JP2001127429A - Method for producing multilayer printed wiring board - Google Patents
Method for producing multilayer printed wiring boardInfo
- Publication number
- JP2001127429A JP2001127429A JP30235099A JP30235099A JP2001127429A JP 2001127429 A JP2001127429 A JP 2001127429A JP 30235099 A JP30235099 A JP 30235099A JP 30235099 A JP30235099 A JP 30235099A JP 2001127429 A JP2001127429 A JP 2001127429A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- carrier
- copper
- circuit
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、製造工程を減らし
て製造コストを低減することが可能な多層印刷配線板の
製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board capable of reducing manufacturing steps and manufacturing costs.
【０００２】[0002]
【従来の技術】従来より多層印刷配線板の製造法につい
ては各種の方法が提案されている。一般に、三層板を製
造する際には、両面銅張り積層板の片面に回路加工を施
し、さらにその上に銅箔をプリプレグを介して銅箔を積
層することにより三層板としている。製造方法として例
を挙げると、図４に示すように両面銅張り積層板２の両
面にフォトレジスト１をラミネートし、その片面に回路
パターンを描いたマスクフィルムを重ねて露光−現像−
エッチングし銅箔に回路形成する。その後、薬液により
両面のレジストを除去するとともに黒化処理を行い、さ
らにプリプレグにより銅箔を積層して内層回路を有する
三層板とするというものである。しかし、この方法では
銅箔のエッチングマスクの役割として用いる片面のフォ
トレジストや、その後の工程で銅箔を積層しない面の黒
化処理は不要なものになる。また、銅箔積層後の三層板
は黒化処理をされた面が残るために、その面に回路加工
を行う際に黒化処理を除去する工程が必要となる。さら
に薄物の多層板の場合、取り扱いの際に折れ等によって
破損してしまうというハンドリング上の問題も抱えてい
た。2. Description of the Related Art Various methods have heretofore been proposed for producing multilayer printed wiring boards. Generally, when manufacturing a three-layer board, a circuit processing is performed on one side of a double-sided copper-clad laminate, and a copper foil is further laminated on the copper foil via a prepreg to form a three-layer board. As an example of a manufacturing method, as shown in FIG. 4, a photoresist 1 is laminated on both sides of a double-sided copper-clad laminate 2, and a mask film on which a circuit pattern is drawn is overlapped on one side thereof, and is exposed-developed-
Etching and circuit formation on copper foil. Thereafter, the resist on both sides is removed with a chemical solution, blackening is performed, and copper foil is laminated by prepreg to form a three-layer plate having an inner layer circuit. However, this method does not require a single-sided photoresist used as an etching mask for the copper foil or a blackening treatment on a surface on which the copper foil is not laminated in a subsequent step. In addition, since the surface of the three-layer plate after the copper foil lamination has been subjected to the blackening treatment, a step of removing the blackening treatment when performing circuit processing on the surface is required. Further, in the case of a thin multilayer board, there is also a handling problem that the board is broken due to breakage or the like during handling.
【０００３】これらの問題を解決する方法として、図３
に示すように片面にフォトレジストを貼り付けた２枚の
銅張り積層板の、フォトレジストを貼り付けていないも
う一方の面同士を接着シート４で貼り合わせて回路加工
等を行い、レジストを除去した後黒化処理を行い、しか
る後接着シート４を剥離することにより２枚の両面板と
し、この回路形成面にプリプレグを介して銅箔を積層す
ることにより３層板とする多層板の製造方法（特開平８
−６４９６５号公報）が提案されているが、まだ充分と
は言い難く改良の余地があった。例えば、この方法で接
着力の強い接着シートを用いると、２枚の銅張り積層板
を剥離する際に基板の反りや折れ、ひどい場合には破損
してしまうこともある。また、接着力の弱い接着シート
を用いると、回路形成の際のエッチング液等の薬液が接
着界面に染込み、目的以外の部分がエッチングされてし
まったり、他工程に薬液が持ち込まれて汚染されてしま
うという問題が発生する。As a method for solving these problems, FIG.
