CN105208768A - Aluminum-attached FPC base material product for LED illumination and etching process thereof - Google Patents
Aluminum-attached FPC base material product for LED illumination and etching process thereof Download PDFInfo
- Publication number
- CN105208768A CN105208768A CN201510645944.9A CN201510645944A CN105208768A CN 105208768 A CN105208768 A CN 105208768A CN 201510645944 A CN201510645944 A CN 201510645944A CN 105208768 A CN105208768 A CN 105208768A
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- CN
- China
- Prior art keywords
- copper foil
- foil layer
- layer
- etching process
- aluminium sheet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
Abstract
The invention relates to a base material product and an etching process thereof, in particular to an FPC base material product and an etching process thereof. The etching process comprises the following specific steps that a, a copper foil layer is evenly coated with liquid hot pressing glue; b, a polyimide layer and the glue face of the copper foil layer are pressed together; c, the polyimide layer is evenly coated with liquid hot pressing glue; d, an aluminum plate and the polyimide layer with the surface coated with the liquid hot pressing glue are pressed together; e, two faces are etched at the same time; f, the surface of the copper foil layer obtained after etching is coated with a flexible white solder resist ink layer. The FPC base material product and the etching process thereof have the advantages that different circuit and line etching designs are carried out according to the requirement of an LED illuminating device, the dual-face etching process is adopted, production cost is reduced, production efficiency is improved, meanwhile, an FPC can be freely bent, multiple angles can be irradiated at the same time, high cooling performance is achieved, and assembly of multiple PCBs is not needed.
Description
Technical field
The present invention relates to a kind of substrate product and etch process thereof, particularly relate to a kind of FPC substrate product and etch process thereof.
Background technology
Traditional LED light device, many employings PCB makes, reach multidirectional illumination, multiple PCB to assemble, heat dispersion is poor, manufacturing process is loaded down with trivial details, production cost is high, and weight is relatively heavier simultaneously, and single PCB cannot bend, LED direction of illumination on it is single, causes local light to cover completely.
Summary of the invention
The object of this invention is to provide that a kind of production cost is low, thermal diffusivity good, can the multi-angle attached aluminium FPC substrate product for LED illumination of simultaneously irradiating and etch process thereof.
Technical scheme of the present invention is: for the attached aluminium FPC substrate product of LED illumination, comprise copper foil layer, described copper foil layer is by the first hot pressing glue-line bonding polyimide layer, described polyimide layer is by the second hot pressing glue-line bonding aluminium sheet, described copper foil layer surface etching circuit-line, and applying bent white solder mask layer, described aluminium sheet is provided with kink.
Described copper foil layer is 0.01mm-2mm to the thickness of aluminium sheet.
The bending angle of described kink is 0 °-360 °.
For the etch process of the attached aluminium FPC substrate product of LED illumination, concrete steps are as follows:
A) by liquid heat moulding even spread on copper foil layer;
B) sticky surface of polyimide layer copper foil layer and copper foil layer is pressed together;
C) even spread liquid heat moulding on polyimide layer;
D) by the polyimide layer pressing of aluminium sheet and surface coating liquid state hot pressing glue;
E) two-sided simultaneously etching, namely at copper foil layer surface etching circuit-line, simultaneously at surface of aluminum plate etching kink is carried out at copper foil layer and surface of aluminum plate respectively according to the designing requirement of LED light device;
F) at the bent white solder mask layer of the copper foil layer surface-coated etched.
Beneficial effect of the present invention is: adopt the processing technology that FPC base material combines with aluminium sheet, compensate for the shortcomings and deficiencies that PCB is many, different circuit-line etching designs is carried out according to the designing requirement of LED light device, adopt double-sided etching process, reduce production cost, enhance productivity, achieve FPC can free folding simultaneously, both meet multi-angle to irradiate simultaneously, had again higher heat dispersion, and do not need multiple PCB to assemble.
Accompanying drawing explanation
The present invention has accompanying drawing 5 width.
Fig. 1 is the structure chart of the present invention attached aluminium FPC base material;
Fig. 2 is copper foil layer line map after etching;
Fig. 3 is polyimide layer schematic diagram after etching;
Fig. 4 is aluminium sheet structural representation after etching;
Fig. 5 is white solder mask Rotating fields schematic diagram.
In figure, sequence number illustrates: 1, copper foil layer, the 2, first hot pressing glue-line, 3, polyimide layer, and the 4, second hot pressing glue-line, 5, aluminium sheet, 6, kink.
Embodiment
Below in conjunction with accompanying drawing 1-5, the present invention will be further described:
For the attached aluminium FPC substrate product of LED illumination, comprise copper foil layer 1, described copper foil layer 1 bonds polyimide layer 3 by the first hot pressing glue-line 2, described polyimide layer 3 bonds aluminium sheet 5 by the second hot pressing glue-line 4, described copper foil layer 1 surface etching circuit-line, and applying bent white solder mask layer, described aluminium sheet 5 is provided with kink 6.
The thickness of described copper foil layer 1 to aluminium sheet 5 is 0.01mm-2mm.
The bending angle of described kink 6 is 0 °-360 °.
For the etch process of the attached aluminium FPC substrate product of LED illumination, concrete steps are as follows:
A) by liquid heat moulding even spread on copper foil layer 1;
B) sticky surface of polyimide layer copper foil layer 3 with copper foil layer 1 is pressed together;
C) even spread liquid heat moulding on polyimide layer 3;
D) by polyimide layer 3 pressing of aluminium sheet 4 with surface coating liquid state hot pressing glue;
E) two-sided simultaneously etching, namely at copper foil layer 1 surface etching circuit-line, simultaneously at aluminium sheet 5 surface etching kink 6 is carried out at copper foil layer 1 and aluminium sheet 4 surface respectively according to the designing requirement of LED light device;
F) at the bent white solder mask layer of copper foil layer 1 surface-coated etched.
After etching, aluminium sheet 4 is separated, be connected to together by polyimide layer 3, position between aluminium sheet 4 only has polyimide layer 3+ copper foil layer 3+ white solder mask layer, so can free folding and do not damage its electric property, the two-sided technique simultaneously etched, has broken the technique that traditional FPC attaches aluminium sheet reinforcement, has improve production efficiency.And ink replaces coverlay more effective production efficiency that improves under the prerequisite ensureing its application function and illumination, reduce production cost.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.
Claims (4)
1. for the attached aluminium FPC substrate product of LED illumination, it is characterized in that, comprise copper foil layer (1), described copper foil layer (1) is by the first hot pressing glue-line (2) bonding polyimide layer (3), described polyimide layer (3) is by the second hot pressing glue-line (4) bonding aluminium sheet (5), described copper foil layer (1) surface etching circuit-line, and applying bent white solder mask layer, described aluminium sheet (5) is provided with kink (6).
2. the attached aluminium FPC substrate product for LED illumination according to claim 1, it is characterized in that, described copper foil layer (1) is 0.01mm-2mm to the thickness of aluminium sheet (5).
3. the attached aluminium FPC substrate product for LED illumination according to claim 1 and 2, it is characterized in that, the bending angle of described kink (6) is 0 °-360 °
4., as claimed in claim 1 for the etch process of the attached aluminium FPC substrate product of LED illumination, it is characterized in that, concrete steps are as follows:
A) by liquid heat moulding even spread on copper foil layer (1);
B) sticky surface of polyimide layer copper foil layer (3) with copper foil layer (1) is pressed together;
C) in the upper even spread liquid heat moulding of polyimide layer (3);
D) by polyimide layer (3) pressing of aluminium sheet (4) with surface coating liquid state hot pressing glue;
E) carry out two-sidedly etching at copper foil layer (1) and aluminium sheet (4) surface respectively according to the designing requirement of LED light device simultaneously, namely at copper foil layer (1) surface etching circuit-line, simultaneously at aluminium sheet (5) surface etching kink (6);
F) at the bent white solder mask layer of the copper foil layer etched (1) surface-coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510645944.9A CN105208768B (en) | 2015-09-30 | 2015-09-30 | Attached aluminium FPC substrate products and its etch process for LED illumination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510645944.9A CN105208768B (en) | 2015-09-30 | 2015-09-30 | Attached aluminium FPC substrate products and its etch process for LED illumination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105208768A true CN105208768A (en) | 2015-12-30 |
| CN105208768B CN105208768B (en) | 2018-03-23 |
Family
ID=54956094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510645944.9A Active CN105208768B (en) | 2015-09-30 | 2015-09-30 | Attached aluminium FPC substrate products and its etch process for LED illumination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105208768B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028716A (en) * | 2016-07-15 | 2016-10-12 | 信利光电股份有限公司 | Cover plate and making method thereof |
| CN109219238A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209612A (en) * | 1997-01-24 | 1998-08-07 | Shinko Electric Ind Co Ltd | Circuit board and its manufacture |
| CN101161039A (en) * | 2005-04-19 | 2008-04-09 | 电气化学工业株式会社 | Metal base circuit board, LED and LED light source unit |
| CN101346047A (en) * | 2007-07-13 | 2009-01-14 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board production method and inner layer substrates for producing the same |
| CN205071442U (en) * | 2015-09-30 | 2016-03-02 | 大连吉星电子有限公司 | A attach aluminium FPC substrate and circuit board for LED illumination |
-
2015
- 2015-09-30 CN CN201510645944.9A patent/CN105208768B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209612A (en) * | 1997-01-24 | 1998-08-07 | Shinko Electric Ind Co Ltd | Circuit board and its manufacture |
| CN101161039A (en) * | 2005-04-19 | 2008-04-09 | 电气化学工业株式会社 | Metal base circuit board, LED and LED light source unit |
| CN101346047A (en) * | 2007-07-13 | 2009-01-14 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board production method and inner layer substrates for producing the same |
| CN205071442U (en) * | 2015-09-30 | 2016-03-02 | 大连吉星电子有限公司 | A attach aluminium FPC substrate and circuit board for LED illumination |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028716A (en) * | 2016-07-15 | 2016-10-12 | 信利光电股份有限公司 | Cover plate and making method thereof |
| CN106028716B (en) * | 2016-07-15 | 2018-11-16 | 信利光电股份有限公司 | A kind of cover board and preparation method thereof |
| CN109219238A (en) * | 2017-07-03 | 2019-01-15 | 张文耀 | Using silica gel plate as the circuit board of substrate and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105208768B (en) | 2018-03-23 |
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