KR20160139829A - Multilayer fpcb and fabricating method thereof - Google Patents

Multilayer fpcb and fabricating method thereof Download PDF

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Publication number
KR20160139829A
KR20160139829A KR1020150075392A KR20150075392A KR20160139829A KR 20160139829 A KR20160139829 A KR 20160139829A KR 1020150075392 A KR1020150075392 A KR 1020150075392A KR 20150075392 A KR20150075392 A KR 20150075392A KR 20160139829 A KR20160139829 A KR 20160139829A
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KR
South Korea
Prior art keywords
fpcb
copper foil
base film
via hole
multilayer
Prior art date
Application number
KR1020150075392A
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Korean (ko)
Inventor
정진용
Original Assignee
주식회사 스마테크
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Priority to KR1020150075392A priority Critical patent/KR20160139829A/en
Publication of KR20160139829A publication Critical patent/KR20160139829A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

According to the present invention, by electrically spatially welding each copper foil surface of two different FPCBs formed by laminating a copper foil on each base film, printing a circuit, and patterning and etching the copper foil, The present invention relates to a multilayer FPCB capable of manufacturing an FPCB and a method of manufacturing the multilayer FPCB. The first copper foil has a first copper foil upper surface on a part of the upper side, and a first copper foil bottom surface (120) A first FPCB 100 having a base film 130 and a via hole 140 passing through the first copper foil upper surface 110, the first copper foil bottom surface 120, and the first base film 130; And a second base film 220 having a second copper foil upper surface 210 attached to a part of the upper side and a via hole passing through the second copper foil upper surface 210 and the second base film 220 is formed And a second FPCB (200) which does not include the first FPCB (200); The second copper foil upper surface 210 of the second FPCB 200 is formed on the lower side of the first copper foil bottom surface 120 of the first FPCB 100 around the via hole 130 of the first FPCB 100 And are formed by being welded to each other and electrically welded.

Description

[0001] MULTILAYER FPCB AND FABRICATING METHOD THEREOF [0002]

More particularly, the present invention relates to a multilayer FPCB and a method of manufacturing the same. More particularly, the present invention relates to a multilayer FPCB and a method of manufacturing the multilayer FPCB, Layer FPCB can be manufactured reliably without any defect of disconnection by spot welding to a multi-layer FPCB and a manufacturing method thereof.

[0003] In general, with the development of electronic parts and component embedding technologies, multilayer printed circuit boards that superimpose circuit conductors have been continuously developed.

In recent years, in the field of electronic industrial technology, rapid development of integration degree of semiconductor integrated circuits and surface mounting technology for directly mounting small-sized chip components have been advanced and miniaturization of electronic equipments has necessitated making it easier to embed in a more complicated and narrow space In response to these demands, double-side exposed type and multi-layer FPCB are being developed.

Particularly, in the case of FPCB having a double-sided exposure structure which is easy to be stacked and has a high degree of use, the use of mobile phone batteries, heads of printers, LCDs, PDPs and the like is rapidly increasing due to technological advancement.

In the conventional FPCB stacking method, through-holes or via holes are used to connect the layers. In the case of the through holes, since the connection portions are the same for each layer, The circuit is fixed and there are many restrictions in design.

To solve these problems, Korean Patent Laid-Open No. 10-2006-0128168 and Korean Patent Laid-open No. 10-2014-0081460 have been proposed.

Korean Patent Laid-Open Publication No. 10-2006-0128168 discloses a method in which another copper-clad laminate is laminated on the outside of the inside copper-clad laminate on which a circuit pattern is formed through an inner circuit forming process, using a hot- The outer circuit forming step of forming a circuit pattern of the copper foil layer exposed on the outer surface of the copper clad laminate is performed to manufacture a multilayer FPCB. In the inner circuit forming step, a double-sided copper clad laminate having copper foil layers on both surfaces thereof is used And a pattern formation process of the inner circuit is performed.

However, in the above-mentioned prior art, there is a problem of disconnection of the two copper-clad laminates by interposing an interlayer adhesive film between two different copper-clad laminates and applying pressure and heat in a hot press method to bond the two different copper-clad laminates.

