CN105813391A - Fabrication method of light emitting diode (LED) aluminum-based circuit board - Google Patents
Fabrication method of light emitting diode (LED) aluminum-based circuit board Download PDFInfo
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- CN105813391A CN105813391A CN201610303262.4A CN201610303262A CN105813391A CN 105813391 A CN105813391 A CN 105813391A CN 201610303262 A CN201610303262 A CN 201610303262A CN 105813391 A CN105813391 A CN 105813391A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention relates to a fabrication method of a light emitting diode (LED) aluminum-based circuit board. A finished product is obtained according to the following steps of surface processing on an aluminum plate, head conduction adhesive fabrication, coating, composite copper foil lamination, cutting, positioning hole drilling, pre-processing, circuit pattern forming, etching and film removal, positioning hole by a target process, circuit on/off test, solder resistant white oil coating, exposure, development, character printing and curing, punching, v-shaped cutting and anti-oxidation process, wherein in the step of coating, the heat conduction adhesive is sprayed by a curtain formed by a spraying cutter, and the circuit pattern forming is achieved by processes such as double-sided light-sensitive ink coating, exposure and developing. Through the technical scheme disclosed by the invention, an aluminum-based circuit integrated with a light source and an electric source can be produced at a large scale, and the fabricated LED and the electric source both have favorable heat dissipation performance.
Description
Technical field
The present invention relates to LED photovoltaic technical field, specifically the manufacture method of a kind of LED aluminum-based circuit board.
Background technology
Pursuing is lightly, conveniently the trend of current LED illumination electrical equipment, a kind of collects power pack and light comes from the LED illumination utensil of one it is intended that have, it is possible to greatly facilitate routine use.Make aluminum-based circuit board generally include making aluminum-based copper-clad plate and based on it, make aluminum-based circuit board two large divisions, in the process making aluminum-based copper-clad plate, current glue application step adopts roller coating, printing and spraying, and these are several, and these several gluing modes have the disadvantage that
1, roller coating, the thickness of glue is difficult to adjustment, became uneven, and speed of production is slower: be typically in about 3-4m/min；2, printing, efficiency is low, speed is slow, and product size is little, and common product width is at below 60cm, it is impossible to produce the such big specification aluminum-based copper-clad plate of size 1m*2m；3, spray curtain, product can spray very uniform, also can produce large-sized plates, but a large amount of colloidal substance flies away at air ambient, except having a strong impact on environment, and wastes raw material in a large number.
And, copper-clad plate sheet material, in the gluing course of processing, has dust or the bad situation of flatness such as surface, roller coating and typography there is impact, such as, easily there is space between heat-conducting glue and aluminium sheet, Copper Foil, the problems such as adhesive force is not strong occurring, thus affecting the quality of aluminum-based copper-clad plate.
On the other hand, what at present collection power pack and light came from one has two kinds of ways, one of which way is directly to be placed within LED light source circuit by driving power pack in the way of paster in aluminum-based circuit board, drive in the way of AC-AC, this mode LED has scintillation, and being subject to the impact of the factors such as line surge, driving chip very easily damages, the stability of LED lamp is severely impacted.Another kind of way is to make substrate with FR4 or the CEM-1 plate of milling good (or made with punch press) size; it is mounted on the aluminium sheet of milling good (or made) same size; then layer of cloth it is coated with; it is covered with copper foil plate pressing; carry out wiring board processing again, make power light source integral LED lamp, the shortcoming of this method be machined to high, production efficiency is very low; can only manufacture on a small quantity, it is impossible to large-scale production；And during pressing, the mismachining tolerance and the dust produced man-hour that adds such as die-cut that are embedded on aluminium sheet to occur due to the thickness error produced when substrate and aluminium sheet itself cut, substrate fall on aluminium sheet, these factors all can badly influence the combination of insulating barrier and Copper Foil, aluminium sheet, eventually affects the peel strength of product, insulating properties and heat conductivity.
Summary of the invention
The invention provides the manufacture method of a kind of LED aluminum-based circuit board, be can be mass-produced aluminium base circuit by this technique, and the LED made and power supply are respectively provided with good thermal diffusivity.