As shown in, the two copper-clad laminates, each having a photo-resist bonded to one side, are bonded to each other without a photo-resist by an adhesive sheet 4 to perform circuit processing and the like, and the resist is removed. Then, a blackening treatment is performed, and then the adhesive sheet 4 is peeled off to form two double-sided boards, and a copper foil is laminated on the circuit forming surface via a prepreg to produce a three-layer board. Method (Japanese Unexamined Patent Publication
-64965) has been proposed, but there is still room for improvement because it is hardly sufficient. For example, if an adhesive sheet having a strong adhesive force is used in this method, the substrate may be warped or broken when the two copper-clad laminates are peeled off, or may be damaged in severe cases. In addition, when an adhesive sheet having a weak adhesive force is used, a chemical such as an etchant at the time of forming a circuit infiltrates the bonding interface, and a part other than the intended one is etched, or a chemical is brought into another process and contaminated. The problem that occurs.
【０００４】[0004]
【発明が解決しようとする課題】本発明はかかる実状に
鑑みなされたもので、基板の反りや折れ、あるいは薬液
の染込みがなく、製造工程を減らして製造コストを低減
することが可能な多層印刷配線板の製造方法を提供する
ことを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has no warpage or breakage of a substrate or infiltration of a chemical solution, and can reduce the number of manufacturing steps and reduce the manufacturing cost. An object of the present invention is to provide a method for manufacturing a printed wiring board.
【０００５】[0005]
【課題を解決するための手段】すなわち本願の第１発明
に係る多層印刷配線板の製造方法は、片面に銅箔を有す
る２枚のキャリア付き銅箔のキャリア面同士を接着剤に
より貼着する第１工程と、貼着されたキャリア付き銅箔
両面にプリプレグを介して銅箔を積層する第２工程と、
前記積層板の両面に回路加工する第３工程と、両回路加
工面に黒化処理を行うとともにプリプレグを介してさら
に銅箔を積層する第４工程と、前記積層板をキャリア面
から剥離する第５工程とを含んでなる多層印刷配線板の
製造方法に関し、また、本願の第２発明に係る多層印刷
配線板の製造方法は、両面に銅箔を有するキャリア付き
銅箔の両面にプリプレグを介して銅箔を積層する第１工
程と、前記積層板の両面に回路加工する第２工程と、両
回路加工面に黒化処理を行うとともにプリプレグを介し
てさらに銅箔を積層する第３工程と、前記積層板をキャ
リア面から剥離する第４工程とを含んでなる多層印刷配
線板の製造方法に関する。That is, in the method of manufacturing a multilayer printed wiring board according to the first invention of the present application, the carrier surfaces of two copper foils with a carrier having a copper foil on one side are adhered to each other with an adhesive. A first step and a second step of laminating a copper foil on both sides of the attached copper foil with a carrier via a prepreg,
A third step of performing circuit processing on both surfaces of the laminated plate, a fourth step of performing blackening treatment on both circuit processed surfaces and further laminating a copper foil via a prepreg, and a third step of peeling the laminated plate from the carrier surface. And a method for manufacturing a multilayer printed wiring board according to the second invention of the present application, wherein a copper foil with a carrier having copper foils on both sides is provided via prepregs on both sides. A first step of laminating copper foil, a second step of processing a circuit on both sides of the laminate, and a third step of performing a blackening treatment on both circuit processing surfaces and further laminating the copper foil via a prepreg. And a fourth step of peeling the laminate from the carrier surface.
