CN101483210A - Substrate construction for LED - Google Patents
Substrate construction for LED Download PDFInfo
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- CN101483210A CN101483210A CNA2008100013472A CN200810001347A CN101483210A CN 101483210 A CN101483210 A CN 101483210A CN A2008100013472 A CNA2008100013472 A CN A2008100013472A CN 200810001347 A CN200810001347 A CN 200810001347A CN 101483210 A CN101483210 A CN 101483210A
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- substrate
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- emitting diode
- light
- soft board
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Abstract
The invention relates to a Light Emitting Diode (LED) substrate structure comprising an upper substrate, a Flexible Printed Circuit (FPC), a lower substrate and an insulation rubber. A conductive pattern is arranged on the top surface of the upper substrate to form a combination region and a plurality of electrode regions; the FPC is combined under the upper substrate; the lower substrate is combined under the FPC, while a conductive circuit is arranged at the bottom of the lower substrate; the insulation rubber is coated on the top surface of the upper substrate and the end surface of the lower substrate; thereby forming the substrate structure with upper and lower substrates and middle flexible printed circuit.
Description
Technical field
The present invention relates to the board structure of a kind of light-emitting diode (LED), especially refer to by an a kind of top substrate layer, a soft board, Combination Design of laminar substrate and an insulation rubber once of comprising, formed with the soft board in the middle of this upper and lower substrate pressing, need not adopt surface adhering technology (SMT:Surface Mount Technology) and cross the solder furnace welding, and can avoid the empty weldering problem of generation between substrate and the soft board, make tool improve the element yield, and then can reduce the effect of cost of manufacture, and be applicable to board structure in conjunction with luminescence chip.
Background technology
Light-emitting diode has advantages such as power consumption is low, the life-span is long, and electronic product all generally adopts at present, and under science and technology is maked rapid progress, the existing trend that develops towards light, thin, short, little direction of electronic product external form.Yet traditional light emitting diode construction no matter how little the volume of its bearing base is, after photic zone is combined into one each element coating, still has certain volume, is not inconsistent the demand of modern product gradually.
So, get over small-sized trend for adapting to product shape, the substrate that visible on the market a kind of use surface adhering technology (SMT:Surface Mount Technology) will combine luminescence chip is incorporated into flexible printed wiring board (FPC:Flexible Printed Circuit again, the abbreviation soft board) structure on, see also Fig. 6, mainly be provided with an insulated substrate B in a soft board A, and this insulated substrate B is the hardboard in the printed circuit board (PCB) (PCB:Printed Circuit Board), and be provided with conductive pattern C in the end face of this insulated substrate B, this conductive pattern C is formed with land C1, positive electrode region C2 and negative electrode region C3, this conductive pattern C avoids this land C1, positive electrode region C2 and negative electrode region C3 place are coated with insulation rubber D, and this land C1 is for the flip bonded luminescence chip.During use, luminescence chip is incorporated on the land C1 of this insulated substrate B end face, and to link lead and the conducting of conductive pattern C electrically connect, with colloid E luminescence chip is covered again, i.e. encapsulation is finished.But, said structure still need adopt surface adhering technology (SMT), and need some glue to weld after solder furnace, so that this insulated substrate B is in conjunction with being fixed on this soft board A, so, make the problem that produces empty weldering between this insulated substrate B and the soft board A easily, and cause the raising of element fraction defective, and then also improved the cost of making.When soft board A and insulated substrate B mutually combine with welding, this insulated substrate B still can occupy the plate space of planes, allow the area of unit volume increase, and when the bending winding is used, make the structure of junction of this soft board A and insulated substrate B fragile, and easily cause soft board A and insulated substrate B to separate, cause problems such as circuit contacts is bad.In addition, above-mentioned existing structure is being used for luminous lamp strip ... during the application that waits, and regular meeting has upper and lower bending and the situation of pullling to take place, and insulated substrate B is welded in structure opposing bending on the soft board A, the ability pullled is relatively poor.
Summary of the invention
Main purpose of the present invention is to overcome the deficiencies in the prior art and defective, the board structure of a kind of LED is proposed, by a top substrate layer, one soft board (FPC:Flexible Printed Circuit), the Combination Design of a laminar substrate and an insulation rubber once, need not adopt surface adhering technology (SMT:Surface Mount Technology), and need not put glue and cross solder furnace solder bond substrate and soft board, can avoid making substrate and soft board to produce the problem of empty weldering, and then can improve the yield of element, reach the purpose that reduces cost of manufacture, to promote whole practicality and convenience.