The present invention is achieved by the following technical solutions: the manufacture method of a kind of LED aluminum-based circuit board, including the making of aluminum-based copper-clad plate and based on aluminum-based copper-clad plate making aluminum-based circuit board, comprises the following steps:.
(1) surface of aluminum plate processes: aluminium substrate plate 0.2-1.5mm washes drying after treatment, is prepared into aluminium base base plate；
(2) preparation heat-conducting glue；
(3) spraying heat-conducting glue: adopting spray cutter spraying technology directly to be sprayed on aluminium sheet by heat-conducting glue, the aluminium sheet sprayed is put in continuous tunnel furnace and toasted, and makes the gel time of heat-conducting glue place semi-cured state control in the 50-70 second；Adopting spray cutter spraying technology, solve the defect that existing several gluing mode is brought, what high pressure spray cutter thereunder sprayed is heavy curtain, wiring board can carrying out gluing equably, and save ink or glue, operating rate is fast, per minute can going to 20-25 rice, labor efficiency becomes the growth of geometry multiple.
(4) laminating Copper Foil: be stacked on the aluminium sheet of the conductive adhesive film coated by the copper foil layer that thickness is 0.018-0.072mm, and laminated, shear forming, obtain aluminum-based copper-clad plate；
(5) sawing sheet, brill position hole, pre-treatment；
(6) layout molding: include double-sided light sensitive Ink Application, exposure, development, first it is that liquid photosensitive coating simultaneously completes with two-sided, copper face is upper warm area, its temperature controls at 80-110 DEG C, aluminum face is lower warm area, its temperature controls at 70-90 DEG C, and exposure energy respectively copper-clad surface light energy is 450-550mj, and aluminium sheet face exposure energy is 550-650mj；Two-sided development, concentration is the carbon film potassium solution of 0.8-1.2%, speed 3.2mm-4mm/ minute, pressure 1.8-2.4kg；
(7) etching striping: after aluminium sheet face and copper-clad surface printing forming and hardening, be etched, striping, carries out surface clean, dry again after striping, surface clean hydraulic pressure control is at 2.4-3.6kg, and washing time reaches more than 20 seconds；
(8) target practice technology hole, circuit on-off are tested；
(9) coating of welding resistance white oil；
(10) exposure；
(11) development；
(12) character printing and solidification；
(13) punching；
(14) v cuts；
(15) anti-oxidation technique: obtain aluminum-based circuit board
Further, described step (1) surface of aluminum plate processes method particularly includes: a, this aluminium sheet is immersed in 10%-12%, the alkaline etching groove that temperature is 56-60 ° processes 3.5-4.5 minute, the aluminium sheet that b, alkaline etching are good steeps after washing and processes 2-3 minute at the neutralization chamber that nitric acid content is 10%-12%, removing surface of aluminum plate residue further, the washing of c, the aluminium sheet handled well is dried.
Further, the thickness of the heat-conducting glue in step (3) is more than 300 μm, and by the number of times that the thickness adjustment of heat-conducting glue sprays, each coating thickness is between 50um-150um, and the aluminium sheet sprayed puts continuous tunnel furnace when 140 DEG C-150 DEG C, toasts 4-6 minute.
Further, add after spraying heat-conducting glue and cover one layer of prepreg, more laminating Copper Foil, prepreg adopts glass cloth, and heat conductivity is at more than 1W/mk.
Further, in step (4), first typesetted composite aluminum substrate is proceeded to press and heat, pressurize, evacuation pressing, make aluminium sheet, conductive adhesive film, Copper Foil combine, then the aluminium base that hot pressing is good is proceeded to cold press cooling.
Further, in described step (5), being heated through drying tunnel budget by aluminum-based copper-clad plate, drying tunnel temperature parameter is 160-180 DEG C, and transmission speed was at 3.5-4M/ minute.
Further, in step (10), at the film ink sheet that aluminium sheet face pad 0.1-0.15mm is thick, circuit welding resistance is exposed.
Further, step (11) is developed, and adopts sodium carbonate liquor, and concentration is 0.8-1.2%, speed 3.2mm-4mm/ minute, pressure 1.8-2.4kg, and under cleaning, the power of spraying is 2.5-3.5kg, and hot blast cutter pressure is 2.0-3.0kg.
