CN105246274B - A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method - Google Patents

A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method Download PDF

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Publication number
CN105246274B
CN105246274B CN201510702850.0A CN201510702850A CN105246274B CN 105246274 B CN105246274 B CN 105246274B CN 201510702850 A CN201510702850 A CN 201510702850A CN 105246274 B CN105246274 B CN 105246274B
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time
heating
prepreg
film
power
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CN105246274A (en
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李胜伦
钱小进
黎军
郑冬华
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Jiangxi Hongxin Flexible Electronic Technology Co ltd
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Jiangsu Hongxin Huayin Circuit Technology Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention relates to a kind of overall thickness to be more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method comprising following steps:S1:Lamination, S2:X RAY practice shooting, S3:Milling plate side, S4:Copper, S5 is thinned:Outer layer drills, S6:Deburring, S7:De-smear, S8:Heavy copper, S9:Copper facing, S10:Outer-layer circuit pre-treatment, S11:Outer laminated film 1, S12:Outer-layer circuit exposes, S13:Development, S14:Outer-layer circuit etches DES, S15:Outer layer AOI detections, S16:Welding resistance pre-treatment, S17:Welding resistance is printed, S18:It is pre-baked, S19:Welding resistance exposes, S20:Welding resistance is developed, S21:After bake, S22:Groove milling, S23:Take off lid, S24:Change gold, S25:First time silk-screen, S26:It toasts for the first time, S27:Second of silk-screen, S28:Second of baking, S29:Milling plate, S30:Stamp, S31:Flying probe, S32:Product inspection FQC, S33:Packaging, S34:Storage.The present invention have the advantages that it is easy to operate, be easy to carry out and practicality and high efficiency.

Description

A kind of overall thickness is more than 0.32mm grafting hand and is made in four layers of intermediate rigid-flex combined board Method
Technical field
It is rigid-flexible in intermediate four layers more than 0.32mm grafting hand that the present invention relates to circuit board manufacture field, especially overall thickness In conjunction with board manufacturing method.
Background technology
As electronic product develops towards frivolous, short and small, multifunction, the wiring board needed should rigid printed board Welding stability, it is main development trend to have flexible printed wiring flexible, such rigid-flex combined board again.But it is flexible Printed wiring board would generally use plug finger to be connect with other components.Plug finger just goes out in the middle layer positioned at layer structure Now finger is etched or etches away part caused by protection is improper.Lid is taken off due to prepreg thickness using single side flexible substrate Degree compared with, after pressing high low head larger dry film corner can not be protected cause etching after take off lid copper bar side it is irregular, nothing Method is neatly torn flexible platen material.
Invention content
The technical purpose of the present invention is by by cover film (or high temperature release film with glue), leading to hot pressing mode by glue surface Be bonded together with prepreg, by mold punching by the cover film in rigid plate region (or the high temperature release film with glue Tear it down), prepreg is isolated using cover film or high temperature release film, it is viscous less than on the soft board of middle layer using prepreg. It is peptized after being pressed using prepreg that gap is made to link together, but intermediate glass is disconnected, outer layer prepreg Do protective layer.The finger of internal layer will not all touch liquid medicine always after pressing in this way;It provides a kind of rigid with superpower restoration Scratch the manufacture craft of joint plate.
In order to solve the above technical problems, a kind of overall thickness of offer of the invention is more than 0.32mm grafting hand intermediate four Layer rigid-flex combined board production method comprising following steps:S1:Lamination, S2:X-RAY practices shooting, S3:Milling plate side, S4:Copper is thinned, S5:Outer layer drills, S6:Deburring, S7:De-smear, S8:Heavy copper, S9:Copper facing, S10:Outer-layer circuit pre-treatment, S11:Outer lamination Film 1, S12:Outer-layer circuit exposes, S13:Development, S14:Outer-layer circuit etching-DES, S15:Outer layer AOI detections, S16:Before welding resistance Processing, S17:Welding resistance is printed, S18:It is pre-baked, S19:Welding resistance exposes, S20:Welding resistance is developed, S21:After bake, S22:Groove milling, S23:It takes off Lid, S24:Change gold, S25:First time silk-screen, S26:It toasts for the first time, S27:Second of silk-screen, S28:Second of baking, S29: Milling plate, S30:Stamp, S31:Flying probe, S32:Product inspection-FQC, S33:Packaging, S34:Storage.
