CN113630988A - Control method for high-precision interlayer alignment of ultrahigh multi-layer plate - Google Patents
Control method for high-precision interlayer alignment of ultrahigh multi-layer plate Download PDFInfo
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- CN113630988A CN113630988A CN202110942415.0A CN202110942415A CN113630988A CN 113630988 A CN113630988 A CN 113630988A CN 202110942415 A CN202110942415 A CN 202110942415A CN 113630988 A CN113630988 A CN 113630988A
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- 239000010410 layer Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000011229 interlayer Substances 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000012943 hotmelt Substances 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 description 8
- 238000004080 punching Methods 0.000 description 4
- 239000002023 wood Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B47/00—Constructional features of components specially designed for boring or drilling machines; Accessories therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a control method for high-precision interlayer alignment of an ultrahigh multilayer board, relates to printed circuit board processing, in particular to an interlayer alignment processing technology of the ultrahigh multilayer board, and solves the technical problem that interlayer offset is easy to be out of tolerance in the existing multilayer board pressing mode. Splitting an ultrahigh multi-layer board to be laminated into a plurality of core board groups, and aligning and laminating the core boards in the core board groups to form a daughter board; and aligning and pressing all the daughter boards to form the mother board. The invention is effective, feasible and low in cost, not only realizes the high-precision interlayer alignment effect, but also improves the excellent rate of products and reduces the manufacturing difficulty of ultrahigh multilayer boards.
Description
Technical Field
The invention relates to printed circuit board processing, in particular to a control method for high-precision interlayer alignment of an ultrahigh multilayer board.
Background
Layer offset is one of the biggest processing difficulties of ultra-high multi-layer circuit boards (generally, the number of layers is more than 20). Due to the influence of the expansion and contraction difference of the core plates of each layer, the deviation of the equipment precision, the deformation of the board caused by the processing and the like, the accumulated deviation of the alignment degree of each layer of the final board is overlarge, and the board is scrapped. At present, the ultrahigh multi-layer board adopts a plurality of core boards to be pre-stacked and pressed together at one time. In the process of manufacturing the core board patterns, punching PE holes, sleeving PIN PINs or riveting, and finally pressing into an ultrahigh multi-layer board, due to the influence of multiple factors such as material expansion and shrinkage, equipment precision, processing process control and the like, the final finished product yield is often reduced due to the out-of-alignment between layers. At present, advanced equipment such as a high-precision exposure machine, a PE punching machine, a hot melting machine, an X-Ray shooting machine and the like are adopted in the industry to process ultra-high multi-layer plates, and meanwhile, the precision of interlayer alignment is improved by combining a Pin-lam pressing process technology. However, such high-precision equipment has high investment, and the problem of accumulation layer deviation of the ultrahigh multi-layer board is still difficult to solve fundamentally.
In addition, the publication "CN 111970859A" describes a multi-layer circuit board laminating method, in which no more than three prepared daughter boards (i.e. core boards of each layer) are aligned and stacked, and then a point pressing is performed; and (4) prepressing after the alignment is qualified, otherwise, disassembling and keeping for later use. And then carrying out secondary point pressing on the plurality of point pressed plates, and then carrying out secondary pre-pressing. Repeating the process to realize the manufacture of the multilayer board. But this approach has quality implications. Firstly, the stability of the subplate after point pressing is insufficient, and the subplate is easy to deviate due to interference of external factors in the moving process; secondly, the process is complex, the point pressing is less each time (the number of plates is not more than three), the consumed time is long, and if the ultrahigh multilayer circuit board is processed, the consumed time is greatly increased, and the production efficiency is seriously influenced; thirdly, when the alignment degree of the spot pressing is not ideal, the disassembled plates are difficult to recombine, and the worse the alignment degree is, the more difficult the recombination is, and even the plate is scrapped.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art, provides a control method for high-precision interlayer alignment of an ultrahigh multi-layer board, and solves the problem that the interlayer offset is easy to be out of tolerance in the existing multi-layer board laminating mode.
The invention relates to a control method for high-precision interlayer alignment of an ultrahigh multilayer board, which is characterized in that an ultrahigh multilayer board to be pressed is split into a plurality of core board groups, a plurality of positioning holes for core board alignment are formed in each core board of the core board groups, and then the core boards in the core board groups are aligned and pressed to form a daughter board; and manufacturing a plurality of rivet holes for daughter board alignment on all the daughter boards, setting the rivet holes at the outer sides of the daughter boards positioned at two ends of the ultrahigh multilayer board as stepped holes, and aligning and pressing all the daughter boards to form a mother board.