Also, Korean Patent Laid-Open Publication No. 10-2014-0081460 discloses an adhesive layer providing step of providing a temporary adhesive layer on both sides; A first lamination step of laminating a first core layer on both sides of the temporary adhesive layer; A second laminating step of laminating a first insulating layer on the first core layer, respectively; A third stacking step of stacking a second insulating layer on the first insulating layer, respectively; And removing the temporary adhesive layer to form two multi-layer substrates having the first insulating layer as a core.

However, the above-mentioned prior art also has a problem of disconnection because the temporary adhesive layer is a foamable double-sided tape.

1. Korean Patent Laid-Open No. 10-2006-0128168 entitled " Method for manufacturing multilayer flexible printed circuit boards using double-sided type copper-clad laminates "(Open date: December 14, 2006) 1. Korean Patent Laid-Open No. 10-2014-0081460 entitled "Multi-layer Printed Circuit Board Substrate; Facilitation Method" (Published on 2014. 07. 01.)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a semiconductor device and a method of manufacturing the same, in which a bottom face of a copper foil of a first FPCB having a via hole and an upper face of a copper foil of a second FPCB without a via hole are arranged to face each other, The voltage and current are electrically applied to the top surface of the copper foil so that the voltage and current are transmitted to the top surface of the copper foil of the second FPCB via the copper foil bottom surface of the first FPCB through the via hole of the first FPCB, Layer FPCB and a method of manufacturing the same, in which two different FPCBs can be stacked by electrically spot-welding the upper surface of the copper foil of the second FPCB.

The multilayer FPCB according to the present invention comprises a first base film having a first copper foil upper surface attached to a part of the upper side and a first copper foil bottom surface attached to a lower part of the first base film, A first FPCB having a via hole penetrating the first base film; And a second FPCB which is formed of a second base film having an upper surface of a second copper foil on a part of the upper side and in which no via hole penetrating the upper surface of the second copper foil and the second base film is formed; And the upper surface of the second copper foil of the second FPCB is formed by being welded to the lower portion of the first copper foil bottom surface of the first FPCB about the via-hole of the first FPCB to be electrically welded.

The method for manufacturing a multilayer FPCB according to the present invention is a method for manufacturing a multilayer FPCB comprising a first base film having a first copper foil upper surface attached to a part of an upper side and a first copper foil bottom surface attached to a lower part of the first base film, 1) preparing a first FPCB having a copper foil bottom and a via hole passing through the first base film; Preparing a second FPCB formed of a second base film having an upper surface of a second copper foil on an upper side thereof and having no via hole penetrating the upper surface of the second copper foil and the second base film; Positioning a first copper foil bottom face of the first FPCB having the via hole formed in the via hole of the first FPCB and an upper face of the second copper foil of the second FPCB not having the via hole to face each other; And electrically applying a voltage and an electric current to an upper surface of the first copper foil of the first FPCB; The voltage and current are transferred to the upper surface of the second copper foil of the second FPCB via the first copper foil bottom surface of the first FPCB through the via hole of the first FPCB, And the upper surface of the second copper foil of the second FPCB is electrically welded so that two different FPCBs are stacked.

As described above, the multilayer FPCB and the method of manufacturing the same according to the present invention have an advantage in that the multilayer FPCB can be manufactured easily without interposing the interlayer adhesive film between two different FPCBs.

Further, since the bottom face of the copper foil of the first FPCB and the top face of the copper foil of the second FPCB are electrically welded by spot welding, two different FPCBs are stacked, thereby solving the problem of disconnection and advantageously obtaining a reliable multilayer FPCB .

1 is a sectional side view of a multilayer FPCB according to the present invention before lamination;
2 is a cross-sectional side view of a multilayer FPCB according to the present invention in a stacking process.
3 is a cross-sectional side view of a multi-layer FPCB according to the present invention after lamination.
4 is a flow chart of a multi-layer FPCB manufacturing process according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and they may vary depending on the intentions or customs of the client, the operator, the user, and the like. Therefore, the definition should be based on the contents throughout this specification.

Like numbers refer to like elements throughout the drawings.