This invention takes above-mentioned corrective measure to carry out, its beneficial effect is notable: can be mass-produced current collection, light of the present invention comes from the aluminum-based circuit board of one, changes the traditional form of wiring board, implants new function for wiring board；Obviate and offer, at aluminium sheet, the way that groove inlays loaded down with trivial details, poor efficiency, the rapid wear of FR4 or CEM-1 plate again.And this invention is without the ash that falls adding man-hour, product has that Copper Foil adhesive force is strong, thermal diffusivity good, heat conductivity is strong, resistance to pressure high, the assembling structure of the indoor and outdoor lighting light fixtures such as current LED down, shot-light, flat lamp can be changed, have energy-saving and cost-reducing, material-saving potentiation feature.
Accompanying drawing explanation
Fig. 1 is the production technology block diagram of aluminum-based copper-clad plate of the present invention；
Fig. 2 is the block diagram producing aluminum-based circuit board.
Detailed description of the invention
Below against accompanying drawing, the present invention is further illustrated in conjunction with the embodiments:
Shown in reference Fig. 1, Fig. 2, the manufacture method of a kind of LED aluminum-based circuit board, generally include making aluminum-based copper-clad plate and based on it, make aluminum-based circuit board two large divisions, step includes:
(1) surface of aluminum plate processes: a, this aluminium sheet is immersed in 10%-12%, the alkaline etching groove that temperature is 56-60 ° processes 3.5-4.5 minute, the aluminium sheet that b, alkaline etching are good steeps after washing and processes 2-3 minute at the neutralization chamber that nitric acid content is 10%-12%, removing surface of aluminum plate residue further, the washing of c, the aluminium sheet handled well is dried.
(2) preparation heat-conducting glue: by 901 resins that mass percent is 15%, 295 resins of 3%, 128 resins of 6.7%, the plasticiser of 3.2%, the dicyandiamide of 0.57%, the DDS firming agent of 1.2%, the levelling agent of 0.19%, the coupling agent of 0.47%, the catalyst of 0.07%, the DMF solvent mix homogeneously of 15.6%, after continuous stirring 30-40 minute, stands 1-3 hour prepared epoxy resin intermixture；By the epoxy resin intermixture mix homogeneously of aluminium oxide that mass percent is 54% and 46%, after stirring 2-3 hour, through ball-milling treatment, filler and resin is made homogeneously to be distributed, more stand-by after carrying out remove impurity.
(3) spraying heat-conducting glue: adopt spray cutter spraying technology directly to be sprayed on aluminium sheet by heat-conducting glue, the thickness of heat-conducting glue is more than 300 μm, by the number of times that the thickness adjustment of heat-conducting glue sprays, each coating thickness is between 50um-150um, the film thickness of requirement can be obtained by adjustment spraying transfer rate and glue pump motor frequency conversion, the aluminium sheet sprayed puts continuous tunnel furnace when 140 DEG C 150 DEG C, toasts 4-6 minute, and makes the gel time of heat-conducting glue place semi-cured state control in the 50-70 second；
Can add after spraying heat-conducting glue and cover one layer of prepreg, more laminating Copper Foil, prepreg adopts glass cloth, and heat conductivity is at more than 1w/mk.
null(4) laminating Copper Foil: the copper foil layer that thickness is 0.018-0.072mm is stacked on the aluminium sheet of the conductive adhesive film coated，First typesetted composite aluminum substrate is proceeded to press to heat、Pressurization，Evacuation pressing，Make aluminium sheet、Conductive adhesive film、Copper Foil combines，Needed for pressing, technological parameter is 180 ° of C for (a) initial temperature，It is warmed up to 185 ° of C，Pressurization 50kgf，B 185 ° of C of () insulation are pressurized to 70kgf，Time is 2 minutes，C 185 ° of C of () insulation are pressurized to 120kgf，Time is 7 minutes，D 185 ° of C of () insulation are pressurized to 180kgf，Time is 17 minutes，E 185 ° of C of () insulation are forced into 200kgf，Press 20 minutes，F () is warming up to 210 ° of C by 185 °，Time is 5 minutes，Pressure increases to 250kgf，210 ° of C of (h) insulation，Pressing 22 minutes when pressure is 250kgf，(i) it is warmed up to 5 minutes 215 ° of C heating-up times，Pressure increases to 280kgf pressing 50 minutes，J () is cooled to 180 ° of C by 215 °，Time is 6 minutes，Pressure reduces to 50kgf，K () is cooled to 150 ° of C，Time is 4 minutes，Pressure reduces to 4Kgf,Hot pressing completes；The aluminium base that hot pressing is good proceeds to cold press cooling, and pressure is 100kgf, and cool time is 100 minutes.