【０００６】[0006]
【発明の実施の形態】本発明に係るキャリア付き銅箔
は、厚みが２０〜５０μｍの銅、アルミニウム等の表面
に銅メッキにより厚みが５〜１０μｍ程度の銅箔を形成
したもので、この銅箔はキャリア面から剥離することが
できるようになっており、ピーラブルタイプの銅箔と称
されている。キャリア付き銅箔同士を貼着する接着剤と
しては、後述のエッチングや黒化処理の薬剤に侵されな
いものであれば特に制約はないが、後で再剥離できるよ
うな接（粘）着シートが貼りつけが容易で作業性に優れ
ており好ましい。かかる接着剤の主成分としては、アク
リル酸系ポリマー又はメタアクリル酸系ポリマーが望ま
しく、具体的にはアクリル酸、メタアクリル酸、アクリ
ル酸アルキルエステル、メタアクリル酸アルキルエステ
ル、架橋のための官能基含有モノマーの共重合体及びそ
の変性物である。BEST MODE FOR CARRYING OUT THE INVENTION The copper foil with a carrier according to the present invention is obtained by forming a copper foil having a thickness of about 5 to 10 μm on a surface of copper or aluminum having a thickness of 20 to 50 μm by copper plating. The foil can be peeled off from the carrier surface, and is called a peelable type copper foil. The adhesive for bonding the copper foils with the carrier to each other is not particularly limited as long as it is not affected by an etching or blackening treatment agent described later. It is preferable because it can be easily attached and has excellent workability. As the main component of the adhesive, an acrylic acid polymer or a methacrylic acid polymer is desirable, and specifically, acrylic acid, methacrylic acid, alkyl acrylate, alkyl methacrylate, and a functional group for crosslinking. It is a copolymer of the contained monomer and a modified product thereof.
【０００７】第一の発明であるキャリア付き銅箔を用い
た３層板の製造法を図１により説明すると、まず片面に
銅箔を有する２枚のキャリア付き銅箔６、６’をキャリ
ア面同士を接着シート５により貼着し、さらにその両面
にプリプレグ３、３’を介して銅箔７、７’を積層して
銅張り積層板する。次にその両面の銅箔７、７’にフォ
トレジストをラミネートして回路パターンを焼付・現像
を行い、塩化第２銅溶液等の公知のエッチング剤により
エッチングして回路形成７１、７１’を行う。ついで、
前記回路形成面に残っているフォトレジストを除去し回
路形成面の黒化処理を行う。黒化処理は、カセイソー
ダ、亜塩素酸ソーダ、リン酸三ソーダ等からなる公知の
黒化溶液に浸漬することにより行われ、この黒化処理の
結果、回路の表面が粗化される。これは、次の工程で行
われる銅箔とプリプレグとの密着性を向上するためのも
のである。次に、黒化処理された回路形成面にプリプレ
グ３、３’を介して銅箔８、８’を熱圧着し、冷却後キ
ャリア界面から剥離することにより２枚の３層構造の配
線板を得る。第二の発明であるキャリアの両面に銅箔を
有するキャリア付き銅箔を用いた３層板の製造法を図２
により説明すると、ステンレスのようなキャリアの両面
に銅メッキにより銅箔を形成したキャリア付き銅箔９の
両面に、プリプレグ３、３’を介して銅箔７、７’を積
層して銅張り積層板する。次にその両面の銅箔７、７’
にフォトレジストをラミネートして回路パターンを焼付
・現像を行い、塩化第２銅溶液等の公知のエッチング剤
によりエッチングして回路形成７１、７１’を行う。以
降第一の発明と同様にして２枚の３層構造の配線板を得
る。A method of manufacturing a three-layer plate using a copper foil with a carrier according to the first invention will be described with reference to FIG. 1. First, two copper foils with a carrier 6, 6 'having a copper foil on one side are attached to the carrier surface. These are adhered to each other with an adhesive sheet 5, and copper foils 7, 7 'are laminated on both surfaces thereof via prepregs 3, 3' to form a copper-clad laminate. Next, a photoresist is laminated on the copper foils 7 and 7 'on both surfaces thereof, and a circuit pattern is baked and developed, and the circuit is formed by etching with a known etching agent such as a cupric chloride solution to form circuits 71 and 71'. . Then
The photoresist remaining on the circuit forming surface is removed, and the circuit forming surface is blackened. The blackening treatment is performed by dipping in a known blackening solution such as caustic soda, sodium chlorite, trisodium phosphate, etc. As a result of the blackening treatment, the surface of the circuit is roughened. This is for improving the adhesion between the copper foil and the prepreg performed in the next step. Next, copper foils 8 and 8 ′ are thermocompression-bonded to the blackened circuit formation surface via prepregs 3 and 3 ′, and after cooling, are peeled off from the carrier interface to form two three-layer wiring boards. obtain. FIG. 2 shows a method of manufacturing a three-layer plate using a copper foil with a carrier having copper foils on both sides of a carrier according to the second invention.
