CN113966079B - LED flexible circuit board and preparation method thereof - Google Patents
LED flexible circuit board and preparation method thereof Download PDFInfo
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- CN113966079B CN113966079B CN202111115011.0A CN202111115011A CN113966079B CN 113966079 B CN113966079 B CN 113966079B CN 202111115011 A CN202111115011 A CN 202111115011A CN 113966079 B CN113966079 B CN 113966079B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 69
- 230000001070 adhesive effect Effects 0.000 claims abstract description 69
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- 239000011889 copper foil Substances 0.000 claims abstract description 60
- 239000010408 film Substances 0.000 claims abstract description 55
- 239000011888 foil Substances 0.000 claims abstract description 28
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 24
- 238000005530 etching Methods 0.000 claims abstract description 15
- 238000007650 screen-printing Methods 0.000 claims abstract description 14
- 239000013039 cover film Substances 0.000 claims abstract description 7
- 239000002131 composite material Substances 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 124
- 239000000463 material Substances 0.000 claims description 41
- 239000012790 adhesive layer Substances 0.000 claims description 25
- 238000013329 compounding Methods 0.000 claims description 25
- 238000001035 drying Methods 0.000 claims description 23
- 229910000831 Steel Inorganic materials 0.000 claims description 16
- 239000010959 steel Substances 0.000 claims description 16
- 238000001723 curing Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 12
- 238000007731 hot pressing Methods 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
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- 238000007254 oxidation reaction Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
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- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 6
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- 238000000034 method Methods 0.000 claims description 5
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- 229910000679 solder Inorganic materials 0.000 description 1
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of circuit boards, and particularly discloses an LED flexible circuit board and a preparation method thereof, wherein the preparation method is characterized in that a cover film is attached to a copper foil circuit layer through whole-coil screen printing circuit, etching, coil-to-coil coating adhesive, coil-to-coil composite aluminum foil and baking and curing; the covering film is soft and bending-resistant, so that the flexibility, bending-resistant performance and resistance of the LED flexible circuit board are improved; the LED flexible circuit board can be freely bent, is bending-resistant, and can meet the requirement of multi-angle simultaneous irradiation; the air permeability and the heat dissipation capability are achieved, the reliability is improved, and the mechanical durability is improved; and the volume of the flexible circuit board is reduced, and the assembly area of the radiator and other hardware is reduced, so that the hardware and the assembly cost are reduced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an LED flexible circuit board and a preparation method thereof.
Background
A Printed Circuit Board (PCB) is an important electronic component, a support for electronic components, and a carrier for interconnecting electronic components and electrical appliances, typically a hard board. For the LED light illumination industry, illumination needs to be carried out on a multi-azimuth angle, so a bendable flexible circuit board (FPC) is generated, and the problem that a traditional aluminum substrate cannot be bent is solved due to the appearance of the FPC. The copper foil on the traditional flexible circuit board is generally printed with a layer of protective ink, namely the ink for solder resist, but the ink layer formed by the ink after thermosetting molding has harder texture, and the flexibility, bending resistance and resistance of the FPC are easily reduced. Moreover, because the copper foil is bad in air permeability, the flexible circuit board is difficult to dissipate heat, electronic components on the flexible circuit board are easy to burn out, in order to improve the problems, the copper foil is generally compounded with aluminum foil, but the traditional copper foil and aluminum foil are generally compounded by manual bonding, the production efficiency is lower, and because the copper foil and the aluminum foil are both soft boards, the flexible circuit board is easy to wrinkle during compounding, so that the conductive performance, the heat dissipation performance and the like of the FPC are influenced.
