CN219876352U - False layer for pressing PCB and workpiece to be pressed - Google Patents
False layer for pressing PCB and workpiece to be pressed Download PDFInfo
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- CN219876352U CN219876352U CN202320412733.0U CN202320412733U CN219876352U CN 219876352 U CN219876352 U CN 219876352U CN 202320412733 U CN202320412733 U CN 202320412733U CN 219876352 U CN219876352 U CN 219876352U
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- layer
- pcb
- thickness
- copper foil
- pressing
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- 238000003825 pressing Methods 0.000 title claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 28
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims abstract description 14
- 229910000831 Steel Inorganic materials 0.000 abstract description 15
- 239000010959 steel Substances 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000002955 isolation Methods 0.000 abstract description 4
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 16
- 238000003475 lamination Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model discloses a false layer for pressing a PCB and a piece to be pressed, wherein the false layer for pressing the PCB comprises a carrier layer, a stripping layer and a copper foil layer which are sequentially overlapped along the thickness direction, and the thickness of the false layer is d 1 Wherein said d 1 The method meets the following conditions: d is less than or equal to 40 mu m 1 Less than or equal to 75 mu m. According to the utility model, the thickness of the false layer for pressing the PCB is thinner, and the false layer for pressing the PCB replaces the steel plate, so that a plurality of PCBs to be pressed can be placed between two isolation steel plates, the number of PCBs pressed each time can be increased, and the efficiency of pressing production can be improved.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a false layer for pressing a Printed Circuit Board (PCB) and a piece to be pressed.
Background
In the related art, the multilayer circuit board production process realizes layering by a pressing mode. Specifically, an inner layer plate is firstly manufactured, and then structural type layer-adding is carried out layer by layer through lamination. In order to fully cure the material to increase the stability between layers of the circuit board, each press-fit usually needs to be performed at a higher temperature and for a longer time, and the waiting time of the heating and cooling process is added, so that the single press-fit time of the common FR4 material is usually more than 4 hours, and the time required for high-speed material is longer. The press-fit stacking schematic diagram is shown in fig. 2, and different numbers of PCBs isolated by steel plates are placed between the cover plate and the chassis according to the plate thickness, and only one PCB can be placed between every two isolated steel plates, so that the production efficiency is low.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a dummy layer for laminating a PCB, which can improve the lamination and production efficiency of the PCB.
Another object of the present utility model is to provide a to-be-pressed member.
According to the first aspect of the utility model, the false layer for pressing the PCB comprises a carrier layer, a stripping layer and a copper foil layer which are sequentially stacked along the thickness direction, wherein the thickness of the false layer is d 1 Wherein said d 1 The method meets the following conditions: d is less than or equal to 40 mu m 1 ≤75μm。
According to the utility model, the thickness of the false layer for pressing the PCB is thinner, and the false layer for pressing the PCB replaces the steel plate, so that a plurality of PCBs to be pressed can be placed between two isolation steel plates, the number of PCBs pressed each time can be increased, and the efficiency of pressing production can be improved.
According to some embodiments of the utility model, the release layer is a high temperature resistant release film, and a release force of a side surface of the release film adjacent to the carrier layer is greater than a release force of a side surface of the release film adjacent to the copper foil layer in the thickness direction.
According to some embodiments of the utility model, the release force of the high temperature resistant release film adjacent to the carrier layer side surface is P 1 Wherein the P is 1 The method meets the following conditions: p (P) 1 Not less than 1.0N/25mm; and/or
The peeling force of the surface of the high-temperature resistant release film adjacent to one side of the copper foil layer is P 2 Wherein the P is 2 The method meets the following conditions: p (P) 2 ≤0.05N/25mm。
According to some embodiments of the utility model, the thickness of the release layer is d 2 Wherein said d 2 The method meets the following conditions: d is less than or equal to 20 mu m 2 Less than or equal to 30 mu m; preferably d 2 ＝25μm。
According to some embodiments of the utility model, the carrier layer has a thickness d 3 Wherein said d 3 The method meets the following conditions: d is more than or equal to 12 mu m 3 ≤35μm。
According to some embodiments of the utility model, the carrier layer is an electrodeposited copper foil.
According to some embodiments of the utility model, the copper foil layer has a thickness d 4 Wherein said d 4 The method meets the following conditions: d is less than or equal to 3 mu m 4 ≤15μm。
According to a second aspect of the present utility model, an embodiment of a to-be-pressed member includes: a plurality of PCB boards to be pressed; at least one dummy layer according to the embodiment of the first aspect of the present utility model is disposed between two adjacent PCB boards to be laminated.
