CN109219273B - PCB laminating structure based on buffer material and laminating method - Google Patents
PCB laminating structure based on buffer material and laminating method Download PDFInfo
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- CN109219273B CN109219273B CN201811009660.0A CN201811009660A CN109219273B CN 109219273 B CN109219273 B CN 109219273B CN 201811009660 A CN201811009660 A CN 201811009660A CN 109219273 B CN109219273 B CN 109219273B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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Abstract
The invention discloses a PCB laminated plate structure based on a buffer material, wherein a middle layer is a mirror steel plate and a laminated unit; the mirror steel plates are symmetrically distributed on the upper side and the lower side of the laminated unit, a plurality of substrate units are arranged in the laminated unit, and the mirror steel plates are arranged between the adjacent substrate units; the substrate unit includes: the device comprises a plate to be pressed and buffer layers symmetrically distributed on the upper side and the lower side of the plate to be pressed; the buffer layer comprises a release film and a buffer material, and the release film is symmetrically distributed on the upper side and the lower side of the buffer material; the buffer material is a prepreg. The FR-4 prepreg is used as a buffer material, so that the temperature and pressure uniformity of the plate to be laminated during the lamination is improved, the thickness control of the plate is facilitated, and the phenomena of white spots on the laminated plate and layering, sliding plates and layer deviation inside the laminated plate are avoided.
Description
Technical Field
The invention relates to the technical field of lamination of printed multilayer circuit boards, in particular to a laminated board structure and a lamination method for PCB lamination based on buffer materials.
Background
With the rapid development of the electronic industry, the requirements of printed circuit boards are higher and higher, the number of layers of the printed circuit boards is more and more, the hole density of the circuit boards is increased, the hole diameter is small, the number of holes on one circuit board is up to thousands, and the hole diameter is 0.05-2.0 mm. With the development of the PCB towards thinning and circuit precision, the PCB substrate is required to be thinner and thinner, and meanwhile, the reliability of the PCB substrate is also required to be higher and higher.
According to the traditional PCB laminating method, kraft paper and a silica gel pad are used as buffer materials, when the thickness of an inner core plate is not more than 0.245mm and not less than 0.1mm, or the total thickness of a plate to be laminated after lamination is less than 1.0mm, and the requirement on the alignment precision of the plate to be laminated is high, the thickness precision of the plate to be laminated is difficult to control, the probability of white spots of the plate to be laminated is increased due to the non-uniformity of the temperature and the pressure of the plate to be laminated during lamination, and the quality problems of cavities and delamination can also occur in the plate to be laminated. Therefore, the conventional buffer material used in PCB lamination cannot fully satisfy the temperature and pressure buffer requirements in the PCB lamination process.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a laminated structure for PCB lamination based on a buffer material and a lamination method, wherein an FR-4 prepreg is adopted as the buffer material, so that the temperature and pressure uniformity of a plate to be laminated during lamination is improved, the thickness control of the plate is facilitated, and the phenomena of white spots of the laminated plate and layering, sliding and layer deviation of the laminated plate are avoided.
In order to achieve the purpose, the invention adopts the following technical scheme that:
the utility model provides a folded plate structure of PCB pressfitting based on buffer material, includes from top to bottom in proper order:
a first layer: a support tray;
a second layer: a kraft layer;
an intermediate layer: mirror steel plate, laminated unit; the mirror steel plates are symmetrically distributed on the upper side and the lower side of the laminated unit; a plurality of substrate units are arranged in the laminated unit, and a mirror steel plate is arranged between the adjacent substrate units; the substrate unit includes: the device comprises a plate to be pressed and buffer layers symmetrically distributed on the upper side and the lower side of the plate to be pressed; the buffer layer comprises a release film and a buffer material, and the release film is symmetrically distributed on the upper side and the lower side of the buffer material; the buffer material is a prepreg;
the penultimate layer: a kraft layer;
the bottom layer: a bearing plate.