3 is a cross-sectional side view of a multi-layer FPCB according to the present invention after lamination, and FIG. 3 is a cross-sectional view of a multi-layer FPCB according to the present invention, 4 is a flowchart of a process for manufacturing a multilayer FPCB according to the present invention.

Referring to FIGS. 1 to 3, the production of a multilayer FPCB according to the present invention will be described.

Here, since the FPCB manufacturing process is well known, a detailed description thereof will be omitted. The present invention is directed to a method for producing a multilayer FPCB by stacking FPCBs manufactured in a well known manner.

First, in order to manufacture a multilayer FPCB, a first FPCB 100 and a second FPCB 200 for forming a multilayer FPCB are prepared.

Here, the first FPCB 100 and the second FPCB 200 are formed by laminating a copper foil on a base film, printing a circuit, and patterning and etching the base film. The base film is made of a polyimide ) Is used as an inner core to have flexibility, and a variety of makers are manufactured under the trade names Aplical, Kapton, and Upilex, so that a detailed description thereof will be omitted.

The first FPCB 100 includes a first base film 130 having a first copper foil 110 on a part of the upper side and a first copper foil 120 on a lower part of the first FPCB 100, A first copper foil upper surface 110, a first copper foil bottom surface 120 and a via hole 140 penetrating the first base film 130.

The second FPCB 200 is formed of a second base film 220 having a second copper foil upper surface 210 attached on a part of the upper side and the upper surface 210 of the second copper foil 210 and the second base film 220 The via hole is not formed.

The multilayer FPCB according to the present invention has a structure in which the first copper foil bottom surface 120 of the first FPCB 100 having the via hole 140 formed with the via hole 140 of the first FPCB 100 as a center, Voltage and current are applied to the first copper foil upper surface 110 of the first FPCB 100 by the electric welder 300 after the upper surfaces 210 of the second copper foil 200 of the second FPCB 200, The voltage and current are applied to the second FPCB 200 through the first copper bottom surface 120 of the first FPCB 100 via the via hole 140 of the first FPCB 100, The first copper foil bottom surface 120 of the first FPCB 100 and the second copper foil top surface 210 of the second FPCB 200 are electrically welded to each other by being transferred to the copper foil upper surface 210 And then laminated.

Here, the welding through the electric welder 300 is spot welding, the voltage for the spot welding is 5V to 10V, and the current is 0.5A to 1A. If the voltage is less than 5V, If it exceeds 10V, the base film may be damaged due to welding. If the current is less than 0.5 A, it is impossible to perform electrical welding, and if the current exceeds 1 A, the copper foil may be burned.

Now, referring to FIG. 4, a method of manufacturing a multilayer FPCB according to the present invention will be described.

A first base film 130 having a first copper foil upper surface 110 attached to a part of the upper side and a first copper foil bottom surface 120 attached to a lower part of the first base film 110, A first FPCB 100 having a first copper foil bottom surface 120 and a via hole 140 passing through the first base film 130 is prepared (S410). Thereafter, a via hole is formed in the upper portion of the second base film 220, which is formed of the second base film 220 having the second copper film upper surface 210 attached thereto, and penetrates the upper surface 210 of the second copper film 210 and the second base film 220 The second FPCB 200 is prepared (S420). Thereafter, the first copper foil bottom surface 120 of the first FPCB 100 having the via hole 140 formed around the via hole 140 of the first FPCB 100 and the second copper foil bottom surface 120 of the second FPCB 100 without the via- The upper surfaces 210 of the second copper foils of the FPCB 200 are positioned so as to face each other (S430). Thereafter, a voltage and a current are electrically applied to the first copper foil upper surface 110 of the first FPCB 100 (S440).

Here, the voltage and the current may flow through the via hole 140 of the first FPCB 100, through the first copper foil bottom surface 120 of the first FPCB 100, The first copper foil bottom surface 120 of the first FPCB 100 and the second copper foil top surface 210 of the second FPCB 200 are electrically welded to each other to form two FPCB is laminated.

The steps S410 and S420 may be reversed.

The electric welding is spot welding through the electric welder 300. The voltage for the spot welding is 5V to 10V and the electric current is 0.5A to 1A. If the voltage is less than 5V, If the voltage exceeds 10V, the base film may be damaged due to welding. If the current is less than 0.5 A, it is impossible to perform electrical welding, and if the current exceeds 1 A, the copper foil may be burned.