Another object of the present invention is to, the board structure of a kind of LED is proposed, by a top substrate layer, a soft board (FPC), the Combination Design of laminar substrate and an insulation rubber once, the combination of this upper and lower substrate clamping soft board (FPC) has been avoided present soft board and the fragile problem of substrate solder bond place structure, and then can more be applicable to the restriction that bends winding, is not subjected to the circuit installing space, have more elasticity in the use, to promote whole practicality and convenience.
Another purpose of the present invention is, the board structure of a kind of LED is proposed, by a top substrate layer, a soft board (FPC), the Combination Design of laminar substrate and an insulation rubber once, the combination of this upper and lower substrate clamping soft board (FPC), make the volume of circuit board littler, can reduce the volume of light-emitting diode (LED) significantly, more applicable to luminous lamp strip, the miniaturization electronics product of different length demand ... the application that waits, to promote whole practicality and convenience.
A further object of the present invention is, the board structure of a kind of LED is proposed, by a top substrate layer, a soft board (FPC), the Combination Design of laminar substrate and an insulation rubber once, and the structure of clamping soft board (FPC) between this upper and lower substrate, go up the preferable resistivities of situation tool such as chance bends, pulls for using, and then promote whole practicality and convenience.
For reaching above-mentioned purpose, the invention provides a kind of board structure of light-emitting diode, comprising: a top substrate layer, the end face of this top substrate layer is provided with conductive pattern, to be formed with a land and a plurality of electrode district; One soft board, this soft board is incorporated into the below of this top substrate layer; Laminar substrate once, this lower floor's substrate is incorporated into the below of this soft board, and the bottom surface of this time laminar substrate is provided with the conducting wire; And an insulation rubber, this insulation rubber is coated the place, bottom surface of end face and this time laminar substrate of this top substrate layer; Thus, be substrate and the centre is the board structure of soft board to form upper and lower layer.
The present invention has following useful technique effect:
1. the present invention is by a top substrate layer, a soft board (FPC:Flexible Printed Circuit), the Combination Design of laminar substrate and an insulation rubber once, need not adopt surface adhering technology (SMT:Surface Mount Technology), and need not put glue and cross solder furnace solder bond substrate and soft board, can avoid making substrate and soft board to produce the problem of empty weldering, and then can improve the yield of element, reach the purpose that reduces cost of manufacture, to promote whole practicality and convenience.
2. the present invention is by a top substrate layer, a soft board (FPC), the Combination Design of laminar substrate and an insulation rubber once, the combination of this upper and lower substrate clamping soft board (FPC) has been avoided present soft board and the fragile problem of substrate solder bond place structure, and then can more be applicable to the restriction that bends winding, is not subjected to the circuit installing space, have more elasticity in the use, to promote whole practicality and convenience.
3. the present invention is by a top substrate layer, a soft board (FPC), the Combination Design of laminar substrate and an insulation rubber once, the combination of this upper and lower substrate clamping soft board (FPC), make the volume of circuit board littler, can reduce the volume of light-emitting diode (LED) significantly, more applicable to luminous lamp strip, the miniaturization electronics product of different length demand ... the application that waits, to promote whole practicality and convenience.
4. the present invention is by a top substrate layer, a soft board (FPC), the Combination Design of laminar substrate and an insulation rubber once, and the structure of clamping soft board (FPC) between this upper and lower substrate, go up the preferable resistivities of situation tool such as chance bends, pulls for using, and then promote whole practicality and convenience.
Other characteristics of the present invention and specific embodiment can further be understood in the detailed description of following conjunction with figs..
Description of drawings
Fig. 1 is the three-dimensional appearance schematic diagram of embodiments of the invention;
Fig. 2 is the three-dimensional element exploded view of embodiments of the invention;
Fig. 3 is the schematic top plan view of embodiments of the invention;
Fig. 4 is the elevational schematic view of embodiments of the invention;
Fig. 5 is the three-dimensional appearance schematic diagrames of embodiments of the invention in conjunction with a LED;
Fig. 6 is the three-dimensional appearance schematic diagram of prior art structure.