The number of kraft paper of the kraft paper layer is 10-16, and the thickness of a single kraft paper is 0.15mm, namely the thickness of the kraft paper layer is 1.5-2.4 mm.
The board to be pressed comprises an inner core board and a PP sheet; the alignment precision of the plate to be pressed is less than 0.15 mm; the thickness of the inner core plate is not more than 0.254mm and not less than 0.1mm, or the total thickness of the plates to be pressed is not more than 1.0 mm.
The buffer material is 1-3 FR-4 prepregs, and the thickness of the buffer material is less than or equal to 0.5 mm.
The release film is a high-temperature resistant release film, the model is TF-50, and the manufacturer is an Italy LOTF brand.
A PCB stitching method based on buffer materials comprises the following steps:
s1, carrying out blackening or browning treatment on the inner-layer core board, and drying the inner-layer core board after the blackening or browning treatment;
s2, pre-stacking, wherein the pre-stacking is to stack and fix the inner core board and the PP sheet together according to a stack diagram required by PCB manufacturing, and the inner core board and the PP sheet after being stacked and fixed are the board to be pressed; the alignment precision of the plate to be pressed is less than 0.15 mm; the thickness of the inner core plate is not more than 0.254mm and not less than 0.1mm, or the total thickness of the plates to be pressed after pressing is not more than 1.0 mm; the PP sheet is a prepreg with a bonding effect;
s3, folding plate, the folding plate structure includes from top to bottom in proper order:
a first layer: a support tray;
a second layer: the kraft paper layer is 10-16 pieces of kraft paper, and the thickness of each piece of kraft paper is 0.15mm, namely the thickness of the kraft paper layer is 1.5-2.4 mm;
an intermediate layer: mirror steel plate, laminated unit; the mirror steel plates are symmetrically distributed on the upper side and the lower side of the laminated unit; a plurality of substrate units are arranged in the laminated unit, and a mirror steel plate is arranged between the adjacent substrate units; the substrate unit includes: the device comprises a plate to be pressed and buffer layers symmetrically distributed on the upper side and the lower side of the plate to be pressed; the buffer layer comprises a release film and a buffer material, and the release film is symmetrically distributed on the upper side and the lower side of the buffer material; the buffer material is 1-3 FR-4 prepregs, and the thickness of the buffer material is less than or equal to 0.5 mm; the model of the release film is TF-50, and the manufacturer is an Italy LOTF brand;
the penultimate layer: a kraft layer;
the bottom layer: a support tray;
and S4, pressing, namely putting the laminated plates into a vacuum pressing machine for pressing.
In step S2, the lamination and fixing process is a pin-lam or a non-pin lamination process mass-lam.
The invention has the advantages that:
(1) in the pressing process, the FR-4 prepreg starts to have fluidity at a certain temperature under the action of temperature and pressure and then slowly solidifies, and the FR-4 prepreg is used as a buffer material, so that the uniformity of the temperature and the pressure of the plate to be pressed during pressing is improved, the thickness precision of the plate is favorably controlled, and white spots of the plate to be pressed after pressing and layer deviation caused by layering and sliding plates are avoided.
(2) The invention separates each plate to be pressed by the mirror steel plate, and a buffer layer is arranged between the plate to be pressed and the mirror steel plate for buffering the temperature and the pressure.
(3) The invention is suitable for the lamination of the multilayer board with the inner layer core board thickness of not more than 0.254mm and not less than 0.1mm and high requirement on interlayer alignment precision.
Drawings
Fig. 1 is a schematic diagram of a laminated board structure of PCB lamination based on buffer material according to the present invention.