Further:The step S1:Lamination is to be filled four pieces of release films, two pieces by upper and lower two blocks of steel plates Film, two pieces of single side flex plates, two pieces of prepregs and inner plating carry out hot-forming, the both sides up and down of every piece of filling film Respectively it is connected with one piece of release film, the both sides up and down of the inner plating are respectively connected with one piece of prepreg, on the prepreg The side for posting cover film or high temperature resistant degree film glue surface is connected with single side flex plate, and the outside of two pieces of single side flex plates respectively connects It is connected to one piece of release film.
Further:The production process of inner plating is as follows:Step 1:Internal layer sawing sheet, step 2:Drilling (it is fixed to bore lamination Position hole and exposure location hole), step 3:Circuit pre-treatment, step 4:Interior laminated film, step 5:Internal layer circuit exposes, step 6:It is interior Sandwich circuit etches, step 7:Internal layer AOI detections, step 8:Roughening, step 9:Lamination cover film, step 10:It is laminated.
Further:The production process of the prepreg is as follows:Step 1:Sawing sheet, step 2:Processing (will be covered Epiphragma glue surface is attached on prepreg (pressure:0.6Mpa, temperature:60 DEG C, the time:30 seconds) or by high temperature resistant degree film glue surface plaster (pressure on to prepreg:0.6Mpa, temperature:110 DEG C, the time:30 seconds)), step 3:Drilling (bores lamination location hole and mold It is punched location hole), step 4:(high knife-edge portion connects prepreg and cover film (or heat safe release film), low for punching Knife-edge portion only thrusts cover film (or heat safe release film), and the part using the low edge of a knife will be linked up at semi-solid preparation, Cover film (or heat safe release film) other than the edge of a knife is torn).
Further:The hot-forming method and step is a successively:The power of 1KG is first used to carry out it tight for the first time Pressure, it is 3min to press the time for the first time, carries out first time heating during pressing for the first time to it, for the first time the temperature of heating Control is at 130 DEG C, duration of heat 3min, b:Then the power of 2KG is used to press it for the second time, second of heating Temperature control at 130 DEG C, duration of heat 15min, c:Then it uses the power of 2KG to carry out it third time to press, the It is 22min to press the time three times, carries out third time heating, the temperature control of third time heating during pressing for the third time to it At 180 DEG C, duration of heat 5min, d:Then it uses the power of 3KG to carry out it the 4th time to press, the temperature of the 4th heating Degree control is at 180 DEG C, duration of heat 60min, e:Then it uses the power of 3KG to carry out it the 5th time to press, the 5th time It is 70min to press the time, carries out the 5th heating during pressing for the 5th time to it, and the temperature control of the 5th heating exists 180 DEG C, duration of heat 72min, f:Then it uses the power of 3KG to carry out the 6th heating to it, presses the time the 6th time Temperature for 60min, the 6th heating controls 180 DEG C, duration of heat 55min, g:Then using the power pair of 3KG It carries out the 7th heating, and it is 50min to press the time for the 7th time, and the 7th heating is carried out to it during pressing for the 7th time, The temperature of 7th heating controls 20 DEG C, h:It is last that the 8th heating then carries out it using the power of 1KG, when pressing for the 8th time Between be 5min.
