CN103249251A - PCB correction method and correction device - Google Patents
PCB correction method and correction device Download PDFInfo
- Publication number
- CN103249251A CN103249251A CN2013101390147A CN201310139014A CN103249251A CN 103249251 A CN103249251 A CN 103249251A CN 2013101390147 A CN2013101390147 A CN 2013101390147A CN 201310139014 A CN201310139014 A CN 201310139014A CN 103249251 A CN103249251 A CN 103249251A
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- pcb board
- pile
- pcb
- heat
- carrier
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- 238000000034 method Methods 0.000 title abstract description 15
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 30
- 239000010959 steel Substances 0.000 claims description 30
- 238000012546 transfer Methods 0.000 claims description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 239000000729 antidote Substances 0.000 claims description 14
- 239000004411 aluminium Substances 0.000 claims description 13
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 230000007306 turnover Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 11
- 230000005540 biological transmission Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- VYQRBKCKQCRYEE-UHFFFAOYSA-N ctk1a7239 Chemical compound C12=CC=CC=C2N2CC=CC3=NC=CC1=C32 VYQRBKCKQCRYEE-UHFFFAOYSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Abstract
The invention discloses a PCB correction method which comprises the steps as follows: a, stacking a plurality of pieces of PCBs into PCB groups, and stacking the PCB groups into a pile, wherein a heat transmission component is placed between every two PCB groups; b, applying pressure to the top of the whole pile of stacked PCB groups and heating for roasting; and c, performing cold pressing on the pile of PCBs. The invention further discloses a PCB correction device which comprises a roaster, and a carrier used for stacking and placing PCBs to be corrected; and the PCB correction device is characterized in that the carrier can be arranged in the roaster in an in-out manner, and is provided with a pressurizing component capable of applying pressure to the whole pile of PCBs simultaneously, and heat transmission components. According to the invention, pressure is applied to the top of the whole pile after the plurality of groups of PCBs to be corrected are stacked into the whole pile, so that the pile of PCBs can be corrected simultaneously, and production efficiency is improved; and compared with the traditional method, the PCB correction method and device for correcting the PCBs, disclosed by the invention, have the advantage that, double-area products can be processed every time.
Description
Technical field
The present invention relates to pcb board correcting technology field, be specifically related to a kind of pcb board antidote and apparatus for correcting.
Background technology
When making pcb board (Printed Circuit Board, printed circuit board (PCB)), the PCB finished product is if phenomenon such as plate is curved, plate sticks up, and generally direct Bian pressure bake mode is corrected in test and visual inspection process.See also Fig. 1, traditional apparatus for correcting is arranged in the curved warping anti-stetch machine 100 of plate, and it comprises baking box 101, upper table surface 102 and following table 103, and described upper table surface 102 can slide up and down in baking box 101, and 103 of following tables are fixed in the baking box 101.When using this apparatus for correcting, earlier the bad pcb board of several piece being stacked as one folds, be placed on the following table 103, make upper table surface 102 move down on the pcb board that directly is pressed on the following table 103 again and keep a period of time, the evenness tolerance of upper table surface 102 and following table 103 is ± 2mm (millimeter).The said apparatus complex structure, utilization rate of equipment and installations is low, can only correct the folded pcb board of 2-3 at every turn, and because hot pressing and the step of colding pressing are all carried out, process length consuming time in baking box, and efficient is very low.When using said apparatus to carry out the pcb board rectification, in order to carry out subsequent handling, need repeatedly carry pcb board, easy scratch pcb board produces scrap products after the operation inconvenience.
Summary of the invention
In view of this, the present invention discloses a kind of pcb board antidote and device that improves the pcb board rectification effect, enhances productivity.
First purpose of the present invention is achieved through the following technical solutions: a kind of pcb board antidote may further comprise the steps:
A. the several piece pcb board is stacked and be the pcb board group, and several pcb board groups are stacked is one pile, whenever be placed with heat-transferring assembly between folded pcb board; B. press at whole pile of pcb board top that stacks and heated baking; C. this pile pcb board is colded pressing.