When the ultrahigh multilayer board is disassembled, the number of the remaining core boards is ensured not to exceed two, and the patterns or structures on the two surfaces of the remaining core boards are approximately symmetrical or symmetrical; and the rest core boards are the core boards at the middle positions of the ultrahigh multi-layer boards, and corresponding rivet holes are manufactured in the rest core boards according to the rivet holes in the daughter boards.
Manufacturing a plurality of rivet holes on all the daughter boards, aligning and pressing all the daughter boards to form a mother board, which specifically comprises,
and according to the layer arrangement sequence of the ultrahigh multilayer board, sequentially aligning and superposing the daughter boards and the rest core boards by taking the rivet holes as positioning points, then carrying out preliminary fusion and fixation on the daughter boards and the rest core boards through a hot melting machine, adding rivets and rivet caps into the rivet holes, and fixing the daughter boards and the rest core boards through a riveting machine to obtain the mother board.
Rivet holes are formed in each edge of the sub plate, and the rivet holes in the two opposite edges of the sub plate are arranged in a staggered mode.
And a plurality of hot melting bonding pads are arranged on the daughter board at the periphery of the rivet hole.
After the ultrahigh multilayer board is grouped, circuit pattern manufacturing and browning processing are carried out on the core board.
And processing the core plate by using the same laser direct imaging exposure machine.
The number of layers of each core plate group is not more than 10.
And the end corners at two sides of the core plate are provided with circular ring images for observing the rear layer deviation condition of the laminated plate.
Advantageous effects
The invention has the advantages that:
1. the ultra-high multi-layer board to be pressed is firstly manufactured into a plurality of daughter boards, and then the daughter boards are pressed to form a mother board, so that the problem of layer deviation and over-tolerance in the existing production of the ultra-high multi-layer board is solved. The method is effective, feasible and low in cost, not only realizes the high-precision interlayer alignment effect, but also improves the excellent rate of products and reduces the manufacturing difficulty of ultrahigh multilayer boards.
2. The rivet holes on two opposite edges on the daughter board are arranged in a staggered mode, so that the problem that the direction of the daughter board is reversed when the daughter board is overlapped can be effectively solved. In addition, the design of a plurality of hot melt bonding pads on the periphery of the rivet hole can effectively prevent the problem of slippage and dislocation of the rivet hole in the alignment process during pressing, and greatly improves the accuracy of interlayer alignment.
3. Set up the rivet hole into the shoulder hole, can effectual reduction rivet slip or skew, promote the precision behind the mother board pressfitting. In addition, after the rivet is installed, the rivet cap is arranged in the plate, so that adverse effects on subsequent processing are avoided, and the rivet is practical and reliable.
Drawings
FIG. 1 is a schematic diagram of a split structure of a 26-layer ultrahigh multilayer board;
FIG. 2 is a schematic view of a core plate structure of the present invention;
fig. 3 is a schematic diagram of a motherboard structure according to the present invention.
Wherein: 1-core plate, 2-copper foil, 3-bonding sheet, 4-positioning hole, 5-rivet hole, 6-step hole, 7-circular hole ring image, 8-rivet and 9-mother plate.
Detailed Description
The invention is further described below with reference to examples, but not to be construed as being limited thereto, and any number of modifications which can be made by anyone within the scope of the claims are also within the scope of the claims.
Referring to fig. 1 to 3, the method for controlling high-precision interlayer alignment of an ultra-high multi-layer board according to the present invention includes the following steps.
Step one, splitting an ultrahigh multi-layer board to be pressed into a plurality of core board groups. The number of layers of each core plate group is not more than 10. The smaller the number of the core plates 1 is, the higher the alignment precision of the daughter boards after lamination is. However, excessive core board components will affect the alignment precision when the mother board 9 is laminated, so it is suitable to control the number of core board groups to be less than 10. Namely, the maximum number of layers of the daughter boards after lamination is 10. In addition, because the core boards 1 used by different ultrahigh multi-layer boards have different thicknesses, in order to ensure the lamination quality, the thickness of each sub-board is ensured to be between 0.8 and 1.5 mm. If the total thickness of the core plates 1 in the core plate group is more than 1.5mm, the core plates 1 are properly reduced, and the grouping is increased.
When the ultrahigh multi-layer board is disassembled, the number of the remaining core boards 1 is ensured not to exceed two, and the patterns or structures on two surfaces of the remaining core boards are approximately symmetrical or symmetrical; and the rest core boards 1 are the core boards 1 at the middle positions of the ultrahigh multi-layer boards, when in lamination, the rest core boards 1 are directly overlapped between the daughter boards, and the rest core boards 1 do not need to be laminated again, so that the production efficiency is improved. After the ultrahigh multi-layer boards are grouped, the core boards 1 can be processed and pressed.
