CN105246274B - A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method - Google Patents
A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method Download PDFInfo
- Publication number
- CN105246274B CN105246274B CN201510702850.0A CN201510702850A CN105246274B CN 105246274 B CN105246274 B CN 105246274B CN 201510702850 A CN201510702850 A CN 201510702850A CN 105246274 B CN105246274 B CN 105246274B
- Authority
- CN
- China
- Prior art keywords
- time
- heating
- prepreg
- film
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of overall thickness to be more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method comprising following steps：S1：Lamination, S2:X RAY practice shooting, S3：Milling plate side, S4：Copper, S5 is thinned:Outer layer drills, S6：Deburring, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film 1, S12：Outer-layer circuit exposes, S13：Development, S14:Outer-layer circuit etches DES, S15：Outer layer AOI detections, S16：Welding resistance pre-treatment, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：Groove milling, S23：Take off lid, S24：Change gold, S25：First time silk-screen, S26：It toasts for the first time, S27：Second of silk-screen, S28：Second of baking, S29：Milling plate, S30：Stamp, S31：Flying probe, S32：Product inspection FQC, S33：Packaging, S34：Storage.The present invention have the advantages that it is easy to operate, be easy to carry out and practicality and high efficiency.
Description
Technical field
It is rigid-flexible in intermediate four layers more than 0.32mm grafting hand that the present invention relates to circuit board manufacture field, especially overall thickness
In conjunction with board manufacturing method.
Background technology
As electronic product develops towards frivolous, short and small, multifunction, the wiring board needed should rigid printed board
Welding stability, it is main development trend to have flexible printed wiring flexible, such rigid-flex combined board again.But it is flexible
Printed wiring board would generally use plug finger to be connect with other components.Plug finger just goes out in the middle layer positioned at layer structure
Now finger is etched or etches away part caused by protection is improper.Lid is taken off due to prepreg thickness using single side flexible substrate
Degree compared with, after pressing high low head larger dry film corner can not be protected cause etching after take off lid copper bar side it is irregular, nothing
Method is neatly torn flexible platen material.
Invention content
The technical purpose of the present invention is by by cover film (or high temperature release film with glue), leading to hot pressing mode by glue surface
Be bonded together with prepreg, by mold punching by the cover film in rigid plate region (or the high temperature release film with glue
Tear it down), prepreg is isolated using cover film or high temperature release film, it is viscous less than on the soft board of middle layer using prepreg.
It is peptized after being pressed using prepreg that gap is made to link together, but intermediate glass is disconnected, outer layer prepreg
Do protective layer.The finger of internal layer will not all touch liquid medicine always after pressing in this way；It provides a kind of rigid with superpower restoration
Scratch the manufacture craft of joint plate.
In order to solve the above technical problems, a kind of overall thickness of offer of the invention is more than 0.32mm grafting hand intermediate four
Layer rigid-flex combined board production method comprising following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling plate side, S4：Copper is thinned,
S5:Outer layer drills, S6：Deburring, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer lamination
Film 1, S12：Outer-layer circuit exposes, S13：Development, S14:Outer-layer circuit etching-DES, S15：Outer layer AOI detections, S16：Before welding resistance
Processing, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：Groove milling, S23：It takes off
Lid, S24：Change gold, S25：First time silk-screen, S26：It toasts for the first time, S27：Second of silk-screen, S28：Second of baking, S29：
Milling plate, S30：Stamp, S31：Flying probe, S32：Product inspection-FQC, S33：Packaging, S34：Storage.
Further：The step S1：Lamination is to be filled four pieces of release films, two pieces by upper and lower two blocks of steel plates
Film, two pieces of single side flex plates, two pieces of prepregs and inner plating carry out hot-forming, the both sides up and down of every piece of filling film
Respectively it is connected with one piece of release film, the both sides up and down of the inner plating are respectively connected with one piece of prepreg, on the prepreg
The side for posting cover film or high temperature resistant degree film glue surface is connected with single side flex plate, and the outside of two pieces of single side flex plates respectively connects
It is connected to one piece of release film.
Further：The production process of inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：Drilling (it is fixed to bore lamination
Position hole and exposure location hole), step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step 6：It is interior
Sandwich circuit etches, step 7：Internal layer AOI detections, step 8：Roughening, step 9：Lamination cover film, step 10：It is laminated.
