CN207733169U - A kind of structure improved thermally conductive sheet - Google Patents

A kind of structure improved thermally conductive sheet Download PDF

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Publication number
CN207733169U
CN207733169U CN201820040797.1U CN201820040797U CN207733169U CN 207733169 U CN207733169 U CN 207733169U CN 201820040797 U CN201820040797 U CN 201820040797U CN 207733169 U CN207733169 U CN 207733169U
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CN
China
Prior art keywords
heat
conducting glue
glue layer
layer
thermally conductive
Prior art date
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Expired - Fee Related
Application number
CN201820040797.1U
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Chinese (zh)
Inventor
陈声杰
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Dongguan Trans Electronic Co Ltd
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Dongguan Trans Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Trans Electronic Co Ltd filed Critical Dongguan Trans Electronic Co Ltd
Priority to CN201820040797.1U priority Critical patent/CN207733169U/en
Application granted granted Critical
Publication of CN207733169U publication Critical patent/CN207733169U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of structure improved thermally conductive sheets comprising has the first heat-conducting glue layer, the second heat-conducting glue layer, the first heat-conducting glue layer is located at the upper end side of the second heat-conducting glue layer and the first heat-conducting glue layer and the second heat-conducting glue layer arranged for interval;It is provided with graphene layer between first heat-conducting glue layer and the second heat-conducting glue layer, first heat-conducting glue layer, graphene layer and the second heat-conducting glue layer stack gradually arrangement from top to bottom, the lower surface of first heat-conducting glue layer and the upper surface of graphene layer connect, and the lower surface of graphene layer is connect with the upper surface of the second heat-conducting glue layer;The upper end side of first heat-conducting glue layer is provided with macromolecule protective layer, and the lower surface of macromolecule protective layer is connect with the upper surface of the first heat-conducting glue layer;The lower end side of second heat-conducting glue layer is provided with layers of two-sided, and the upper surface of layers of two-sided is connect with the lower surface of the second heat-conducting glue layer.By said structure design, the utility model has the advantages that novel in design, heat conduction and heat radiation effect is good.

Description

A kind of structure improved thermally conductive sheet
Technical field
The utility model is related to thermally conductive sheet technical field more particularly to a kind of structure improved thermally conductive sheets.
Background technology
Thermally conductive sheet is a kind of sheet structure with heat conduction, insulation effect, is used for power device and cooling fin or shell Between play heat conductive insulating;Stringenter industry, such as LED light, automotive electronics, power supply, PDP/LED is required heat conduction to put down Plate TV, communication, household electrical appliances and Medical Devices, military installations, aircraft, water conservancy equipment etc. are generally led using thermally conductive sheet to realize Heat heat dissipation.
Wherein, the heat conduction flake products being in various forms exist in the prior art;However, for existing heat conduction flake products and Speech, during the use of design, generally existing designs defect unreasonable, that heat conduction and heat radiation effect is poor.
Utility model content
The purpose of this utility model is that a kind of structure improved thermally conductive sheet is provided in view of the deficiencies of the prior art, the knot Thermally conductive sheet novel design, the heat conduction and heat radiation effect of structure improvement are good.
In order to achieve the above objectives, the utility model is achieved through the following technical solutions.
A kind of structure improved thermally conductive sheet, includes the first heat-conducting glue layer, the second heat-conducting glue layer, and the first heat-conducting glue layer is located at The upper end side of second heat-conducting glue layer and the first heat-conducting glue layer and the second heat-conducting glue layer arranged for interval;
Be provided with graphene layer between first heat-conducting glue layer and the second heat-conducting glue layer, the first heat-conducting glue layer, graphene layer with And second heat-conducting glue layer stack gradually arrangement from top to bottom, the lower surface of the first heat-conducting glue layer and the upper surface of graphene layer connect It connects, the lower surface of graphene layer is connect with the upper surface of the second heat-conducting glue layer;
The upper end side of first heat-conducting glue layer is provided with macromolecule protective layer, the lower surface of macromolecule protective layer and the first heat conduction The upper surface of glue-line connects;
The lower end side of second heat-conducting glue layer is provided with layers of two-sided, the upper surface of layers of two-sided under the second heat-conducting glue layer Surface connects.
Wherein, the macromolecule protective layer is macromolecule PI film layers.
Wherein, the upper surface of the macromolecule protective layer is coated with reflective coating layer.
The beneficial effects of the utility model are:A kind of structure improved thermally conductive sheet described in the utility model comprising have First heat-conducting glue layer, the second heat-conducting glue layer, the first heat-conducting glue layer are located at the upper end side and the first heat-conducting glue layer of the second heat-conducting glue layer With the second heat-conducting glue layer arranged for interval;Graphene layer, the first heat conduction are provided between first heat-conducting glue layer and the second heat-conducting glue layer Glue-line, graphene layer and the second heat-conducting glue layer stack gradually arrangement, the lower surface of the first heat-conducting glue layer and graphite from top to bottom The upper surface of alkene layer connects, and the lower surface of graphene layer is connect with the upper surface of the second heat-conducting glue layer;First heat-conducting glue layer it is upper End side is provided with macromolecule protective layer, and the lower surface of macromolecule protective layer is connect with the upper surface of the first heat-conducting glue layer;Second leads The lower end side of hot glue layer is provided with layers of two-sided, and the upper surface of layers of two-sided is connect with the lower surface of the second heat-conducting glue layer.Pass through Said structure design, the utility model have the advantages that novel in design, heat conduction and heat radiation effect is good.
Description of the drawings
The utility model is further detailed below with attached drawing, but the embodiment in attached drawing is not constituted pair Any restrictions of the utility model.
Fig. 1 is the structural schematic diagram of the utility model.
Include in Fig. 1:
1 --- macromolecule protective layer 2 --- first heat-conducting glue layer
3 --- graphene layer 4 --- second heat-conducting glue layers
5 --- layers of two-sided.
Specific implementation mode
The utility model is illustrated with reference to specific embodiment.
Include the first heat-conducting glue layer 2, the second heat-conducting glue layer 4 as shown in Figure 1, a kind of structure improved thermally conductive sheet, first Heat-conducting glue layer 2 is located at the upper end side and 4 arranged for interval of the first heat-conducting glue layer 2 and the second heat-conducting glue layer of the second heat-conducting glue layer 4.
Wherein, graphene layer 3, the first heat-conducting glue layer 2, stone are provided between the first heat-conducting glue layer 2 and the second heat-conducting glue layer 4 3 and second heat-conducting glue layer 4 of black alkene layer stacks gradually arrangement, lower surface and the graphene layer 3 of the first heat-conducting glue layer 2 from top to bottom Upper surface connection, the lower surface of graphene layer 3 is connect with the upper surface of the second heat-conducting glue layer 4.
Further, the upper end side of the first heat-conducting glue layer 2 is provided with macromolecule protective layer 1, the following table of macromolecule protective layer 1 Face is connect with the upper surface of the first heat-conducting glue layer 2.
Further, the lower end side of the second heat-conducting glue layer 4 is provided with layers of two-sided 5, the upper surface of layers of two-sided 5 and the The lower surface of two heat-conducting glue layers 4 connects.
It should further be noted that macromolecule protective layer 1 is macromolecule PI film layers.
In addition, the upper surface of macromolecule protective layer 1 is coated with reflective coating layer.
It need to be explained further, the fabric of the layers of two-sided 5 of the utility model as thermally conductive sheet, and layers of two-sided 5 is used In the effect of achieving a fixed connection, in use, the thermally conductive sheet of the utility model is bonded and fixed to corresponding installation by layers of two-sided 5 Face.
For first heat-conducting glue layer 2 of the utility model, the second heat-conducting glue layer 4, it is respectively used to realize that heat conduction is made With, and the first heat-conducting glue layer 2 is additionally operable to realize that the viscosity between macromolecule protective layer 1 and graphene layer 3 connects, the second heat-conducting glue Layer 4 is for realizing the viscosity connection between graphene layer 3 and layers of two-sided 5.
For the graphene layer 3 of the utility model, have the effect of enhancing heat conduction, and then increased thermal conductivity energy.
Also it is exactly, for the macromolecule protective layer 1 of the utility model, as the surface texture of thermally conductive sheet, and The macromolecule protective layer 1 of the utility model is formed using macromolecule PI material preparations, which has pH protective Effect.In addition, for the reflective coating layer coated on 1 surface of macromolecule protective layer, with anti-with certain radiation The effect of penetrating can be effectively prevented from outside heat and conduct to thermally conductive sheet.
Based on the above situation, it may be appreciated that by said structure design, the utility model has novel in design, heat conduction and heat radiation effect Good advantage.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality With novel thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as Limitations of the present invention.