According to some embodiments of the utility model, the PCB board to be laminated includes an upper copper foil, an upper prepreg, an inner layer board, a lower prepreg, and a lower copper foil stacked in order in a thickness direction.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a dummy layer for laminating a PCB according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a PCB board lamination;
fig. 3 is a schematic structural diagram of a PCB board to be laminated according to an embodiment of the present utility model; the method comprises the steps of carrying out a first treatment on the surface of the
FIG. 4 is a schematic structural view of an inner layer panel according to one embodiment of the present utility model;
FIG. 5 is a schematic structural view of an inner layer panel according to another embodiment of the present utility model;
fig. 6 is a schematic diagram of a stacked structure of two PCBs to be pressed together according to an embodiment of the present utility model.
Reference numerals:
100: a dummy layer;
1: a carrier layer; 2: a peeling layer; 3: a copper foil layer;
200: a PCB board;
4: copper foil; 5: a prepreg; 6: an inner layer plate; 61: a core plate;
300: and (3) a steel plate.
Detailed Description
Embodiments of the present utility model are described in detail below, and the embodiments described with reference to the drawings are exemplary, and the dummy layer 100 for pressing the PCB board 200 according to the first aspect of the present utility model is described below with reference to fig. 1 to 6. As shown in fig. 1, the dummy layer 100 for the laminated PCB board 200 includes a carrier layer 1, a peeling layer 2, and a copper foil layer 3, the carrier layer 1, the peeling layer 2, and the copper foil layer 3 being stacked in this order in the thickness direction. Wherein the thickness of the dummy layer 100 is d 1 Wherein d 1 The method meets the following conditions: d is less than or equal to 40 mu m 1 Less than or equal to 75 mu m. So arranged, if d 1 If the thickness of the dummy layer 100 is smaller than 40 μm, the pressure bearing capability in the lamination process is smaller, which may affect the lamination effect of the PCB 200. If d 1 If the thickness of the dummy layer 100 is greater than 75 μm, the number of the printed circuit boards 200 may be affected, thereby affecting the lamination efficiency of the printed circuit boards 200. By setting up, d 1 Satisfies d of 40 mu m 1 And less than or equal to 75 mu m, so that the dummy layer 100 for pressing the PCB 200 has strong bearing capacity, the number of the PCB 200 capable of being pressed is large, and the production efficiency of pressing the PCB is high.
The dummy layer 100 for the laminated PCB 200 according to the embodiment of the present utility model has a relatively small thickness, and the use of the dummy layer 100 for the laminated PCB 200 according to the embodiment of the present utility model instead of the steel plates 300 can realize that a plurality of PCBs to be laminated are placed between two isolation steel plates 300, so as to increase the number of PCBs to be laminated each time, thereby improving the efficiency of lamination production.
According to some embodiments of the present utility model, the release layer 2 is a high temperature resistant release film, so that the dummy layer 100 for laminating the PCB 200 can withstand a high lamination temperature. Specifically, the high temperature that the release layer 2 can withstand is 260 ℃ or higher. In the thickness direction (up-down direction indicated by an arrow in fig. 1), the peel force of the side surface of the release film adjacent to the carrier layer 1 is greater than the peel force of the side surface of the release film adjacent to the copper foil layer 3. By this arrangement, the peeling layers 2 have different peeling strengths on both sides, and the laminated board can be detached from the junction between the copper foil layer 3 and the peeling layer 2.
According to some embodiments of the utility model, the release force of the high temperature resistant release film adjacent to the side surface of the carrier layer 1 is P 1 Wherein P is 1 The method meets the following conditions: p (P) 1 1.0N/25mm. The high-temperature-resistant release film is overweight and large in stripping force, is difficult to separate, and is favorable for detaching the carrier layer 1 and the stripping layer 2 from the laminated board together.
According to some embodiments of the present utility model, the peel force of the high temperature resistant release film adjacent to the copper foil layer 3 side surface is P 2 Wherein P is 2 The method meets the following conditions: p (P) 2 Less than or equal to 0.05N/25mm. The surface of the high-temperature-resistant release film, which is contacted with the copper foil layer 3, is light in stripping, small in stripping force and easy to separate. The copper foil layer 3 is convenient to detach from the surface of the high-temperature-resistant release film, which is contacted with the copper foil layer 3.