Further：The production process of the prepreg is as follows：Step 1：Sawing sheet, step 2：Processing (will be covered
Epiphragma glue surface is attached on prepreg (pressure：0.6Mpa, temperature：60 DEG C, the time：30 seconds) or by high temperature resistant degree film glue surface plaster
(pressure on to prepreg：0.6Mpa, temperature：110 DEG C, the time：30 seconds)), step 3：Drilling (bores lamination location hole and mold
It is punched location hole), step 4：(high knife-edge portion connects prepreg and cover film (or heat safe release film), low for punching
Knife-edge portion only thrusts cover film (or heat safe release film), and the part using the low edge of a knife will be linked up at semi-solid preparation,
Cover film (or heat safe release film) other than the edge of a knife is torn).
Further：The hot-forming method and step is a successively：The power of 1KG is first used to carry out it tight for the first time
Pressure, it is 3min to press the time for the first time, carries out first time heating during pressing for the first time to it, for the first time the temperature of heating
Control is at 130 DEG C, duration of heat 3min, b：Then the power of 2KG is used to press it for the second time, second of heating
Temperature control at 130 DEG C, duration of heat 15min, c:Then it uses the power of 2KG to carry out it third time to press, the
It is 22min to press the time three times, carries out third time heating, the temperature control of third time heating during pressing for the third time to it
At 180 DEG C, duration of heat 5min, d：Then it uses the power of 3KG to carry out it the 4th time to press, the temperature of the 4th heating
Degree control is at 180 DEG C, duration of heat 60min, e：Then it uses the power of 3KG to carry out it the 5th time to press, the 5th time
It is 70min to press the time, carries out the 5th heating during pressing for the 5th time to it, and the temperature control of the 5th heating exists
180 DEG C, duration of heat 72min, f：Then it uses the power of 3KG to carry out the 6th heating to it, presses the time the 6th time
Temperature for 60min, the 6th heating controls 180 DEG C, duration of heat 55min, g：Then using the power pair of 3KG
It carries out the 7th heating, and it is 50min to press the time for the 7th time, and the 7th heating is carried out to it during pressing for the 7th time,
The temperature of 7th heating controls 20 DEG C, h：It is last that the 8th heating then carries out it using the power of 1KG, when pressing for the 8th time
Between be 5min.
Further：The step S15：It needs to use a kind of detection machine in outer layer AOI detections, the detection machine
Structure includes upper bracket, pedestal, hydraulic cylinder, workbench, detection support plate, hoistable platform and detector bar, the upper bracket
It is fixedly connected on the top of pedestal, the workbench is set on the base, and the detection support plate is fixedly mounted on work
Make on platform, the hoistable platform is connected to the bottom of upper bracket by hydraulic cylinder, and the detector bar passes through flat
Telephone-moving structure is connected to the bottom of hoistable platform, and the bottom of the detector bar is uniformly arranged detection syringe needle, detection support
Position on plate relative to detection syringe needle offers through-hole.
Further：It is each provided with a pilot pin column on four feet of the detection support plate.
Further：The spacing of two adjacent detection syringe needles of the detector bar bottom is 5 millimeters.
Further：The translation mechanism include be arranged hoistable platform bottom two parallel orbits and translate it is small
Vehicle, the detector bar are fixedly connected with translating trolleys, and the translating trolleys are movably connected on two parallel orbits.
With the above structure, the present invention will be by the way that by cover film (or high temperature release film with glue), leading to hot pressing mode will
Glue surface is bonded together with prepreg, by mold punching by the cover film in rigid plate region (or the high temperature with glue from
Type film tears it down), prepreg is isolated using cover film or high temperature release film, uses the viscous soft board less than middle layer of prepreg
On.It is peptized after being pressed using prepreg that gap is made to link together, but intermediate glass is disconnected, outer layer semi-solid preparation
Piece does protective layer.The finger of internal layer will not all touch liquid medicine always after pressing in this way；And can by translation mechanism and
Hydraulic cylinder does horizontal and vertical movement with detector bar, is completed to rigid-flexible engagement using the detection syringe needle being arranged in detector bar bottom
The detection of plate substantially increases its detection efficiency.
Description of the drawings
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is step S1：Structural schematic diagram in lamination process.