It can be seen that there is a need for improvements and improvements in the art.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention aims to provide an LED flexible circuit board and a method for manufacturing the same, which aims to solve the problems that the existing LED flexible circuit board is low in production efficiency, and the flexibility, bending resistance, air permeability and the like of the manufactured LED flexible circuit board are poor.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the preparation method of the LED flexible circuit board comprises the following steps:
A. carrying out full-coil screen printing on the copper foil subjected to material cutting according to a designed film pattern, etching to remove a non-circuit copper layer, exposing a circuit on the copper foil, and then carrying out acid washing on the copper foil;
B. covering a layer of covering film on the circuit layer of the copper foil, arranging an adhesive on the lower surface of the covering film, attaching the covering film to the circuit layer through the adhesive, and then rolling and laminating;
C. coating an adhesive on the back surface of the copper foil circuit layer, covering a flexible insulating layer on the adhesive, and then curing;
D. roll-to-roll gluing: coating an adhesive on the flexible insulating layer, feeding the whole body into a drying tunnel in coating and compounding equipment, and carrying out roll-to-roll hot-pressing compounding on the surface, coated with the adhesive, of the flexible insulating layer and the aluminum foil after the whole body is discharged from the drying tunnel to obtain a flexible aluminum plate material; then baking and solidifying the flexible aluminum plate material;
E. and (3) performing target punching and OSP (open shortest path first) anti-oxidation treatment on the flexible aluminum plate material, and then cutting and quality inspection to obtain the LED flexible circuit board.
The preparation method of the LED flexible circuit board comprises the following steps of: 90+/-2 ℃, 100+/-2 ℃, 130+/-2 ℃, 150+/-2 ℃ and 170+/-2 ℃; the temperature of the cooling section is 110+/-2 ℃.
The preparation method of the LED flexible circuit board comprises the step D, wherein hot press compounding is achieved through a steel roller and a rubber roller which are arranged up and down, a flexible aluminum plate material is arranged between the steel roller and the rubber roller steel roller, and the temperature of the steel roller is 90+/-2 ℃.
The adhesive in the step D is sprayed out from a die head and uniformly sprayed on the surface of the flexible insulating layer, and the thickness of the cured adhesive is 20-30 nm.
The preparation method of the LED flexible circuit board comprises the step D, wherein the linear speed of the coating composite equipment is 25-30 m/s.
In the step D, the flexible aluminum plate material is placed in an oven at 170+/-2 ℃ to be baked for 30-35 min.
The preparation method of the LED flexible circuit board comprises the step B, wherein the covering film in the step B is a polyimide film; and C and D, wherein the flexible insulating layers are polyimide layers.
The minimum line width of etching in the step A is 0.5+/-0.02 mm, and the minimum line distance is 0.34+/-0.02 mm.
The preparation method of the LED flexible circuit board comprises the following steps of: baking at 180+/-2 deg.c for 15-20 min.
The LED flexible circuit board is prepared by the preparation method of the LED flexible circuit board, and comprises an oxidation prevention layer, a covering film layer, a first adhesive layer, a copper foil circuit layer, a second adhesive layer, a flexible insulating layer, a third adhesive layer and an aluminum foil layer which are sequentially arranged from top to bottom; the anti-oxidation layer is formed by OSP, and the first adhesive layer, the second adhesive layer and the third adhesive layer are all formed by curing adhesives; the covering film layer is a polyimide film layer; the flexible insulating layer is a polyimide layer.
The beneficial effects are that:
the invention provides an LED flexible circuit board and a preparation method thereof, wherein the production efficiency and the compounding effect are greatly improved compared with the existing manual lamination of aluminum foil to a flexible insulating layer by the steps of whole-roll screen printing circuit, etching, laminating a covering film on a copper foil circuit layer, roll-to-roll coating adhesive, roll-to-roll compounding aluminum foil and baking and curing, so that the product is ensured to have good electric conductivity and heat dissipation performance; the covering film is soft and bending-resistant, so that the flexibility, bending-resistant performance and resistance of the LED flexible circuit board are improved; the LED flexible circuit board can be freely bent, is bending-resistant, and can meet the requirement of multi-angle simultaneous irradiation; the air permeability and the heat dissipation capability are achieved, so that the running temperature of the module is reduced, the service life is prolonged, the reliability is improved, and the mechanical durability is improved; and the volume of the flexible circuit board is reduced, and the assembly area of the radiator and other hardware is reduced, so that the hardware and the assembly cost are reduced.
