CN215991415U - Novel high multilayer circuit board pressfitting positioning tool - Google Patents
Novel high multilayer circuit board pressfitting positioning tool Download PDFInfo
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- CN215991415U CN215991415U CN202122660779.8U CN202122660779U CN215991415U CN 215991415 U CN215991415 U CN 215991415U CN 202122660779 U CN202122660779 U CN 202122660779U CN 215991415 U CN215991415 U CN 215991415U
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Abstract
The utility model discloses a novel high multilayer circuit board pressing positioning tool, which comprises a pin and at least two auxiliary boards, wherein the auxiliary boards are rectangular, the length and the width of each auxiliary board are 0.5-2.5 inches longer than the circuit board to be pressed, the thickness of each auxiliary board is 2-5 mm, at least eight pin holes corresponding to the pin are arranged on each auxiliary board, the positions of all the pin holes on the auxiliary boards are asymmetrically distributed to play a foolproof role, at least two pin holes are arranged on the auxiliary boards close to each edge, and the length of the pin is 0.5-1.5 mm less than the sum of the thicknesses of the auxiliary boards and the circuit board to be pressed. The utility model solves the problem that the high multilayer circuit board with small hole-to-line size is easy to have layer deviation risk in the pressing process.
Description
Technical Field
The utility model belongs to the technical field of circuit board production, and particularly relates to a novel high multilayer circuit board pressing and positioning tool.
Background
At present, the circuit board is higher and higher in level, the hole-to-line is smaller and smaller, the number of easy-to-slide plate materials is increased, and the risk of layer deviation is higher and higher due to the factors for pressing. Particularly, in the existing hot melting process or hot melting and riveting process, when a board with more than 30 layers and the hole-to-line length of less than or equal to 8 mils is processed, the layer deflection risk is extremely high. That is to say, the high multilayer circuit board with small hole-to-line is easy to have layer deviation risk in the pressing process.
Therefore, it is necessary to design a novel high multi-layer circuit board pressing and positioning tool for assisting the pressing of the high multi-layer circuit board.
Disclosure of Invention
The utility model aims to provide a novel high multilayer circuit board pressing and positioning tool to solve the problem that the high multilayer circuit board with small hole-to-line thickness is easy to have layer deviation risk in the pressing process in the prior art.
In order to achieve the purpose, the utility model provides a novel high multilayer circuit board pressing positioning tool which comprises a pin and at least two auxiliary boards, wherein each auxiliary board is rectangular, the length and the width of each auxiliary board are 0.5-2.5 inches longer than the circuit board to be pressed, the thickness of each auxiliary board is 2-5 mm, at least eight pin holes corresponding to the pin are formed in each auxiliary board, the positions of all the pin holes in each auxiliary board are asymmetrically distributed to play a foolproof role, at least two pin holes are formed in the positions, close to each edge, of each auxiliary board, and the length of the pin is 0.5-1.5 mm less than the sum of the thicknesses of the auxiliary board and the circuit board to be pressed.
In a specific embodiment, the novel high multilayer circuit board pressing and positioning tool comprises three auxiliary boards, wherein one auxiliary board is arranged below the circuit board to be pressed, and the other two auxiliary boards are arranged above the circuit board to be pressed in an overlapped mode.
In a specific embodiment, the diameter of the pin is 2-5 mm.
In a specific embodiment, the pin has a diameter of 3.175 mm.
In a specific embodiment, eight pin holes are provided in the auxiliary plate.
In a specific embodiment, the auxiliary plate is an FR-4 light plate.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model solves the problem that the high multilayer circuit board with small hole-to-line size is easy to have layer deviation risk in the pressing process.
The utility model is adopted to press the high multilayer circuit board, and the interlayer offset can be ensured to be less than or equal to 3 mil.
In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic cross-sectional view of one embodiment of the present invention in use;
FIG. 2 is a schematic view of an auxiliary plate according to an embodiment of the present invention;
wherein, 1, an auxiliary plate; 2. a pin; 3. pressing the circuit board; 11. a pin hole.
Detailed Description
Embodiments of the utility model will be described in detail below with reference to the drawings, but the utility model can be implemented in many different ways, which are defined and covered by the claims.