Fig. 2 is the structural schematic diagram of detection machine.
Specific implementation mode
Four layers of rigid-flex combined board production method the present invention provides a kind of overall thickness more than 0.32mm grafting hand in centre,
It includes the following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling plate side, S4：Copper, S5 is thinned:Outer layer drills, S6：Unhairing
Thorn, S7：De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film 1, S12：Outer-layer circuit exposes
Light, S13：Development, S14:Outer-layer circuit etching-DES, S15：Outer layer AOI detections, S16：Welding resistance pre-treatment, S17：Welding resistance is printed,
S18：It is pre-baked, S19：Welding resistance exposes, S20：Welding resistance is developed, S21：After bake, S22：Groove milling, S23：Take off lid, S24：Change gold, S25：The
Silk-screen, S26：It toasts for the first time, S27：Second of silk-screen, S28：Second of baking, S29：Milling plate, S30：Stamp, S31：
Flying probe, S32：Product inspection-FQC, S33：Packaging, S34：Storage.
As shown in Figure 1, the step S1：Lamination is to be filled four pieces of 12, two pieces of release films by upper and lower two blocks of steel plates
13, two pieces of film, 14, two pieces of single side flex plate prepreg 15 and inner plating 16 carry out hot-forming, described every piece of filling film 13
Both sides up and down be respectively connected with one piece of release film 12, the both sides up and down of the inner plating 16 are respectively connected with one piece of prepreg 15,
The side that cover film or high temperature resistant degree film glue surface are posted on the prepreg 15 is connected with single side flex plate 14, described two pieces
The outside of single side flex plate 14 is respectively connected with one piece of release film 12.
The production process of above-mentioned inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：Drilling (bores lamination location hole
With exposure location hole), step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step 6：Interior layer line
Road etches, step 7：Internal layer AOI detections, step 8：Roughening, step 9：Lamination cover film, step 10：It is laminated.
The production process of above-mentioned prepreg is as follows：Step 1：Sawing sheet, step 2：Processing is (by cover film glue surface plaster
(pressure on to prepreg：0.6Mpa, temperature：60 DEG C, the time：30 seconds) or high temperature resistant degree film glue surface is attached to prepreg
Upper (pressure：0.6Mpa, temperature：110 DEG C, the time：30 seconds)), step 3：Drilling (bores lamination location hole and mold punching positioning
Hole), step 4：(high knife-edge portion connects prepreg and cover film (or heat safe release film), low knife-edge portion for punching
Only thrust cover film (or heat safe release film), the part using the low edge of a knife will be linked up at semi-solid preparation, by the edge of a knife with
Outer cover film (or heat safe release film) is torn).
Above-mentioned hot-forming method and step is a successively：The power of 1KG is first used to carry out pressing for the first time to it, for the first time
It is 3min to press the time, carries out first time heating during pressing for the first time to it, and the temperature of heating is controlled 130 for the first time
DEG C, duration of heat 3min, b：Then the power of 2KG is used to press it for the second time, the temperature control of second of heating
System is at 130 DEG C, duration of heat 15min, c:Then it uses the power of 2KG to carry out it third time to press, press for the third time
Time is 22min, carries out third time heating during pressing for the third time to it, and the temperature of third time heating is controlled at 180 DEG C,
The duration of heat is 5min, d：Then it uses the power of 3KG to carry out it the 4th time to press, the temperature control of the 4th heating exists
180 DEG C, duration of heat 60min, e：Then it uses the power of 3KG to carry out the 5th time to it and press, presses the time the 5th time
For 70min, the 5th heating is carried out to it during pressing for the 5th time, the temperature of the 5th heating is controlled at 180 DEG C, heating
Duration is 72min, f：Then the power of 3KG is used to carry out the 6th heating to it, it is 60min to press the time for the 6th time, the
The temperature of six heating controls 180 DEG C, duration of heat 55min, g：Then the 7th is carried out to it using the power of 3KG
Secondary heating, it is 50min to press the time for the 7th time, and the 7th heating, the 7th heating are carried out to it during pressing for the 7th time
Temperature control 20 DEG C, h：Last then to carry out the 8th heating to it using the power of 1KG, it is 5min to press the time for the 8th time.
