CN202019499U - Riveting die for multilayer printed circuit board - Google Patents
Riveting die for multilayer printed circuit board Download PDFInfo
- Publication number
- CN202019499U CN202019499U CN2011201285880U CN201120128588U CN202019499U CN 202019499 U CN202019499 U CN 202019499U CN 2011201285880 U CN2011201285880 U CN 2011201285880U CN 201120128588 U CN201120128588 U CN 201120128588U CN 202019499 U CN202019499 U CN 202019499U
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- China
- Prior art keywords
- circuit board
- riveting die
- multilayer circuit
- utility
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a riveting die, in particular to a riveting die for a multilayer printed circuit board. The riveting die for the multilayer printed circuit board provided by the utility model comprises a platy body and sliding blocks, wherein two sides of the platy body are provided with positioning grooves; guide rail flanges are arranged on two side faces, which are parallel to each other, of each positioning groove; two sides of each sliding block are provided with guide rail grooves; the guide rail flanges are arranged on the guide rail grooves; and each sliding block is provided with a positioning column. The utility model has the advantages that: the riveting die for the multilayer printed circuit board provides positioning for riveting of the multilayer printed circuit board and is beneficial to improvement of riveting quality and efficiency.
Description
Technical field
The utility model relates to riveting die, relates in particular to a kind of riveting die of multilayer circuit board.
Background technology
1961, U.S. Hazelting Corp. delivered Multiplanar, was the pioneer who first opens the multi-layer sheet exploitation, and this kind mode is close to identical with utilizing the multiple-plate mode of plated-through-hole manufactured now.After this field of foot was striden by Japan in 1963, relevant multiple-plate various conception schemes, manufacture method were then popularized gradually in the whole world.Because of along with marching toward the integrated circuit epoch by electric crystal, after the application of computer is general gradually,, make that the wiring capacity is big, transmission characteristic is good becomes multiple-plate demand emphasis because of the demand of multifunction.6 layers and above wiring board are before pressing in the printed substrate, all need to use rivet driver that each layer of wiring board central layer riveted is fixed together, to avoid in the pressing process, each interlayer central layer is moved, thereby the interlayer dislocation causes the short circuit between pcb layer, and generation is scrapped, at present, the riveted efficient of multilayer circuit board is lower.
Summary of the invention
In order to solve the problems of the prior art, the utility model provides a kind of riveting die of multilayer circuit board.
The utility model provides a kind of riveting die of multilayer circuit board, comprise plate-like body and slide block, the both sides of described plate-like body are provided with detent, two sides that are parallel to each other of described detent are provided with track flanges, the both sides of described slide block are provided with guide rail groove, described track flanges is arranged on the described guide rail groove, and described slide block is provided with reference column.
As further improvement of the utility model, the other both sides of described plate-like body are provided with the riveted groove.
As further improvement of the utility model, described riveted groove is a U-lag.
As further improvement of the utility model, described riveted groove has two at least.
As further improvement of the utility model, described riveted groove has six.
As further improvement of the utility model, described track flanges and described guide rail groove are interference fit.
As further improvement of the utility model, described reference column is a shop bolt.
The beneficial effects of the utility model are: by such scheme, the riveted that can be multilayer circuit board provides the location, helps improving riveted quality and efficient.
Description of drawings
Fig. 1 is the structural representation of the riveting die of a kind of multilayer circuit board of the utility model;
Fig. 2 is the partial enlarged drawing of Slipper of the riveting die of multilayer circuit board described in the utility model.
Embodiment
Below in conjunction with description of drawings and embodiment the utility model is further specified.
Drawing reference numeral among Fig. 1 to Fig. 2 is: riveted groove 1; Slide block 2; Reference column 3; Track flanges 4; Detent 5.
Extremely shown in Figure 2 as Fig. 1, a kind of riveting die of multilayer circuit board, comprise plate-like body and slide block 3, the both sides of described plate-like body are provided with detent 5, two sides that are parallel to each other of described detent 5 are provided with track flanges 4, the both sides of described slide block 3 are provided with guide rail groove, and described track flanges 4 is arranged on the described guide rail groove, and described slide block 3 is provided with reference column 2.
To shown in Figure 2, the other both sides of described plate-like body are provided with riveted groove 1 as Fig. 1.Wherein, above the riveting die of multilayer circuit board there be and the complete corresponding riveted groove 1 of central layer rivet hole design, each riveted groove 1 is consistent with rivet hole Position Design on the central layer, left and right sides Y-axis center line symmetry, it also is up and down X-axis center line symmetry, riveted groove 1 can be a rational deployment according to core material with the distance of center line, and is consistent to the distance between center line design with the core material rivet hole; Can design 2 can about movable slide block (guarantee that riveting die can put the different wiring board of size, be fit to the operation of many sizes wiring board), the center is fixed with reference column 2 above the slide block, and location hole is big or small the same on the size of reference column 2 and the central layer.It is not loosening to guarantee that the central layer location hole is enclosed within on the reference column 2, does not damage the central layer location hole.
To shown in Figure 2, described riveted groove 1 is a U-lag as Fig. 1.
