CN105228380B - A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre - Google Patents
A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre Download PDFInfo
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- CN105228380B CN105228380B CN201510703156.0A CN201510703156A CN105228380B CN 105228380 B CN105228380 B CN 105228380B CN 201510703156 A CN201510703156 A CN 201510703156A CN 105228380 B CN105228380 B CN 105228380B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of gross thickness to be less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre, and it comprises the following steps：S1：Lamination, S2:X RAY practice shooting, S3：Milling edges of boards, S4：Copper, S5 is thinned:Outer layer drills, S6：Deburring, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film 1, S12：Outer-layer circuit exposes, S13：Development, S14:Outer-layer circuit etches DES, S15：Outer layer AOI is detected, S16：Welding resistance pre-treatment, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：Groove milling, S23：Take off lid, S24：Change gold, S25：First time silk-screen, S26：Toast for the first time, S27：Second of silk-screen, S28：Second of baking, S29：Milling plate, S30：Stamp, S31：Flying probe, S32：Product inspection FQC, S33：Packaging, S34：Storage.The present invention have it is simple to operate, be easy to carry out and the advantages of practicality and high efficiency.
Description
Technical field
It is rigid-flexible in middle four layers to be less than 0.32mm grafting hand the present invention relates to circuit board manufacture field, particularly gross thickness
With reference to board manufacturing method.
Background technology
With electronic product towards the development of frivolous, short and small, multifunction, it is necessary to wiring board should rigid printed board
Welding stability, have flexible printed wiring flexible again, such rigid-flex combined board is main development trend.It is but flexible
Printed wiring board would generally use what plug finger was connected with other components.Plug finger just goes out positioned at the intermediate layer of Rotating fields
Now finger is etched or etched away part caused by protection is improper, exists so designing a kind of gross thickness less than 0.32mm grafting hands
Four layers of middle rigid-flex combined board preparation method are just particularly important.
The content of the invention
The technical purpose of the present invention is that the pure copper layer of outer layer is replaced by using one side flexible substrate, utilizes the poly- of flexible substrate
Acid imide does diaphragm.It is not fragile in process of production using polyimides flexibility, also using polyimides softness in outer layer
It can be broken under the hardness effect of copper in the case where there is external force effect at the edge of copper.So the finger of internal layer after pressing all the time all
Liquid medicine will not be touched；A kind of manufacture craft with the rigid-flexible joint plate of superpower restoration is provided.
To solve above-mentioned technical problem, a kind of gross thickness of offer of the invention is less than 0.32mm grafting hand the four of centre
Layer rigid-flex combined board preparation method, it is characterised in that：Comprise the following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling edges of boards,
S4：Copper, S5 is thinned:Outer layer drills, S6：Deburring, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment,
S11：Outer laminated film 1, S12：Outer-layer circuit exposes, S13：Development, S14:Outer-layer circuit etching-DES, S15：Outer layer AOI is detected,
S16：Welding resistance pre-treatment, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：
Groove milling, S23：Take off lid (being torn together with flexible substrate and copper sheet, expose internal finger), S24：Change gold, S25：First time silk
Print (printing the character in positive rigid plate), S26：Toast for the first time, S27：Second of silk-screen (character in back up rigid plate),
S28：Second of baking, S29：Milling plate, S30：Stamp, S31：Flying probe, S32：Product inspection-FQC, S33：Packaging, S34：
Storage.
Further：Described step S1：Lamination is by four pieces of mould release membrances, two pieces of filling films, two by upper and lower two blocks of steel plates
Block flex plate, two pieces of prepregs and inner plating progress are hot-forming, and the both sides up and down of every piece of described filling film are connected with
One piece of mould release membrance, the both sides up and down of the inner plating are respectively connected with one piece of prepreg, and patch high temperature is held on described prepreg
The side of slide glass is connected with flex plate, and the outside of described two pieces of flex plates is respectively connected with one piece of mould release membrance.