Fig. 2 is a flow chart of a method for PCB lamination based on a buffer material according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, a laminated board structure of PCB lamination based on buffer material sequentially includes from top to bottom:
a first layer: a support tray 10;
a second layer: a kraft layer 20;
an intermediate layer: mirror steel plate 30, lamination unit 50; the mirror steel plates 30 are symmetrically distributed on the upper and lower sides of the laminated unit 50; the laminated unit 50 is provided with a plurality of substrate units 40, and a mirror steel plate 30 is arranged between the adjacent substrate units 40; the substrate unit 40 includes: the plate pressing device comprises a plate to be pressed 420 and buffer layers 410 which are symmetrically distributed on the upper side and the lower side of the plate to be pressed 420; the buffer layer 410 comprises a release film 411 and a buffer material 412, and the release film 411 is symmetrically distributed on the upper side and the lower side of the buffer material 412; the buffer material 412 is an FR-4 prepreg;
the penultimate layer: a kraft layer 20;
the bottom layer: a support tray 10.
The number of kraft paper of the kraft paper layer 20 is 10-16, and the thickness of a single piece of kraft paper is 0.15mm, that is, the thickness of the kraft paper layer 20 is 1.5-2.4 mm.
The plate 420 to be pressed comprises an inner core plate and a PP sheet; the alignment precision of the plate 420 to be pressed is less than 0.15 mm; the thickness of the inner core plate is not more than 0.254mm and not less than 0.1mm, or the total thickness of the plates 420 to be pressed is not more than 1.0 mm; the PP sheet is a prepreg having an adhesive effect, and the type of the prepreg serving as the PP sheet may be the same as that of the prepreg serving as the buffer material 412.
The number of FR-4 prepregs of the buffer material 412 is 1-3, and the thickness of the buffer material 412 is less than or equal to 0.5 mm.
The release film 411 is a high-temperature resistant release film, the model is TF-50, and the manufacturer is Italy LOTF brand;
in the first embodiment, the lamination of twelve microwave boards is taken as an example.
As shown in fig. 2, a method for stitching a PCB based on a buffer material includes the following steps:
s1, carrying out blackening or browning treatment on the inner-layer core board after the pattern is made, and drying the inner-layer core board after the blackening or browning treatment; the blackening or browning treatment is to enhance the bonding force between the inner core plate and the PP sheet.
S2, pre-stacking, wherein the pre-stacking is to stack and fix the inner core plate and the PP sheet together according to a stack diagram required by the manufacturing, and the inner core plate and the PP sheet after being stacked and fixed are the plate 420 to be pressed;
the overlapping and fixing process is a pin positioning and pressing process pin-lam or a non-pin positioning and pressing process mass-lam;
the requirement of the alignment precision of the plate 420 to be pressed is less than 0.15mm, and the total plate thickness of the plate 420 to be pressed is 1.478 mm;
the inner core board is a framework of the PCB, is a double-sided copper-clad board and can be used as a double-sided board for manufacturing the inner layer; in this embodiment, the inner core board of the twelve-layer microwave board is made of Rogers RT6002, the thickness of the inner core board is 0.127mm, the thickness of the copper foil of the inner core board is 18 μm, the line width of the graphic lines of the inner core board is 0.1mm, and the line spacing of the graphic lines of the inner core board is 0.1 mm;
the PP sheet is a prepreg with a bonding effect, and in the embodiment, the PP sheet is FR-28-0040-50.
S3, folding plate, the folding plate structure includes from top to bottom in proper order:
a first layer: a support tray 10;
a second layer: the kraft paper layer 20, the number of kraft paper of the kraft paper layer 20 is 13, and the thickness of a single kraft paper is 0.15 mm;
an intermediate layer: mirror steel plate 30, lamination unit 50; the mirror steel plates 30 are symmetrically distributed on the upper and lower sides of the laminated unit 50; the laminated unit 50 is provided with a plurality of substrate units 40, and a mirror steel plate 30 is arranged between the adjacent substrate units 40; the substrate unit 40 includes: the plate pressing device comprises a plate to be pressed 420 and buffer layers 410 which are symmetrically distributed on the upper side and the lower side of the plate to be pressed 420; the buffer layer 410 comprises a release film 411 and a buffer material 412, and the release film 411 is symmetrically distributed on the upper side and the lower side of the buffer material 412; in this embodiment, the buffer material 412 is 1 prepreg with a thickness of 0.2mm and a high Tg value, and the model is S1000-2B 2116; the model of the release film 411 is TF-50, and the manufacturer is Italy LOTF brand;
the penultimate layer: the kraft paper layer 20, the number of kraft paper of the kraft paper layer 20 is 13, and the thickness of a single kraft paper is 0.15 mm;
the bottom layer: a support tray 10.