Further:The step S15:It needs to use a kind of detection machine in outer layer AOI detections, the detection machine Structure includes upper bracket, pedestal, hydraulic cylinder, workbench, detection support plate, hoistable platform and detector bar, the upper bracket It is fixedly connected on the top of pedestal, the workbench is set on the base, and the detection support plate is fixedly mounted on work Make on platform, the hoistable platform is connected to the bottom of upper bracket by hydraulic cylinder, and the detector bar passes through flat Telephone-moving structure is connected to the bottom of hoistable platform, and the bottom of the detector bar is uniformly arranged detection syringe needle, detection support Position on plate relative to detection syringe needle offers through-hole.
Further:It is each provided with a pilot pin column on four feet of the detection support plate.
Further:The spacing of two adjacent detection syringe needles of the detector bar bottom is 5 millimeters.
Further:The translation mechanism include be arranged hoistable platform bottom two parallel orbits and translate it is small Vehicle, the detector bar are fixedly connected with translating trolleys, and the translating trolleys are movably connected on two parallel orbits.
With the above structure, the present invention will be by the way that by cover film (or high temperature release film with glue), leading to hot pressing mode will Glue surface is bonded together with prepreg, by mold punching by the cover film in rigid plate region (or the high temperature with glue from Type film tears it down), prepreg is isolated using cover film or high temperature release film, uses the viscous soft board less than middle layer of prepreg On.It is peptized after being pressed using prepreg that gap is made to link together, but intermediate glass is disconnected, outer layer semi-solid preparation Piece does protective layer.The finger of internal layer will not all touch liquid medicine always after pressing in this way;And can by translation mechanism and Hydraulic cylinder does horizontal and vertical movement with detector bar, is completed to rigid-flexible engagement using the detection syringe needle being arranged in detector bar bottom The detection of plate substantially increases its detection efficiency.
Description of the drawings
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is step S1:Structural schematic diagram in lamination process.
Fig. 2 is the structural schematic diagram of detection machine.
Specific implementation mode
Four layers of rigid-flex combined board production method the present invention provides a kind of overall thickness more than 0.32mm grafting hand in centre, It includes the following steps:S1:Lamination, S2:X-RAY practices shooting, S3:Milling plate side, S4:Copper, S5 is thinned:Outer layer drills, S6:Unhairing Thorn, S7:De-smear, S8:Heavy copper, S9:Copper facing, S10:Outer-layer circuit pre-treatment, S11:Outer laminated film 1, S12:Outer-layer circuit exposes Light, S13:Development, S14:Outer-layer circuit etching-DES, S15:Outer layer AOI detections, S16:Welding resistance pre-treatment, S17:Welding resistance is printed, S18:It is pre-baked, S19:Welding resistance exposes, S20:Welding resistance is developed, S21:After bake, S22:Groove milling, S23:Take off lid, S24:Change gold, S25:The Silk-screen, S26:It toasts for the first time, S27:Second of silk-screen, S28:Second of baking, S29:Milling plate, S30:Stamp, S31: Flying probe, S32:Product inspection-FQC, S33:Packaging, S34:Storage.
As shown in Figure 1, the step S1:Lamination is to be filled four pieces of 12, two pieces of release films by upper and lower two blocks of steel plates 13, two pieces of film, 14, two pieces of single side flex plate prepreg 15 and inner plating 16 carry out hot-forming, described every piece of filling film 13 Both sides up and down be respectively connected with one piece of release film 12, the both sides up and down of the inner plating 16 are respectively connected with one piece of prepreg 15, The side that cover film or high temperature resistant degree film glue surface are posted on the prepreg 15 is connected with single side flex plate 14, described two pieces The outside of single side flex plate 14 is respectively connected with one piece of release film 12.
The production process of above-mentioned inner plating is as follows:Step 1:Internal layer sawing sheet, step 2:Drilling (bores lamination location hole With exposure location hole), step 3:Circuit pre-treatment, step 4:Interior laminated film, step 5:Internal layer circuit exposes, step 6:Interior layer line Road etches, step 7:Internal layer AOI detections, step 8:Roughening, step 9:Lamination cover film, step 10:It is laminated.