The present invention is by the way that by cover film (or high temperature release film with glue), logical hot pressing mode glues glue surface and prepreg
It is combined, by the cover film (or the high temperature release film with glue tears it down) in rigid plate region, is utilized by mold punching
Prepreg is isolated in cover film or high temperature release film, viscous less than on the soft board of middle layer using prepreg.Utilize prepreg
Glass peptized after pressing that gap is made to link together but intermediate be it is disconnected, outer layer does protective layer with prepreg.In this way
The finger of internal layer will not all touch liquid medicine always after pressing.
Above-mentioned step S15：It needs to use a kind of detection machine, structure such as Fig. 2 of the detection machine in outer layer AOI detections
Shown, structure includes upper bracket 2, pedestal 1, hydraulic cylinder 6, workbench 3, detection support plate 4, hoistable platform 7 and detector bar
10, the upper bracket 2 is fixedly connected on the top of pedestal 1, and the workbench 3 is arranged on pedestal 1, the detection
Support plate 4 is fixedly mounted on workbench 3, and the hoistable platform 7 is connected to the bottom of upper bracket 2, institute by hydraulic cylinder 6
The detector bar 10 stated is connected to the bottom of hoistable platform 7 by translation mechanism, and the bottom of the detector bar 10 is uniformly arranged
Cloth detection syringe needle 11, and the position in the detection support plate 4 relative to detection syringe needle 11 offers through-hole, the detection
A pilot pin column 5, two adjacent detection syringe needles 11 of 10 bottom of detector bar are each provided on four feet of support plate 4
Spacing be 5 millimeters.When work, the rigid-flexible joint plate that needs detect is placed in detection support plate 4, and by four feet
Pilot pin column 5 rigid-flexible joint plate is fixed, then start hydraulic cylinder 6 make it through hoistable platform 7 with detector bar 10
It moves downward, when the detection syringe needle 11 of 10 bottom of detector bar passes through the through-hole in detection support plate 4, then proves detection needle
Hole in the first 11 rigid-flexible joint plates passed through is qualified, if detection syringe needle 11 wears only through-hole, proves rigid-flexible engagement
Hole on plate is underproof, and the photoelectric sensor being arranged in detection support plate 4 then can be wearing corresponding aperture only
Position is sent out, and is then returned to elemental height with detector bar 10 by hydraulic cylinder 6, and then starting translation mechanism makes its band
It detector bar 10 and moves horizontally certain position, subsequently continuing startup hydraulic cylinder 6 makes it be moved downward with detector bar 10, with
This reciprocal completion is to the porose detection of institute in rigid-flexible joint plate.The utility model is by translation mechanism and hydraulic cylinder with detector bar
Horizontal and vertical movement is done, the detection to rigid-flexible joint plate is completed using the detection syringe needle being arranged in detector bar bottom, carries significantly
Its high detection efficiency；And the design also has the advantages that simple in structure, easily fabricated and practicality and high efficiency.
Translation mechanism as shown in Figure 1 includes two parallel orbits 9 and translating trolleys 8 being arranged in 7 bottom of hoistable platform,
The detector bar 10 is fixedly connected with translating trolleys 8, and the translating trolleys 8 are movably connected on two parallel orbits 9.When
When needing to move horizontally detector bar 10, starting translating trolleys 8 makes it do horizontal fortune along two parallel orbits 9 with detector bar 10
It is dynamic, have the advantages that simple in structure, easily fabricated and practicality and high efficiency.
Claims (2)
1. a kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method, it is characterised in that：Packet
Include following steps：S1：Lamination, S2:X-RAY practices shooting, S3：Milling plate side, S4：Copper, S5 is thinned:Outer layer drills, S6：Deburring, S7：
De-smear, S8：Heavy copper, S9：Copper facing, S10：Outer-layer circuit pre-treatment, S11：Outer laminated film, S12：Outer-layer circuit exposes, S13：
Development, S14:DES, S15：Outer layer AOI detections, S16：Welding resistance pre-treatment, S17：Welding resistance is printed, S18：It is pre-baked, S19：Welding resistance exposes
Light, S20：Welding resistance is developed, S21：After bake, S22：Groove milling, S23：Take off lid, S24：Change gold, S25：First time silk-screen, S26：For the first time
Baking, S27：Second of silk-screen, S28：Second of baking, S29：Milling plate, S30：Stamp, S31：Flying probe, S32：At product examine
Test-FQC, S33：Packaging, S34：Storage；
The step S1：Lamination is by upper and lower two blocks of steel plates by four pieces of release films (12), two pieces of filling films (13), two pieces of lists
Face flex plate (14), two pieces of prepregs (15) and inner plating (16) progress are hot-forming, every piece of filling film (13)
Upper and lower both sides are respectively connected with one piece of release film (12), and the both sides up and down of the inner plating (16) are respectively connected with one piece of prepreg
(15), side and single side flex plate (14) phase of cover film or high temperature resistant degree film glue surface are posted on the prepreg (15)
Even, the outside of two pieces of single side flex plates 14 is respectively connected with one piece of release film (12)；
The production process of inner plating is as follows：Step 1：Internal layer sawing sheet, step 2：It is positioned including boring lamination location hole and exposure
The drilling in hole, step 3：Circuit pre-treatment, step 4：Interior laminated film, step 5：Internal layer circuit exposes, step 6：Internal layer circuit loses
It carves, step 7：Internal layer AOI detections, step 8：Roughening, step 9：Lamination cover film, step 10：Lamination；
The production process of the prepreg is as follows：Step 1：Sawing sheet, step 2：Cover film glue surface is attached to semi-solid preparation
High temperature resistant degree film glue surface is attached to the processing on prepreg by piece, when cover film glue surface is attached on prepreg, pressure
Power：0.6Mpa, temperature：60 DEG C, the time：30 seconds, when high temperature resistant degree film glue surface is attached on prepreg, pressure：0.6Mpa, temperature
Degree：110 DEG C, the time：30 seconds,
Step 3：It is punched the drilling of location hole, step 4 including boring lamination location hole and mold：Punching, the punching includes high knife
Even prepreg and heat safe release film, low knife-edge portion only thrust heat safe release film to oral area point, utilize the low edge of a knife
Part will be linked up at semi-solid preparation, and the heat safe release film other than the edge of a knife is torn；
The hot-forming method and step is a successively：It first uses the power of 1KG to carry out pressing for the first time to it, presses for the first time
Time is 3min, carries out first time heating during pressing for the first time to it, and the temperature of heating is controlled at 130 DEG C for the first time,
The duration of heat is 3min, b：Then the power of 2KG is used to press it for the second time, the temperature control of second of heating exists
130 DEG C, duration of heat 15min, c:Then it uses the power of 2KG to carry out it third time to press, presses the time for the third time
For 22min, third time heating is carried out during pressing for the third time to it, the temperature of third time heating is controlled at 180 DEG C, heating
Duration is 5min, d：Then it uses the power of 3KG to carry out it the 4th time to press, the temperature of the 4th heating is controlled 180
DEG C, duration of heat 60min, e：Then the power of 3KG is used to carry out the 5th time to it and press, pressing the time for the 5th time is
70min carries out it during pressing for the 5th time the 5th heating, and the temperature of the 5th heating is controlled at 180 DEG C, and heating is held
The continuous time is 72min, f：Then the power of 3KG is used to carry out the 6th heating to it, it is 60min to press the time for the 6th time, the 6th
The temperature of secondary heating controls 180 DEG C, duration of heat 55min, g：Then it uses the power of 3KG to carry out it the 7th time to add
Heat, it is 50min to press the time for the 7th time, and the 7th heating, the temperature of the 7th heating are carried out to it during pressing for the 7th time
20 DEG C of degree control, h：The power of 1KG is finally used to carry out the 8th heating to it, it is 5min to press the time for the 8th time；
The step S15：It needs to use a kind of detection machine in outer layer AOI detections, the structure of the detection machine includes upper branch
Frame (2), pedestal (1), hydraulic cylinder (6), workbench (3), detection support plate (4), hoistable platform (7) and detector bar (10), institute
The upper bracket (2) stated is fixedly connected on the top of pedestal (1), and the workbench (3) is arranged on pedestal (1), described
Detection support plate (3) is fixedly mounted on workbench (3), and the hoistable platform (7) is connected to upper branch by hydraulic cylinder (6)
The bottom of frame (2), the detector bar (10) are connected to the bottom of hoistable platform (7), the detector bar by translation mechanism
(10) bottom is uniformly arranged detection syringe needle (11), the position in the detection support plate (3) relative to detection syringe needle (11)
It sets and offers through-hole；
A pilot pin column (5) is each provided on four angles of the detection support plate (3)；
The spacing of two adjacent detection syringe needles (11) of described detector bar (10) bottom is 5 millimeters.