Drawings
Fig. 1 is a schematic structural diagram of an LED flexible circuit board provided by the present invention.
Description of main reference numerals: 1-oxidation-preventing layer, 2-covering film layer, 3-first adhesive layer, 4-copper foil circuit layer, 5-second adhesive layer, 6-flexible insulating layer, 7-third adhesive layer, 8-aluminum foil layer.
Detailed Description
The invention provides an LED flexible circuit board and a preparation method thereof, which are used for making the purposes, technical schemes and effects of the invention clearer and more definite, and the invention is further described in detail below by referring to the accompanying drawings and examples. It should be understood that the detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the invention.
The invention provides a preparation method of an LED flexible circuit board, which comprises the following steps:
A. carrying out full-roll screen printing on the copper foil after the material is cut according to the designed film pattern, then etching to remove a non-circuit copper layer to expose a circuit on the copper foil, wherein the minimum line width of etching is 0.5+/-0.02 mm, the minimum line distance is 0.34+/-0.02 mm, the line width is thinner, the line distance is denser, and the LED flexible circuit board with high density and fine line is formed; then the copper foil is put into sulfuric acid solution with the concentration of 3 to 5 percent for pickling, oil stains and oxide layers on the copper foil are removed, and the pickling is used for cleaning and activating the surface of the copper foil, so that the subsequent lamination is facilitated.
B. The circuit layer of the copper foil is covered with a layer of covering film, the lower surface of the covering film is provided with an adhesive, the covering film is attached to the circuit layer through the adhesive, and specifically, the covering film is a polyimide film (PI film), and the covering film is good in bending performance and thick and is used for protecting the circuit layer on the surface of the copper foil and preventing circuit scratches; and the insulating strength is higher, so that the short circuit caused by foreign matters falling into the circuit can be prevented. When the covering film is attached, the alignment hole sites are positioned, the allowable tolerance is +/-0.10 mm, and the accuracy of the attaching film is ensured. And then rolling the copper foil adhered with the covering film, and laminating the whole roll for reinforcing the adhesion degree of the covering film and the copper foil.
C. Coating an adhesive on the back surface of the copper foil circuit layer 4, covering a flexible insulating layer 6 on the adhesive, and then curing; the flexible insulating layer 6 is a polyimide layer, PI has the performances of high and low temperature resistance, acid and alkali resistance, solvent resistance, radiation resistance, electric insulation and the like, is arranged between the copper foil and the aluminum foil and is used for protecting and protecting electronic components and insulation, and the PI is film-shaped, very thin, has good bending capability and cannot hinder bending of the LED flexible circuit board.
D. Roll-to-roll gluing: coating an adhesive on the flexible insulating layer 6, feeding the whole body into a drying tunnel in coating and compounding equipment, and carrying out roll-to-roll hot-pressing compounding on the surface of the flexible insulating layer 6 coated with the adhesive and an aluminum foil after the whole body is discharged from the drying tunnel to obtain a flexible aluminum plate material; and then placing the flexible aluminum plate material in an oven at 170+/-2 ℃ for rolling and baking for 30-35 min, and further improving the bonding effect between the LED flexible circuit board layers and performing post-curing treatment.
E. Carrying out target punching on a flexible aluminum plate material, carrying out whole-roll silk-screen printing on characters according to film patterns, wherein the mesh number is 120T, and putting the whole roll into an oven with the temperature of 170+/-2 ℃ to bake for 10-15 min so as to solidify ink; then carrying out secondary acid washing.
F. And (3) performing OSP (organic liquid crystal) anti-oxidation treatment on the flexible aluminum plate material, wherein an organic film is grown on the clean bare copper surface by a chemical method. The organic film has oxidation resistance, thermal shock resistance and moisture resistance, and OSP generally comprises rosin, active resin and azole, and is used for protecting and blocking the copper surface from further rusting, oxidizing or vulcanizing in a normal environment. And then cutting the flexible aluminum plate material into proper specifications according to the design requirements, and performing FQC and FQA quality inspection to obtain the LED flexible circuit board.