And step two, after the ultrahigh multi-layer boards are grouped, manufacturing a plurality of positioning holes 4 on each core board 1 of the core board group for aligning the core boards 1 during lamination. The size of the positioning hole 4 of the present embodiment is 3.175mm, and the allowable deviation thereof is ± 0.025 mm. The number of the positioning holes 4 on the long side of the core plate 1 is 3-4, and the number of the positioning holes on the short side is 2-3. The positions of the positioning holes 4 on each core plate 1 are the same. Through such setting, the skew of sub-board after can effectual reduction pressfitting.
After the core board 1 is drilled, the core board 1 is processed by forming a circuit pattern and browning. The processed core board 1 can be pressed. All the core boards 1 in the ultrahigh multilayer board of the embodiment are made by the same laser direct imaging exposure machine, so that the machine alignment deviation can be effectively reduced.
In addition, in the process of manufacturing and processing the core plate 1, the end corners at two sides of the core plate 1 can be provided with circular ring images 7 for observing the rear layer deviation of the laminated plate. Through the circular hole ring image 7, the condition of the alignment accuracy degree of each plate after lamination can be better observed. In the ultrahigh multilayer board of the embodiment, the distance between the circular hole ring images 7 on each layer is 2-3mil, and the distance between the circular hole ring images 7 and the board edge is not less than 1.5 cm.
And aligning and pressing the core plates 1 in the core plate group according to the positioning holes 4 to form the daughter board. Specifically, before lamination, each core board 1 in the chip set is laminated with the bonding sheet 3, the copper foil 2 and the like according to a preset required sequence, and the core boards are pressed into a sub-board through a press machine, so that the manufacture of the sub-board is completed.
And step three, manufacturing a plurality of rivet holes 5 on the daughter board. In addition, rivet holes 5 are also formed in the remaining core boards 1. The size of the rivet hole 5 of the present embodiment is 3.175mm, and the allowable deviation thereof is ± 0.025 mm. Each side of the daughter board should be provided with a rivet hole 5. Specifically, 2-3 rivet holes 5 can be arranged on the long edge and 1-2 rivet holes can be arranged on the short edge of the daughter board. And the rivet holes 5 on the two opposite edges of the daughter board are arranged in a staggered manner. Therefore, the problem that the direction of the daughter board is reversed during lamination can be effectively prevented.
Preferably, be equipped with a plurality of hot melt pads on the peripheral daughter board of rivet hole 5, can effectually prevent that the pressfitting from making the problem of rivet hole 5 dislocation.
Preferably, the positioning hole 4 and the rivet hole 5 are both manufactured in a drilling mode, so that the precision deviation caused by PE punching and the influence of poor punching quality can be effectively reduced.
And aligning and pressing the daughter board according to the rivet hole 5 to form a mother board 9. Specifically, the daughter boards and the rest of the core boards 1 are aligned and superposed in sequence according to the sequence of the ultrahigh multilayer boards. And then, the high-precision interlayer alignment plate is preliminarily fused and fixed through a hot melting machine, a rivet 8 and a rivet cap are added into the rivet hole 5, and the high-precision interlayer alignment plate is fixed through a riveting machine to obtain a mother plate 9, so that the ultrahigh multi-layer plate with the high-precision interlayer alignment effect can be obtained.
Preferably, the outer side rivet holes of the daughter boards at the two ends of the ultrahigh multilayer board are arranged to be stepped holes. Namely, a step is hollowed out on the rivet hole 5 by numerical control electric milling on the outward surfaces of the two sub-boards on the outermost sides, so that the rivet hole 5 is a step hole 6, and the step section on the outer side of the step hole 6 is 1/3-1/2 deep as the thickness of the sub-boards. Through the design of the stepped hole 6, the sliding or deviation of the rivet 8 can be effectively reduced, and the precision of the mother board 9 after pressing is improved. In addition, the rivet cap is built into the plate and does not adversely affect subsequent processing. It should be noted that after the stepped hole 6 is electrically milled, the electrically milled residue is removed to ensure the bottom is flat and consistent.