Further：The Making programme of described inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：Drilling (is bored
Lamination positioning hole and exposure positioning hole), step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step
Rapid 6：Internal layer circuit etches, step 7：Internal layer AOI is detected, step 8：Roughening, step 9：Lamination cover layer, step 10：Lamination.
Further：The Making programme of described prepreg is as follows：Step 1：Sawing sheet, step 2：Drilling (is bored folded
Layer positioning hole), step 3：Groove milling (by the prepreg mill off in soft board region).
Further：The hot-forming method and step is a successively：First it is carried out using 1KG power tight for the first time
Pressure, it is 3min to press the time for the first time, carries out the temperature of first time heating, for the first time heating during pressing for the first time to it
Control is at 130 DEG C, duration of heat 3min, b：Then it is pressed for the second time using 2KG power, second of heating
Temperature control at 130 DEG C, duration of heat 15min, c:Then third time is carried out to it using 2KG power to press, the
It is 22min to press the time three times, carries out third time heating, the temperature control of third time heating during pressing for the third time to it
At 180 DEG C, duration of heat 5min, d：Then carry out the 4th time to it using 3KG power to press, the temperature of the 4th heating
Degree control is at 180 DEG C, duration of heat 60min, e：Then carry out the 5th time to it using 3KG power to press, the 5th time
It is 70min to press the time, the 5th heating is carried out to it during pressing for the 5th time, the temperature control of the 5th heating exists
180 DEG C, duration of heat 72min, f：Then the 6th time is carried out to it press using 3KG power, press the time the 6th time
For 60min, 180 DEG C of the temperature control of the 6th heating, duration of heat 55min, g：Then it is entered using 3KG power
Row presses for the 7th time, and it is 50min to press the time for the 7th time, carries out the 7th heating during pressing for the 7th time to it, and the 7th
20 DEG C of the temperature control of secondary heating, h：Finally the 8th time is carried out to it press using 1KG power, pressing the time for the 8th time is
5min。
Further：Described step S7：Need to use a kind of VCP upper grips during de-smear, on described VCP
The structure of chuck includes the first jig arm, the second jig arm, lead, spring and chuck, and the first described jig arm passes through bearing pin and
Two jig arm are connected, and described spring is arranged between the first jig arm and the second jig arm, the first described jig arm and the second jig arm
Lower end is respectively fixedly connected with a lead, and through hole, described folder are offered relative to the position of lead on described chuck
Headgear is provided with retaining mechanism, two is additionally provided with the inside of the chuck on lead between described chuck and lead
Individual projection, the inner side for being connected to chuck of described two projecting parallels.
Further：Described projection is connected by holding out against termination with threaded post and formed, and is offered on the inside of the chuck
First screwed hole, described threaded post are connected in the first screwed hole.
Further：Described retaining mechanism includes being opened in the second screwed hole and the clamping screw on the outside of chuck, described
Clamping screw pass through the second screwed hole and lead phase.
After said structure, the present invention replaces the pure copper layer of outer layer by using one side flexible substrate, utilizes flexible substrate
Polyimides do diaphragm.It is not fragile in process of production using polyimides flexibility, also existed using polyimides softness
It can be broken under the hardness effect of outer layer copper in the case where there is external force effect at the edge of copper.The finger of so internal layer begins after pressing
Eventually all without touching liquid medicine.
Brief description of the drawings
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description.
Fig. 1 is step S1：Structural representation in lamination process.
Fig. 2 is the structural representation of VCP upper grips.