The utility model provides a novel high multilayer circuit board pressing and positioning tool which comprises a pin 2 and at least two auxiliary boards 1, wherein each auxiliary board 1 is rectangular, the length and the width of each auxiliary board 1 are 0.5-2.5 inches longer than the circuit board 3 to be pressed, the thickness of each auxiliary board 1 is 2-5 mm, at least eight pin holes 11 corresponding to the pin 2 are formed in each auxiliary board 1, the positions of all the pin holes 11 on the auxiliary boards 1 are asymmetrically distributed to play a foolproof role, at least two pin holes 11 are formed in the auxiliary boards 1 close to each edge, and the length of each pin 2 is 0.5-1.5 mm less than the sum of the thicknesses of the auxiliary boards 1 and the circuit board 3 to be pressed.
Novel high multilayer circuit board pressfitting positioning tool includes three accessory plates 1, and wherein an accessory plate 1 sets up in the below of treating pressfitting circuit board 3, and two accessory plates 1 overlap the setting in the top of treating pressfitting circuit board 3 in addition.
The diameter of the pin 2 is 2-5 mm.
The pin 2 has a diameter of 3.175 mm.
Eight pin holes 11 are arranged on the auxiliary plate 1.
The auxiliary board 1 is an FR-4 light board.
Example 1
The circuit board to be pressed is required to be pressed: 32 plates, 5.0mm thick, 20 x 20 inches in size.
Punching 8 pin hole patterns on the circuit board to be laminated before laminating according to the design of the auxiliary board;
taking 3 FR-4 light plates with the thickness of 3.0mm as auxiliary plates, wherein the cutting size of the auxiliary plates is 22 x 22 inches, and corresponding pin hole positions are arranged in the auxiliary plates;
taking a pin, taking a pin with the length of 3 × 3+5-1 × 14-1 × 13mm, and taking a pin with the length of 3.175 × 13 mm;
sleeving 8 pins on a first FR-4 light plate at the bottom, sleeving an inner core plate and prepregs (namely circuit boards to be laminated) one by one, and sleeving the other two FR-4 light plates at the top end for normal lamination;
and after lamination, the pin and the auxiliary plate are detached, so that lamination processing is completed, and the layer deviation is less than or equal to 3 mil.
The foregoing is a more detailed description of the utility model in connection with specific preferred embodiments and it is not intended that the utility model be limited to these specific details. For those skilled in the art to which the utility model pertains, several simple deductions and substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.
Claims (6)
1. The utility model provides a novel high multilayer circuit board pressfitting positioning tool, a serial communication port, including pin (2) and two piece at least accessory boards (1), accessory board (1) is the rectangle, accessory board (1) length and width all than wait to pressfitting circuit board (3) 0.5 ~ 2.5 inches long, the thickness of accessory board (1) is 2 ~ 5mm, be provided with eight at least cotter holes (11) that correspond with pin (2) on accessory board (1), and all cotter holes (11) are asymmetric distribution in order to play the fool-proof effect in the position on accessory board (1), the position that is close to every limit on accessory board (1) is provided with two cotter holes (11) at least, the length ratio accessory board (1) of pin (2) and the thickness sum of waiting to pressfitting circuit board (3) is less by 0.5 ~ 1.5 mm.
2. The novel high multilayer circuit board pressing and positioning tool is characterized in that the novel high multilayer circuit board pressing and positioning tool comprises three auxiliary boards (1), wherein one auxiliary board (1) is arranged below a circuit board (3) to be pressed, and the other two auxiliary boards (1) are arranged above the circuit board (3) to be pressed in an overlapped mode.
3. The novel high multilayer circuit board pressing and positioning tool is characterized in that the diameter of the pin (2) is 2-5 mm.
4. The novel high multilayer circuit board pressing and positioning tool is characterized in that the diameter of the pin (2) is 3.175 mm.
5. The novel high multilayer circuit board pressing and positioning tool is characterized in that eight pin holes (11) are formed in the auxiliary board (1).
6. The tool for pressing and positioning the novel high multi-layer circuit board as claimed in claim 1, wherein the auxiliary board (1) is an FR-4 optical board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122660779.8U CN215991415U (en) | 2021-11-02 | 2021-11-02 | Novel high multilayer circuit board pressfitting positioning tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122660779.8U CN215991415U (en) | 2021-11-02 | 2021-11-02 | Novel high multilayer circuit board pressfitting positioning tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215991415U true CN215991415U (en) | 2022-03-08 |
Family
ID=80511700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122660779.8U Active CN215991415U (en) | 2021-11-02 | 2021-11-02 | Novel high multilayer circuit board pressfitting positioning tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215991415U (en) |
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2021
- 2021-11-02 CN CN202122660779.8U patent/CN215991415U/en active Active
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