Symbol description among the figure
10 top substrate layer
11 conductive patterns, 111 lands
112 positive electrodes, 113 negative electrodes
20 soft boards
21 metallic circuit layers, 22 coat of metal
30 times laminar substrates
31 conducting wires, 32 polarity contacts
40 insulation rubbers
50 luminescence chips 51 link lead
A soft board B insulated substrate
C conductive pattern C1 land
C2 positive electrode region C3 negative electrode region
D insulation rubber E colloid
Embodiment
See also Fig. 1～4, the invention provides the board structure of a kind of light-emitting diode (LED), the board structure of this LED comprises:
One top substrate layer 10, this top substrate layer 10 is an insulated substrate, and can adopt circuit board (PCB:Printed Circuit Board), glass mat (FR-4), refractory glass fibre plate (FR5), ceramic substrate (Ceramic Substrate), metal clip koan brush wiring board (MCPCB:MetalCore PCB), direct copper bonded substrate (DBC:Direct Copper Bonded Substrate), the metallic composite substrate, aluminium base copper-clad plate, aluminium base ... that waits is wherein arbitrary, and the end face of this top substrate layer 10 is provided with conductive pattern 11, this conductive pattern 11 is that end face in this top substrate layer 10 is in conjunction with a conductive layer, and carve required conducting wire layout by etched technology, and this conductive pattern 11 is formed with a land 111 and a plurality of electrode districts (in present embodiment, these a plurality of electrode districts include the electrode district of a positive electrode 112 and two negative electrodes 113, this top substrate layer 10 can be directly as the usefulness that is welded of surface adhesion type (SMD:Surface-Mount Device) LED, can be further in conjunction with at least one luminescence chip (chip) on the land 111 of this top substrate layer 10; This top substrate layer 10 can be adopted upside-down mounting (Flip Chip) mode with the combination of luminescence chip, and luminescence chip directly is incorporated on this land 111, and the conducting wire layout by conductive pattern 11 for the electrode district electrically connect of positive electrode 112, two negative electrodes 113; Perhaps, when implementing, the combination of this top substrate layer 10 and luminescence chip can adopt the combination of routing (Wire Bonding) in addition, earlier luminescence chip directly is welded on the land 111 of this top substrate layer 10, relend and help the binding lead to electrically connect this luminescence chip and positive and negative electrode district 112,113, to form circuit turn-on; Wherein, this luminescence chip can be adopted surface adhesion type (SMD:Surface-Mount Device) LED.
One soft board 20, this soft board 20 is flexible printed wiring board (FPC:Flexible Printed Circuit), this soft board 20 is incorporated into the below of this top substrate layer 10, this soft board 20 can adopt pi (Polyimide) ... etc. the pliability material make, this soft board 20 is provided with the metallic circuit layer 21 and the coat of metal 22 with the one side that top substrate layer 10 mutually combines, and this metallic circuit layer 21 is the conducting wire layout, this metallic circuit layer 21 can be selected from aluminium, silver, copper, nickel, iron, cobalt, cadmium, the groups that platinum is formed etc. are wherein arbitrary, and the coat of metal 22 is distributed in and avoids this metallic circuit layer 21 places, the other one side of this soft board 20 then is provided with the coat of metal 22, and these coat of metal 22 optional free gold (Au), nickel (Ni), the cohorts that chromium (Cr) is formed etc. are wherein arbitrary.
Once laminar substrate 30, this time laminar substrate 30 is incorporated into the below of this soft board 20, and the bottom surface of this time laminar substrate 30 is provided with conducting wire 31, this time laminar substrate 30 is an insulated substrate, and can adopt circuit board (PCB:Printed Circuit Board), glass mat (FR-4), refractory glass fibre plate (FR5), ceramic substrate (Ceramic Substrate), metal clip koan brush wiring board (MCPCB:Metal Core PCB), direct copper bonded substrate (DBC:Direct CopperBonded Substrate), the metallic composite substrate, aluminium base copper-clad plate, aluminium base ... that waits is wherein arbitrary, perhaps this time laminar substrate 30 can adopt other low thermal resistance high thermal conductivity coefficient material or low thermal resistance high-resistance material, in addition, this time laminar substrate 30 can be further combined with Aluminium Radiator (figure does not show), for improving radiating effect.
One insulation rubber 40, this insulation rubber 40 is coated the place, bottom surface of end face and this time laminar substrate 30 of this top substrate layer 10, and this insulation rubber 40 can be PU (Polyurethane, the polyureas ester) insulation rubber or other insulating cement, and when these top substrate layer 10 coating insulation rubbers 40, this land 111 need not be coated with insulation rubber 40, for in conjunction with at least one luminescence chip 50 (as shown in Figure 5), and the electrode district of this positive electrode 112 and negative electrode 113 is positioned at the part of this land 111 and need be coated with insulation rubber 40, for electrically connecting with at least one luminescence chip 50, place, the bottom surface of this time laminar substrate 30 can be coated with the insulation rubber 40 of full wafer again, for covering conducting wire 31, maybe can be provided with the polarity contact 32 (please with ginseng Fig. 4) of several conduction usefulness and be not coated with insulation rubber 40.