Be to solve the low problem of prior art production efficiency, it is to exert pressure in whole pile of top after one whole pile that the present invention will count that folded pcb board to be corrected stacks, thereby corrects this pile pcb board simultaneously, simplifies the operation and has improved production efficiency; No longer need when adopting designed method of the present invention to correct pcb board respectively every folded pcb board is exerted pressure, internal structure structure that can thin device helps to improve utilization rate of equipment and installations, reduces maintenance difficulties.Because whole pile of pcb board that stacks have less specific area, namely its heating surface is few, causes pcb board to be heated inequality easily and influences rectification effect.Correct success rate for improving, the present invention with the pcb board of some as a pcb board group, and between each pcb board group, heat-transferring assembly being set, this heat-transferring assembly can import its inside from whole pile of pcb board surface with heat, can use the material preparation with good heat conductivility.
The thickness of described each pcb board group is less than 130mm; Described every pile of pcb board comprises 2-6 pcb board group.
The present invention is directed to the characteristics that whole pile of pcb board corrected, to the thickness of each pcb board group, every pile of pcb board comprise PCB group quantity all optimize, guarantee that each piece pcb board is heated evenly, make it to correct and also be conducive to cut down the consumption of energy successful the time, realize energy-saving and emission-reduction.
Described step b presses to this folded pcb board top and heated baking is with 140-160 ℃ of baking 110-130min under 12-17KPa pressure.
Described step c cold pressing be under 12-17KPa pressure, carry out with
15-45 ℃Carry out 80-100min.
Because the present invention and traditional pcb board antidote have bigger difference, the inequality of being heated easily, designer's characteristics according to the present invention have redesigned parameters such as the pressure, temperature, time of hot pressing and cold pressing process, make the present invention can realize optimum rectification effect.
Another object of the present invention is achieved through the following technical solutions: a kind of pcb board apparatus for correcting of realizing above-mentioned pcb board antidote, comprise baking box, be used for stacking the carrier of waiting to correct pcb board, described carrier can be arranged in the baking box with passing in and out, and described carrier is provided with the pressure-applying unit that can exert pressure simultaneously to whole pile of pcb board simultaneously; Also be provided with heat-transferring assembly on the described carrier.
Because described carrier can take out outside the baking box, and the operation that stacks pcb board is carried out more easily, more can reduce the carrying of pcb board, reduces it by the probability of scratch; In addition, when carrying out described cold pressing process, pcb board directly can be taken out together with carrier and carry out, baking box then can continue to come into operation.
Described heat-transferring assembly comprises the heat transfer steel plate that overlays between each folded pcb board.
The heat transfer steel plate is except making pcb board is heated evenly, and its even curface also has the effect that strengthens rectification effect.
Further, described heat transfer surface of steel plate is coated with aluminium matter heat-conducting layer.
In order further to overcome the uneven problem of being heated inside and outside the pcb board that stacks in a pile, spy of the present invention is coated with the good thermal conductivity aluminium of tool matter heat-conducting layer at the heat transfer surface of steel plate.
Described aluminium matter heat-conducting layer is 1:20-1:50 with the ratio of the thickness of heat transfer steel plate.
Aluminum material hardness is lower, if the too high gross distortion that then takes place easily of aluminium matter heat-conducting layer thickness.Use the heat transfer steel plate of aluminium matter heat-conducting layer distortion to handle pcb board, not only the plate that can not correct pcb board stick up, problem increased the weight of and cause whole blackboard newspaper useless.Aluminium matter heat-conducting layer thickness is low then to be not enough to the heat transfer effect that provides enough.Designer of the present invention proposes the ratio of aluminium matter heat-conducting layer and the thickness of heat transfer steel plate is limited to 1:20-1:50 after long term test demonstration, can guarantee that heat-transfer effect has enough hardness again, and its heat transfer efficiency is than clean steel plate hight more than 65%.
Described pressing mechanism comprises that one is positioned over the compression steel plate at whole pile of pcb board top.
Directly compression steel plate is placed on the whole pile of pcb board top that stacks, carrier is sent in the baking oven toasted again, by the weight of compression steel plate self pcb board is exerted pressure.Owing to need not to move up and down during compression steel plate work, improved the utilance of baking box; The heat transfer steel plate of surfacing also has the effect that strengthens rectification effect.
Described carrier bottom tool wheel; Described baking box bottom is provided with the guide rail of carrier turnover.
The present invention has following beneficial effect with respect to prior art:
1. will to count that folded pcb board to be corrected stacks be to exert pressure in whole pile of top after one whole pile in the present invention, thereby correct this pile pcb board simultaneously, improve production efficiency, adopted pcb board antidote disclosed in this invention and device to correct pcb board, the product of one times of area of each comparable conventional method multiprocessing.