Embodiment
The invention provides a kind of gross thickness to be less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre,
It comprises the following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling edges of boards, S4：Copper, S5 is thinned:Outer layer drills, S6：Unhairing
Thorn, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film 1, S12：Outer-layer circuit exposes
Light, S13：Development, S14:Outer-layer circuit etching-DES, S15：Outer layer AOI is detected, S16：Welding resistance pre-treatment, S17：Welding resistance is printed,
S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：Groove milling, S23：Take off lid (together with flexible substrate and
Copper sheet is torn together, exposes internal finger), S24：Change gold, S25：First time silk-screen (prints the character in positive rigid plate), S26：
Toast for the first time, S27：Second of silk-screen (character in back up rigid plate), S28：Second of baking, S29：Milling plate, S30：
Stamp, S31：Flying probe, S32：Product inspection-FQC, S33：Packaging, S34：Storage.
As shown in figure 1, described step S1：Lamination is by four pieces of mould release membrances, 9, two pieces of filling films by upper and lower two blocks of steel plates
10th, two pieces of flex plates, 11, two pieces of prepregs 12 and inner plating 13 carry out the upper and lower of hot-forming, described every piece of filling film 10
Both sides are respectively connected with one piece of mould release membrance 9, and the both sides up and down of the inner plating 13 are respectively connected with one piece of prepreg 12, and described half
The side that high temperature carrying tablet is pasted in cured sheets 12 is connected with flex plate 11, and the outside of described two pieces of flex plates 11 is respectively connected with one
Block mould release membrance 9.
The Making programme of above-mentioned inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：Drilling (bores lamination positioning hole
With exposure positioning hole), step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step 6：Interior layer line
Road etches, step 7：Internal layer AOI is detected, step 8：Roughening, step 9：Lamination cover layer, step 10：Lamination.
The Making programme of above-mentioned prepreg is as follows：Step 1：Sawing sheet, step 2：Drilling (bores lamination positioning hole),
Step 3：Groove milling (by the prepreg mill off in soft board region).
Above-mentioned hot-forming method and step is a successively：First it is carried out for the first time to press using 1KG power, for the first time
It is 3min to press the time, carries out first time heating during pressing for the first time to it, the temperature control of heating is 130 for the first time
DEG C, duration of heat 3min, b：Then it is pressed for the second time using 2KG power, the temperature control of second of heating
System is at 130 DEG C, duration of heat 15min, c:Then third time is carried out to it using 2KG power to press, press for the third time
Time is 22min, carries out third time heating during pressing for the third time to it, the temperature control of third time heating at 180 DEG C,
The duration of heat is 5min, d：Then carry out the 4th time to it using 3KG power to press, the temperature control of the 4th heating exists
180 DEG C, duration of heat 60min, e：Then the 5th time is carried out to it press using 3KG power, press the time the 5th time
For 70min, the 5th heating is carried out to it during pressing for the 5th time, the temperature control of the 5th heating is at 180 DEG C, heating
Duration is 72min, f：Then the 6th time is carried out to it press using 3KG power, it is 60min to press the time for the 6th time, the
180 DEG C of the temperature control of six heating, duration of heat 55min, g：Then the 7th time is carried out to it tightly using 3KG power
Pressure, it be 50min to press the time for the 7th time, and the 7th heating, the 7th temperature heated are carried out to it during pressing for the 7th time
20 DEG C of degree control, h：Finally the 8th time is carried out to it press using 1KG power, it is 5min to press the time for the 8th time.
The present invention replaces the pure copper layer of outer layer by using one side flexible substrate, is protected using the polyimides of flexible substrate
Film.It is not fragile in process of production using polyimides flexibility, also acted on using hardness of the polyimides softness in outer layer copper
Under can be broken in the case where there is external force effect at the edge of copper.So the finger of internal layer after pressing all the time all without touching medicine
Water.
