CN215420944U - Combined printed circuit board - Google Patents
Combined printed circuit board Download PDFInfo
- Publication number
- CN215420944U CN215420944U CN202120831340.4U CN202120831340U CN215420944U CN 215420944 U CN215420944 U CN 215420944U CN 202120831340 U CN202120831340 U CN 202120831340U CN 215420944 U CN215420944 U CN 215420944U
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- circuit board
- printed circuit
- hot
- prepreg
- clamping
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Abstract
The utility model discloses a combined printed circuit board, which relates to the technical field of printed circuit boards and is characterized in that: the non-circuit pattern area at the top of the circuit board I is provided with at least two first clamping blocks; the non-circuit pattern area at the bottom of the circuit board II is provided with a first clamping groove corresponding to the first clamping block, and the non-circuit pattern area of the circuit board II is provided with a hot melting hole; the hot-melting hole is filled with the prepreg in a melting way; according to the utility model, the clamping blocks and the clamping grooves are correspondingly arranged between different circuit boards, so that accurate positioning is completed, and the effect of pressing the printed circuit boards is improved.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a combined printed circuit board.
Background
At present, when a multilayer PCB (Printed Circuit Board) is manufactured, a developed and etched inner layer Circuit Board is firstly used for black/brown oxidation treatment, and then a prepreg is added between an inner layer core Board and the inner layer core Board, and then hot pressing is performed on the prepreg and an outer layer copper foil. And then, drilling, plating through holes, developing and etching outer-layer circuits and the like, and continuously performing processing procedures such as ink printing, surface treatment, molding, testing and the like to finish the multilayer board.
The lamination process of the multilayer board comprises the following steps: binding, pre-stacking, plate stacking, hot pressing, cold pressing, post-processing and the like. The Bonding means that all the core boards of the inner layers are subjected to lamination alignment so as to ensure that the layers are not discarded due to dislocation. Common Bonding processes include riveting, fusing, and PIN-Lam processes. The fusion process is simple, the equipment investment is general, the capacity is high, and the interlayer alignment accuracy is relatively high, so that the fusion process becomes a preferable Bonding process for large, medium and small enterprises.
A multilayer printed circuit board of the prior application No. CN201120526841.8 includes at least two inner core boards, a non-circuit pattern area of each inner core board has a hot-melt area, and the hot-melt area has at least one hot-melt hole therein; and at least one prepreg is filled between the adjacent inner core boards, and after the fusion process, the prepreg is melted and filled into the hot melting holes. The embodiment of the utility model provides a multilayer printed circuit board, through set up the hot melt region in non-circuit pattern region to set up one or more hot melt hole in the hot melt region, make when fusing the technology, the prepreg between two inlayer cores melts and fills in the hot melt hole, from this, cohesion between the effectual reinforcing inlayer core, but does not play the effect of aiming at between the circuit board, in case discover the dislocation behind the hot melt, it will be very difficult to restore again.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a combined printed circuit board, wherein corresponding clamping blocks and clamping grooves are arranged between different circuit boards, so that accurate positioning is completed, and the effect of pressing the printed circuit board is improved.
In order to achieve the purpose, the utility model provides the following technical scheme:
a combined printed circuit board comprises a non-circuit pattern area at the top of a circuit board, at least two clamping blocks I are arranged in the non-circuit pattern area; the non-circuit pattern area at the bottom of the circuit board II is provided with a first clamping groove corresponding to the first clamping block, and the non-circuit pattern area of the circuit board II is provided with a hot melting hole; the hot-melting hole is filled with the prepreg in a melting mode.
By adopting the scheme, when the printed circuit board needs to be pressed, the clamping groove on the second circuit board is sleeved on the clamping block on the first circuit board, so that accurate positioning is completed, the possibility of dislocation of the circuit board is reduced, and the effect of pressing the printed circuit board is improved; during hot melting, the prepreg between the first circuit board and the second circuit board is melted and filled in the hot melting hole, so that the first circuit board and the second circuit board are connected more firmly, and the possibility of dislocation of the circuit boards is further reduced.