Further, the drying tunnel in the step D includes a heating section and a cooling section, where the temperature of the heating section is sequentially: 90+/-2 ℃, 100+/-2 ℃, 130+/-2 ℃, 150+/-2 ℃ and 170+/-2 ℃; the temperature of the cooling section is 110+/-2 ℃.
By the whole roll screen printing circuit, etching, laminating a cover film on the copper foil circuit layer 4, coating an adhesive roll to roll, compounding an aluminum foil roll to roll and baking and solidifying, compared with the existing method of manually laminating the aluminum foil to the flexible insulating layer 6, the production efficiency and the compounding effect are greatly improved, and therefore the product is guaranteed to have good electric conductivity and heat dissipation performance; and the covering film is soft and bending-resistant, so that the flexibility, bending-resistant performance and resistance of the LED flexible circuit board are improved.
When the LED flexible circuit board is used for an LED lighting product, the cover film is used for welding LED pins, the aluminum foil layer 8 is generally coated with heat conduction slurry and then is contacted with the heat conduction part, electric conduction is provided, and aluminum foil is compounded on the copper foil, so that the LED flexible circuit board has good air permeability and heat dissipation performance, the running temperature of a module is reduced, the service life is prolonged, the reliability is improved, and the mechanical durability is improved; and the volume of the LED flexible circuit board is reduced, and the assembly area of the radiator and other hardware is reduced, so that the hardware and the assembly cost are reduced. The FPC can be freely bent, so that the multi-angle simultaneous irradiation is realized, the heat dissipation performance is high, and a plurality of PCB assemblies are not needed.
Further, the drying tunnel in the step D includes a heating section and a cooling section, where the temperature of the heating section is sequentially: 90+/-2 ℃, 100+/-2 ℃, 130+/-2 ℃, 150+/-2 ℃ and 170+/-2 ℃; the temperature of the cooling section is 110+/-2 ℃. Gradually heating up through a drying tunnel to gradually volatilize the organic solvent in the adhesive and dry the composition in the adhesive, and performing heat curing from a completely liquid state to a semi-cured state, so that the composition is primarily adhered to the flexible insulating layer 6 and is prepared for subsequent compounding with aluminum foil.
Further, the hot pressing compounding in step D is realized through steel roller and the rubber roller that sets up from top to bottom, the steel roller sets up in the top of rubber roller, and flexible aluminum plate material passes the steel roller with clearance between the rubber roller steel rod is when carrying out the compounding, and the steel roller pushes down or the rubber roller rises, makes the both sides of flexible aluminum plate material laminate with steel roller and rubber roller respectively, the temperature of steel roller is 90 + -2 ℃, through the temperature on the steel roller and the pressure between steel roller and the rubber roller, makes copper foil circuit layer 4, adhesive layer, flexible insulating layer 6 and aluminium foil closely laminate, is equivalent to laminating to make flexible aluminum plate material solidify the shaping completely, realizes the quick laminating of reel and reel, compares with current manual work laminating aluminium foil to flexible insulating layer 6, has promoted production efficiency and compound effect greatly, thereby ensure that the product has good conductive property, heat dispersion etc..
Further, the adhesive in the step D is sprayed out from a die head and uniformly sprayed on the surface of the flexible insulating layer 6, and the thickness of the cured adhesive is 20-30 nm. The adhesive has high temperature resistance and good softness, and the product prepared by using the adhesive has good flame retardant property, peeling strength, soldering tin heat resistance, electrical property, high temperature resistance and low water absorption. The die head is provided with a plurality of nozzles extending along the length direction of the die head at equal intervals, the nozzles are arranged in the die head, the front of each nozzle is provided with a guide roller, the flexible insulating layer 6 penetrates through a gap between the die head and each guide roller, when adhesive is coated, the die head moves in the direction close to the guide roller, then the adhesive in the die head is transferred onto the flexible insulating layer 6, the die head also plays a role in controlling the coating thickness of the adhesive and scraping the adhesive, so that the coating amount of the adhesive on the flexible insulating layer 6 is basically consistent, the adhesive in the thickness range is favorable for fully volatilizing an organic solvent in the adhesive through a drying channel at the temperature, the adhesive is favorable for primary solidification, and the adhesive can be tightly bonded with an aluminum foil.