The production process of above-mentioned prepreg is as follows:Step 1:Sawing sheet, step 2:Processing is (by cover film glue surface plaster (pressure on to prepreg:0.6Mpa, temperature:60 DEG C, the time:30 seconds) or high temperature resistant degree film glue surface is attached to prepreg Upper (pressure:0.6Mpa, temperature:110 DEG C, the time:30 seconds)), step 3:Drilling (bores lamination location hole and mold punching positioning Hole), step 4:(high knife-edge portion connects prepreg and cover film (or heat safe release film), low knife-edge portion for punching Only thrust cover film (or heat safe release film), the part using the low edge of a knife will be linked up at semi-solid preparation, by the edge of a knife with Outer cover film (or heat safe release film) is torn).
Above-mentioned hot-forming method and step is a successively:The power of 1KG is first used to carry out pressing for the first time to it, for the first time It is 3min to press the time, carries out first time heating during pressing for the first time to it, and the temperature of heating is controlled 130 for the first time DEG C, duration of heat 3min, b:Then the power of 2KG is used to press it for the second time, the temperature control of second of heating System is at 130 DEG C, duration of heat 15min, c:Then it uses the power of 2KG to carry out it third time to press, press for the third time Time is 22min, carries out third time heating during pressing for the third time to it, and the temperature of third time heating is controlled at 180 DEG C, The duration of heat is 5min, d:Then it uses the power of 3KG to carry out it the 4th time to press, the temperature control of the 4th heating exists 180 DEG C, duration of heat 60min, e:Then it uses the power of 3KG to carry out the 5th time to it and press, presses the time the 5th time For 70min, the 5th heating is carried out to it during pressing for the 5th time, the temperature of the 5th heating is controlled at 180 DEG C, heating Duration is 72min, f:Then the power of 3KG is used to carry out the 6th heating to it, it is 60min to press the time for the 6th time, the The temperature of six heating controls 180 DEG C, duration of heat 55min, g:Then the 7th is carried out to it using the power of 3KG Secondary heating, it is 50min to press the time for the 7th time, and the 7th heating, the 7th heating are carried out to it during pressing for the 7th time Temperature control 20 DEG C, h:Last then to carry out the 8th heating to it using the power of 1KG, it is 5min to press the time for the 8th time.
The present invention is by the way that by cover film (or high temperature release film with glue), logical hot pressing mode glues glue surface and prepreg It is combined, by the cover film (or the high temperature release film with glue tears it down) in rigid plate region, is utilized by mold punching Prepreg is isolated in cover film or high temperature release film, viscous less than on the soft board of middle layer using prepreg.Utilize prepreg Glass peptized after pressing that gap is made to link together but intermediate be it is disconnected, outer layer does protective layer with prepreg.In this way The finger of internal layer will not all touch liquid medicine always after pressing.
Above-mentioned step S15:It needs to use a kind of detection machine, structure such as Fig. 2 of the detection machine in outer layer AOI detections Shown, structure includes upper bracket 2, pedestal 1, hydraulic cylinder 6, workbench 3, detection support plate 4, hoistable platform 7 and detector bar 10, the upper bracket 2 is fixedly connected on the top of pedestal 1, and the workbench 3 is arranged on pedestal 1, the detection Support plate 4 is fixedly mounted on workbench 3, and the hoistable platform 7 is connected to the bottom of upper bracket 2, institute by hydraulic cylinder 6 The detector bar 10 stated is connected to the bottom of hoistable platform 7 by translation mechanism, and the bottom of the detector bar 10 is uniformly arranged Cloth detection syringe needle 11, and the position in the detection support plate 4 relative to detection syringe needle 11 offers through-hole, the detection A pilot pin column 5, two adjacent detection syringe needles 11 of 10 bottom of detector bar are each provided on four feet of support plate 4 Spacing be 5 millimeters.When work, the rigid-flexible joint plate that needs detect is placed in detection support plate 4, and by four feet Pilot pin column 5 rigid-flexible joint plate is fixed, then start hydraulic cylinder 6 make it through hoistable platform 7 with detector bar 10 It moves downward, when the detection syringe needle 11 of 10 bottom of detector bar passes through the through-hole in detection support plate 4, then proves detection needle Hole in the first 11 rigid-flexible joint plates passed through is qualified, if detection syringe needle 11 wears only through-hole, proves rigid-flexible engagement Hole on plate is underproof, and the photoelectric sensor being arranged in detection support plate 4 then can be wearing corresponding aperture only Position is sent out, and is then returned to elemental height with detector bar 10 by hydraulic cylinder 6, and then starting translation mechanism makes its band It detector bar 10 and moves horizontally certain position, subsequently continuing startup hydraulic cylinder 6 makes it be moved downward with detector bar 10, with This reciprocal completion is to the porose detection of institute in rigid-flexible joint plate.The utility model is by translation mechanism and hydraulic cylinder with detector bar Horizontal and vertical movement is done, the detection to rigid-flexible joint plate is completed using the detection syringe needle being arranged in detector bar bottom, carries significantly Its high detection efficiency;And the design also has the advantages that simple in structure, easily fabricated and practicality and high efficiency.