According to some embodiments of the utility model, the thickness of the release layer 2 is d 2 Wherein d 2 The method meets the following conditions: d is less than or equal to 20 mu m 2 Less than or equal to 30 mu m. So arranged, if d 2 Less than 20 μm, the thickness of the peeling layer 2 is small, and the peeling force between the peeling layer 2 and the carrier layer 1, the peeling layer 2, and the copper foil layer 3 is small, possibly affecting the detachment of the dummy layer 100 from the laminated board. If d 2 If the thickness of the peeling layer 2 is greater than 30 μm, the thickness of the dummy layer 100 may be greater, thereby affecting the number of the pressed PCB boards 200 and thus affecting the pressing efficiency of the PCB boards 200. By setting up, d 2 Satisfies d of 20 mu m 2 Less than or equal to 30 mu m, thus strippingThe peeling force of the separation layer 2 is suitable, the number of the PCB boards 200 capable of being pressed is large, and the production efficiency of pressing the PCB is high.
According to some alternative embodiments of the utility model, d 2 By arranging in this way, the peel force of the peel layer 2 is more suitable, the number of PCB boards 200 that can be pressed together is more, and the production efficiency of pressing together PCBs is higher.
According to some embodiments of the utility model, the thickness of the carrier layer 1 is d 3 Wherein d 3 The method meets the following conditions: d is more than or equal to 12 mu m 3 And less than or equal to 35 mu m. So arranged, if d 3 If the thickness of the carrier layer 1 is smaller than 12 μm, the thickness of the dummy layer 100 for pressing the PCB 200 is smaller, so that the pressure bearing capability in the pressing process is smaller, and the pressing effect of the PCB 200 may be affected. If d 3 If the thickness of the carrier layer 1 is larger than 35 μm, the thickness of the dummy layer 100 may be larger, which affects the number of the pressed PCB boards 200 and thus affects the pressing efficiency of the PCB boards 200. By setting up, d 3 Satisfies d of 12 mu m 3 The thickness is less than or equal to 35 mu m, so that the dummy layer 100 for pressing the PCB 200 has strong bearing capacity, the number of the PCB 200 which can be pressed is large, and the production efficiency of pressing the PCB is high. In addition, the thickness of the carrier layer 1 may be 12 μm, 18 μm or 35 μm, but is not limited thereto.
According to some embodiments of the utility model, the carrier layer 1 is an electrodeposited copper foil. The structure is light and the cost is low.
According to some embodiments of the utility model, the copper foil layer 3 has a thickness d 4 Wherein d 4 The method meets the following conditions: d is less than or equal to 3 mu m 4 And is less than or equal to 15 mu m. If d 4 If the thickness of the copper foil layer 3 is smaller than 3 μm, the thickness of the dummy layer 100 for pressing the PCB 200 is smaller, so that the pressure bearing capacity in the pressing process is smaller, and the pressing effect of the PCB 200 may be affected. If d 4 If the thickness of the carrier layer 1 is larger than 15 μm, the thickness of the dummy layer 100 may be larger, which affects the number of the pressed PCB boards 200 and thus affects the pressing efficiency of the PCB boards 200. By setting up, d 4 Satisfies d of 3 mu m 4 And less than or equal to 15 mu m, so that the dummy layer 100 for pressing the PCB 200 has strong bearing capacity and can press the PCB 200The quantity is many, and pressfitting PCB's production efficiency is high. In addition, the thickness of the copper foil layer 3 may be 3 μm, 9 μm, 12 μm or 15 μm, but is not limited thereto.
According to an embodiment of the second aspect of the present utility model, as shown in fig. 6, the present utility model provides a to-be-laminated member, which includes a plurality of to-be-laminated PCB boards 200, at least one dummy layer 100 according to the embodiment of the first aspect of the present utility model, and the dummy layer 100 is disposed between two adjacent to-be-laminated PCB boards 200.
The working principle of the dummy layer 100 for the laminated PCB 200 of the utility model is as follows, the dummy layer 100 with the carrier layer 1, the stripping layer 2 and the copper foil layer 3 is used in the lamination process, so that two or more inner layers 6 can be placed between two steel plates, and the dummy layer 100 is removed after lamination is completed, thereby improving lamination efficiency.