Further, the line speed of the coating composite equipment in the step D is 25-30 m/s. The linear speed is matched with the temperature of the drying tunnel and the drying tunnel, is beneficial to primary solidification of the adhesive and the compounding of the adhesive and the aluminum foil, and therefore apparent quality, mechanical property, electric conductivity and the like of the product are ensured.
Referring to fig. 1, the present invention further provides an LED flexible circuit board, which is manufactured by the manufacturing method of the LED flexible circuit board, and the LED flexible circuit board includes an oxidation preventing layer 1, a covering film layer 2, a first adhesive layer 3, a copper foil circuit layer 4, a second adhesive layer 5, a flexible insulating layer 6, a third adhesive layer 7 and an aluminum foil layer 8, which are sequentially arranged from top to bottom; the oxidation preventing layer 1 is formed of OSP, and the oxidation preventing layer 1 is used for covering the surface of the copper foil to prevent oxidation, vulcanization and the like of the copper. The first adhesive layer 3, the second adhesive layer 5 and the third adhesive layer 7 are all formed by curing adhesives, the first adhesive layer 3 is used for bonding the covering film layer 2 and the copper foil circuit layer 4, the second adhesive layer 5 is used for bonding the copper foil circuit layer 4 and the flexible insulating layer 6, and the third adhesive layer 7 is used for bonding the flexible insulating layer 6 and the aluminum foil layer 8. The covering film layer 2 is a polyimide film layer and is used for protecting circuits on the copper foil, preventing the circuits from being scratched and improving the flexibility and bending resistance of the copper foil circuit layer 4; the flexible insulating layer 6 is a polyimide layer and is used for improving the high and low temperature resistance and corrosion resistance of the LED flexible circuit board and insulating the layers. The aluminum foil layer 8 is used for improving air permeability and heat dissipation of the LED flexible circuit board and providing electric conduction for the LED flexible circuit board. Through the arrangement, the LED flexible circuit board is large in bending angle, bending-resistant and strong in resistance, is more than ten thousand times, is applicable to the fields of arc-shaped LED lamps and the like requiring bending of the circuit board and occasions with higher dynamic requirements, is more widely applied, solves the problem of poor air permeability of copper foil materials of the traditional flexible circuit board, is beneficial to reducing the running temperature of a module, and prolongs the service life of the LED flexible circuit board.
In order to further illustrate an LED flexible circuit board and a method of manufacturing the same of the present invention, the following examples are provided.
Example 1
The preparation method of the LED flexible circuit board comprises the following steps:
A. carrying out full-roll screen printing on the copper foil after the material is cut according to the designed film pattern, and then etching to remove a non-circuit copper layer to expose a circuit on the copper foil, wherein the minimum line width of etching is 0.5+/-0.02 mm, and the minimum line distance is 0.34+/-0.02 mm; the copper foil is then placed in a 5% strength sulfuric acid solution for pickling.
B. A layer of covering film is covered on the circuit layer of the copper foil, an adhesive is arranged on the lower surface of the covering film, and the covering film is attached to the circuit layer through the adhesive. When the covering film is attached, the alignment hole sites are positioned, and the allowable tolerance is +/-0.10 mm. Then, the copper foil with the cover film attached is wound up, and the whole roll is laminated.
C. And coating an adhesive on the back surface of the copper foil circuit layer, covering a flexible insulating layer on the adhesive, and then curing.