More specifically, copper foils 7 and 7 'are laminated via prepregs 3 and 3' on both sides of a copper foil 9 with a carrier in which copper foil is formed by copper plating on both sides of a carrier such as stainless steel. Board. Next, copper foil 7, 7 'on both sides
A circuit pattern is printed by laminating a photoresist, and the circuit pattern is baked and developed, and the circuit is formed by etching with a known etching agent such as a cupric chloride solution to form circuits 71 and 71 '. Thereafter, two wiring boards having a three-layer structure are obtained in the same manner as in the first invention.
【０００８】[0008]
【実施例】以下、本発明を実施例に基づいて説明するが
本発明は、これらの実施例により限定されるものではな
い。 実施例１ ピーラブルタイプのキャリア付き銅箔(古河電気工業
(株)製:９μｍ銅箔 商品名 DOUBLEHIN、キャリア４０μ
ｍ銅）３４０×５１０ｍｍ角２枚を両面粘着テープ(ニ
チバン(株):ナイスタック)にて、キャリア面同士を貼り
合わせ、その上下にガラス布基材エポキシ樹脂プリプレ
グ(日立化成工業(株)製ＧＥＡ−６７Ｎ 厚み８０μｍを
置き、更にその上下に１８μｍ銅箔(日本電解(株)製:Ｇ
Ｐ−１８μｍ）を配し、それらをＳＵＳ３０１ステンレ
ス板の間に挟み、熱プレスにて１８０℃・２５×１０４
Ｐａ、１時間加熱加圧して積層し銅張り積層板を得た。
次に、その両面にフォトレジストを貼り付け、両面に所
定の回路パターンを焼付現像を行い、塩化第２銅溶液に
よりエッチングして回路形成し、さらに回路形成面を黒
化処理した後、その回路面にプリプレグ(日立化成工業
(株)製：ＧＥＡ−６７Ｎ）０．１ｍｍを１枚づつおき、
さらに銅箔（日本電解（株）製：ＧＰ−１８）を載置、
多層化積層（１８０℃、１２０分、２０×１０4Ｐａ）
し、冷却後キャリア面から剥離し２枚の三層板を得た。
得られた三層板はキャリア端部に若干の腐食が見られた
が薬液の染込みもなく、キャリアからの剥離性も良く、
また反りの発生も問題ないものであった。 実施例２ 表面をアルカリ脱脂液で洗浄した、厚みが５０μｍのＳ
ＵＳ３０４ステンレス箔(粗さ:Ｒｚ１〜３μｍ)のコー
ナーを通電できる治具にて固定し、硫酸銅メッキ浴にて
２５℃、２．５Ａ／ｄｍ2の条件で電気めっきを行い、
片側１８μｍ厚の２枚の銅箔を有するキャリア付き銅箔
を得た。これに実施例１と同様にプリプレグ、銅箔を配
し、実施例１と同様の積層条件で、銅張り積層板を得
た。更に実施例１と同様に回路形成、銅箔の積層を行
い、キャリア面から剥離し２枚の三層板を得た。得られ
た三層板は実施例１と同様に、キャリア端部に若干の腐
食が見られたが薬液の染込みもなく、キャリアからの剥
離性も良く、また反りの発生も問題ないものであった。EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Example 1 Copper foil with peelable type carrier (Furukawa Electric Co., Ltd.)