Preferably, the prepreg is arranged between the first circuit board and the third circuit board, the second circuit board is arranged between the second circuit board and the first circuit board, a second clamping groove corresponding to the first clamping block is formed in the bottom of the third circuit board, a second clamping block corresponding to the first clamping groove is arranged at the top of the third circuit board, the second clamping groove is matched with the second clamping block in size, and the prepreg is arranged between the first circuit board and the third circuit board and between the third circuit board and the second circuit board.
Preferably, when the number of the circuit boards three is more than one, at least one curing sheet is arranged between two adjacent circuit boards three.
Preferably, the hot melting hole penetrates through the third circuit board.
Preferably, the heat-melting hole penetrates through the first circuit board.
Preferably, the fixture block is located at the edge of the first circuit board.
Preferably, the hot melting hole is positioned at the edge of the second circuit board.
Preferably, the pore diameter of the hot-melt pore is 0.5 mm to 1 mm.
The utility model has the following beneficial effects:
when the printed circuit board needs to be pressed, firstly, the clamping groove on the circuit board II is sleeved on the clamping block on the circuit board I to complete accurate positioning, the possibility of dislocation of the circuit board is reduced, and the effect of pressing the printed circuit board is improved; during hot melting, the prepreg between the first circuit board and the second circuit board is melted and filled in the hot melting hole, so that the first circuit board and the second circuit board are connected more firmly, and the possibility of dislocation of the circuit boards is further reduced;
the circuit board III can be mutually stacked or connected with the circuit board and the circuit board II through the fixture block and the clamping groove, the layer number of the circuit board can be simply adjusted, accurate positioning is kept, and the applicability of the circuit board is improved;
and thirdly, the hot melting hole penetrates through the first circuit board, the second circuit board and the third circuit board, so that the combination stability between the circuit boards is further improved.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention.
In the figure: 1. a first circuit board; 2. a second circuit board; 3. a third circuit board; 4. a first clamping block; 5. a first clamping groove; 6. A second clamping block; 7. a second clamping groove; 8. hot-melting holes; 9. a prepreg.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
A combined printed circuit board is disclosed, as shown in figure 1, comprising a non-circuit pattern area on the top of a circuit board I1, wherein at least two clamping blocks I4 are arranged; the non-circuit pattern area at the bottom of the circuit board II 2 is provided with a clamping groove I5 corresponding to the clamping block I4, the non-circuit pattern area of the circuit board II 2 is provided with a hot melting hole 8, and the aperture of the hot melting hole 8 is 0.5 mm to 1 mm; the hot melting structure comprises at least one prepreg 9, wherein the prepreg 9 is positioned between a first circuit board 1 and a second circuit board 2, and the prepreg 9 is melted and filled into a hot melting hole 8.
As shown in fig. 1, when the printed circuit board needs to be pressed, the first clamping groove 5 on the second circuit board 2 is sleeved on the clamping block on the first circuit board 1, so that accurate positioning is completed, the possibility of dislocation of the circuit board is reduced, and the effect of pressing the printed circuit board is improved; during hot melting, the prepreg 9 between the first circuit board 1 and the second circuit board 2 is melted and filled in the hot melting hole 8, so that the first circuit board 1 and the second circuit board 2 are connected more firmly, and the possibility of dislocation of the circuit boards is further reduced.