To shown in Figure 2, described riveted groove 1 has two at least as Fig. 1.
To shown in Figure 2, described riveted groove 1 has six as Fig. 1.
To shown in Figure 2, described track flanges 4 is an interference fit with described guide rail groove as Fig. 1.
To shown in Figure 2, described reference column 2 is a shop bolt as Fig. 1.
The riveting die of a kind of multilayer circuit board that can provide by the utility model carries out following riveted step:
A. layer pattern (designing rivet hole and location hole) in the central layer;
B. CCD practices shooting and gets out central layer rivet hole and location hole;
C. the central layer brown is handled;
D. central layer that the employee is good with brown and the location hole on the prepreg successively are enclosed within on the shop bolt on the riveting die according to row's plate structure of wiring board;
E. adjust the shop bolt position of riveting die, rivet hole on the central layer and the riveted groove 1 on the riveting die are fitted like a glove, and be in the positive center of riveted groove 1;
F. the riveted groove 1 on the riveting die being stuck on the overhead necklace of rivet driver (requires the overhead necklace to be higher than the board plane of putting of rivet driver, the height and the consistency of thickness of riveting die, when guaranteeing that riveting die is placed on the rivet driver, the rivet hole of riveted groove 1 position just in time is attached on the overhead necklace on the riveting die, not can owing to the reason of riveted groove 1 to sinking, thereby make rivet hole and whole wiring board at same horizontal plane, when guaranteeing down that rivet is smooth and easy and suppressing rivet, rivet is smooth), the position that makes rivet under the rivet driver thimble just in time with the rivet hole of central layer at same position, the rivet driver thimble is put rivet rivet hole into and is exerted pressure and makes rivet fix wiring board;
G. the laggard press of plate row's plate that riveted is good carries out pressing.
Can design the riveting die of 2 multilayer circuit boards, the operation of 2 employee's pipeline systems, 1 employee is responsible for being enclosed within on the riveting die central layer and lower plate, and other 1 employee operates rivet driver and carries out nail-plate.
The riveting die of a kind of multilayer circuit board provided by the utility model, the riveted that can be multilayer circuit board provides the location, helps improving riveted quality and efficient.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (7)
1. the riveting die of a multilayer circuit board, it is characterized in that: comprise plate-like body and slide block (3), the both sides of described plate-like body are provided with detent (5), two sides that are parallel to each other of described detent (5) are provided with track flanges (4), the both sides of described slide block (3) are provided with guide rail groove, described track flanges (4) is arranged on the described guide rail groove, and described slide block (3) is provided with reference column (2).
2. according to the riveting die of the described multilayer circuit board of claim 1, it is characterized in that: the other both sides of described plate-like body are provided with riveted groove (1).
3. according to the riveting die of the described multilayer circuit board of claim 2, it is characterized in that: described riveted groove (1) is a U-lag.
4. according to the riveting die of the described multilayer circuit board of claim 3, it is characterized in that: described riveted groove (1) has two at least.
5. according to the riveting die of the described multilayer circuit board of claim 4, it is characterized in that: described riveted groove (1) has six.
6. according to the riveting die of the described multilayer circuit board of claim 1, it is characterized in that: described track flanges (4) is an interference fit with described guide rail groove.
7. according to the riveting die of the described multilayer circuit board of claim 1, it is characterized in that: described reference column (2) is a shop bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201285880U CN202019499U (en) | 2011-04-27 | 2011-04-27 | Riveting die for multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201285880U CN202019499U (en) | 2011-04-27 | 2011-04-27 | Riveting die for multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202019499U true CN202019499U (en) | 2011-10-26 |
Family
ID=44813163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201285880U Expired - Fee Related CN202019499U (en) | 2011-04-27 | 2011-04-27 | Riveting die for multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202019499U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523690A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Manufacturing method of PCB board with blind slot containing IC foot |
| CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
| CN105722322A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | PIN installing machine |
| CN108307593A (en) * | 2018-04-08 | 2018-07-20 | 高德（无锡）电子有限公司 | A kind of thin plate core plate beats rivet fixture |
-
2011
- 2011-04-27 CN CN2011201285880U patent/CN202019499U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523690A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Manufacturing method of PCB board with blind slot containing IC foot |
| CN102523690B (en) * | 2011-12-26 | 2014-08-06 | 深圳市星河电路有限公司 | Manufacturing method of PCB board with blind slot containing IC foot |
| CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
| CN105722322A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | PIN installing machine |
| CN105722322B (en) * | 2014-12-03 | 2018-07-10 | 北大方正集团有限公司 | Upper PIN nailing machines |
| CN108307593A (en) * | 2018-04-08 | 2018-07-20 | 高德（无锡）电子有限公司 | A kind of thin plate core plate beats rivet fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO., LTD. Assignor: Shenzhen Suntak Circuit Technology Co., Ltd. Contract record no.: 2013440000531 Denomination of utility model: Riveting die for multilayer printed circuit board Granted publication date: 20111026 License type: Exclusive License Record date: 20131205 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111026 Termination date: 20160427 |