Co., Ltd .: 9μm copper foil Product name DOUBLEHIN, carrier 40μ
(M copper) 340 x 510 mm square two sheets are bonded together with double-sided adhesive tape (Nichiban Co., Ltd .: Nystack), and a glass cloth base epoxy resin prepreg (manufactured by Hitachi Chemical Co., Ltd.) GEA-67N A thickness of 80 μm is placed, and an 18 μm copper foil (G
P-18 μm), sandwiching them between SUS301 stainless steel plates, and using a hot press at 180 ° C. and 25 × 104.
Pa was heated and pressurized for one hour to obtain a copper-clad laminate.
Next, a photoresist is stuck on both sides, a predetermined circuit pattern is baked and developed on both sides, a circuit is formed by etching with a cupric chloride solution, and a circuit forming surface is blackened. Prepreg (Hitachi Chemical Industry
(GEA-67N) 0.1 mm every other sheet,
Further, a copper foil (GP-18 manufactured by Nippon Electrolysis Co., Ltd.) is placed,
Multi-layer lamination (180 ° C, 120 minutes, 20 × 10 4 Pa)
After cooling, it was peeled off from the carrier surface to obtain two three-layer plates.
The obtained three-layer plate showed slight corrosion at the carrier edge, but there was no penetration of the chemical solution, and the peelability from the carrier was good,
Also, there was no problem of warpage. Example 2 50 μm thick S whose surface was washed with an alkaline degreasing solution
US304 stainless steel foil (roughness: Rz1-3 μm) corners are fixed with a jig that can conduct electricity, and electroplating is performed in a copper sulfate plating bath at 25 ° C. and 2.5 A / dm 2 ,
A copper foil with a carrier having two copper foils with a thickness of 18 μm on one side was obtained. A prepreg and a copper foil were disposed thereon in the same manner as in Example 1, and a copper-clad laminate was obtained under the same lamination conditions as in Example 1. Further, circuit formation and lamination of copper foil were carried out in the same manner as in Example 1, and peeled off from the carrier surface to obtain two three-layer plates. As in Example 1, the obtained three-layer plate showed slight corrosion at the carrier edge, but did not penetrate the chemical solution, had good releasability from the carrier, and had no problem of warpage. there were.
【０００９】比較例 両面銅張り積層板(日立化成工業(株)製:ＭＣＬ-Ｅ-６
７)０．０６ｍｍ１８μｍ両面板２枚の４辺をポリエス
テル粘着テープにてシールし、合わせ銅張り積層板を作
成した。更に実施例１と同様に回路形成、銅箔の積層を
行い、２枚の三層板を得た。得られた三層板は、シール
の一部にフクレやはがれがみられ、薬液の染込みが見ら
れた。Comparative Example Double-sided copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd .: MCL-E-6)
7) The four sides of two 0.06 mm 18 μm double-sided boards were sealed with a polyester adhesive tape to prepare a laminated copper-clad laminate. Further, circuit formation and copper foil lamination were performed in the same manner as in Example 1 to obtain two three-layer boards. In the obtained three-layer plate, swelling and peeling were observed in a part of the seal, and permeation of the chemical solution was observed.
【００１０】[0010]
【発明の効果】本発明によれば、基板の反りや折れ、あ
るいは薬液の染込みがなく、エッチング、黒化処理回路
加工、さらには銅箔積層の加工費や材料費を大幅に低減
することが可能である。According to the present invention, there is no warpage or breakage of a substrate, or a chemical solution is impregnated, and the processing cost and material cost of etching, blackening circuit processing, and copper foil lamination are greatly reduced. Is possible.
【図１】 本発明にかかるキャリア付き銅箔（片面）を
用いた多層板の製造工程を示す。FIG. 1 shows a manufacturing process of a multilayer board using a copper foil with a carrier (one side) according to the present invention.