Claims (3)

1. a kind of structure improved thermally conductive sheet, it is characterised in that:It include the first heat-conducting glue layer(2), the second heat-conducting glue layer(4), First heat-conducting glue layer(2)Positioned at the second heat-conducting glue layer(4)Upper end side and the first heat-conducting glue layer(2)With the second heat-conducting glue layer(4) Arranged for interval;
First heat-conducting glue layer(2)With the second heat-conducting glue layer(4)Between be provided with graphene layer(3), the first heat-conducting glue layer(2), stone Black alkene layer(3)And second heat-conducting glue layer(4)Arrangement, the first heat-conducting glue layer are stacked gradually from top to bottom(2)Lower surface and stone Black alkene layer(3)Upper surface connection, graphene layer(3)Lower surface and the second heat-conducting glue layer(4)Upper surface connection;
First heat-conducting glue layer(2)Upper end side be provided with macromolecule protective layer(1), macromolecule protective layer(1)Lower surface and the One heat-conducting glue layer(2)Upper surface connection;
Second heat-conducting glue layer(4)Lower end side be provided with layers of two-sided(5), layers of two-sided(5)Upper surface and the second heat-conducting glue Layer(4)Lower surface connection.
2. a kind of structure improved thermally conductive sheet according to claim 1, it is characterised in that:The macromolecule protective layer(1) For macromolecule PI film layers.
3. a kind of structure improved thermally conductive sheet according to claim 2, it is characterised in that:The macromolecule protective layer(1) Upper surface be coated with reflective coating layer.
CN201820040797.1U 2018-01-11 2018-01-11 A kind of structure improved thermally conductive sheet Expired - Fee Related CN207733169U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820040797.1U CN207733169U (en) 2018-01-11 2018-01-11 A kind of structure improved thermally conductive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820040797.1U CN207733169U (en) 2018-01-11 2018-01-11 A kind of structure improved thermally conductive sheet

Publications (1)

Publication Number Publication Date
CN207733169U true CN207733169U (en) 2018-08-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820040797.1U Expired - Fee Related CN207733169U (en) 2018-01-11 2018-01-11 A kind of structure improved thermally conductive sheet

Country Status (1)

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CN (1) CN207733169U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113374765A (en) * 2021-06-04 2021-09-10 上海复合材料科技有限公司 High-heat-conductivity flexible structure and connecting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113374765A (en) * 2021-06-04 2021-09-10 上海复合材料科技有限公司 High-heat-conductivity flexible structure and connecting method

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180814

Termination date: 20220111

CF01 Termination of patent right due to non-payment of annual fee