As shown in fig. 1, the printed circuit board assembly further comprises at least one circuit board three 3, wherein the circuit board three 3 is located between the circuit board two 2 and the circuit board one 1, the bottom of the circuit board three 3 is provided with a clamping groove two 7 corresponding to the clamping block one 4, the top of the circuit board three 3 is provided with a clamping block two 6 corresponding to the clamping groove one 5, the clamping groove two 7 is adapted to the size of the clamping block two 6, at least one half of the curing sheet 9 is arranged between the circuit board one 1 and the circuit board three 3 and between the circuit board three 3 and the circuit board two 2, and when the number of the circuit board three 3 is greater than one, at least one curing sheet is arranged between two adjacent circuit boards three 3; the third circuit board 3 is arranged, the third circuit board 3 can be mutually stacked or connected with the second circuit board and the second circuit board 2 through the clamping blocks and the clamping grooves, the layer number of the circuit boards can be simply adjusted, accurate positioning is kept, and the applicability of the circuit boards is improved;
as shown in fig. 1, the hot-melting hole 8 penetrates through the third circuit board 3, the hot-melting hole 8 penetrates through the first circuit board 1, the prepreg 9 is melted and filled in the hot-melting hole 8, and the hot-melting hole 8 penetrates through the first circuit board 1, the second circuit board 2 and the third circuit board 3, so that the combination stability between the circuit boards is further improved.
As shown in fig. 1, a first 4 of the fixture block is located at the edge of a first 1 of the circuit board, a second 6 of the fixture block, a second 7 of the fixture block and a first 5 of the fixture block are located at the edge of the corresponding circuit board, the middle portion is located by comparison, the fixture block and the fixture block which are located at the edge can play a better stabilizing role, a hot melting hole 8 is located at the edge of a second 2 of the circuit board, the middle portion is located by comparison, the hot melting hole 8 which is located at the edge can achieve a better combining role, and the stability of the multilayer circuit board is improved.
The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions or modifications made on the basis of the present invention to solve the substantially same technical problems and achieve the substantially same technical effects are within the scope of the present invention.
Claims (8)
1. A modular printed circuit board, comprising:
the non-circuit pattern area on the top of the circuit board I (1) is provided with at least two fixture blocks I (4);
a first clamping groove (5) corresponding to the first clamping block (4) is formed in a non-circuit pattern area at the bottom of the second circuit board (2), and a hot melting hole (8) is formed in the non-circuit pattern area of the second circuit board (2);
the hot-melt adhesive comprises at least one prepreg (9), wherein the prepreg (9) is positioned between a first circuit board (1) and a second circuit board (2), and the prepreg (9) is melted and filled into a hot-melt hole (8).
2. The modular printed circuit board of claim 1, wherein: the printed circuit board is characterized by further comprising at least one circuit board III (3), wherein the circuit board III (3) is located between the circuit board II (2) and the circuit board I (1), a clamping groove II (7) corresponding to the clamping block I (4) is formed in the bottom of the circuit board III (3), a clamping block II (6) corresponding to the clamping groove I (5) is arranged at the top of the circuit board III (3), the clamping groove II (7) is matched with the clamping block II (6) in size, and at least one prepreg (9) is arranged between the circuit board I (1) and the circuit board III (3) and between the circuit board III (3) and the circuit board II (2).
3. A modular printed circuit board according to claim 2, wherein: when the number of the circuit boards three (3) is more than one, at least one curing sheet is arranged between two adjacent circuit boards three (3).
4. A modular printed circuit board according to claim 3, wherein: and the hot melting hole (8) penetrates through the third circuit board (3).
5. A modular printed circuit board according to claim 3, wherein: the hot melting hole (8) penetrates through the first circuit board (1).
6. The modular printed circuit board of claim 1, wherein: the first clamping block (4) is located at the edge of the first circuit board (1).
7. The modular printed circuit board of claim 5, wherein: the hot melting hole (8) is positioned at the edge of the second circuit board (2).
8. The modular printed circuit board of claim 1, wherein: the aperture of the hot melting hole (8) is 0.5 mm to 1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120831340.4U CN215420944U (en) | 2021-04-21 | 2021-04-21 | Combined printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120831340.4U CN215420944U (en) | 2021-04-21 | 2021-04-21 | Combined printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215420944U true CN215420944U (en) | 2022-01-04 |
Family
ID=79672394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120831340.4U Active CN215420944U (en) | 2021-04-21 | 2021-04-21 | Combined printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215420944U (en) |
-
2021
- 2021-04-21 CN CN202120831340.4U patent/CN215420944U/en active Active
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