Translation mechanism as shown in Figure 1 includes two parallel orbits 9 and translating trolleys 8 being arranged in 7 bottom of hoistable platform, The detector bar 10 is fixedly connected with translating trolleys 8, and the translating trolleys 8 are movably connected on two parallel orbits 9.When When needing to move horizontally detector bar 10, starting translating trolleys 8 makes it do horizontal fortune along two parallel orbits 9 with detector bar 10 It is dynamic, have the advantages that simple in structure, easily fabricated and practicality and high efficiency.

Claims (2)

1. a kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method, it is characterised in that:Packet Include following steps:S1:Lamination, S2:X-RAY practices shooting, S3:Milling plate side, S4:Copper, S5 is thinned:Outer layer drills, S6:Deburring, S7: De-smear, S8:Heavy copper, S9:Copper facing, S10:Outer-layer circuit pre-treatment, S11:Outer laminated film, S12:Outer-layer circuit exposes, S13: Development, S14:DES, S15:Outer layer AOI detections, S16:Welding resistance pre-treatment, S17:Welding resistance is printed, S18:It is pre-baked, S19:Welding resistance exposes Light, S20:Welding resistance is developed, S21:After bake, S22:Groove milling, S23:Take off lid, S24:Change gold, S25:First time silk-screen, S26:For the first time Baking, S27:Second of silk-screen, S28:Second of baking, S29:Milling plate, S30:Stamp, S31:Flying probe, S32:At product examine Test-FQC, S33:Packaging, S34:Storage;
The step S1:Lamination is by upper and lower two blocks of steel plates by four pieces of release films (12), two pieces of filling films (13), two pieces of lists Face flex plate (14), two pieces of prepregs (15) and inner plating (16) progress are hot-forming, every piece of filling film (13) Upper and lower both sides are respectively connected with one piece of release film (12), and the both sides up and down of the inner plating (16) are respectively connected with one piece of prepreg (15), side and single side flex plate (14) phase of cover film or high temperature resistant degree film glue surface are posted on the prepreg (15) Even, the outside of two pieces of single side flex plates 14 is respectively connected with one piece of release film (12);
The production process of inner plating is as follows:Step 1:Internal layer sawing sheet, step 2:It is positioned including boring lamination location hole and exposure The drilling in hole, step 3:Circuit pre-treatment, step 4:Interior laminated film, step 5:Internal layer circuit exposes, step 6:Internal layer circuit loses It carves, step 7:Internal layer AOI detections, step 8:Roughening, step 9:Lamination cover film, step 10:Lamination;
The production process of the prepreg is as follows:Step 1:Sawing sheet, step 2:Cover film glue surface is attached to semi-solid preparation High temperature resistant degree film glue surface is attached to the processing on prepreg by piece, when cover film glue surface is attached on prepreg, pressure Power:0.6Mpa, temperature:60 DEG C, the time:30 seconds, when high temperature resistant degree film glue surface is attached on prepreg, pressure:0.6Mpa, temperature Degree:110 DEG C, the time:30 seconds,
Step 3:It is punched the drilling of location hole, step 4 including boring lamination location hole and mold:Punching, the punching includes high knife Even prepreg and heat safe release film, low knife-edge portion only thrust heat safe release film to oral area point, utilize the low edge of a knife Part will be linked up at semi-solid preparation, and the heat safe release film other than the edge of a knife is torn;