With reference to fig. 2-6, the lamination process includes the following steps:
step one, stacking plates, wherein the number of the stacked plates is set according to the plate thickness. Referring to fig. 2 and 6, taking an example of stacking two PCBs between two steel plates 300, the operation method is as follows: inserting positioning pins on the tool board, and sequentially placing a buffer material, a lowest layer steel plate 300, a lower layer copper foil 4, a prepreg 5, an inner layer board 6, a prepreg 5, a dummy layer 100, the prepreg 5, the inner layer board 6, the prepreg 5 and an upper layer copper foil 4, wherein the inner layer board 6 can be a single core board 61 as shown in fig. 4; as shown in fig. 5, the inner panel 6 may be a plurality of core panels as well);
step two, pressing, namely selecting proper pressing parameters according to the material type of the prepreg 5 to press;
and thirdly, disassembling the PCB, namely disassembling the pressed PCB 200 from the stripping layer 2, and removing irregular burrs of the PCB by edge milling to finish the pressing of the PCB 200.
According to the to-be-laminated member of the embodiment of the present utility model, by adding one dummy layer 100, a plurality of to-be-laminated PCB boards 200 can be placed between two isolation steel plates 300 for lamination. Since the height of the press opening is constant, the number of steel plates 300 can be effectively reduced by adding one dummy layer 100, since the thickness of the dummy layer 100 (40 μm. Ltoreq.)d 1 75 μm) is much smaller than the thickness (about 1.6 mm) of the steel plate 300, so that the number of PCB boards 200 per press-fit can be increased, thereby improving press-fit efficiency.
According to some embodiments of the present utility model, as shown in fig. 3, the PCB board 200 to be laminated includes an upper copper foil 4, an upper prepreg 5, an inner layer board 6, a lower prepreg 5, and a lower copper foil 4 stacked in this order in the thickness direction. This arrangement ensures that the structure of the inner laminate 6 is not damaged during the lamination process. Wherein the inner layer plate 6 may comprise a plurality of core plates 61 or the inner layer plate 6 is a single Zhang Xinban.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A false layer for pressing PCB is characterized by comprising a carrier layer, a stripping layer and a copper foil layer which are sequentially overlapped along the thickness direction,
the thickness of the dummy layer is d 1 Wherein said d 1 The method meets the following conditions: d is less than or equal to 40 mu m 1 ≤75μm。
2. The laminated PCB panel of claim 1, wherein the release layer is a high temperature resistant release film, and the release film has a greater peel force in the thickness direction than the release film.
3. The laminated PCB panel of claim 2, wherein the high temperature resistant release film has a peel force P 1 Wherein the P is 1 The method meets the following conditions: p (P) 1 Not less than 1.0N/25mm; and/or
The peeling force of the surface of the high-temperature resistant release film adjacent to one side of the copper foil layer is P 2 Wherein the P is 2 The method meets the following conditions: p (P) 2 ≤0.05N/25mm。
4. The laminate PCB of claim 1, wherein the peel layer has a thickness d 2 Wherein said d 2 The method meets the following conditions: d is less than or equal to 20 mu m 2 ≤30μm。
5. The laminate PCB of claim 4, wherein d 2 Further satisfies: d, d 2 ＝25μm。
6. The laminate PCB of claim 1, wherein the carrier layer has a thickness d 3 Wherein said d 3 The method meets the following conditions: d is more than or equal to 12 mu m 3 ≤35μm。
7. The laminate PCB of claim 1, wherein the carrier layer is an electrolytic copper foil member.
8. The laminate PCB of claim 1, wherein the copper foil layer has a thickness d 4 Wherein said d 4 The method meets the following conditions: d is less than or equal to 3 mu m 4 ≤15μm。
9. A part to be pressed, comprising:
a plurality of PCB boards to be pressed;
at least one dummy layer according to any one of claims 1-8, said dummy layer being arranged between two adjacent PCB boards to be laminated.
10. The to-be-laminated member according to claim 9, wherein the to-be-laminated PCB board includes an upper copper foil, an upper prepreg, an inner layer board, a lower prepreg, and a lower copper foil which are laminated in this order in a thickness direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320412733.0U CN219876352U (en) | 2023-02-24 | 2023-02-24 | False layer for pressing PCB and workpiece to be pressed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320412733.0U CN219876352U (en) | 2023-02-24 | 2023-02-24 | False layer for pressing PCB and workpiece to be pressed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876352U true CN219876352U (en) | 2023-10-20 |
Family
ID=88324489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320412733.0U Active CN219876352U (en) | 2023-02-24 | 2023-02-24 | False layer for pressing PCB and workpiece to be pressed |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876352U (en) |
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2023
- 2023-02-24 CN CN202320412733.0U patent/CN219876352U/en active Active
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