーミスタ、積層型インダクタなどの様々な積層セラミック電子部品の製造方法に広く用いることができる。
【００４４】
【発明の効果】
本発明に係る積層セラミック電子部品の製造方法によれば、弾性体シート上において、導電ペーストが印刷された少なくとも１枚のセラミックグリーンシート毎に圧力が加えられつつ、複数枚のセラミックグリーンシートが積層され、得られた積層体を弾性体シート上において積層方向に加圧するため、導電ペーストが印刷されたセラミックグリーンシートの積層枚数が多くなった場合であっても、またセラミックグリーンシートの厚みが薄くなった場合であっても、導電ペーストがセラミックグリーンシート層を介して積層されている部分と他の部分との密度差が生じ難く、かつ両者の間で歪みも生じ難い。従って、デラミネーション等が生じ難く、耐湿性に優れた積層セラミック電子部品を提供することができる。
【００４５】
また、上記弾性体シートとして、ショア硬度計を用いたデュロメータ硬さが、４０〜８０の範囲にある材料を用いた場合には、デラミネーションが生じ難く、耐湿性に優れているだけでなく、クラック等の構造欠陥がより一層生じ難く、それによってより一層信頼性に優れ、かつ特性のばらつきの積層セラミック電子部品を提供することができるとともに、積層セラミック電子部品の良品率を高めることが可能となる。
【図面の簡単な説明】
【図１】（ａ）及び（ｂ）は、本発明の一実施例において複数枚のセラミックグリーンシートを積層する工程を説明するための各模式的正面断面図。
【図２】
本発明の一実施例において得られるマザーの積層体を説明するための略図的正面断面図。
【図３】本発明の一実施例でマザーの積層体を積層方向に加圧した後の状態を説明するための模式的正面断面図。
【図４】本発明の一実施例において得られた、個々の積層セラミックコンデンサ単位の積層体を説明するための正面断面図。
【図５】本発明の一実施例で得られる積層セラミックコンデンサを説明するための正面断面図。
【図６】従来の積層セラミック電子部品を得るための積層方法を一例を説明するための模式的正面図。
【符号の説明】
１…積層ステージ
２…弾性体シート
３…マザーのセラミックグリーンシート
４…プレス
５…導電ペースト
５Ａ…導電ペースト
５Ｂ…内部電極
６…マザーのセラミックグリーンシート
７…マザーの積層体
７Ａ…マザーの積層体
８…積層体
９…セラミック焼結体
９ａ，９ｂ…端面
１０，１１…外部電極
１２…積層セラミックコンデンサ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method of manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor, and more particularly, to a method of manufacturing a multilayer ceramic electronic component in which a step of stacking ceramic green sheets is improved.
[0002]
[Prior art]
Conventionally, when manufacturing a multilayer ceramic electronic component, first, a mother ceramic green sheet is prepared. Next, a conductive paste for forming an internal electrode is applied on the mother ceramic green sheet. A plurality of mother ceramic green sheets to which the conductive paste is applied are laminated to obtain a mother laminate. Next, the mother laminate is pressed in the thickness direction and the ceramic green sheets are pressed together. Further, the mother laminate is cut into laminates of individual multilayer ceramic electronic component units. The obtained multilayer body of each multilayer ceramic electronic component is fired to obtain a sintered body. Thereafter or simultaneously with sintering, external electrodes are formed on the surface of the ceramic sintered body.
[0003]
Meanwhile, multilayer ceramic electronic components such as multilayer ceramic capacitors are strongly required to be reduced in size and increased in capacity. With the progress of miniaturization, large capacity, and the like, the thickness of the ceramic layer between the internal electrodes has been reduced, and the number of laminated internal electrodes has been increasing. In recent years, the thickness of the ceramic layer between the internal electrodes is extremely thin, 5 μm or less, and the number of laminated internal electrodes may exceed 200 sheets.
[0004]
When the thickness of the ceramic layer between the internal electrodes decreases, it is necessary to reduce the thickness of the ceramic green sheet to be used. Therefore, a number of thin ceramic green sheets had to be laminated.
[0005]
When the ceramic green sheet becomes thinner and the number of laminated internal electrodes increases, a step is formed due to a difference in thickness between a portion where the conductive paste for forming an internal electrode is laminated and another portion in the mother laminate. Occurs.
[0006]
When the step occurs, when the mother laminate is pressed by a rigid press, a density difference occurs between a portion where the conductive paste for internal electrode configuration is stacked and a portion where the conductive paste is not arranged, Cracks and delaminations tend to occur in the finally obtained sintered body. Further, even when the mother laminate is pressed by a hydrostatic press or the like, there is a possibility that distortion may occur between a portion where the conductive paste is laminated and a portion where the conductive paste is not arranged.