【図２】 本発明にかかるキャリア付き銅箔（両面）を
用いた多層板の製造工程を示す。FIG. 2 shows a manufacturing process of a multilayer board using the copper foil with carrier (both sides) according to the present invention.
【図３】 両面接着シートを用いた銅張り積層板貼合せ
による三層板の製造工程を示す。FIG. 3 shows a process for producing a three-layer board by laminating a copper-clad laminate using a double-sided adhesive sheet.
【図４】 一般的なフォトレジストを用いた三層板の製
造工程を示す。FIG. 4 shows a manufacturing process of a three-layer plate using a general photoresist.
１ フォトレジスト ２ 両面銅張り積層板 ３、３’プリプレグ ４ 接着シート ５ 接着剤 ６、６’キャリア付き銅箔 （片面銅箔） ７、７’、８、８’ 銅箔 ９、キャリア付き銅箔（両面銅箔） Reference Signs List 1 photoresist 2 double-sided copper-clad laminate 3, 3 'prepreg 4 adhesive sheet 5 adhesive 6, 6' copper foil with carrier (single-sided copper foil) 7, 7 ', 8, 8' copper foil 9, copper foil with carrier (Double-sided copper foil)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 横澤 舜哉 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館事業所内 Ｆターム(参考） 5E346 CC32 CC34 DD44 EE09 EE13 EE19 GG18 GG22 GG27 GG28 HH31 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor: Shunya Yokozawa 1500 Ogawa, Oji, Shimodate-shi, Ibaraki F-term (reference) in Shimodate Works of Hitachi Chemical Co., Ltd. 5E346 CC32 CC34 DD44 EE09 EE13 EE19 GG18 GG22 GG27 GG28 HH31
Claims (2)
箔のキャリア面同士を接着剤により貼着する第１工程
と、貼着されたキャリア付き銅箔両面にプリプレグを介
して銅箔を積層する第２工程と、前記積層板の両面に回
路加工する第３工程と、両回路加工面に黒化処理を行う
とともにプリプレグを介してさらに銅箔を積層する第４
工程と、前記積層板をキャリア面から剥離する第５工程
とを含んでなる多層印刷配線板の製造方法。1. A first step of adhering carrier surfaces of two copper foils with a carrier having a copper foil on one side to each other with an adhesive, and a copper foil via a prepreg on both sides of the copper foil with a carrier attached. A second step of laminating a circuit board, a third step of processing a circuit on both sides of the laminate, and a fourth step of performing a blackening treatment on both circuit processing surfaces and further laminating a copper foil via a prepreg.
A method for manufacturing a multilayer printed wiring board, comprising: a step of removing the laminate from a carrier surface.
面にプリプレグを介して銅箔を積層する第１工程と、前
記積層板の両面に回路加工する第２工程と、両回路加工
面に黒化処理を行うとともにプリプレグを介してさらに
銅箔を積層する第３工程と、前記積層板をキャリア面か
ら剥離する第４工程とを含んでなる多層印刷配線板の製
造方法。2. A first step of laminating a copper foil on both sides of a copper foil with a carrier having a copper foil on both sides via a prepreg, a second step of processing a circuit on both sides of the laminate, and both circuit processing surfaces. And a fourth step of laminating a copper foil via a prepreg and a fourth step of peeling the laminate from a carrier surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30235099A JP2001127429A (en) | 1999-10-25 | 1999-10-25 | Method for producing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30235099A JP2001127429A (en) | 1999-10-25 | 1999-10-25 | Method for producing multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001127429A true JP2001127429A (en) | 2001-05-11 |
Family
ID=17907867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30235099A Pending JP2001127429A (en) | 1999-10-25 | 1999-10-25 | Method for producing multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001127429A (en) |
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|---|---|---|---|---|
| JP2010080595A (en) * | 2008-09-25 | 2010-04-08 | Hitachi Chem Co Ltd | Method of manufacturing three-layer wiring board |