2. pcb board antidote provided by the invention and device have reduced the carrying number of times of pcb board in the processing procedure, simplify working process and reduce process time, more than 50%, can also avoid being scrapped by scratch in the pcb board handling process simultaneously when economizing on than traditional processing mode.
3. the heat transfer surface of steel plate of pcb board apparatus for correcting provided by the present invention is provided with aluminium matter heat-conducting layer, and the thickness ratio of heat transfer steel plate and aluminium matter heat-conducting layer is optimized, and satisfies the requirement of heat transfer efficiency and hardness simultaneously.Its heat transfer efficiency of heat transfer steel plate that is provided with aluminium matter heat-conducting layer more than 65, has guaranteed that the rectification effect of pcb board is as for more being conducive to energy savings than the ordinary steel plate hight.
4. pcb board antidote provided by the invention and device have good pcb board rectification effect, and corrected rate reaches more than 99%, correct mode apparently higher than tradition.
Description of drawings
Fig. 1 is the schematic diagram of existing pcb board apparatus for correcting.
Fig. 2 is Roasting oven structure schematic diagram of the present invention.
Fig. 3 is carrier structure schematic diagram of the present invention.
Embodiment
Describe in further detail for the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and the present invention of embodiment:
Embodiment 1
As Fig. 2 and a kind of pcb board apparatus for correcting shown in Figure 3, comprise baking box 210, can pass in and out the carrier 220 of baking box.Above-mentioned carrier 220 bottoms are provided with roller 221, and above-mentioned baking box 210 bottoms are provided with the guide rail 211 with the roller coupling.
Also be provided with pressure-applying unit on the above-mentioned carrier 220.In the present embodiment, above-mentioned pressure-applying unit comprises a compression steel plate 230.
In addition, also be provided with heat-transferring assembly under the compression steel plate, comprise the heat transfer steel plate 231 of 4 space sets between the pcb board that stacks, the thickness of heat transfer steel plate is 1mm, and the heat transfer surface of steel plate is coated with the aluminium matter heat-conducting layer of 0.05mm.
The method that the use said apparatus carries out the pcb board rectification is as follows:
A. pending pcb board being stacked is 5 pcb board groups, and 5 pcb board groups 232 are overlayed on the carrier successively, makes it to be stacked as one pile; Whenever stack a pcb board group and namely put a heat transfer steel plate at its top; B. stack compression steel plate at whole pile of pcb board top that stacks, and carrier pushed in the baking box toast; C. carrier is hauled out baking box, the pcb board of colding pressing.
The above-mentioned thickness of folded pcb board whenever is 130mm.
Above-mentioned compression steel plate can provide the pressure (disregarding pcb board self pressure) of 15Kpa for pcb board; Above-mentioned baking is to toast 120min down at 130 ℃.
After baking finishes, carrier is shifted out baking box, and it is continued with compression steel plate the 90min that exerts pressure under 20 ℃ of environment.During this time, can push other pcb boards in the baking box works on.
The device and method that present embodiment provides can be corrected pcb board efficiently, and restitution factor reaches 99%.In addition, also have advantages such as capacity utilization height, pcb board scrappage be low.
More than be wherein specific implementation of the present invention, it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (10)
1. pcb board antidote may further comprise the steps:
A. the several piece pcb board is stacked and be the pcb board group, and several pcb board groups are stacked is one pile, whenever be placed with heat-transferring assembly between folded pcb board; B. press at whole pile of pcb board top that stacks and heated baking; C. this pile pcb board is colded pressing.
2. pcb board antidote according to claim 1, it is characterized in that: the thickness of described each pcb board group is less than 130mm; Described every pile of pcb board comprises 2-6 pcb board group.
3. pcb board antidote according to claim 2 is characterized in that: described step b presses to whole pile of pcb board top and heated baking is with 140-160 ℃ of baking 110-130min under 12-17KPa pressure.
4. pcb board antidote according to claim 3 is characterized in that: described step c cold pressing be under 12-17KPa pressure, carry out with
15-45 ℃Carry out 90min.
5. pcb board apparatus for correcting of realizing each described pcb board antidote of claim 1-4, comprise baking box (210), be used for stacking the carrier (220) of waiting to correct pcb board, it is characterized in that: described carrier (220) can be arranged in the baking box (210) with passing in and out, and described carrier (220) is provided with the pressure-applying unit that can exert pressure simultaneously to whole pile of pcb board simultaneously; Also be provided with heat-transferring assembly on the described carrier.