And S4, pressing, namely putting the laminated plates into a vacuum pressing machine for pressing, wherein the maximum temperature in the pressing process is 230 ℃.
And S5, after the pressing procedure is finished, taking out the plate 420 to be pressed after cooling to room temperature.
In the second embodiment, the lamination of the microwave four-layer board is taken as an example.
A PCB stitching method based on buffer materials comprises the following steps:
s1, carrying out blackening or browning treatment on the inner-layer core board after the pattern is made, and drying the inner-layer core board after the blackening or browning treatment; the blackening or browning treatment is to enhance the bonding force between the inner core plate and the PP sheet.
S2, pre-stacking, wherein the pre-stacking is to stack and fix the inner core plate and the PP sheet together according to a stack diagram required by the manufacturing, and the inner core plate and the PP sheet after being stacked and fixed are the plate 420 to be pressed;
the overlapping and fixing process is a pin positioning and pressing process pin-lam or a non-pin positioning and pressing process mass-lam;
the requirement of the alignment precision of the plate 420 to be pressed is less than 0.15mm, and the total plate thickness of the plate 420 to be pressed is 0.335 mm;
the inner core board is a framework of the PCB, is a double-sided copper-clad board and can be used as a double-sided board for manufacturing the inner layer; in this embodiment, the material of the inner core board of the microwave twelve-layer board is bio-benefit FR-4, the thickness of the inner core board is 0.1mm, the thickness of the copper foil of the inner core board is 18 μm, the line width of the pattern lines of the inner core board is 0.1mm, and the line spacing of the pattern lines of the inner core board is 0.1 mm;
the PP sheet is a prepreg for bonding, and in this embodiment, the PP sheet is S0401106.
S3, folding plate, the folding plate structure includes from top to bottom in proper order:
a first layer: a support tray 10;
a second layer: the kraft paper layer 20, the number of kraft paper of the kraft paper layer 20 is 13, and the thickness of a single kraft paper is 0.15 mm;
an intermediate layer: mirror steel plate 30, lamination unit 50; the mirror steel plates 30 are symmetrically distributed on the upper and lower sides of the laminated unit 50; the laminated unit 50 is provided with a plurality of substrate units 40, and a mirror steel plate 30 is arranged between the adjacent substrate units 40; the substrate unit 40 includes: the plate pressing device comprises a plate to be pressed 420 and buffer layers 410 which are symmetrically distributed on the upper side and the lower side of the plate to be pressed 420; the buffer layer 410 comprises a release film 411 and a buffer material 412, and the release film 411 is symmetrically distributed on the upper side and the lower side of the buffer material 412; in this embodiment, the buffer material 412 is 1 prepreg with a thickness of 0.2mm and a common Tg value, and the model is S04012116; the model of the release film 411 is TF-50, and the manufacturer is Italy LOTF brand;
the penultimate layer: the kraft paper layer 20, the number of kraft paper of the kraft paper layer 20 is 13, and the thickness of a single kraft paper is 0.15 mm;
the bottom layer: a support tray 10.
And S4, pressing, namely putting the laminated plates into a vacuum pressing machine for pressing, wherein the maximum temperature during pressing is 200 ℃ in the embodiment.
And S5, after the pressing procedure is finished, taking out the plate 420 to be pressed after cooling to room temperature.
In the invention, the number of the plates 420 to be pressed is one or more; the mirror steel plate 30 plays a role in isolating the plate 420 to be pressed; the FR-4 prepreg serving as the buffer material 412 has the effect of buffering temperature and pressure in a laminated plate structure, the FR-4 prepreg with a high Tg value or a common Tg value can be selected as the buffer material 412, the prepreg with the common Tg FR-4 value is selected when the highest temperature during pressing is less than or equal to 200 ℃, and the FR-4 prepreg with the high Tg value is selected when the highest temperature during pressing is greater than 200 ℃; the type of the prepreg as the PP sheet may be the same as that of the prepreg as the buffer material 412, and in the present invention, for cost reasons, an FR-4 prepreg is selected as the buffer material 412.
