CN110996546A - Method for enhancing surface pressure resistance of PCB (printed circuit board) - Google Patents
Method for enhancing surface pressure resistance of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN110996546A CN110996546A CN201911410416.XA CN201911410416A CN110996546A CN 110996546 A CN110996546 A CN 110996546A CN 201911410416 A CN201911410416 A CN 201911410416A CN 110996546 A CN110996546 A CN 110996546A
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- CN
- China
- Prior art keywords
- film
- pcb
- enhancing
- pressure resistance
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000010030 laminating Methods 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 238000002203 pretreatment Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a method for enhancing the pressure resistance of the surface of a PCB (printed circuit board), which comprises the following steps of: s1: designing cutting data of the PI film; s2: cutting the PI film to form a standby film; s3: carrying out film pasting pretreatment on the surface of the PCB; s4: pre-laminating the film to be used and the PCB to form a plate to be laminated; s5: and pressing the plates to be pressed to form a finished plate. The PCB reinforced by the method for enhancing the surface voltage endurance of the PCB provided by the embodiment of the invention has the voltage endurance value which can stably reach more than 3600VDC, and meets the voltage endurance requirement of the power supply PCB.
Description
Technical Field
The invention relates to the field of processing methods of electronic components, in particular to a method for enhancing the surface pressure resistance of a PCB (printed circuit board).
Background
Printed Circuit Boards (PCBs) are important electronic components, support members for electronic components, and carriers for electrical connection of electronic components. In almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronic devices, etc., as long as there are electronic components such as integrated circuits, printed wiring boards are used in order to electrically interconnect the various components. Different application scenes have different requirements on the voltage withstanding degree of the surface of the electronic circuit board. The conventional PCB has a withstand voltage of 1800VDC, and many power products have a PCB surface with a withstand voltage of 3600VDC, so that the conventional PCB needs to be enhanced in withstand voltage capability.
The conventional method for enhancing the voltage endurance capability of the PCB comprises the following steps:
1. increasing the thickness of the medium;
2. reducing the copper tooth height (i.e., using RTF copper foil instead);
3. increasing the ink thickness or overprinting the white blocks.
Experiments prove that the three methods can not meet the requirement of the voltage endurance capability of 3600VDC, so that a new method for increasing the voltage endurance capability of the PCB needs to be found.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a method for enhancing the voltage endurance of the surface of a PCB (printed circuit board), so as to meet the voltage endurance requirement of part of power PCBs at present.
In order to achieve the technical effect, the method for enhancing the surface pressure resistance of the PCB comprises the following steps:
s1: designing cutting data of the PI film;
s2: cutting the PI film to form a standby film;
s3: carrying out film pasting pretreatment on the surface of the PCB;
s4: pre-laminating the film to be used and the PCB to form a plate to be laminated;
s5: and pressing the plates to be pressed to form a finished plate.
As an improvement of the above method for enhancing the surface pressure resistance of the PCB board of the present invention, in step S1: the cutting data comprises the shape and thickness of the PI film; the initial thickness of the PI film is 50 um.
As an improvement of the above method for enhancing the surface pressure resistance of the PCB board of the present invention, in step S2: the thickness of the film to be used is 300um less than that of the PCB.
As an improvement of the above method for enhancing the surface pressure resistance of the PCB board of the present invention, in step S3: the pre-treatment of the film pasting is to carry out nickel-gold treatment on the PCB.
As an improvement of the above-mentioned method for enhancing the pressure resistance of the surface of the PCB board of the present invention, in step S4, the film to be used is pre-laminated with the PCB using a dummy laminator.
As an improvement of the above method for enhancing the surface pressure resistance of the PCB board of the present invention, in step S5: pressing the board to be pressed by using a method of combining a soft board and a hard board with a pressing board; before the lamination of the plate to be laminated, the surface is sequentially covered with a release film, a soft film and a hard film.
As a further improvement of the method for enhancing the pressure resistance of the surface of the PCB, the soft film is a silica gel pad.
As a further improvement of the above method for enhancing the pressure resistance of the surface of the PCB board, the hard film is a steel plate.
The PCB reinforced by the method for enhancing the surface voltage endurance of the PCB provided by the invention has the voltage endurance value which can stably reach more than 3600VDC, and meets the voltage endurance requirement of partial power supply PCBs.
The features and advantages of the present invention will become more apparent upon reading the detailed description of the embodiments of the invention in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a flowchart of a method for enhancing a surface voltage endurance of a PCB board according to an embodiment of the present invention;
fig. 2 is a model diagram of a soft and hard board combined with a pressing board according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a method for enhancing a surface pressure resistance of a PCB, for example, fig. 1 is a flowchart of the method provided by the embodiment of the present invention, which includes steps S1 to S5:
s1: designing the cutting data of the PI film. Specifically, the cutting data includes the shape and thickness of the PI film; in this example, the initial thickness of the PI film is 50 um.
S2: and cutting the PI film to form a film to be used. Specifically, the thickness of the film to be used is 300um less than the thickness of the PCB to be attached.