(5) sawing sheet, bore location hole, pre-treatment: sawing sheet, owing to this properties of materials is that aluminium lamination is relatively thin, the thicker toughness of dielectric layer reduces, can only cut with shearing bed.It is before cutting, and heats through drying tunnel budget, and drying tunnel temperature parameter is 160-180 DEG C, and transmission speed, at 3.5-4M/ minute, is primarily to the heat effect toughening of dielectric layer, and the layering limit reducing tangent plane is split bad.Arranging effective back gauge simultaneously and reach 2.5mm-3.5mm, it is ensured that after etching, the frame after edging at the integrity of the die-cut frame of rear operation, reduces frame fracture and falls into the indentation bad of generation punch die in；Working plate after sawing sheet first cleans, drying and processing.Main purpose is that the foreign body preventing plate bits etc exists gap in the middle of lamination, re-uses the special wolfram steel of aluminium base or diamond cutter is holed；It is required for through cleaning before doing line pattern again, except oxidation processes, become the aqueous sulfuric acid of the concentration of volume ratio 2-3 by 98 concentration sulphuric acid proportionings, it is possible to make copper face and aluminum face obtain oxidation removal simultaneously, throw brush brush roll brush order up and down and to distinguish, upper brush is about 350 orders, polishing scratch is at 12-15MM, and lower brush is at 500 orders, and polishing scratch is at 6-9MM, dry temperature at 60-70 DEG C. so can guarantee that copper face and aluminum face are clean, make the adhesion of ink reach requirement.
null(6) layout molding: include double-sided light sensitive Ink Application、Exposure、Development，First it is that liquid photosensitive coating simultaneously completes with two-sided，Due to aluminium lamination、Middle interlayer、The difference in thickness of copper，It absorbs differing greatly of energy，So drying tunnel stove double; two heating systems up and down，Copper face is upper warm area，Its temperature controls at 80-110 DEG C，Aluminum face is lower warm area，Its temperature controls at 70-90 DEG C，Liquid photosensitive film so just will not be made unclean because temperature drift produces the development after exposure，Same also different in exposure technology，When being attached to different base colors because of same ink，Photo absorption performance difference can be produced，For can be clean in two-sided development，Exposure energy respectively copper-clad surface light energy is 450-550mj，Aluminium sheet face exposure energy is 550-650mj，Two-sided development simultaneously can be reached clean；Two-sided development, concentration is the carbon film potassium solution of 0.8-1.2%, speed 3.2mm-4mm/ minute, pressure 1.8-2.4kg.
(7) etching striping: first check two-sided figure to open the bad of short circuit; complete rationality protected by the ink in aluminum face; behind aluminum face and copper face figure molding; putting in acid medicinal liquid and be etched striping, liquid concentration beryllium value 1.19-1.21, fluid temperature is 35-45 DEG C; put in acidic etching liquid be etched, striping; carrying out surface clean, dried after striping again, clean hydraulic pressure control at 2.4-3.6kg, scavenging period reaches more than 20 seconds.
(8) target practice technology hole, circuit on-off are tested.
(9) coating of welding resistance white oil: coating and printing will clean process, and chemical solution dilute sulfuric acid concentration controls at 3-5%, can guarantee that copper face and the effect in aluminum face, the throwing brush fiber brush of copper face and order number, wear scar width is the same with single sided board in technique, no longer describes.White oil coating post-drying after etc. to be exposed.
(10) exposure: because dielectric layer is thin, be again translucent, so film ink sheet that must be thick for one 0.1-0.15mm of this face pad in aluminum face, it is prevented that upper and lower frames, with phenomenon when exposing, has during exposure and Exposing Lamp scattering process is affected development effect.