| JP2010098086A (en) * | 2008-10-16 | 2010-04-30 | Shinko Electric Ind Co Ltd | Method of manufacturing wiring board |
| JP2010199616A (en) * | 2010-05-12 | 2010-09-09 | Shinko Electric Ind Co Ltd | Method of manufacturing wiring board |
| JP2011235537A (en) * | 2010-05-11 | 2011-11-24 | Jx Nippon Mining & Metals Corp | Copper foil laminated body and method for manufacturing laminated sheet |
| WO2012043742A1 (en) * | 2010-09-29 | 2012-04-05 | 日立化成工業株式会社 | Method for manufacturing package substrate for semiconductor element mounting |
| JP2012178601A (en) * | 2009-12-01 | 2012-09-13 | Samsung Electro-Mechanics Co Ltd | Metal laminate board and method of manufacturing core substrate using the same |
| JP2013069745A (en) * | 2011-09-21 | 2013-04-18 | Panasonic Corp | Support body and method for manufacturing printed wiring board |
| JP2013229640A (en) * | 2013-08-16 | 2013-11-07 | Jx Nippon Mining & Metals Corp | Metal foil with carrier |
| WO2014109357A1 (en) * | 2013-01-09 | 2014-07-17 | 日立化成株式会社 | Method for producing wiring board and laminate with supporting material |
| JP2014135344A (en) * | 2013-01-09 | 2014-07-24 | Hitachi Chemical Co Ltd | Wiring board manufacturing method |
| JP2015199355A (en) * | 2014-03-31 | 2015-11-12 | Jx日鉱日石金属株式会社 | Carrier-provided copper foil, printed wiring board, laminate, laminate sheet, electronic equipment and method of producing printed wiring board |
| JP2015212076A (en) * | 2014-03-26 | 2015-11-26 | Jx日鉱日石金属株式会社 | Laminate made up of resin tabular carrier and metal layer |
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1999
- 1999-10-25 JP JP30235099A patent/JP2001127429A/en active Pending
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|---|---|---|---|---|
| JP2010080595A (en) * | 2008-09-25 | 2010-04-08 | Hitachi Chem Co Ltd | Method of manufacturing three-layer wiring board |
| JP2010098086A (en) * | 2008-10-16 | 2010-04-30 | Shinko Electric Ind Co Ltd | Method of manufacturing wiring board |
| JP4533449B2 (en) * | 2008-10-16 | 2010-09-01 | 新光電気工業株式会社 | Wiring board manufacturing method |
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| JP2011235537A (en) * | 2010-05-11 | 2011-11-24 | Jx Nippon Mining & Metals Corp | Copper foil laminated body and method for manufacturing laminated sheet |
| JP4546581B2 (en) * | 2010-05-12 | 2010-09-15 | 新光電気工業株式会社 | Wiring board manufacturing method |
| JP2010199616A (en) * | 2010-05-12 | 2010-09-09 | Shinko Electric Ind Co Ltd | Method of manufacturing wiring board |
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| WO2014109357A1 (en) * | 2013-01-09 | 2014-07-17 | 日立化成株式会社 | Method for producing wiring board and laminate with supporting material |
| JP2014135344A (en) * | 2013-01-09 | 2014-07-24 | Hitachi Chemical Co Ltd | Wiring board manufacturing method |
| JP2013229640A (en) * | 2013-08-16 | 2013-11-07 | Jx Nippon Mining & Metals Corp | Metal foil with carrier |
| JP2015212076A (en) * | 2014-03-26 | 2015-11-26 | Jx日鉱日石金属株式会社 | Laminate made up of resin tabular carrier and metal layer |
| JP2015199355A (en) * | 2014-03-31 | 2015-11-12 | Jx日鉱日石金属株式会社 | Carrier-provided copper foil, printed wiring board, laminate, laminate sheet, electronic equipment and method of producing printed wiring board |
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