As described above, the multilayer FPCB and the method of manufacturing the same according to the present invention can easily produce a multilayer FPCB without interposing the interlayer adhesive film between two different FPCBs. Further, since the bottom face of the copper foil of the first FPCB and the top face of the copper foil of the second FPCB are electrically welded by spot welding, two different FPCBs are stacked, thereby solving the problem of disconnection, thereby obtaining a reliable multilayer FPCB.

Although the spot welding is performed on the copper foil of the FPCB in the embodiment of the present invention, it is needless to say that the present invention can also be applied to a thin film of FPCB made of a conductive material such as nickel, silver and gold.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Various changes, modifications or adjustments to the example will be possible. Therefore, the scope of protection of the present invention should be construed as including all changes, modifications, and adjustments that fall within the spirit of the technical idea of the present invention.

100: first FPCB 110: first copper upper surface
120: first copper foil bottom surface 130: first base film
140: via hole 200: second FPCB
210: second copper foil upper surface 220: second base film
300: Electric welding machine

Claims (4)

A first base film 130 having a first copper foil upper surface 110 attached to a part of an upper side and a first copper foil bottom surface 120 attached to a lower part of the first base film 110, A first FPCB 100 having a first copper foil bottom surface 120 and a via hole 140 passing through the first base film 130; And
A via hole formed through the second base film 220 and the second copper foil upper surface 210 and the second base film 220 is not formed in a part of the upper side And a second FPCB (200);
The second copper foil upper surface 210 of the second FPCB 200 is formed below the first copper foil bottom surface 120 of the first FPCB 100 around the via hole 140 of the first FPCB 100 And are electrically welded to each other to form a multilayer FPCB.
The method according to claim 1,
Wherein the voltage for the welding is 5V to 10V and the current is 0.5A to 1A.
The method according to claim 1,
Wherein the welding is spot welding.
A first base film 130 having a first copper foil upper surface 110 attached to a part of an upper side and a first copper foil bottom surface 120 attached to a lower part of the first base film 110, A step S410 of preparing a first FPCB 100 having a first copper foil bottom surface 120 and a via hole 140 passing through the first base film 130;
A via hole formed through the second base film 220 and the second copper foil upper surface 210 and the second base film 220 is not formed in a part of the upper side Preparing a second FPCB 200 (S420);
The first copper foil bottom surface 120 of the first FPCB 100 having the via hole 140 formed around the via hole 140 of the first FPCB 100 and the second copper foil bottom surface 120 of the second FPCB 200 (S430) so that the upper surfaces of the second copper foils 210 of the first copper foil are opposed to each other; And
(S440) electrically applying voltage and current to the first copper foil upper surface (110) of the first FPCB (100);
The voltage and current are applied to the second copper foil upper surface of the second FPCB 200 through the first copper foil bottom surface 120 of the first FPCB 100 via the via hole 140 of the first FPCB 100, The first copper foil bottom surface 120 of the first FPCB 100 and the second copper foil top surface 210 of the second FPCB 200 are electrically welded to each other to form two different FPCBs Layered FPCB.
KR1020150075392A 2015-05-28 2015-05-28 Multilayer fpcb and fabricating method thereof KR20160139829A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102274450B1 (en) * 2020-01-07 2021-07-08 삼원액트 주식회사 Inductive sensor manufacturing method and inductive sensor manufactured thereby

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060128168A (en) 2005-06-09 2006-12-14 주식회사 비에이치 Multi layer type fpcb manufacture method using both copper board
KR20140081460A (en) 2012-12-21 2014-07-01 삼성전기주식회사 The method of menufacturing build-up layer of pcb

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060128168A (en) 2005-06-09 2006-12-14 주식회사 비에이치 Multi layer type fpcb manufacture method using both copper board
KR20140081460A (en) 2012-12-21 2014-07-01 삼성전기주식회사 The method of menufacturing build-up layer of pcb

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102274450B1 (en) * 2020-01-07 2021-07-08 삼원액트 주식회사 Inductive sensor manufacturing method and inductive sensor manufactured thereby

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