(11) development: adopt sodium carbonate liquor.Concentration is 0.8-1.2%.Speed 3.2mm-4mm/ minute, pressure 1.8-2.4kg.Because the power drives part in aluminium sheet face has recessed, so the power of spraying to bring up to 2.5-3.5kg under cleaning, hot blast cutter pressure to reach 2.0-3.0kg, enables moisture to dispel and dries completely, it is prevented that moisture dissolves in interlayer and aluminium base.
(12) requirement needed for character printing is different, and some is element identifier, and some is trade mark model.Because of some injustice of aluminum face, it is impossible to by having printed the character printing of recessed portion, so by logo design such as trade marks on aluminum face, and other all of component symbols design in white oil face as well.Print the working plate of character and will carry out heat cure when 150 DEG C of 45 minutes time of temperature.
(13) punching: 1, white oil faces down, once completes the die-cut of aperture and profile with punch press.2, a small amount of or sample, adopts digital control hole drilling, the component hole of power drives plate part is holed, and drilling speed to be adjusted, and bores with 3-4 ten thousand and is advisable.
(14) v cuts.
(15) anti-oxidation technique: adopting concentration is the hydrogen peroxide of 5-6%, and sulfuric acid concentration is 4-5%, reduces aluminium base microetch damage.Under anti-oxidation rear cleaning, the power of spraying to bring up to 2.5-3.5kg, and hot blast cutter pressure to reach 2.0-3.0kg, enables moisture to dispel and dries completely, and temperature controls between 65-80 degree.
Listed above is only specific embodiments of the invention, it is clear that the invention is not restricted to above example, all deformation that those of ordinary skill in the art can directly derive from present disclosure or associate, and all should belong to protection scope of the present invention.
Claims (8)
1. a manufacture method for LED aluminum-based circuit board, including the making of the making of aluminum-based copper-clad plate and aluminum-based circuit board, it is characterised in that comprise the following steps:
(1) surface of aluminum plate processes: aluminium substrate plate 0.2-1.5mm washes drying after treatment, is prepared into aluminium base base plate；
(2) preparation heat-conducting glue；
(3) spraying heat-conducting glue: adopting spray cutter spraying technology directly to be sprayed on aluminium sheet by heat-conducting glue, the aluminium sheet sprayed is put in continuous tunnel furnace and toasted, and makes the gel time of heat-conducting glue place semi-cured state control in the 50-70 second；
(4) laminating Copper Foil: be stacked on the aluminium sheet of the conductive adhesive film coated by the copper foil layer that thickness is 0.018-0.072mm, and laminated, shear forming, obtain aluminum-based copper-clad plate；
(5) sawing sheet, brill position hole, pre-treatment；
(6) layout molding: include double-sided light sensitive Ink Application, exposure, development, first it is that liquid photosensitive coating simultaneously completes with two-sided, copper face is upper warm area, its temperature controls at 80-110 DEG C, aluminum face is lower warm area, its temperature controls at 70-90 DEG C, and exposure energy respectively copper-clad surface light energy is 450-550mj, and aluminium sheet face exposure energy is 550-650mj；Two-sided development, concentration is the carbon film potassium solution of 0.8-1.2%, speed 3.2mm-4mm/ minute, pressure 1.8-2.4kg；
(7) etching striping: after aluminium sheet face and copper-clad surface printing forming and hardening, be etched, striping, carries out surface clean, dry again after striping, surface clean hydraulic pressure control is at 2.4-3.6kg, and washing time reaches more than 20 seconds；
(8) target practice technology hole, circuit on-off are tested；
(9) coating of welding resistance white oil；
(10) exposure；
(11) development；
(12) character printing and solidification；
(13) punching；
(14) v cuts；
(15) anti-oxidation technique: obtain aluminum-based circuit board.
2. the manufacture method of LED aluminum-based circuit board according to claim 1, it is characterized in that, described step (1) surface of aluminum plate processes method particularly includes: a, this aluminium sheet is immersed in 10%-12%, the alkaline etching groove that temperature is 56-60 ° processes 3.5-4.5 minute, the aluminium sheet that b, alkaline etching are good steeps after washing and processes 2-3 minute at the neutralization chamber that nitric acid content is 10%-12%, removing surface of aluminum plate residue further, the washing of c, the aluminium sheet handled well is dried.