[0007]
On the other hand, a laminating method capable of laminating a large number of ceramic green sheets without causing defects has been proposed in Japanese Patent Application Laid-Open No. 8-162364.
As shown in FIG. 6, in the laminating method described in the related art, unit sheets St composed of, for example, 30 ceramic green sheets are laminated on a rigid pallet 21 and thermocompression-bonded. Next, the unit sheet St2 composed of the next 30 ceramic green sheets is laminated on the thermocompressed unit sheet St1, and then thermocompressed on the pallet 21. In this way, lamination and thermocompression bonding are repeated for every predetermined number of unit sheets such as 30 sheets. Therefore, even when the total number of laminations increases, it is said that stress distortion and displacement during thermocompression bonding are unlikely to occur.
[0008]
[Problems to be solved by the invention]
However, even in the method described in the above-mentioned prior art, when the number of laminated sheets increases, pressure is applied to the previously laminated ceramic green sheets every time lamination and thermocompression bonding of unit sheets are repeated. Therefore, when the ceramic green sheet laminated first expands compared to the ceramic green sheet laminated later and the number of laminated sheets increases, the density difference between the lower part and the upper part of the obtained laminate is increased. Or distortion may occur.
[0009]
An object of the present invention is to solve the above-described drawbacks of the prior art, and to surely obtain a laminate in which thinner and more ceramic green sheets are less likely to cause distortion or density difference even when many ceramic green sheets are laminated. Accordingly, it is an object of the present invention to provide a method for manufacturing a multilayer ceramic electronic component, in which delamination, cracks and the like are hardly generated in a sintered body.
[0010]
[Means for Solving the Problems]
The present invention is a method of manufacturing a multilayer ceramic electronic component having a ceramic sintered body obtained by laminating ceramic green sheets on which a conductive paste is printed, and sintering the ceramic green sheets. Preparing a ceramic green sheet, and applying pressure to at least one of the ceramic green sheets on which the conductive paste is printed on the elastic sheet, stacking the plurality of ceramic green sheets, and forming a laminate. Obtaining, a step of pressing the laminate in the laminating direction on the elastic sheet, and pressing the ceramic green sheets together, and a step of firing the laminate to obtain a ceramic sintered body. And
[0011]
In a specific aspect of the present invention, a material having a durometer A hardness of 40 to 80 using a Shore hardness meter (A type) is used as the elastic sheet. If the hardness is less than 40, the ceramic green sheets may be minutely bent at the time of lamination, and structural defects such as cracks and delamination may occur in the obtained ceramic sintered body. When the hardness exceeds 80, it is difficult to sufficiently obtain the effect of using the elastic sheet, and as in the case where the laminate is pressed on the rigid body, in the region between the internal electrode laminated portion and other portions, and the like. Cracks and delamination may occur.
[0012]
In the manufacturing method of the present invention, when laminating a plurality of ceramic green sheets, a plurality of ceramic green sheets are laminated while applying pressure to at least one ceramic green sheet on which the conductive paste is printed. In this case, it is preferable to apply pressure to every five or less ceramic green sheets, and it is more preferable to stack the sheets while applying pressure to every one ceramic green sheet. By sequentially laminating a plurality of ceramic green sheets while applying pressure to each of the smaller number of ceramic green sheets, the ceramic green sheets can be more effectively adhered to each other, and the occurrence of structural defects can be more effectively reduced. Can be prevented.
[0013]
Although the method for manufacturing a multilayer ceramic electronic component according to the present invention can be generally used for manufacturing various multilayer ceramic electronic components, in a specific aspect of the present invention, a ceramic green sheet uses a dielectric ceramic layer. In this case, a multilayer ceramic capacitor is obtained as a multilayer ceramic electronic component.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.
[0015]
One embodiment of the method for manufacturing a multilayer ceramic electronic component of the present invention will be described with reference to FIGS. In this embodiment, a multilayer capacitor is manufactured as a multilayer ceramic electronic component.
[0016]
In this embodiment, first, a plurality of ceramic green sheets obtained by forming a ceramic slurry into sheets are prepared. Next, the ceramic green sheet is punched into a rectangular shape.
[0017]
Next, a conductive paste for forming an internal electrode is applied to the upper surface of the rectangular mother ceramic green sheet by screen printing or the like. As described above, a plurality of mother ceramic green sheets provided with the conductive paste and a rectangular mother ceramic green sheet not provided with the conductive paste are prepared.