The invention is not to be considered as limited to the specific embodiments shown and described, but is to be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. The utility model provides a folded plate structure of PCB pressfitting based on buffer material which characterized in that includes from top to bottom in proper order:
a first layer: a support tray (10);
a second layer: a kraft layer (20);
an intermediate layer: a mirror steel plate (30) and a lamination unit (50); the mirror steel plates (30) are symmetrically distributed on the upper side and the lower side of the laminated unit (50); a plurality of substrate units (40) are arranged in the laminated unit (50), and a mirror steel plate (30) is arranged between the adjacent substrate units (40); the substrate unit (40) includes: the plate pressing machine comprises a plate to be pressed (420) and buffer layers (410) symmetrically distributed on the upper side and the lower side of the plate to be pressed (420); the buffer layer (410) comprises a release film (411) and a buffer material (412), and the release film (411) is symmetrically distributed on the upper side and the lower side of the buffer material (412); the buffer material (412) is a prepreg;
the penultimate layer: a kraft layer (20);
the bottom layer: a support tray (10);
the plate (420) to be pressed comprises an inner core plate and a PP sheet; the alignment precision of the plate to be pressed is less than 0.15 mm; the thickness of the inner core plate is not more than 0.254mm and not less than 0.1mm, or the total thickness of the plates (420) to be pressed after pressing is not more than 1.0 mm;
the buffer material (412) is 1-3 FR-4 prepregs, and the thickness of the buffer material (412) is less than or equal to 0.5 mm;
when the highest temperature in the pressing process is less than or equal to 200 ℃, the FR-4 prepreg with the common Tg value is selected as the buffer material (412); when the highest temperature during the pressing is more than 200 ℃, the FR-4 prepreg with a high Tg value is selected as the buffer material (412);
the to-be-laminated plate (420) is a microwave twelve-layer plate, and when the to-be-laminated plate (420), namely the microwave twelve-layer plate, is laminated, the used buffer material (412) is 1 prepreg with the thickness of 0.2mm and a high Tg value; the plate (420) to be laminated is a microwave four-layer plate, and when the plate (420) to be laminated, namely the microwave four-layer plate, is laminated, the used buffer material (412) is 1 prepreg with the thickness of 0.2mm and the common Tg value.
2. The laminated board structure of PCB lamination based on buffer material of claim 1, wherein the kraft paper layer (20) has 10-16 pieces of kraft paper, and the thickness of the kraft paper is 0.15mm, i.e. the thickness of the kraft paper layer (20) is 1.5-2.4 mm.
3. The laminated board structure of PCB based on buffer material as claimed in claim 1, wherein the release film (411) is a high temperature resistant release film model TF-50 manufactured by LOTF brand of Italy.
4. A PCB stitching method based on buffer materials is characterized by comprising the following steps:
s1, carrying out blackening or browning treatment on the inner-layer core board, and drying the inner-layer core board after the blackening or browning treatment;
s2, pre-stacking, wherein the pre-stacking is to stack and fix the inner core board and the PP sheet together according to a stack diagram required by PCB manufacture, and the inner core board and the PP sheet after being stacked and fixed are the board to be pressed (420); the alignment precision of the plate (420) to be pressed is less than 0.15 mm; the thickness of the inner core plate is not more than 0.254mm and not less than 0.1mm, or the total thickness of the plates (420) to be pressed after pressing is not more than 1.0 mm; the PP sheet is a prepreg with a bonding effect;
s3, the folded sheet structure includes from top to bottom in proper order:
a first layer: a support tray (10);
a second layer: the kraft paper layer (20), the kraft paper layer (20) is 10-16 pieces of kraft paper, the thickness of a single piece of kraft paper is 0.15mm, namely the thickness of the kraft paper layer (20) is 1.5-2.4 mm;
an intermediate layer: a mirror steel plate (30) and a lamination unit (50); the mirror steel plates (30) are symmetrically distributed on the upper side and the lower side of the laminated unit (50); a plurality of substrate units (40) are arranged in the laminated unit (50), and a mirror steel plate (30) is arranged between the adjacent substrate units (40); the substrate unit (40) includes: the plate pressing machine comprises a plate to be pressed (420) and buffer layers (410) symmetrically distributed on the upper side and the lower side of the plate to be pressed (420); the buffer layer (410) comprises a release film (411) and a buffer material (412), and the release film (411) is symmetrically distributed on the upper side and the lower side of the buffer material (412); the buffer material (412) is 1-3 FR-4 prepregs, and the thickness of the buffer material (412) is less than or equal to 0.5 mm; the model of the release film (411) is TF-50, and the manufacturer is an Italy LOTF brand;
the penultimate layer: a kraft layer (20);
the bottom layer: a support tray (10);
s4, pressing, namely putting the laminated plates into a vacuum pressing machine for pressing;
when the highest temperature in the pressing process is less than or equal to 200 ℃, the FR-4 prepreg with the common Tg value is selected as the buffer material (412); when the highest temperature during the pressing is more than 200 ℃, the FR-4 prepreg with a high Tg value is selected as the buffer material (412);
the to-be-laminated plate (420) is a microwave twelve-layer plate, and when the to-be-laminated plate (420), namely the microwave twelve-layer plate, is laminated, the used buffer material (412) is 1 prepreg with the thickness of 0.2mm and a high Tg value; the plate (420) to be laminated is a microwave four-layer plate, and when the plate (420) to be laminated, namely the microwave four-layer plate, is laminated, the used buffer material (412) is 1 prepreg with the thickness of 0.2mm and the common Tg value.
5. The method as claimed in claim 4, wherein in the step S2, the lamination process is a pin-lamination process or a non-pin-lamination process.
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| CN110121236A (en) * | 2019-05-07 | 2019-08-13 | 苏州浪潮智能科技有限公司 | A kind of double-side plug-in wiring board and manufacturing method |
| CN110996546A (en) * | 2019-12-31 | 2020-04-10 | 华宇华源电子科技（深圳）有限公司 | Method for enhancing surface pressure resistance of PCB (printed circuit board) |
| CN111757614A (en) * | 2020-07-03 | 2020-10-09 | 广东兴达鸿业电子有限公司 | Cushion pad for laminating multilayer board and laminating method of multilayer board |
| CN111844936A (en) * | 2020-07-09 | 2020-10-30 | 苏州鑫淼新材料科技有限公司 | Aluminum foil high-temperature composite buffer pad suitable for circuit board pressing |
| CN113056120A (en) * | 2021-02-06 | 2021-06-29 | 深圳市昶东鑫线路板有限公司 | Lamination method for preventing high-rise board from layer deviation |
| CN113473750B (en) * | 2021-06-30 | 2022-11-15 | 天津普林电路股份有限公司 | Lamination processing method of windowing laminated plate for aviation |
| CN117998770A (en) * | 2024-04-07 | 2024-05-07 | 广州添利电子科技有限公司 | Laminated board structure for improving bending of board in circuit board lamination process and manufacturing process thereof |
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| JPH09214137A (en) * | 1996-01-30 | 1997-08-15 | Ibiden Co Ltd | Manufacture of multilayered board |
| CN102573339A (en) * | 2012-01-18 | 2012-07-11 | 四会富士电子科技有限公司 | Process for laminating printed circuit board (PCB) with buried/blind via structure |
| CN105228380B (en) * | 2015-10-26 | 2018-04-06 | 江苏弘信华印电路科技有限公司 | A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre |
| CN105555032A (en) * | 2015-12-18 | 2016-05-04 | 深圳市新宇腾跃电子有限公司 | Press-fitting method and lamination structure for flexible circuit board |
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