Above-mentioned step S7：Need to use a kind of VCP upper grips, described VCP upper grips such as Fig. 2 during de-smear
Shown, its structure includes the first jig arm 1, the second jig arm 2, lead 5, spring 3 and chuck 6, and the first described jig arm 1 passes through pin
Axle 4 is connected with the second jig arm 2, and described spring 3 is arranged between the first jig arm 1 and the second jig arm 2, the first described jig arm 1
A lead 5 is respectively fixedly connected with the lower end of the second jig arm 2, is opened up on described chuck 6 relative to the position of lead 5
There is through hole, described chuck 6 is sleeved on lead 5, and retaining mechanism is provided between described chuck 6 and lead 5, described
The inner side of chuck 6 is additionally provided with two projections 8, the parallel inner side for being connected to chuck 6 of described two projections 8.It is first loose during work
The length that open locking mechanism is stretched into chuck 6 according to the different adjustment lead 5 for the rigid-flexible engagement plate thickness to be clamped, then
Again retaining mechanism is tightened, between rigid-flexible joint plate is subsequently placed on two chucks 6, passes through phase in the presence of spring 3
Clamping to rigid-flexible joint plate is completed to the projection 8 of setting, the utility model can stretch into the length of chuck by adjusting lead
Spend to change the clamping force of upper grip, so as to add the practical performance of upper grip.
Projection 8 as shown in Figure 2 is connected by holding out against termination with threaded post and formed, and the inner side of the chuck 6 offers the
One screwed hole, described threaded post are connected in the first screwed hole.The design can be connected into the first spiral shell by changing threaded post
The length of pit, to complete the regulation to upper grip clamping force, the length that threaded post stretches into is longer, and the clamping force of upper grip is got over
Greatly.
Retaining mechanism as shown in Figure 2 includes the second screwed hole and clamping screw 7 for being opened in the outside of chuck 6, described
Clamping screw 7 is connected through the second screwed hole with lead 5.When needing the clamping force to upper grip to be adjusted, lock is unclamped
Tight bolt 7 adjusts the length that lead 5 stretches into chuck 6, and then rotation lock bolt 7 makes it be in contact with lead 5, passes through lock
Tight bolt 7 makes chuck 6 that relative displacement no longer occur with lead 5, so as to complete the regulation to upper grip clamping force.The design is also
The advantages of with simple in construction, easily fabricated and practicality and high efficiency.
Claims (3)
1. a kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre, it is characterised in that：Bag
Include following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling edges of boards, S4：Copper, S5 is thinned:Outer layer drills, S6：Deburring, S7：
De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film 1, S12：Outer-layer circuit exposes, S13：
Development, S14:DES, S15：Outer layer AOI is detected, S16：Welding resistance pre-treatment, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes
Light, S20：Welding resistance is developed, S21：After bake, S22：Groove milling, S23：Lid is taken off, is torn together with flexible substrate and copper sheet, is exposed interior
Portion's finger, S24：Change gold, S25：First time silk-screen, print the character in positive rigid plate, S26：Toast for the first time, S27：Second
Silk-screen, the character in back up rigid plate, S28：Second of baking, S29：Milling plate, S30：Stamp, S31：Flying probe, S32：
FQC, S33：Packaging, S34：Storage；
Described step S1：Lamination is to be scratched four pieces of mould release membrances (9), two pieces of filling films (10), two pieces by upper and lower two blocks of steel plates
Property plate (11), two pieces of prepregs (12) and inner plating (13) carry out hot-forming, described every piece of filling film (10) up and down
Both sides are respectively connected with one piece of mould release membrance (9), and the both sides up and down of the inner plating (13) are respectively connected with one piece of prepreg (12), institute
The side that high temperature carrying tablet is pasted on the prepreg (12) stated is connected with flex plate (11), described two pieces of flex plates (11) outside
Side is respectively connected with one piece of mould release membrance (9)；
The Making programme of described inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：Drilling, bore lamination positioning hole and exposure
Light-seeking hole, step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step 6：Internal layer circuit loses
Carve, step 7：Internal layer AOI is detected, step 8：Roughening, step 9：Lamination cover layer, step 10：Lamination；