6. pcb board apparatus for correcting according to claim 5, it is characterized in that: described heat-transferring assembly comprises the heat transfer steel plate (231) that overlays between each pcb board group.
7. pcb board apparatus for correcting according to claim 6, it is characterized in that: described heat transfer surface of steel plate is coated with aluminium matter heat-conducting layer.
8. pcb board apparatus for correcting according to claim 7, it is characterized in that: described aluminium matter heat-conducting layer is 1:20-1:50 with the ratio of the thickness of heat transfer steel plate.
9. pcb board apparatus for correcting according to claim 8, it is characterized in that: described pressure-applying unit comprises that one is positioned over the compression steel plate (230) at whole pile of pcb board top.
10. according to each described pcb board apparatus for correcting of claim 5-9, it is characterized in that: described carrier (220) bottom tool roller (221); Described baking box (210) bottom is provided with the guide rail (211) of carrier turnover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310139014.7A CN103249251B (en) | 2013-04-22 | 2013-04-22 | A kind of PCB correction method and apparatus for correcting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310139014.7A CN103249251B (en) | 2013-04-22 | 2013-04-22 | A kind of PCB correction method and apparatus for correcting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103249251A true CN103249251A (en) | 2013-08-14 |
| CN103249251B CN103249251B (en) | 2016-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310139014.7A Active CN103249251B (en) | 2013-04-22 | 2013-04-22 | A kind of PCB correction method and apparatus for correcting |
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| Country | Link |
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| CN (1) | CN103249251B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041446A (en) * | 2018-09-25 | 2018-12-18 | 上海移远通信技术股份有限公司 | A kind of antidote of pcb board flatness defective products |
| CN113141724A (en) * | 2021-03-25 | 2021-07-20 | 广州美维电子有限公司 | PCB (printed Circuit Board) manufacturing process |
| CN113207238A (en) * | 2021-03-30 | 2021-08-03 | 广东兴达鸿业电子有限公司 | PCB correction equipment and correction method thereof |
| CN113858596A (en) * | 2021-08-31 | 2021-12-31 | 福州瑞华印制线路板有限公司 | PCB (printed circuit board) buckling method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201426216Y (en) * | 2009-05-06 | 2010-03-17 | 深圳市深南电路有限公司 | PCB stacking structure |
| CN201766771U (en) * | 2010-05-14 | 2011-03-16 | 深圳市博敏电子有限公司 | Rapid vehicle device for levelling warpage of printed circuit board |
| CN201813615U (en) * | 2010-08-10 | 2011-04-27 | 竞华电子(深圳)有限公司 | Correction device for printed circuit board (PCB) |
-
2013
- 2013-04-22 CN CN201310139014.7A patent/CN103249251B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201426216Y (en) * | 2009-05-06 | 2010-03-17 | 深圳市深南电路有限公司 | PCB stacking structure |
| CN201766771U (en) * | 2010-05-14 | 2011-03-16 | 深圳市博敏电子有限公司 | Rapid vehicle device for levelling warpage of printed circuit board |
| CN201813615U (en) * | 2010-08-10 | 2011-04-27 | 竞华电子(深圳)有限公司 | Correction device for printed circuit board (PCB) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041446A (en) * | 2018-09-25 | 2018-12-18 | 上海移远通信技术股份有限公司 | A kind of antidote of pcb board flatness defective products |
| CN113141724A (en) * | 2021-03-25 | 2021-07-20 | 广州美维电子有限公司 | PCB (printed Circuit Board) manufacturing process |
| CN113141724B (en) * | 2021-03-25 | 2023-09-29 | 广州美维电子有限公司 | PCB manufacturing process |
| CN113207238A (en) * | 2021-03-30 | 2021-08-03 | 广东兴达鸿业电子有限公司 | PCB correction equipment and correction method thereof |
| CN113858596A (en) * | 2021-08-31 | 2021-12-31 | 福州瑞华印制线路板有限公司 | PCB (printed circuit board) buckling method |
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| Publication number | Publication date |
|---|---|
| CN103249251B (en) | 2016-12-28 |
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Effective date of registration: 20210219 Address after: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee after: Nantong Shenghong Technology Co.,Ltd. Address before: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. |
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Effective date of registration: 20231124 Address after: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee after: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. Address before: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee before: Nantong Shenghong Technology Co.,Ltd. |
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