2. overall thickness according to claim 1 is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board making side
Method, it is characterised in that：The translation mechanism includes setting in two parallel orbits (9) of hoistable platform (7) bottom and translation
Trolley (8), the detector bar (10) are fixedly connected with translating trolleys (8), and the translating trolleys (8) are movably connected in two
On parallel orbit (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510702850.0A CN105246274B (en) | 2015-10-26 | 2015-10-26 | A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510702850.0A CN105246274B (en) | 2015-10-26 | 2015-10-26 | A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105246274A CN105246274A (en) | 2016-01-13 |
| CN105246274B true CN105246274B (en) | 2018-09-25 |
Family
ID=55043680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510702850.0A Active CN105246274B (en) | 2015-10-26 | 2015-10-26 | A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105246274B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108207078A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board takes off lid leak |
| CN109760122A (en) * | 2018-12-24 | 2019-05-17 | 江苏弘信华印电路科技有限公司 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
| CN110678011A (en) * | 2019-11-12 | 2020-01-10 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103412212A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB performance detection jig with positioning function |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
-
2015
- 2015-10-26 CN CN201510702850.0A patent/CN105246274B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103412212A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | PCB performance detection jig with positioning function |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
| CN104470214A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105246274A (en) | 2016-01-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105246274B (en) | A kind of overall thickness is more than 0.32mm grafting hand in four layers of intermediate rigid-flex combined board production method | |
| CN105246271B (en) | A kind of manufacturing method for the rigid-flex combined board for having an isolated island formula hardboard | |
| CN105228370B (en) | A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare | |
| CN101662897B (en) | Manufacturing method for multilayer stacking printed wiring board | |
| CN106535508B (en) | The exposed technique of golden finger built in multi-layer board flexible circuit board | |
| CN105246272B (en) | A kind of outer layer rigidity plate thickness is more than the rigid-flex combined board preparation method of 0.4mm internal layers lettering symbol | |
| CN106686916B (en) | A kind of laminating method of high density ultrathin type rigid-flex combined board | |
| CN106659000A (en) | Method for producing copper-free area between layers of printed board | |
| CN107148151A (en) | A kind of method of figure filling holes with resin after | |
| CN108811375A (en) | A kind of processing of multi-layer PCB blind slot gasket and fill method | |
| CN105228380B (en) | A kind of gross thickness is less than four layer rigid-flex combined board preparation method of the 0.32mm grafting hand in centre | |
| CN102045948A (en) | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg | |
| CN113490351B (en) | Circuit board manufacturing method for preventing lamination glue overflow | |
| CN104023485B (en) | A kind of high-accuracy stepped multilayer printed circuit board process | |
| CN109287080A (en) | The compression method of asymmetric core plate and asymmetric core plate | |
| CN108811374A (en) | A kind of multiple-plate compression method of flexible PCB | |
| CN103144378A (en) | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof | |
| CN104812181B (en) | The photoresistance film of rigid-flex combined board with flexible structure outer layer keeps away infiltration technique | |
| CN103582321A (en) | Multilayer circuit board and manufacturing method thereof | |
| CN105246273B (en) | A kind of manufacture craft with the rigid-flexible joint plate of restoration | |
| CN102555402B (en) | Prebonding process of metal-base copper-clad plate | |
| CN108174532A (en) | Improving rigid-flex combined board, repeatedly lamination forms bevel edge laminating method | |
| CN106793581A (en) | The folded structure circuit board pressing localization methods of multilayer N+N | |
| CN202918593U (en) | Cover film fitting tool for flexible printed circuit board (FPC) | |
| CN206948721U (en) | A kind of new V grooves board separating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221230 Address after: 335000 No.2 Zhilian Avenue, high tech Industrial Development Zone, Yingtan City, Jiangxi Province Patentee after: Jiangxi Hongxin Flexible Electronic Technology Co.,Ltd. Address before: 212000 no.308-1, Nanxu Avenue, Runzhou District, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU HONGXIN HUAYIN CIRCUIT TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |