CN205071442U - A attach aluminium FPC substrate and circuit board for LED illumination - Google Patents
A attach aluminium FPC substrate and circuit board for LED illumination Download PDFInfo
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- CN205071442U CN205071442U CN201520772207.0U CN201520772207U CN205071442U CN 205071442 U CN205071442 U CN 205071442U CN 201520772207 U CN201520772207 U CN 201520772207U CN 205071442 U CN205071442 U CN 205071442U
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- led illumination
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Abstract
The utility model relates to an attach aluminium FPC substrate and circuit board for LED illumination belongs to LED illumination articles for use technical field, including the copper foil layer, the copper foil layer is through first hot pressing glue film bonding polyimide layer, polyimide passes through on the layer second hot pressing glue film bonding aluminum plate. The beneficial effects of the utility model are that: carrying out different circuit etching designs according to LED lighting device's requirement, adopting two -sided etch process, reduction in production cost improves production efficiency, has realized simultaneously that FPC can freely buckle, has both satisfied the multi -angle and has shone simultaneously, has higher heat dispersion again, does not need the equipment of a plurality of PCB.
Description
Technical field
The utility model relates to a kind of attached aluminium FPC base material for LED illumination and wiring board, belongs to LED illumination articles for use technical field.
Background technology
Traditional LED, many employings PCB makes, reach multidirectional illumination, multiple PCB to assemble, heat dispersion is poor, manufacturing process is loaded down with trivial details, production cost is high, and weight is relatively heavier simultaneously, and single PCB cannot bend, LED direction of illumination on it is single, causes local light to cover completely.
Utility model content
The purpose of this utility model is to provide that a kind of production cost is low, thermal diffusivity good, can the attached aluminium FPC base material for LED illumination that simultaneously irradiates of multi-angle and wiring board.
The technical solution of the utility model is: for the attached aluminium FPC base material of LED illumination, comprise copper foil layer, and described copper foil layer is by the first hot pressing glue-line bonding polyimide layer, and described polyimide layer is by the second hot pressing glue-line bonding aluminium sheet.
Described copper foil layer is 0.01mm-2mm to the thickness of aluminium sheet.
For the wiring board that the attached aluminium FPC base material of LED illumination makes, described copper foil layer surface etching circuit-line, and apply bent white solder mask layer, described aluminium sheet is provided with kink.
The bending angle of described kink is 0 °-360 °.
The beneficial effects of the utility model are: adopt the processing technology that FPC base material combines with aluminium sheet, compensate for the shortcomings and deficiencies that PCB is many, different circuit-line etching designs is carried out according to the requirement of LED light device, adopt double-sided etching process, reduce production cost, enhance productivity, achieve FPC can free folding simultaneously, both meet multi-angle to irradiate simultaneously, had again higher heat dispersion, and do not need multiple PCB to assemble.
Accompanying drawing explanation
The utility model has accompanying drawing 5 width.
Fig. 1 is the structure chart of the utility model attached aluminium FPC base material;
Fig. 2 is copper foil layer line map after etching;
Fig. 3 is polyimide layer schematic diagram after etching;
Fig. 4 is aluminium sheet structural representation after etching;
Fig. 5 is white solder mask Rotating fields schematic diagram.
In figure, Reference numeral is as follows: 1, copper foil layer, the 2, first hot pressing glue-line, and 3, polyimide layer, the 4, second hot pressing glue-line, 5, aluminium sheet, 6, kink.
Embodiment
Below in conjunction with accompanying drawing 1-5, the utility model is described further:
For the attached aluminium FPC base material of LED illumination, comprise copper foil layer 1, described copper foil layer 1 bonds polyimide layer 3 by the first hot pressing glue-line 2, and described polyimide layer 3 bonds aluminium sheet 5 by the second hot pressing glue-line 4.
The thickness of described copper foil layer 1 to aluminium sheet 5 is 0.01mm-2mm.
For the wiring board that the attached aluminium FPC base material of LED illumination makes, described copper foil layer 1 surface etching circuit-line, and apply bent white solder mask layer, described aluminium sheet 5 is provided with kink 6.
The bending angle of described kink 6 is 0 °-360 °.
For the wiring board that the attached aluminium FPC base material of LED illumination makes, concrete making step is as follows:
A) by liquid heat moulding even spread on copper foil layer 1;
B) sticky surface of polyimide layer 3 with copper foil layer 1 is pressed together;
C) even spread liquid heat moulding on polyimide layer 3;
D) by polyimide layer 3 pressing of aluminium sheet 5 with surface coating liquid state hot pressing glue;
F) two-sided simultaneously etching, namely at copper foil layer 1 surface etching circuit-line, simultaneously at aluminium sheet 5 surface etching kink 6 is carried out at copper foil layer 1 and aluminium sheet 5 surface respectively according to the designing requirement of LED light device;
G) at the bent white solder mask layer of copper foil layer 1 surface-coated etched.
After etching, aluminium sheet 5 is separated, be connected to together by polyimide layer 3, position between aluminium sheet 5 only has polyimide layer 3+ copper foil layer 1+ white solder mask layer, so can free folding and do not damage its electric property, the two-sided technique simultaneously etched, has broken the technique that traditional FPC attaches reinforcement, has improve production efficiency.And copper foil surface coating printing ink more effective production efficiency that improves under the prerequisite ensureing its application function and illumination, reduce production cost.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvement and modification, these improve and modification also should be considered as protection range of the present utility model.
Claims (4)
1. for the attached aluminium FPC base material of LED illumination, it is characterized in that: comprise copper foil layer (1), described copper foil layer (1) is by the first hot pressing glue-line (2) bonding polyimide layer (3), and described polyimide layer (3) is by the second hot pressing glue-line (4) bonding aluminium sheet (5).
2. the attached aluminium FPC base material for LED illumination according to claim 1, is characterized in that: described copper foil layer (1) is 0.01mm-2mm to the thickness of aluminium sheet (5).
3. utilize as claimed in claim 1 or 2 for the wiring board of the attached aluminium FPC base material making of LED illumination, it is characterized in that: described copper foil layer (1) surface etching circuit-line, and applying bent white solder mask layer, described aluminium sheet (5) is provided with kink (6).
4. the wiring board made for the attached aluminium FPC base material of LED illumination according to claim 3, is characterized in that: the bending angle of described kink (6) is 0 °-360 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520772207.0U CN205071442U (en) | 2015-09-30 | 2015-09-30 | A attach aluminium FPC substrate and circuit board for LED illumination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520772207.0U CN205071442U (en) | 2015-09-30 | 2015-09-30 | A attach aluminium FPC substrate and circuit board for LED illumination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071442U true CN205071442U (en) | 2016-03-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520772207.0U Active CN205071442U (en) | 2015-09-30 | 2015-09-30 | A attach aluminium FPC substrate and circuit board for LED illumination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205071442U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208768A (en) * | 2015-09-30 | 2015-12-30 | 大连吉星电子有限公司 | Aluminum-attached FPC base material product for LED illumination and etching process thereof |
| CN113966079A (en) * | 2021-09-23 | 2022-01-21 | 佛山市竞国电子有限公司 | LED flexible circuit board and preparation method thereof |
| CN114025500A (en) * | 2021-09-23 | 2022-02-08 | 佛山市竞国电子有限公司 | Flexible circuit board and preparation method thereof |
-
2015
- 2015-09-30 CN CN201520772207.0U patent/CN205071442U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208768A (en) * | 2015-09-30 | 2015-12-30 | 大连吉星电子有限公司 | Aluminum-attached FPC base material product for LED illumination and etching process thereof |
| CN105208768B (en) * | 2015-09-30 | 2018-03-23 | 大连吉星电子有限公司 | Attached aluminium FPC substrate products and its etch process for LED illumination |
| CN113966079A (en) * | 2021-09-23 | 2022-01-21 | 佛山市竞国电子有限公司 | LED flexible circuit board and preparation method thereof |
| CN114025500A (en) * | 2021-09-23 | 2022-02-08 | 佛山市竞国电子有限公司 | Flexible circuit board and preparation method thereof |
| CN113966079B (en) * | 2021-09-23 | 2024-03-08 | 佛山市竞国电子有限公司 | LED flexible circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |