CN105228370B - A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare - Google Patents

A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare Download PDF

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Publication number
CN105228370B
CN105228370B CN201510702188.9A CN201510702188A CN105228370B CN 105228370 B CN105228370 B CN 105228370B CN 201510702188 A CN201510702188 A CN 201510702188A CN 105228370 B CN105228370 B CN 105228370B
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time
heating
press
plate
pressing
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CN105228370A (en
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李胜伦
钱小进
黎军
郑冬华
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Jiangxi Hongxin Flexible Electronic Technology Co ltd
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Jiangsu Hongxin Huayin Circuit Technology Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention relates to a kind of different big rigid-flex combined board manufacture crafts of two sides rigidity plate suqare comprising following steps:S1:Lamination, S2:X RAY practice shooting, S3:Milling plate side, S4:Outer layer drills, S5:Deburring, S6:De-smear, S7:Heavy copper, S8:Whole plate electrolytic copper, S9:Outer-layer circuit pre-treatment, S10:Outer laminated film, S11:Outer-layer circuit exposes, S12:Outer-layer circuit etches DES, S13:Outer layer AOI detections, S14:Welding resistance pre-treatment, S15:Welding resistance is printed, S16:It is pre-baked, S17:Welding resistance exposes, S18:Welding resistance is developed, S19:It toasts for the first time, S20:Take off lid, S21:Change gold, S22:Silk-screen, S23:Second of baking, S24:Milling plate, S25:Finished product cleans, S26:Electric performance test, S27:Radium-shine shape, S28:Pressing, S29:Third time is toasted, S30:Product inspection FQC, S31:Packaging, S32:Storage.The present invention have the advantages that it is easy to operate, be easy to carry out and practicality and high efficiency.

Description

A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare
Technical field
The present invention relates to circuit board manufacture field, especially a kind of different big rigid-flex combined board of two sides rigidity plate suqare Manufacture craft.
Background technology
As electronic product develops towards frivolous, short and small, multifunction, Rigid Flex due to its excellent durability with Flexibility is more and more applied on industry, Medical Devices, mobile phone, LCD TV and other consumer electronics products.With The identification of the mobile phone lines of the hand is prevailing, and since mobile phone is small, normal rigid-flex combined board can not be installed.Need lines of the hand identification component one side Greatly, another side needs small.Flatness can not can be ensured by normally producing big one side, while be difficult to detach with hardboard overlapping.
Invention content
The present invention is in order to cope with the above problem, by designing a kind of different big rigid-flex combined board of two sides rigidity plate suqare Manufacture craft plays to produce the different rigid-flex combined board of two sides rigidity plate suqare and increases rigid-flex combined board practical performance Effect.
In order to solve the above technical problems, the different big rigid-flexible combination of a kind of two sides rigidity plate suqare of offer of the invention Plate manufacture craft comprising following steps:S1:Lamination, S2:X-RAY practices shooting, S3:Milling plate side, S4:Outer layer drills, S5:Unhairing Thorn, S6:De-smear, S7:Heavy copper, S8:Whole plate electrolytic copper, S9:Outer-layer circuit pre-treatment, S10:Outer laminated film, S11:Outer-layer circuit Exposure, S12:Outer-layer circuit etching-DES, S13:Outer layer AOI detections, S14:Welding resistance pre-treatment, S15:Welding resistance is printed, S16:In advance It is roasting, S17:Welding resistance exposes, S18:Welding resistance is developed, S19:It toasts for the first time, S20:Take off lid, S21:Change gold, S22:Silk-screen, S23:The Secondary baking, S24:Milling plate, S25:Finished product cleans, S26:Electric performance test, S27:Radium-shine shape, S28:Pressing, S29:Third Secondary baking, S30:Product inspection-FQC, S31:Packaging, S32:Storage.
Further:The step S1:Lamination is successively that KY3001 release films, soft board is (thick by upper and lower two blocks of steel plates Spend 119um), prepreg (thickness 80um), fine copper plate (thickness 18um), release film, filling film and release film from top to bottom into Row is hot-forming.
Further:The production process of the soft board (thickness 119um) is as follows:Step 1:Internal layer sawing sheet, step 2:Drilling, step 3:Circuit pre-treatment, step 4:Interior laminated film, step 5:Inside circuit exposure, step 6:Internal layer circuit etching- DES, step 7:Internal layer AOI detections, step 8:Roughening, step 9:Lamination cover film, step 10:Pressing, step 11:Baking.
Further:The production process of the prepreg (thickness 80um) is as follows:Step 1:Sawing sheet, step 2: It processes (High temperature-resistanadhesive adhesive tape with low viscose glue is attached to PP on pieces), step 3:Drilling (bores lamination location hole and punching location hole), Step 4:The adhesive tape pasted on soft board region PP (is stayed in PP on pieces, the adhesive tape in other places is all torn) by stamp by hemisection, Step 5:Lamination.
Further:The hot-forming method and step is a successively:The power of 1Kg is first used to carry out it tight for the first time Pressure, it is 3min to press the time for the first time, carries out first time heating during pressing for the first time to it, for the first time the temperature of heating Control is at 130 DEG C, duration of heat 3min, b:Then the power of 2Kg is used to press it for the second time, second of heating Temperature control at 130 DEG C, duration of heat 15min, c:Then it uses the power of 2Kg to carry out it third time to press, the It is 22min to press the time three times, carries out third time heating, the temperature control of third time heating during pressing for the third time to it At 180 DEG C, duration of heat 5min, d:Then it uses the power of 3Kg to carry out it the 4th time to press, the temperature of the 4th heating Degree control is at 180 DEG C, duration of heat 60min, e:Then it uses the power of 3Kg to carry out it the 5th time to press, the 5th time It is 70min to press the time, carries out the 5th heating during pressing for the 5th time to it, and the temperature control of the 5th heating exists 180 DEG C, duration of heat 72min, f:Then it uses the power of 3Kg to carry out the 6th heating to it, presses the time the 6th time Temperature for 60min, the 6th heating controls 180 DEG C, duration of heat 55min, g:Then using the power pair of 3Kg It press for the 7th time, and it is 50min to press the time for the 7th time, and the 7th heating is carried out to it during pressing for the 7th time, The temperature control of 7th heating is at 20 DEG C, h:Finally the power of 1Kg is used to carry out the 8th time to it and press, presses the time the 8th time For 5min.
Further:The step S1:Lamination needs to use a kind of hot press, the hot press in operation Structure include pedestal, workbench, rise valence platform, pressing plate and heating device, the workbench and lived by translation mechanism Dynamic to be connected on pedestal, the liter valence platform is movably connected in by elevating mechanism on pedestal, and the pressing plate is by upper pressure Plate and lower platen are formed, and the top board is mounted on the bottom for rising valence platform, and the lower platen is mounted on workbench On, the heating device is arranged in top board, and a positioning column is each provided on four angles of the lower platen, described The bottom of top board offers location hole relative to the position of positioning column.
Further:The heating device is heating tube, and the heating tube has four, described four heating tubes according to It is secondary to be arranged in top board.
Further:The translation mechanism includes two the first tracks and translating trolleys being horizontally set on pedestal, The workbench is movably connected in by translating trolleys on two the first tracks.
Further:The elevating mechanism includes two the second tracks and lift cart being vertically arranged, and described two The second track of item is vertically arranged on pedestal, and the liter valence platform is movably connected in two the second rails by two lift carts On road.
With the above structure, the present invention is by designing a kind of different big rigid-flex combined board system of two sides rigidity plate suqare Make technique, to produce the different rigid-flex combined board of two sides rigidity plate suqare, plays and increase rigid-flex combined board practical performance Effect.
Description of the drawings
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is step S1:Structural schematic diagram when lamination.
Fig. 2 is the structural schematic diagram of hot press.
Specific implementation mode
The present invention provides a kind of different big rigid-flex combined board manufacture crafts of two sides rigidity plate suqare comprising as follows Step:S1:Lamination, S2:X-RAY practices shooting, S3:Milling plate side, S4:Outer layer drills, S5:Deburring, S6:De-smear, S7:Heavy copper, S8:Whole plate electrolytic copper, S9:Outer-layer circuit pre-treatment, S10:Outer laminated film, S11:Outer-layer circuit exposes, S12:Outer-layer circuit etching- DES, S13:Outer layer AOI detections, S14:Welding resistance pre-treatment, S15:Welding resistance is printed, S16:It is pre-baked, S17:Welding resistance exposes, S18:Resistance Weldering development, S19:It toasts for the first time, S20:Take off lid, S21:Change gold, S22:Silk-screen, S23:Second of baking, S24:Milling plate, S25: Finished product cleans, S26:Electric performance test, S27:Radium-shine shape, S28:Pressing, S29:Third time is toasted, S30:Product inspection- FQC, S31:Packaging, S32:Storage.
As shown in Figure 1, the step S1:Lamination is by upper and lower two blocks of steel plates successively by KY3001 release films 11, soft Plate 12 (thickness 119um), prepreg 13 (thickness 80um), fine copper plate 14 (thickness 18um), release film 15, filling film 16 and from Type film 15 carries out hot-forming from top to bottom.
The production process of above-mentioned soft board (thickness 119um) is as follows:Step 1:Internal layer sawing sheet, step 2:Drilling, step Rapid 3:Circuit pre-treatment, step 4:Interior laminated film, step 5:Inside circuit exposure, step 6:Internal layer circuit etching-DES, step 7:Internal layer AOI detections, step 8:Roughening, step 9:Lamination cover film, step 10:Pressing, step 11:Baking.
The production process of above-mentioned prepreg (thickness 80um) is as follows:Step 1:Sawing sheet, step 2:Processing is (by band The High temperature-resistanadhesive adhesive tape of low viscose glue is attached to PP on pieces), step 3:Drilling (bores lamination location hole and punching location hole), step 4:Stamp (adhesive tape pasted on soft board region PP being stayed in by PP on pieces by hemisection, the adhesive tape in other places is all torn), step 5:Lamination.
Above-mentioned hot-forming method and step is a successively:The power of 1Kg is first used to carry out pressing for the first time to it, for the first time It is 3min to press the time, carries out first time heating during pressing for the first time to it, and the temperature of heating is controlled 130 for the first time DEG C, duration of heat 3min, b:Then the power of 2Kg is used to press it for the second time, the temperature control of second of heating System is at 130 DEG C, duration of heat 15min, c:Then it uses the power of 2Kg to carry out it third time to press, press for the third time Time is 22min, carries out third time heating during pressing for the third time to it, and the temperature of third time heating is controlled at 180 DEG C, The duration of heat is 5min, d:Then it uses the power of 3Kg to carry out it the 4th time to press, the temperature control of the 4th heating exists 180 DEG C, duration of heat 60min, e:Then it uses the power of 3Kg to carry out the 5th time to it and press, presses the time the 5th time For 70min, the 5th heating is carried out to it during pressing for the 5th time, the temperature of the 5th heating is controlled at 180 DEG C, heating Duration is 72min, f:Then the power of 3Kg is used to carry out the 6th heating to it, it is 60min to press the time for the 6th time, the The temperature of six heating controls 180 DEG C, duration of heat 55min, g:Then the 7th is carried out to it using the power of 3Kg Secondary to press, it is 50min to press the time for the 7th time, and the 7th heating, the 7th heating are carried out to it during pressing for the 7th time Temperature control at 20 DEG C, h:Finally the power of 1Kg is used to carry out the 8th time to it and press, it is 5min to press the time for the 8th time.
The above method is by designing a kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare, to make Go out the different rigid-flex combined board of two sides rigidity plate suqare, plays the role of increasing rigid-flex combined board practical performance.
Above-mentioned step S1:Lamination needs to use a kind of hot press, structure such as Fig. 2 of the hot press in operation It is shown comprising pedestal 1, workbench 8 rise valence platform 2, pressing plate and heating device 6, the workbench 8 and pass through translation Mechanism is movably connected on pedestal 1, and the liter valence platform 2 is movably connected in by elevating mechanism on pedestal 1, the pressing plate It is made of top board 5 and lower platen 9, the top board 5 is mounted on the bottom of the valence of liter platform 2, the lower platen 9 peace On workbench 8, the heating device 6 is arranged in top board 5, is respectively arranged on four angles of the lower platen 9 There are a positioning column 10, the bottom of the top board 5 to offer location hole, heating dress relative to the position of positioning column 10 It is heating tube to set 6, and the heating tube has four, and described four heating tubes are successively set in top board 5.Elder generation's handle when work It needs the rigid-flexible joint plate of hot pressing to be placed on lower platen 9, rigid-flexible joint plate is consolidated using the positioning column 10 on four angles It is fixed, then start the underface that translation mechanism is transported to top board 5 and rigid-flexible joint plate top board 5, then give heating tube into Row is powered, and is heated to top board 5 using heating tube, and after the temperature of top board 5 is met the requirements, starting elevating mechanism makes it It is moved downward with top board 5 by a liter valence platform 2, is completed to rigid-flexible joint plate using the cooperation of top board 5 and lower platen 9 Hot pressing finally starts translation mechanism and the rigid-flexible joint plate after hot pressing is transferred out.The design by being heated to top board, By being heated to top board, the hot pressing to rigid-flexible joint plate is completed using the cooperation of top board and lower platen, improves it Working efficiency and interlayer alignment accuracy.
Translation mechanism as shown in Figure 2 includes two the first tracks 7 being horizontally set on pedestal 1 and translating trolleys 8, institute The workbench 8 stated is movably connected in by translating trolleys 8 on two the first tracks 7.When work, by starting translating trolleys 8 It makes it through workbench 8 to move horizontally along the first track with lower platen 9, to which lower platen 9 is transported to top board 5 Underface, have the advantages that simple in structure, easily fabricated and practicality and high efficiency.
Elevating mechanism as shown in Figure 2 includes two the second tracks 3 being vertically arranged and lift cart 4, described two Second track 3 is vertically arranged on pedestal 1, and the liter valence platform 2 is movably connected in two second by two lift carts 4 On track 3.When needing hot pressing, startup lift cart 4 makes it through liter valence platform 2 and is done along the second track 3 with top board 5 Vertical and straight movement, to complete the hot pressing to rigid-flexible joint plate by the cooperation of top board 5 and lower platen 9.

Claims (1)

1. a kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare, it is characterised in that:Include the following steps: S1:Lamination, S2:X-RAY practices shooting, S3:Milling plate side, S4:Outer layer drills, S5:Deburring, S6:De-smear, S7:Heavy copper, S8:It is whole Plate electrolytic copper, S9:Outer-layer circuit pre-treatment, S10:Outer laminated film, S11:Outer-layer circuit exposes, S12:Outer layer DES, S13:Outer layer AOI is detected, S14:Welding resistance pre-treatment, S15:Welding resistance is printed, S16:It is pre-baked, S17:Welding resistance exposes, S18:Welding resistance is developed, S19:The Primary baking, S20:Take off lid, S21:Change gold, S22:Silk-screen, S23:Second of baking, S24:Milling plate, S25:Finished product cleans, S26: Electric performance test, S27:Radium-shine shape, S28:Pressing, S29:Third time is toasted, S30:FQC product inspections, S31:Packaging, S32: Storage;
The step S1:Lamination is by upper and lower two blocks of steel plates successively by KY3001 release films (11), the soft board of thickness 119um (12), the prepreg (13) of thickness 80um, the fine copper plate (14) of thickness 18um, release film (15), filling film (16) and release Film (15) carries out hot-forming from top to bottom;
The production process of the soft board of the thickness 119um is as follows:Step 1:Internal layer sawing sheet, step 2:Drilling, step 3:Line Road pre-treatment, step 4:Interior laminated film, step 5:Inside circuit exposure, step 6:Internal layer DES, step 7:Internal layer AOI detections, step Rapid 8:Roughening, step 9:Lamination cover film, step 10:Pressing, step 11:Baking;
The production process of the prepreg of the thickness 80um is as follows:Step 1:Sawing sheet, step 2:Processing, will be with low viscose glue High temperature-resistanadhesive adhesive tape be attached to PP on pieces, step 3:Lamination location hole and punching location hole, step 4 are bored in drilling:Stamp passes through half It cuts and the adhesive tape pasted on soft board region PP is stayed in into PP on pieces, the adhesive tape in other places is all torn, step 5:Lamination;