S3: and carrying out film pasting pretreatment on the surface of the PCB. Specifically, the pre-treatment of the film pasting is to perform nickel-gold treatment on the PCB.
S4: and pre-laminating the film to be used and the PCB to form a board to be laminated. Specifically, the standby film and the PCB are pre-laminated by using a false laminating machine.
S5: and pressing the to-be-pressed plates. Specifically, the plate to be pressed is pressed by a method of combining a soft plate and a hard plate with a pressing plate; in the laminating process, as shown in fig. 2, the surface of the plate to be laminated 1 is sequentially covered with a release film 2, a soft film 3 and a hard film 4.
In this embodiment, the soft membrane 3 is a silica gel pad; the hard film 4 is a steel plate.
The PCB reinforced by the method for enhancing the surface voltage endurance of the PCB provided by the embodiment of the invention has the voltage endurance value which can stably reach more than 3600VDC, and meets the voltage endurance requirement of the power supply PCB.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (8)
1. A method for enhancing the surface pressure resistance of a PCB (printed circuit board) is characterized by comprising the following steps:
s1: designing cutting data of the PI film;
s2: cutting the PI film to form a standby film;
s3: carrying out film pasting pretreatment on the surface of the PCB;
s4: pre-laminating the film to be used and the PCB to form a plate to be laminated;
s5: and pressing the plates to be pressed to form a finished plate.
2. The method of enhancing PCB board surface withstand voltage capability of claim 1, wherein in step S1:
the cutting data comprises the shape and thickness of the PI film; the initial thickness of the PI film is 50 um.
3. The method of enhancing PCB board surface withstand voltage capability of claim 1, wherein in step S2:
the thickness of the film to be used is 300um less than that of the PCB.
4. The method of enhancing PCB board surface withstand voltage capability of claim 1, wherein in step S3:
the pre-treatment of the film pasting is to carry out nickel-gold treatment on the PCB.
5. The method of enhancing PCB board surface withstand voltage capability of claim 1, wherein in step S4:
and pre-laminating the film to be used and the PCB by using a false laminating machine.
6. The method of enhancing PCB board surface withstand voltage capability of claim 1, wherein in step S5:
pressing the board to be pressed by using a method of combining a soft board and a hard board with a pressing board; before the lamination of the plate to be laminated, the surface is sequentially covered with a release film, a soft film and a hard film.
7. The method of claim 6, wherein the PCB board surface has a higher pressure resistance,
the soft membrane is a silica gel pad.
8. The method of claim 6, wherein the PCB board surface has a higher pressure resistance,
the hard film is a steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911410416.XA CN110996546A (en) | 2019-12-31 | 2019-12-31 | Method for enhancing surface pressure resistance of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911410416.XA CN110996546A (en) | 2019-12-31 | 2019-12-31 | Method for enhancing surface pressure resistance of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110996546A true CN110996546A (en) | 2020-04-10 |
Family
ID=70079784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911410416.XA Pending CN110996546A (en) | 2019-12-31 | 2019-12-31 | Method for enhancing surface pressure resistance of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110996546A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364126A (en) * | 2020-10-13 | 2022-04-15 | 昆山圆裕电子科技有限公司 | Laminating type material supplementing and laminating method for flexible circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100116528A1 (en) * | 2008-11-13 | 2010-05-13 | Samsung Techwin Co., Ltd. | Printed circuit board with multiple metallic layers and method of manufacturing the same |
| CN106572611A (en) * | 2016-10-21 | 2017-04-19 | 惠州市金百泽电路科技有限公司 | Cover film laminating method with flexible plate at outer layer |
| CN108184311A (en) * | 2017-12-28 | 2018-06-19 | 中山市泽优电子科技有限公司 | A kind of high pressure resistant process for manufacturing circuit board of high reflecting rate |
| CN109219273A (en) * | 2018-08-31 | 2019-01-15 | 安徽四创电子股份有限公司 | A kind of laminate structure and compression method of the PCB pressing based on padded coaming |
-
2019
- 2019-12-31 CN CN201911410416.XA patent/CN110996546A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100116528A1 (en) * | 2008-11-13 | 2010-05-13 | Samsung Techwin Co., Ltd. | Printed circuit board with multiple metallic layers and method of manufacturing the same |
| CN106572611A (en) * | 2016-10-21 | 2017-04-19 | 惠州市金百泽电路科技有限公司 | Cover film laminating method with flexible plate at outer layer |
| CN108184311A (en) * | 2017-12-28 | 2018-06-19 | 中山市泽优电子科技有限公司 | A kind of high pressure resistant process for manufacturing circuit board of high reflecting rate |
| CN109219273A (en) * | 2018-08-31 | 2019-01-15 | 安徽四创电子股份有限公司 | A kind of laminate structure and compression method of the PCB pressing based on padded coaming |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364126A (en) * | 2020-10-13 | 2022-04-15 | 昆山圆裕电子科技有限公司 | Laminating type material supplementing and laminating method for flexible circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20200410 |