CN109041446A - A kind of antidote of pcb board flatness defective products - Google Patents
A kind of antidote of pcb board flatness defective products Download PDFInfo
- Publication number
- CN109041446A CN109041446A CN201811114561.9A CN201811114561A CN109041446A CN 109041446 A CN109041446 A CN 109041446A CN 201811114561 A CN201811114561 A CN 201811114561A CN 109041446 A CN109041446 A CN 109041446A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- defective products
- antidote
- baking
- flatness defective
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to pcb board manufacturing technology fields, disclose a kind of antidote of pcb board flatness defective products, this method comprises: S1: pcb board flatness defective products is placed in oven for baking；S2: after the pcb board after baking, hot pressing is carried out；S3: the pcb board after hot pressing is cold-pressed immediately.Antidote provided by the present invention simulates pcb board from room temperature-preheating-TG peak value-cooling oven temperature profile process completely, and rectification effect and correction success rate to pcb board flatness defective products are substantially better than the prior art.
Description
Technical field
The invention belongs to pcb board manufacturing technology field, in particular to a kind of antidote of pcb board flatness defective products.
Background technique
The full name of pcb board is Printed Circuit Board, i.e. printed circuit board, is electronic component electrical connection
Supplier, be the mistake for greatly reducing wiring and assembly using the advantages of printed circuit board, improve the gentle life of Automated water
Produce work rate.In the modern electronic product world, pcb board is the important link for forming electronic product, is difficult the imagination in an electricity
Have in sub- equipment and do not use pcb board, thus the quality of PCB how will to electronic product can long-term normal reliable work belt come it is non-
Often big influence.
Pcb board flatness is bad (i.e. pcb board warpage), is one of pcb board production process common deficiency.Cause PCB
The bad reason of plate flatness have be in short much due to production pcb board various raw material and semi-finished product thermal expansion
(or CTE) mismatch, resin flowing and curing reaction, glass cloth and paving copper is uneven under hot pressing or production process in material drawing
It stretches and cuts, caused by the thermal stress of the formation such as various humid heat treatments and mechanical stress etc..
The combination reliability between copper billet and high-power component, radiating element, the tightness degree being locally embedded to inside PCB
Determine the heat dissipation effect of PCB, and the flatness between copper billet and PCB then determines copper billet and high-power component, radiating element
Between combination reliability, tightness degree, therefore between copper billet and PCB flatness control it is very crucial.To pcb board flatness
Defective products effectively correct and repair be Electronic products manufacturing manufacturer important topic.
Summary of the invention
The purpose of the present invention is to provide a kind of antidotes of pcb board flatness defective products, smooth to pcb board to realize
Degree defective products effectively correcting and repairing.
In order to solve the above technical problems, the correction side of pcb board flatness defective products provided by embodiments of the present invention
Method, comprising: S1: pcb board flatness defective products is placed in oven for baking；S2: by the pcb board after baking, hot pressing is carried out；S3:
Pcb board after hot pressing is cold-pressed immediately.
In terms of existing technologies, the correction side of pcb board flatness defective products provided by embodiments of the present invention
Method, complete analog PCB plate is from room temperature-preheating-TG peak value-cooling oven temperature profile process.Firstly, in the baking procedure of S1, by
In there is hygroscopicity in view of pcb board, if plate layer can not only be damaged, be also possible to cause the fracture in the hole VIA by directly carrying out hot pressing
Pcb board disabler is caused, thus steam is removed by baking procedure and the pre-heat treatment is completed to plate.In the heat-press step of S2,
Pcb board is set to be heated to soft state by hot pressing, heat-press step treated pcb board is in glassy state, substrate softens, is mechanical strong
Degree is substantially reduced, and provides condition for subsequent cold pressing leveling.In the cold pressing step of S3, is cooled down to pcb board and make pcb board
Keep smooth；Apply weight on plate while cooling down rapidly after pcb board absorbs heat, can reach leveling purpose well.
The rectification effect of the antidote of pcb board flatness defective products provided by embodiments of the present invention and correction success rate are obvious
Better than the prior art.
Preferably, in step S1, baking temperature is 120~150 DEG C, and baking time is 4~8 hours.Specifically, it toasts
Temperature range be adjusted according to the TG value of pcb board, TG is the process that the pcb board is glassy state by Solid State Transformation, when
On this temperature, substrate softens, and mechanical strength is substantially reduced.It is further preferred that in step S1, baking temperature is 120 DEG C,
Baking time is 8 hours.
Preferably, the hot pressing in the S2 carries out in hot press, and the hot press is by way of heat transfer to described
Pcb board carries out hot pressing.The hot pressing temperature is 230~250 DEG C, hot pressing time is 30~80 seconds, to reach to the best of pcb board
Bating effect.
Preferably, the method for the cold pressing in the S3 are as follows: the heat source in the heat-press step is detached from the wink of the pcb board
Between, cold pressing block is placed in the upper surface of the pcb board, the gravity of cold pressing block is applied on PCB and is corrected.
Preferably, when the size of the pcb board is 40mm*40mm, the cold pressing block is the piece of stainless steel of 5~8Kg.It is stainless
Steel has excellent thermal conductivity, and the weight needs of cold pressing block have the function that pcb board is overcome to cool down from complications, to pcb board,
The weight of cold pressing block is obtained according to thickness, size and the number of plies of PCBA board.
Preferably, the cold pressing time is 60~120 seconds.Cold pressing basis of time in embodiments of the present invention is to PCB
The acceleration slope of plate Physical temperature-lowering is set, and the temperature of pcb board is reduced to PCB solid state temperature in a short time and is depended on
Cold pressing block absorbs the efficiency of heat, and can not meet if the time is short makes PCB be cooled to solid temperature.
Detailed description of the invention
Fig. 1 is the flow chart of the antidote of pcb board flatness defective products provided by embodiment of the present invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below will to the embodiments of the present invention into
The detailed elaboration of row.However, it will be understood by those skilled in the art that in each embodiment of the present invention, in order to make to read
Person more fully understands the application and proposes many technical details.But even if without these technical details and based on following
The various changes and modifications of embodiment, each claim of the application technical solution claimed can also be realized.
First embodiment of the invention provides a kind of antidote of pcb board flatness defective products, it includes:
S1: pcb board flatness defective products is placed in oven for baking: in this step, by baking removal pcb board
Steam simultaneously completes the pre-heat treatment to plate, avoids damage of the direct hot pressing to pcb board layer and can prevent the fracture of the hole VIA from causing PCB
Plate disabler.
S2: the pcb board after baking is cooling, it carries out hot pressing: after step S1 baking is completed, pcb board being placed in hot press
In, hot press carries out hot pressing to the pcb board by way of heat transfer.Specifically, slowly increase pcb board by cylinder
And heat source is touched, heat source heats pcb board, and with the growth of heating time, the temperature of pcb board increases and reaches rapidly
After the peak temperature of the TG value of pcb board, pcb board is set to be detached from heat source using the effect of cylinder again.In this step, after hot pressing
Pcb board be in glassy state, substrate softens, mechanical strength is substantially reduced, and flattens for subsequent cold pressing and provides condition.
S3: the pcb board after hot pressing is cold-pressed immediately: is detached from the moment of the heat source in heat-press step in pcb board, uses
Cold pressing block applies gravity, to achieve the purpose that correct levelling warpage.
Second embodiment of the present invention is to the optimization in first embodiment.It specifically, is in step S1
The optimization of baking temperature and baking time.In step S1, baking temperature is 120~150 DEG C, and baking time is 4~8 hours.It is excellent
Selection of land, baking temperature is 120 DEG C, baking time is 8 hours.In present embodiment, TG of the temperature range of baking according to pcb board
Value is adjusted, and TG is the process that the pcb board is glassy state by Solid State Transformation, and on this temperature, substrate softens, machine
Tool intensity is substantially reduced.Specifically: the pcb board for being 150 DEG C for TG value, baking temperature range are 120~125 DEG C；For
The pcb board that TG value is 170 DEG C, baking temperature range are 130~150 DEG C.
Third embodiment of the present invention is advanced optimized to second embodiment.It specifically, is to step S2
In hot pressing temperature and hot pressing time optimization.In step S2, hot pressing temperature is 230~250 DEG C, hot pressing time is 30~80
Second.
4th embodiment of the invention is advanced optimized to third embodiment.It specifically, is to step S3
In cold pressing block weight and cold pressing the time it is preferred.In step S3, when the pcb board size be 40mm*40mm, it is described cold
Briquetting is the stainless steel iron block of 5~8Kg.Stainless steel has excellent thermal conductivity, and the weight needs of cold pressing block, which reach, overcomes pcb board
From effect tortuous and to pcb board cooling, the weight of cold pressing block is obtained according to thickness, size and the number of plies of PCBA board.
In addition, the cold pressing time is preferably 60~120.Basis of time is cold-pressed to carry out the acceleration slope of pcb board Physical temperature-lowering
The temperature of pcb board is reduced to efficiency of the PCB solid state temperature depending on cold pressing block absorption heat, such as by setting in a short time
The fruit time is short, which just to be can not meet, makes PCB be cooled to solid temperature.
It is smooth with the mass that technical solution provided by the 4th embodiment of the invention carries out pcb board, assessment report
It accuses as shown in table 1 below:
The smooth project heavy industry data of 1 pcb board mass of table
In the smooth project of the mass of pcb board, amounts to 4121pcs warpage pcb board and planarized, maintenance is retrieved
2928pcs。
It will be understood by those skilled in the art that the respective embodiments described above are to realize specific embodiments of the present invention,
And in practical applications, can to it, various changes can be made in the form and details, without departing from the spirit and scope of the present invention.