Due to the fact that the thickness of the ultrahigh multilayer board is too large and the number of the core boards 1 is too large, equipment capable of extruding the ultrahigh multilayer board at one time is expensive at present, and the problem of too large deviation or out-of-tolerance still exists. And this embodiment is through carrying out the split with super high multiply wood, at first utilizes the mature technology preparation daughter board of current preparation multiply wood, and the coincide pressfitting of daughter board is realized to the mode of 5 location counterpoints in rethread rivet hole to finally further compress tightly mother board 9 through rivet 8, solved the overproof problem of counterpointing between the layer that exists in the super high multiply wood of production at present. The method is effective, feasible and low in cost, not only realizes the high-precision interlayer alignment effect, but also improves the excellent rate of products and reduces the manufacturing difficulty of ultrahigh multilayer boards.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various changes and modifications without departing from the structure of the invention, which will not affect the effect of the invention and the practicability of the patent.
Claims (9)
1. A control method for high-precision interlayer alignment of an ultrahigh multilayer board is characterized in that the ultrahigh multilayer board to be pressed is split into a plurality of core board groups, a plurality of positioning holes for core board alignment are formed in each core board of the core board groups, and then the core boards in the core board groups are aligned and pressed to form a daughter board; and manufacturing a plurality of rivet holes for daughter board alignment on all the daughter boards, setting the rivet holes at the outer sides of the daughter boards positioned at two ends of the ultrahigh multilayer board as stepped holes, and aligning and pressing all the daughter boards to form a mother board.
2. The method for controlling high-precision interlayer alignment of the ultrahigh multilayer board as claimed in claim 1, wherein when the ultrahigh multilayer board is disassembled, the number of the remaining core boards is ensured not to exceed two; and the rest core boards are the core boards at the middle positions of the ultrahigh multi-layer boards, and corresponding rivet holes are manufactured in the rest core boards according to the rivet holes in the daughter boards.
3. The method for controlling high-precision interlayer alignment of an ultrahigh multi-layer board according to claim 2, wherein a plurality of rivet holes are formed in all the daughter boards, and then all the daughter boards are aligned and pressed to form a mother board, specifically comprising,
and according to the layer arrangement sequence of the ultrahigh multilayer board, sequentially aligning and superposing the daughter boards and the rest core boards by taking the rivet holes as positioning points, then carrying out preliminary fusion and fixation on the daughter boards and the rest core boards through a hot melting machine, adding rivets and rivet caps into the rivet holes, and fixing the daughter boards and the rest core boards through a riveting machine to obtain the mother board.
4. The method for controlling high-precision interlayer alignment of the ultrahigh multi-layer plate as claimed in claim 3, wherein each edge of the daughter plate is provided with a rivet hole, and the rivet holes on two opposite edges of the daughter plate are arranged in a staggered manner.
5. The method for controlling high-precision interlayer alignment of the ultrahigh multi-layer plate as claimed in claim 3, wherein a plurality of hot-melt bonding pads are arranged on the daughter board at the periphery of the rivet hole.
6. The method as claimed in claim 1, wherein after the ultrahigh multi-layer board is grouped, the core board is further processed by circuit pattern fabrication and browning.
7. The method as claimed in claim 6, wherein the core board is processed by the same laser direct imaging exposure machine.
8. The method as claimed in claim 1, wherein the number of layers in each core plate group is not more than 10.
9. The method as claimed in claim 1, wherein the core board has circular hole ring images at its two ends for observing the layer deviation of the laminated board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110942415.0A CN113630988A (en) | 2021-08-17 | 2021-08-17 | Control method for high-precision interlayer alignment of ultrahigh multi-layer plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110942415.0A CN113630988A (en) | 2021-08-17 | 2021-08-17 | Control method for high-precision interlayer alignment of ultrahigh multi-layer plate |
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| CN113630988A true CN113630988A (en) | 2021-11-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114554699A (en) * | 2022-04-24 | 2022-05-27 | 圆周率半导体(南通)有限公司 | High-level PCB inter-board alignment method |
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| CN109688736A (en) * | 2019-01-29 | 2019-04-26 | 深圳市景旺电子股份有限公司 | Multilayer circuit board and preparation method thereof |
| CN110191598A (en) * | 2019-06-12 | 2019-08-30 | 景旺电子科技(龙川)有限公司 | A kind of multiple-plate manufacturing technique method of FPC |
| CN110996559A (en) * | 2019-11-15 | 2020-04-10 | 沪士电子股份有限公司 | Blind hole plate lamination positioning method |
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2021
- 2021-08-17 CN CN202110942415.0A patent/CN113630988A/en active Pending
Patent Citations (5)
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| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
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| CN109688736A (en) * | 2019-01-29 | 2019-04-26 | 深圳市景旺电子股份有限公司 | Multilayer circuit board and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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Application publication date: 20211109 |