D. Roll-to-roll gluing: uniformly spraying an adhesive on the flexible insulating layer through a die head, wherein the thickness of the adhesive after curing is 25nm, conveying the whole body into a drying tunnel in coating compounding equipment, and carrying out roll-to-roll hot-pressing compounding on the surface, coated with the adhesive, of the flexible insulating layer and an aluminum foil after exiting the drying tunnel, wherein the hot-pressing temperature is 92 ℃, so as to obtain a flexible aluminum plate material; and then placing the flexible aluminum plate material in a drying oven at 172 ℃ for rolling and baking for 30min. The temperature of the drying tunnel is as follows in sequence: 90 ℃, 100 ℃, 130 ℃, 150 ℃, 170 ℃, 110 ℃. The line speed of the coating composition apparatus was 28m/s.
E. Carrying out target punching on the flexible aluminum plate material, carrying out whole-roll silk-screen printing on characters according to film patterns, wherein the mesh number is 120T, and putting the whole roll into a baking oven with the temperature of 170 ℃ to bake for 10min; then carrying out secondary acid washing.
F. And performing OSP (open shortest path first) anti-oxidation treatment on the flexible aluminum plate material, cutting the flexible aluminum plate material into proper specifications according to design requirements, and performing FQC and FQA quality inspection to obtain the LED flexible circuit board.
Example 2
A. Carrying out full-roll screen printing on the copper foil after the material is cut according to the designed film pattern, and then etching to remove a non-circuit copper layer to expose a circuit on the copper foil, wherein the minimum line width of etching is 0.5+/-0.02 mm, and the minimum line distance is 0.34+/-0.02 mm; the copper foil is then placed in a sulfuric acid solution having a concentration of 3% for pickling.
B. A layer of covering film is covered on the circuit layer of the copper foil, an adhesive is arranged on the lower surface of the covering film, and the covering film is attached to the circuit layer through the adhesive. When the covering film is attached, the alignment hole sites are positioned, and the allowable tolerance is +/-0.10 mm. Then, the copper foil with the cover film attached is wound up, and the whole roll is laminated.
C. And coating an adhesive on the back surface of the copper foil circuit layer, covering a flexible insulating layer on the adhesive, and then curing.
D. Roll-to-roll gluing: uniformly spraying an adhesive on the flexible insulating layer through a die head, wherein the thickness of the adhesive after curing is 30nm, conveying the whole body into a drying tunnel in coating compounding equipment, and carrying out roll-to-roll hot-pressing compounding on the surface, coated with the adhesive, of the flexible insulating layer and an aluminum foil after exiting the drying tunnel, wherein the hot-pressing temperature is 90 ℃, so as to obtain a flexible aluminum plate material; and then placing the flexible aluminum plate material in an oven at 168 ℃ for rolling and baking for 35min. The temperature of the drying tunnel is as follows in sequence: 92 ℃, 102 ℃, 132 ℃, 152 ℃, 172 ℃, 112 ℃. The line speed of the coating composition apparatus was 25m/s.
E. Carrying out target punching on the flexible aluminum plate material, carrying out whole-roll silk-screen printing on characters according to film patterns, wherein the mesh number is 120T, and putting the whole roll into an oven with the temperature of 168 ℃ to bake for 13min; then carrying out secondary acid washing.
F. And performing OSP (open shortest path first) anti-oxidation treatment on the flexible aluminum plate material, cutting the flexible aluminum plate material into proper specifications according to design requirements, and performing FQC and FQA quality inspection to obtain the LED flexible circuit board.
Example 3
A. Carrying out full-roll screen printing on the copper foil after the material is cut according to the designed film pattern, and then etching to remove a non-circuit copper layer to expose a circuit on the copper foil, wherein the minimum line width of etching is 0.5+/-0.02 mm, and the minimum line distance is 0.34+/-0.02 mm; the copper foil was then placed in a 4% strength sulfuric acid solution for pickling.
B. A layer of covering film is covered on the circuit layer of the copper foil, an adhesive is arranged on the lower surface of the covering film, and the covering film is attached to the circuit layer through the adhesive. When the covering film is attached, the alignment hole sites are positioned, and the allowable tolerance is +/-0.10 mm. Then, the copper foil with the cover film attached is wound up, and the whole roll is laminated.