Claims (9)
1. a kind of antidote of pcb board flatness defective products, characterized by comprising:
S1: pcb board flatness defective products is placed in oven for baking；
S2: by the pcb board after baking, hot pressing is carried out；
S3: the pcb board after hot pressing is cold-pressed immediately.
2. the antidote of pcb board flatness defective products according to claim 1, which is characterized in that in the S1, baking
Temperature is 120~150 DEG C, and baking time is 4~8 hours.
3. the antidote of pcb board flatness defective products according to claim 2, which is characterized in that in the S1, baking
Temperature is 120 DEG C；Baking time is 8 hours.
4. the antidote of pcb board flatness defective products according to claim 1, which is characterized in that the heat in the S2
It is pressed in hot press and carries out.
5. the antidote of pcb board flatness defective products according to claim 4, which is characterized in that the hot press is logical
The mode for crossing heat transfer carries out hot pressing to the pcb board.
6. the antidote of pcb board flatness defective products according to claim 1, which is characterized in that the hot pressing temperature
Be referenced as 230~250 DEG C, hot pressing time be 30~80 seconds.
7. the antidote of pcb board flatness defective products according to claim 1, which is characterized in that cold in the S3
The method of pressure are as follows: the heat source in the heat-press step is detached from the moment of the pcb board, places in the upper surface of the pcb board
Cold pressing block.
8. the antidote of pcb board flatness defective products according to claim 7, which is characterized in that when the pcb board
Having a size of 40mm*40mm, the cold pressing block is the piece of stainless steel of 5~8Kg.
9. the antidote of pcb board flatness defective products according to claim 8, which is characterized in that the cold pressing time
It is 60~120.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811114561.9A CN109041446A (en) | 2018-09-25 | 2018-09-25 | A kind of antidote of pcb board flatness defective products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811114561.9A CN109041446A (en) | 2018-09-25 | 2018-09-25 | A kind of antidote of pcb board flatness defective products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109041446A true CN109041446A (en) | 2018-12-18 |
Family
ID=64617862
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811114561.9A Pending CN109041446A (en) | 2018-09-25 | 2018-09-25 | A kind of antidote of pcb board flatness defective products |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466762A (en) * | 2020-11-09 | 2021-03-09 | 太极半导体（苏州）有限公司 | Injection molding baking process for improving substrate warping |
| CN113207238A (en) * | 2021-03-30 | 2021-08-03 | 广东兴达鸿业电子有限公司 | PCB correction equipment and correction method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189694A (en) * | 1984-10-09 | 1986-05-07 | ソニー株式会社 | Method and apparatus for correcting shape of printed circuitboard |
| JPH0197643A (en) * | 1987-10-09 | 1989-04-17 | Matsushita Electric Works Ltd | Correction of warp of printed circuit board |
| CN102905469A (en) * | 2011-07-25 | 2013-01-30 | 北大方正集团有限公司 | Leveling device and method for producing printed circuit board (PCB) |
| CN103249251A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | PCB correction method and correction device |
| CN103579050A (en) * | 2012-07-30 | 2014-02-12 | 三星电机株式会社 | Substrate processing device |
| CN105636367A (en) * | 2016-03-07 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | Lamination method of hybrid material circuit board |
| CN205291184U (en) * | 2015-12-30 | 2016-06-08 | 江苏博腾新材料股份有限公司 | Evener |
| CN106881756A (en) * | 2017-01-16 | 2017-06-23 | 华南农业大学 | A kind of warpage timber correction and hot-pressing drying method |
-
2018
- 2018-09-25 CN CN201811114561.9A patent/CN109041446A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189694A (en) * | 1984-10-09 | 1986-05-07 | ソニー株式会社 | Method and apparatus for correcting shape of printed circuitboard |
| JPH0197643A (en) * | 1987-10-09 | 1989-04-17 | Matsushita Electric Works Ltd | Correction of warp of printed circuit board |
| CN102905469A (en) * | 2011-07-25 | 2013-01-30 | 北大方正集团有限公司 | Leveling device and method for producing printed circuit board (PCB) |
| CN103579050A (en) * | 2012-07-30 | 2014-02-12 | 三星电机株式会社 | Substrate processing device |
| CN103249251A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | PCB correction method and correction device |
| CN205291184U (en) * | 2015-12-30 | 2016-06-08 | 江苏博腾新材料股份有限公司 | Evener |
| CN105636367A (en) * | 2016-03-07 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | Lamination method of hybrid material circuit board |
| CN106881756A (en) * | 2017-01-16 | 2017-06-23 | 华南农业大学 | A kind of warpage timber correction and hot-pressing drying method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466762A (en) * | 2020-11-09 | 2021-03-09 | 太极半导体（苏州）有限公司 | Injection molding baking process for improving substrate warping |
| CN113207238A (en) * | 2021-03-30 | 2021-08-03 | 广东兴达鸿业电子有限公司 | PCB correction equipment and correction method thereof |
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Application publication date: 20181218 |