3. the manufacture method of LED aluminum-based circuit board according to claim 1, it is characterized in that, the thickness of the heat-conducting glue in step (3) is more than 300 μm, by the number of times that the thickness adjustment of heat-conducting glue sprays, each coating thickness is between 50um-150um, the aluminium sheet sprayed puts continuous tunnel furnace when 140 DEG C-150 DEG C, toasts 4-6 minute.
4. the manufacture method of LED aluminum-based circuit board according to claim 1, it is characterised in that add after spraying heat-conducting glue and cover one layer of prepreg, more laminating Copper Foil, prepreg adopts glass cloth, and heat conductivity is at more than 1W/mk.
5. the manufacture method of LED aluminum-based circuit board according to claim 1, it is characterized in that, in step (4), first typesetted composite aluminum substrate is proceeded to press to heat, pressurize, evacuation pressing, make aluminium sheet, conductive adhesive film, Copper Foil combine, then the aluminium base that hot pressing is good is proceeded to cold press cooling.
6. the manufacture method of LED aluminum-based circuit board according to claim 1, it is characterised in that in described step (5), heats aluminum-based copper-clad plate through drying tunnel budget, and drying tunnel temperature parameter is 160-180 DEG C, and transmission speed was at 3.5-4M/ minute.
7. the manufacture method of LED aluminum-based circuit board according to claim 1, it is characterised in that in step (10), at the film ink sheet that aluminium sheet face pad 0.1-0.15mm is thick, is exposed circuit welding resistance.
8. the manufacture method of LED aluminum-based circuit board according to claim 1, it is characterized in that, step (11) is developed, adopt sodium carbonate liquor, concentration is 0.8-1.2%, speed 3.2mm-4mm/ minute, pressure 1.8-2.4kg, under cleaning, the power of spraying is 2.5-3.5kg, and hot blast cutter pressure is 2.0-3.0kg.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610303262.4A CN105813391B (en) | 2016-05-10 | 2016-05-10 | Fabrication method of light emitting diode (LED) aluminum-based circuit board |
| PCT/CN2017/073584 WO2017193660A1 (en) | 2016-05-10 | 2017-02-15 | Method for manufacturing metal led circuit board integrating power and light sources |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610303262.4A CN105813391B (en) | 2016-05-10 | 2016-05-10 | Fabrication method of light emitting diode (LED) aluminum-based circuit board |
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| CN105813391A true CN105813391A (en) | 2016-07-27 |
| CN105813391B CN105813391B (en) | 2017-04-26 |
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| CN106945360A (en) * | 2017-04-21 | 2017-07-14 | 广州市普诺科技有限公司 | The processing method and aluminum-based copper-clad plate of a kind of aluminum-based copper-clad plate |
| CN107072048A (en) * | 2017-03-24 | 2017-08-18 | 安徽林驰电子有限公司 | A kind of production technology optimization method of single-sided aluminum-base plate |
| WO2017193660A1 (en) * | 2016-05-10 | 2017-11-16 | 浙江罗奇泰克电子有限公司 | Method for manufacturing metal led circuit board integrating power and light sources |
| CN107645834A (en) * | 2017-08-30 | 2018-01-30 | 景旺电子科技(龙川)有限公司 | A kind of etching method substitutes machining making and destroyed or force to yield method for product |
| CN109548285A (en) * | 2018-10-19 | 2019-03-29 | 厦门阳光恩耐照明有限公司 | Aluminium base board machining process |
| CN109673109A (en) * | 2019-01-18 | 2019-04-23 | 胜宏科技（惠州）股份有限公司 | A kind of LED circuit board production method |
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| CN111065203A (en) * | 2020-01-06 | 2020-04-24 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN113395835A (en) * | 2021-05-17 | 2021-09-14 | 广德三生科技有限公司 | Processing technology of OLED ultrahigh-definition backlight display circuit board |
| CN113518509A (en) * | 2021-04-01 | 2021-10-19 | 珠海精路电子有限公司 | Manufacturing process of resistance-stabilized circuit board |
| CN116528487A (en) * | 2023-05-17 | 2023-08-01 | 江苏耀鸿电子有限公司 | High-strength aluminum-based PCB and preparation method thereof |
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