C. And coating an adhesive on the back surface of the copper foil circuit layer, covering a flexible insulating layer on the adhesive, and then curing.
D. Roll-to-roll gluing: uniformly spraying an adhesive on the flexible insulating layer through a die head, wherein the thickness of the cured adhesive is 20nm, conveying the whole body into a drying tunnel in coating compounding equipment, and carrying out roll-to-roll hot-pressing compounding on the surface, coated with the adhesive, of the flexible insulating layer and an aluminum foil after the whole body is discharged from the drying tunnel, wherein the hot-pressing temperature is 88 ℃, so as to obtain a flexible aluminum plate material; and then placing the flexible aluminum plate material in an oven at 170 ℃ for rolling and baking for 33 minutes. The temperature of the drying tunnel is as follows in sequence: 88 ℃, 98 ℃, 128 ℃, 148 ℃, 168 ℃, 108 ℃. The line speed of the coating composition apparatus was 30m/s.
E. Carrying out target punching on the flexible aluminum plate material, carrying out whole-roll silk-screen printing on characters according to film patterns, wherein the mesh number is 120T, and putting the whole roll into a baking oven with the temperature of 172 ℃ to bake for 15min; then carrying out secondary acid washing.
F. And performing OSP (open shortest path first) anti-oxidation treatment on the flexible aluminum plate material, cutting the flexible aluminum plate material into proper specifications according to design requirements, and performing FQC and FQA quality inspection to obtain the LED flexible circuit board.
In summary, according to the invention, through the whole roll screen printing circuit, etching, laminating a covering film on a copper foil circuit layer, coating an adhesive roll to roll, compounding an aluminum foil roll to roll and baking and curing, compared with the existing manual lamination of the aluminum foil to a flexible insulating layer, the production efficiency and the compounding effect are greatly improved, so that the product is ensured to have good electric conductivity and heat dissipation performance; the covering film is soft and bending-resistant, so that the flexibility, bending-resistant performance and resistance of the LED flexible circuit board are improved; the LED flexible circuit board can be freely bent, is bending-resistant, and can meet the requirement of multi-angle simultaneous irradiation; the air permeability and the heat dissipation capability are achieved, so that the running temperature of the module is reduced, the service life is prolonged, the reliability is improved, and the mechanical durability is improved; and the volume of the flexible circuit board is reduced, and the assembly area of the radiator and other hardware is reduced, so that the hardware and the assembly cost are reduced.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
It will be understood that equivalents and modifications will occur to those skilled in the art based on the present invention and its spirit, and all such modifications and substitutions are intended to be included within the scope of the present invention.
Claims (5)
1. The preparation method of the LED flexible circuit board is characterized by comprising the following steps of:
A. carrying out full-coil screen printing on the copper foil subjected to material cutting according to a designed film pattern, etching to remove a non-circuit copper layer, exposing a circuit on the copper foil, and then carrying out acid washing on the copper foil;
B. covering a layer of covering film on the front surface of the copper foil circuit layer, arranging an adhesive on the lower surface of the covering film, attaching the covering film to the circuit layer through the adhesive, and then rolling and laminating;
C. coating an adhesive on the back surface of the copper foil circuit layer, covering a flexible insulating layer on the adhesive, and then curing;