The hot-forming method and step is a successively:It first uses the power of 1Kg to carry out pressing for the first time to it, presses for the first time Time is 3min, carries out first time heating during pressing for the first time to it, and the temperature of heating is controlled at 130 DEG C for the first time, The duration of heat is 3min, b:Then the power of 2Kg is used to press it for the second time, the temperature control of second of heating exists 130 DEG C, duration of heat 15min, c:Then it uses the power of 2Kg to carry out it third time to press, presses the time for the third time For 22min, third time heating is carried out during pressing for the third time to it, the temperature of third time heating is controlled at 180 DEG C, heating Duration is 5min, d:Then it uses the power of 3Kg to carry out it the 4th time to press, the temperature of the 4th heating is controlled 180 DEG C, duration of heat 60min, e:Then the power of 3Kg is used to carry out the 5th time to it and press, pressing the time for the 5th time is 70min carries out it during pressing for the 5th time the 5th heating, and the temperature of the 5th heating is controlled at 180 DEG C, and heating is held The continuous time is 72min, f:Then the power of 3Kg is used to carry out the 6th heating to it, it is 60min to press the time for the 6th time, the 6th The temperature of secondary heating controls 180 DEG C, duration of heat 55min, g:Then it is carried out the 7th time using the power of 3Kg Press, it is 50min to press the time for the 7th time, and the 7th heating is carried out to it during pressing for the 7th time, the 7th heating Temperature control is at 20 DEG C, h:Finally the power of 1Kg is used to carry out the 8th time to it and press, it is 5min to press the time for the 8th time;
The step S1:Lamination needs to use a kind of hot press in operation, and the structure of the hot press includes bottom Seat (1), workbench (8) rise valence platform (2), pressing plate and heating device (6), the workbench (8) and pass through translation mechanism It is movably connected on pedestal (1), the liter valence platform (2) is movably connected in by elevating mechanism on pedestal (1), the pressure Plate is made of top board (5) and lower platen (9), and the top board (5) is mounted on the bottom for rising valence platform (2), described Lower platen (9) be mounted on workbench (8), the heating device (6) setting is in the top board (5), the pushing It is each provided with a positioning column (10) on four angles of plate (9), the position of the bottom of the top board (5) relative to positioning column (10) It sets and offers location hole;
The heating device (6) is heating tube, and the heating tube has four, and described four heating tubes are successively set on In pressing plate (5);
The translation mechanism includes two the first tracks (7) being horizontally set on pedestal (1) and translating trolleys (8), described Workbench (8) be movably connected on two the first tracks (7) by translating trolleys (8);
The elevating mechanism includes two the second tracks (3) being vertically arranged and lift cart (4), described two the second rails Road (3) is vertically arranged on pedestal (1), and the liter valence platform (2) is movably connected in two article by two lift carts (4) On two tracks (3).
CN201510702188.9A 2015-10-26 2015-10-26 A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare Active CN105228370B (en)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
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CN106455352A (en) * 2016-08-30 2017-02-22 淮安华泰电子科技有限公司 Novel laminating machine
CN107708331B (en) * 2017-10-16 2024-05-17 伟创力电子技术(苏州)有限公司 Board splicing machine for splicing circuit boards
CN107683031B (en) * 2017-11-07 2020-11-10 珠海杰赛科技有限公司 Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board
CN112654178B (en) * 2020-11-09 2022-04-29 广东科翔电子科技股份有限公司 Process method of embedded pad type rigid-flex printed circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103281859A (en) * 2013-06-07 2013-09-04 厦门弘信电子科技有限公司 Rigid-flex combined circuit board and manufacturing method therefore
CN103747633A (en) * 2013-12-27 2014-04-23 昆山迈致治具科技有限公司 PCB locating stroke-limiting hot-pressing table clamping jig
CN104470214A (en) * 2014-11-25 2015-03-25 镇江华印电路板有限公司 Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590756A (en) * 1991-09-28 1993-04-09 Ibiden Co Ltd Production of rigid/flexible board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103281859A (en) * 2013-06-07 2013-09-04 厦门弘信电子科技有限公司 Rigid-flex combined circuit board and manufacturing method therefore
CN103747633A (en) * 2013-12-27 2014-04-23 昆山迈致治具科技有限公司 PCB locating stroke-limiting hot-pressing table clamping jig
CN104470214A (en) * 2014-11-25 2015-03-25 镇江华印电路板有限公司 Shape machining method for flexible printed circuit board of rigid-flexible combined circuit board

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