[0018]
Next, as shown in FIG. 1A, the elastic sheet 2 is arranged on the lamination stage 1. The elastic sheet 2 is made of a material having rubber elasticity, for example, natural rubber or synthetic rubber. The elastic sheet 2 has a sheet-like shape, and desirably has a durometer A hardness of 40 to 80 using a Shore hardness meter (A type).
[0019]
The thickness of the elastic sheet 2 is not particularly limited, but is desirably about 0.1 to 2 mm.
First, a plurality of plain mother ceramic green sheets 3 are sequentially laminated on the elastic sheet 2. Here, as shown in FIG. 1A, three ceramic green sheets 3 are laminated, and the ceramic green sheets 3 are thermocompression-bonded by lowering a press 4 heated to a predetermined temperature.
[0020]
Next, as shown in FIG. 1B, the mother ceramic green sheet 6 to which the conductive paste 5 is applied is similarly laminated on the elastic green sheet 2 on the ceramic green sheet 3 previously laminated. Is done. Here, three mother ceramic green sheets 6 to which the conductive paste 5 has been applied are stacked, and then the press 4 is lowered, whereby the ceramic green sheets 6 are thermocompression-bonded to each other. At the same time, the lowermost mother ceramic green sheet 6 is thermocompression-bonded to the uppermost mother ceramic green sheet 3 among the mother ceramic green sheets 3, 3 and 3 which have been stacked first.
[0021]
Next, the step of laminating the ceramic ceramic green sheets 6 shown in FIG. 1B is repeated according to the number of laminated internal electrodes. Thereafter, the mother ceramic green sheet 3 is again laminated on the internal electrode laminated portion in the same manner.
[0022]
In this way, a mother laminate 7 schematically shown in FIG. 2 is obtained.
In the mother laminate 7, a plurality of mother ceramic green sheets 3 to which the conductive paste 5 for forming the internal electrode is not applied are respectively laminated on the lower and upper portions, and the conductive paste is provided at the center in the thickness direction. A plurality of mother ceramic green sheets 6 to which reference numerals 5 are given are laminated.
[0023]
Thereafter, the mother laminate 7 is pressed in the thickness direction. In this way, a mother laminate 7A schematically shown in FIG. 3 is obtained.
In the present embodiment, when laminating the mother ceramic green sheet 3 and the mother ceramic green sheet 6 to which the conductive paste 5 is applied, three ceramic green sheets are supported in the elastic sheet 2 as described above. Pressure is applied to each sheet, and the ceramic green sheets are thermocompression bonded together. Therefore, even when the number of stacked ceramic green sheets is increased, the adhesion between the ceramic green sheets is sufficiently enhanced. In addition, since three ceramic green sheets are laminated and thermocompression-bonded, stress distortion and misalignment during thermocompression are less likely to occur even when the total number of laminations increases.
[0024]
In addition, in this embodiment, since the elastic sheet 2 is used, the mother ceramic green sheet 3 that is first laminated is replaced with the ceramic green sheet 6 that is laminated later and the ceramic green sheet that is located above. It is hard to grow compared to 3. Therefore, even when the number of laminated layers increases, in the obtained laminated body 7, a difference in density and distortion between the upper portion and the lower portion hardly occur.
[0025]
In the present embodiment, the thermocompression bonding is performed for each of the three ceramic green sheets. However, the number is not limited to three. As far as possible, the ceramic green sheets can be laminated while applying pressure to an appropriate number of sheets. Preferably, pressure is applied to every five or less ceramic green sheets and thermocompression is performed. More preferably, thermocompression is performed while applying pressure to every single ceramic green sheet.
[0026]
That is, by performing thermocompression bonding and lamination while applying pressure to each of the smaller number of ceramic green sheets, the ceramic green sheets can be more effectively brought into close contact with each other.
[0027]
The mother laminate 7A schematically shown in FIG. 3 is then cut into laminates for individual multilayer ceramic capacitor units. FIG. 4 shows a multilayer body of each multilayer ceramic capacitor obtained in this manner. In the laminate 8, a plurality of conductive pastes 5 </ b> A formed by cutting the conductive paste 5 are arranged so as to overlap with each other via a ceramic green sheet layer.
[0028]
Next, the sintered body 9 shown in FIG. 5 is obtained by firing the laminate 8. In sintered body 9, conductive paste 5A is baked to form internal electrodes 5B. Then, external electrodes 10 and 11 are formed on the end faces 9a and 9b of the sintered body 9, respectively. The external electrodes 10 and 11 are formed so as to be electrically connected to any one of the internal electrodes 5B.
[0029]
In the multilayer ceramic capacitor 12 obtained as described above, structural defects such as cracks and delamination hardly occur in the ceramic sintered body 9. This is because the mother green body 7A is obtained by laminating the ceramic green sheets 3 and 6 as described above. Therefore, at the mother green body 7A stage, the portion where the conductive pastes 5 are stacked and the other This is because a difference in density and distortion between the portion and the portion hardly occur. This will be described more specifically based on experimental examples.
[0030]
By forming the barium titanate-based ceramic slurry into a sheet, a ceramic green sheet having a thickness of 4.5 μm was obtained. The ceramic green sheet was punched into a rectangular shape to prepare a plain mother ceramic green sheet.
[0031]
Next, the conductive paste containing the Ni powder was printed on the upper surface of the mother ceramic green sheet obtained as described above so that the thickness after drying became 2.0 μm, and the paste was dried.
[0032]
On a rigid lamination stage, a 200 μm-thick elastic sheet was placed on a fixed mold, and a plurality of the above-described plain mother ceramic green sheets and a mother ceramic green sheet on which the conductive paste was printed were laminated. Pressed. More specifically, in order to obtain a laminated ceramic capacitor, 30 plain mother ceramic green sheets are laminated, then 250 mother ceramic green sheets on which conductive paste is printed, and then 30 ceramic ceramic sheets are laminated. The mother green sheets of the solid color were laminated. In this case, as shown in Table 1 below, every one, three, or five plain ceramic green sheets were pressed at a temperature of 10 ° C. for 1 second, 5, 10, or 20 MPa / cm using a press die. ² and a thermocompression bonding. The press in this case was the first press. After the mother laminate was obtained, a pressure of 100 MPa / cm ² was applied on the elastic sheet for 10 minutes by a press die to press the mother laminate. The press in this case was the second press.
[0033]
As shown in Table 1 below, in sample numbers 1, 5, 9, 19, 29, and 33, no pressure was applied in the first press. That is, only the second press performed after obtaining the mother laminate was performed. For other sample numbers, a pressure of 5, 10 or 20 MPa / cm ² was applied in the first press as described above.
[0034]
In addition, as shown in Table 1 below, in Sample Nos. 1 to 32, elastic sheets having a durometer A hardness of 30, 40, 60, 80 and 100 using a Shore hardness meter (A type) were prepared as elastic sheets. used. In addition, the elastic sheets were not used in Sample Nos. 33 to 36.
[0035]
After obtaining a mother laminated body having a thickness of 1.8 mm as described above, the mother laminated body is cut in the thickness direction so that the planar shape after firing becomes 3.2 × 1.6 mm. A laminate of a ceramic capacitor unit was obtained. The obtained laminate was kept at a temperature of 300 ° C. for 5 hours to perform a binder removal step.
[0036]
After the binder removal step, the temperature of the laminated body was increased at a rate of 200 ° C./hour in an oxygen partial pressure of 1.0 × 10 ⁻⁷ MPa or less, and the temperature was increased to ¹ × 10 ⁻¹ at a temperature of 1300 ° C. After maintaining for a predetermined time in an oxygen partial pressure of MPa, the temperature was lowered to room temperature at an oxygen partial pressure of 1.0 × 10 ⁻⁷ MPa or less at a temperature reduction rate of 200 ° C./hour. External electrodes were formed by applying a Cu paste to both end surfaces of the ceramic sintered body thus obtained and baking the paste.
[0037]
For each of the multilayer ceramic capacitors obtained as described above, an electrostatic capacity, an insulation resistance IR (applied voltage: 10 V, application time: 2 minutes), a moisture resistance load test, and a structural defect confirmation test by an ultrasonic flaw detector were performed. .
[0038]
In addition, in the humidity resistance load test, when the resistance became 1 MΩ or less when n = 1000 samples were subjected to an acceleration test at 75 ° C. and a relative humidity of 90 to 95%, the samples were regarded as defective. The number of samples having a resistance of 1 MΩ or less is shown in Table 1 as a result of a moisture resistance load test.
[0039]
In the structural defect confirmation test using the ultrasonic flaw detector, n = 10000 samples were evaluated, and the number of samples in which cracks or delaminations were observed is shown in Table 1 below.
[0040]
[Table 1]

[0041]
As is clear from Sample Nos. 1 to 29 in Table 1, when laminating the ceramic green sheets of the mother, a plurality of ceramic green sheets were pressed on the elastic sheet while applying pressure every one, every three or every five sheets. When the ceramic green sheets are laminated, failures due to the moisture resistance load test are less likely to occur compared to the sample numbers 33 to 36, and structural defects due to the ultrasonic flaw detection test are less likely to occur. It can be seen that it can be provided.
[0042]
In particular, in the sample numbers 6 to 8, 10 to 18, and 20 to 28 using an elastic sheet having a durometer A hardness of 40 to 80 using a Shore hardness meter (A type), a failure due to the moisture resistance load test occurs. It can be seen that not only are there no, but also structural defects are less likely to occur. Therefore, according to the present invention, preferably, a plurality of ceramic green sheets are thermocompression-bonded by a predetermined number using an elastic sheet having a hardness of 40 to 80, and a mother laminate obtained finally is obtained. Is desirably pressed on the elastic sheet in the thickness direction.
[0043]
Although the above manufacturing method has been described by taking a multilayer ceramic capacitor as an example, a method of manufacturing various multilayer ceramic electronic components such as a multilayer ceramic substrate, a multilayer thermistor, a multilayer inductor, etc., other than the multilayer ceramic capacitor. Can be widely used.
[0044]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the manufacturing method of the laminated ceramic electronic component which concerns on this invention, while applying a pressure to at least 1 ceramic green sheet with which the conductive paste was printed on an elastic body sheet, several ceramic green sheets are laminated | stacked. Then, to press the obtained laminate in the laminating direction on the elastic sheet, even if the number of laminated ceramic green sheets on which the conductive paste is printed, even if the thickness of the ceramic green sheet is thin Even in such a case, a difference in density between the portion where the conductive paste is laminated via the ceramic green sheet layer and the other portion hardly occurs, and distortion hardly occurs between the two portions. Therefore, it is possible to provide a multilayer ceramic electronic component which is less likely to cause delamination and the like and has excellent moisture resistance.
[0045]
Further, when a material having a durometer hardness in the range of 40 to 80 using a Shore hardness meter is used as the elastic sheet, delamination hardly occurs and not only is excellent in moisture resistance, Structural defects such as cracks are more unlikely to occur, whereby it is possible to provide a multilayer ceramic electronic component having higher reliability and variations in characteristics, and it is possible to increase the yield of multilayer ceramic electronic components. Become.
[Brief description of the drawings]
FIGS. 1A and 1B are schematic front cross-sectional views for explaining a step of laminating a plurality of ceramic green sheets in one embodiment of the present invention.
FIG. 2
1 is a schematic front sectional view for explaining a mother laminate obtained in one embodiment of the present invention.
FIG. 3 is a schematic front sectional view for explaining a state after a mother laminate is pressed in a lamination direction in one embodiment of the present invention.
FIG. 4 is a front cross-sectional view for explaining a laminated body of each multilayer ceramic capacitor obtained in one embodiment of the present invention.
FIG. 5 is a front sectional view for explaining a multilayer ceramic capacitor obtained in one embodiment of the present invention.
FIG. 6 is a schematic front view for explaining an example of a conventional laminating method for obtaining a multilayer ceramic electronic component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Lamination stage 2 ... Elastic body sheet 3 ... Mother ceramic green sheet 4 ... Press 5 ... Conducting paste 5A ... Conducting paste 5B ... Internal electrode 6 ... Mother ceramic green sheet 7 ... Mother laminate 7A ... Mother laminate 8 laminated body 9 ceramic sintered bodies 9a, 9b end faces 10, 11 external electrodes 12 laminated ceramic capacitor

Claims (5)

A method for manufacturing a laminated ceramic electronic component having a ceramic sintered body obtained by laminating ceramic green sheets on which a conductive paste is printed and firing the ceramic green sheets,
A step of preparing a plurality of ceramic green sheets on which the conductive paste is printed,
A step of stacking the plurality of ceramic green sheets on the elastic sheet while applying pressure to at least one of the ceramic green sheets on which the conductive paste is printed, to obtain a stacked body;
Pressing the laminate in the laminating direction on the elastic sheet, and pressing the ceramic green sheets together,
Baking the laminate to obtain a ceramic sintered body. 2. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the elastic sheet is made of a material having a durometer A hardness in a range of 40 to 80. 3. 3. The method of manufacturing a multilayer ceramic electronic component according to claim 1, wherein in the step of obtaining the laminate, a plurality of ceramic green sheets are sequentially laminated while applying a pressure to every five or less ceramic green sheets. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein in the step of obtaining the multilayer body, a plurality of ceramic green sheets are sequentially stacked while applying pressure to each ceramic green sheet. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 4, wherein the ceramic green sheet is formed using dielectric ceramics, and a multilayer ceramic capacitor is obtained as the multilayer ceramic electronic component.

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