D. roll-to-roll gluing: coating an adhesive on the flexible insulating layer, feeding the whole body into a drying tunnel in coating and compounding equipment, and carrying out roll-to-roll hot-pressing compounding on the surface, coated with the adhesive, of the flexible insulating layer and the aluminum foil after the whole body is discharged from the drying tunnel to obtain a flexible aluminum plate material; then baking and solidifying the flexible aluminum plate material; the drying tunnel in the step D comprises a heating section and a cooling section, and the temperature of the heating section is sequentially as follows: 90+/-2 ℃, 100+/-2 ℃, 130+/-2 ℃, 150+/-2 ℃ and 170+/-2 ℃; the temperature of the cooling section is 110+/-2 ℃; the hot-pressing compounding in the step D is realized by a steel roller and a rubber roller which are arranged up and down, a flexible aluminum plate material is arranged between the steel roller and the rubber roller, and the temperature of the steel roller is 90+/-2 ℃; the adhesive in the step D is sprayed out of a die head and uniformly sprayed on the surface of the flexible insulating layer; the die head is provided with a plurality of nozzles extending along the length direction of the die head at equal intervals, the nozzles are arranged in the die head, a guide roller is arranged in front of the nozzles, the flexible insulating layer penetrates through a gap between the die head and the guide roller, when adhesive is coated, the die head moves in the direction close to the guide roller, then the adhesive in the die head is transferred onto the flexible insulating layer, and the thickness of the cured adhesive is 20-30 nm; the linear speed of the coating composite equipment in the step D is 25-30 m/s; in the step D, the flexible aluminum plate material is placed in an oven at 170+/-2 ℃ to be baked for 30-35 min;
E. and performing target punching and OSP (organic light emitting diode) oxidation prevention treatment on the flexible aluminum plate material, forming an oxidation prevention layer on the upper surface of the flexible aluminum plate material, and then cutting and quality testing to obtain the LED flexible circuit board.
2. The method for manufacturing an LED flexible circuit board according to claim 1, wherein the cover film in the step B is a polyimide film; and C and D, wherein the flexible insulating layers are polyimide layers.
3. The method of manufacturing a flexible circuit board for LED of claim 1, wherein the minimum line width etched in step a is 0.5±0.02mm and the minimum line distance is 0.34±0.02mm.
4. The method for manufacturing the LED flexible circuit board according to claim 1, wherein the conditions for baking the whole roll in the step B are as follows: baking at 180+/-2 deg.c for 15-20 min.
5. An LED flexible circuit board manufactured by the manufacturing method of the LED flexible circuit board according to any one of claims 1 to 4, characterized in that the LED flexible circuit board comprises an oxidation preventing layer, a covering film layer, a first adhesive layer, a copper foil circuit layer, a second adhesive layer, a flexible insulating layer, a third adhesive layer and an aluminum foil layer which are sequentially arranged from top to bottom; the anti-oxidation layer is formed by OSP, and the first adhesive layer, the second adhesive layer and the third adhesive layer are all formed by curing adhesives; the covering film layer is a polyimide film layer; the flexible insulating layer is a polyimide layer.
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| CN205071442U (en) * | 2015-09-30 | 2016-03-02 | 大连吉星电子有限公司 | A attach aluminium FPC substrate and circuit board for LED illumination |
| KR20160065627A (en) * | 2014-12-01 | 2016-06-09 | 주식회사 두산 | Insulating resin sheet for flexible printed circuit board and manufacturing method thereof, and printed circuit board comprising the same |
| CN110087399A (en) * | 2019-04-17 | 2019-08-02 | 甄凯军 | A kind of circuit base plate Flexible Production technique |
| CN210093662U (en) * | 2019-04-29 | 2020-02-18 | 大连吉星电子股份有限公司 | Single-sided flexible circuit board meeting double-sided plugging |
| CN111619173A (en) * | 2019-12-30 | 2020-09-04 | 瑞声科技(新加坡)有限公司 | Copper-clad plate and preparation method thereof |
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| KR20160065627A (en) * | 2014-12-01 | 2016-06-09 | 주식회사 두산 | Insulating resin sheet for flexible printed circuit board and manufacturing method thereof, and printed circuit board comprising the same |
| CN205071442U (en) * | 2015-09-30 | 2016-03-02 | 大连吉星电子有限公司 | A attach aluminium FPC substrate and circuit board for LED illumination |
| CN110087399A (en) * | 2019-04-17 | 2019-08-02 | 甄凯军 | A kind of circuit base plate Flexible Production technique |
| CN210093662U (en) * | 2019-04-29 | 2020-02-18 | 大连吉星电子股份有限公司 | Single-sided flexible circuit board meeting double-sided plugging |
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