The Making programme of described prepreg is as follows：Step 1：Sawing sheet, step 2：Drilling, bore lamination positioning hole, step
3：Groove milling, the prepreg mill off by soft board region；
The hot-forming method and step is a successively：First it is carried out for the first time to press using 1KG power, pressed for the first time
Time is 3min, carries out first time heating during pressing for the first time to it, and the temperature control of heating is at 130 DEG C for the first time,
The duration of heat is 3min, b：Then it is pressed for the second time using 2KG power, the temperature control of second of heating exists
130 DEG C, duration of heat 15min, c:Then third time is carried out to it using 2KG power to press, press the time for the third time
For 22min, third time heating is carried out during pressing for the third time to it, the temperature control of third time heating is at 180 DEG C, heating
Duration is 5min, d：Then carry out the 4th time to it using 3KG power to press, the temperature control of the 4th heating is 180
DEG C, duration of heat 60min, e：Then the 5th time is carried out to it press using 3KG power, pressing the time for the 5th time is
70min, the 5th heating is carried out during pressing for the 5th time to it, the temperature control of the 5th heating at 180 DEG C, hold by heating
The continuous time is 72min, f：Then the 6th time is carried out to it press using 3KG power, it is 60min to press the time for the 6th time, the 6th
180 DEG C of the temperature control of secondary heating, duration of heat 55min, g：Then the 7th time is carried out to it tightly using 3KG power
Pressure, it be 50min to press the time for the 7th time, and the 7th heating, the 7th temperature heated are carried out to it during pressing for the 7th time
20 DEG C of degree control, h：Finally the 8th time is carried out to it press using 1KG power, it is 5min to press the time for the 8th time；
Described step S7：Need to use a kind of VCP upper grips, the structure bag of described VCP upper grips during de-smear
The first jig arm (1), the second jig arm (2), lead (5), spring (3) and chuck (6) are included, described the first jig arm (1) passes through pin
Axle (4) is connected with the second jig arm (2), and described spring (3) is arranged between the first jig arm (1) and the second jig arm (2), described
The lower end of first jig arm (1) and the second jig arm (2) is respectively fixedly connected with a lead (5), on described chuck (6) relative to
The position of lead (5) offers through hole, and described chuck (6) is sleeved on lead (5), and described chuck (6) is with being oriented to
Retaining mechanism is provided between post (5), two projections (8), described two projections (8) are additionally provided with the inside of the chuck (6)
The parallel inner side for being connected to chuck (6).
2. gross thickness according to claim 1 is less than 0.32mm grafting hand in four layers of rigid-flex combined board making side of centre
Method, it is characterised in that：Described projection (8) is connected by holding out against termination with threaded post and formed, and is opened up on the inside of the chuck (6)
There is the first screwed hole, described threaded post is connected in the first screwed hole.
3. the gross thickness stated according to claim 1 is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre,
It is characterized in that：Described retaining mechanism includes being opened in the second screwed hole and clamping screw (7) on the outside of chuck (6), described
Clamping screw (7) be connected through the second screwed hole with lead (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703156.0A CN105228380B (en) | 2015-10-26 | 2015-10-26 | A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703156.0A CN105228380B (en) | 2015-10-26 | 2015-10-26 | A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre |
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| Publication Number | Publication Date |
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| CN105228380A CN105228380A (en) | 2016-01-06 |
| CN105228380B true CN105228380B (en) | 2018-04-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105657969A (en) * | 2016-02-02 | 2016-06-08 | 深圳市仁创艺电子有限公司 | Rigid-flexible combined board and laminating method thereof |
| CN109219273B (en) * | 2018-08-31 | 2020-10-30 | 安徽四创电子股份有限公司 | PCB laminating structure based on buffer material and laminating method |
| CN110753450B (en) * | 2019-11-25 | 2020-08-07 | 深圳市景旺电子股份有限公司 | Manufacturing method of rigid-flex board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
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2015
- 2015-10-26 CN CN201510703156.0A patent/CN105228380B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
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