The hot-forming method and step is a successively:It first uses the power of 1KG to carry out pressing for the first time to it, presses for the first time Time is 3min, carries out first time heating during pressing for the first time to it, and the temperature of heating is controlled at 130 DEG C for the first time, The duration of heat is 3min, b:Then the power of 2KG is used to press it for the second time, the temperature control of second of heating exists 130 DEG C, duration of heat 15min, c:Then it uses the power of 2KG to carry out it third time to press, presses the time for the third time For 22min, third time heating is carried out during pressing for the third time to it, the temperature of third time heating is controlled at 180 DEG C, heating Duration is 5min, d:Then it uses the power of 3KG to carry out it the 4th time to press, the temperature of the 4th heating is controlled 180 DEG C, duration of heat 60min, e:Then the power of 3KG is used to carry out the 5th time to it and press, pressing the time for the 5th time is 70min carries out it during pressing for the 5th time the 5th heating, and the temperature of the 5th heating is controlled at 180 DEG C, and heating is held The continuous time is 72min, f:Then the power of 3KG is used to carry out the 6th heating to it, it is 60min to press the time for the 6th time, the 6th The temperature of secondary heating controls 180 DEG C, duration of heat 55min, g:Then it uses the power of 3KG to carry out it the 7th time to add Heat, it is 50min to press the time for the 7th time, and the 7th heating, the temperature of the 7th heating are carried out to it during pressing for the 7th time 20 DEG C of degree control, h:The power of 1KG is finally used to carry out the 8th heating to it, it is 5min to press the time for the 8th time;
The step S15:It needs to use a kind of detection machine in outer layer AOI detections, the structure of the detection machine includes upper branch Frame (2), pedestal (1), hydraulic cylinder (6), workbench (3), detection support plate (4), hoistable platform (7) and detector bar (10), institute The upper bracket (2) stated is fixedly connected on the top of pedestal (1), and the workbench (3) is arranged on pedestal (1), described Detection support plate (3) is fixedly mounted on workbench (3), and the hoistable platform (7) is connected to upper branch by hydraulic cylinder (6) The bottom of frame (2), the detector bar (10) are connected to the bottom of hoistable platform (7), the detector bar by translation mechanism (10) bottom is uniformly arranged detection syringe needle (11), the position in the detection support plate (3) relative to detection syringe needle (11) It sets and offers through-hole;
A pilot pin column (5) is each provided on four angles of the detection support plate (3);
The spacing of two adjacent detection syringe needles (11) of described detector bar (10) bottom is 5 millimeters.
2. overall thickness according to claim 1 is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board making side Method, it is characterised in that:The translation mechanism includes setting in two parallel orbits (9) of hoistable platform (7) bottom and translation Trolley (8), the detector bar (10) are fixedly connected with translating trolleys (8), and the translating trolleys (8) are movably connected in two On parallel orbit (9).
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CN108207078A (en) * 2017-12-29 2018-06-26 江苏弘信华印电路科技有限公司 Improve the manufacture craft that rigid-flex combined board takes off lid leak
CN109760122A (en) * 2018-12-24 2019-05-17 江苏弘信华印电路科技有限公司 A kind of half cutting method of mold for taking off lid for rigid-flex combined board
CN110678011A (en) * 2019-11-12 2020-01-10 江门崇达电路技术有限公司 Manufacturing method of rigid-flex printed circuit board

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CN104470214A (en) * 2014-11-25 2015-03-25 镇江华印电路板有限公司 Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board

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