Please consult Fig. 1～5 again, hold structure to form the board structure of LED of the present invention, characteristics of the present invention are by a top substrate layer 10, one soft board 20, the Combination Design of a laminar substrate 30 and an insulation rubber 40 once, and with this top substrate layer 10 and following this soft board 20 of laminar substrate 30 pressings, on forming, lower floor is a substrate (top substrate layer 10, following laminar substrate 30) and the centre is the board structure of soft board 20, the end face of this top substrate layer 10 is provided with conductive pattern 11, being formed with land 111 by this conductive pattern 11 is just reaching, the electrode district of negative electrode (being provided with the electrode district of a positive electrode 112 and two negative electrodes 113 in the present embodiment), so that the present invention is when reality is implemented, this top substrate layer 10 can be on land 111 further upside-down mounting (Flip Chip) in conjunction with at least one luminescence chip 50 (as shown in Figure 5), and by the circuit layout and the electrode district electrically connect of conductive pattern 11, or also can adopt the combination of routing (Wire Bonding) to implement, and earlier this at least one luminescence chip 50 is passed through to link the positive electrode 112 of lead 51 electrically connects to this top substrate layer 10, the electrode district of negative electrode 113 is incorporated on the land 111 of this top substrate layer 10 again; Again by this insulation rubber 40 being coated the end face of this top substrate layer 10 and avoiding this 111 places, land, for protection conductive pattern 11 and stop to make because of carelessness the design of conductive pattern 11 short circuits, and this insulation rubber 40 is also coated down on the conducting wire, bottom surface 31 of laminar substrate 30, for this conducting wire 31 of protection, moreover, this time laminar substrate 30 can further be provided with at least one polarity contact 32, and makes these insulation rubber 40 applying area avoid this at least one polarity contact 32, connects power supply for extending; In sum, the present invention forms three-decker with pressing, the former surface adhering technology (SMT) that need not adopt is welded a substrate and a soft board with a glue and mistake solder furnace, so can avoid producing between this substrate and the soft board problem of empty weldering, and then can improve the yield of element, reach the effect that reduces the cost of making, and on being somebody's turn to do, infrabasal plate 10, the combination of 30 clamping soft boards 20 has been avoided the fragile problem of existing soft board and substrate solder bond place structure, and then can more be applicable to the bending winding, be not subjected to the restriction of circuit installing space, have more elasticity in the use, and the combination of clamping also makes the volume of circuit board littler, and when being applied in conjunction with luminescence chip, also reduce the volume of light-emitting diode (LED) significantly, more be applicable to the luminous lamp strip of different length demand, miniaturization electronics product ... the application that waits, again, on being somebody's turn to do, the structure of clamping soft board (FPC) between the infrabasal plate, for using at product if meet with bending, the bending or pull ... etc. situation, structure than weldering substrate on the soft board of prior art has more excellent resistivity, and then can promote whole practicality and convenience.
Above-described specific embodiment, only release characteristics of the present invention and effect in order to example, but not in order to limit the category of implementing of the present invention, therefore do not breaking away under above-mentioned spirit of the present invention and the technology category, the disclosed content of any utilization and the equivalence finished changes and modify, the scope that all still should be claims contains.
Claims (11)
1. the board structure of a light-emitting diode is characterized in that,, comprising:
One top substrate layer, the end face of this top substrate layer is provided with conductive pattern, to be formed with a land and a plurality of electrode district;
One soft board, this soft board is incorporated into the below of this top substrate layer;
Laminar substrate once, this lower floor's substrate is incorporated into the below of this soft board, and the bottom surface of this time laminar substrate is provided with the conducting wire; And
One insulation rubber, this insulation rubber are coated the place, bottom surface of end face and this time laminar substrate of this top substrate layer;
Thus, be substrate and the centre is the board structure of soft board to form upper and lower layer.
2. the board structure of light-emitting diode as claimed in claim 1, wherein, this top substrate layer is an insulated substrate with following laminar substrate.
3. the board structure of light-emitting diode as claimed in claim 1 or 2, wherein, this top substrate layer and following laminar substrate adopt the wherein arbitrary of circuit board, glass mat, refractory glass fibre plate, ceramic substrate, metal clip koan brush wiring board, direct copper bonded substrate, aluminium base copper-clad plate, aluminium base, metallic composite substrate.
4. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein, this time laminar substrate adopts low thermal resistance high thermal conductivity coefficient material.
5. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein, this time laminar substrate is further combined with Aluminium Radiator.
6. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein, this insulation rubber is the PU insulation rubber.
7. the encapsulating structure of light-emitting diode as claimed in claim 1, wherein, this soft board adopts pliability material.
8. the board structure of light-emitting diode as claimed in claim 1, wherein, the one side that this soft board and top substrate layer mutually combine is provided with the metallic circuit layer, and this metallic circuit layer is the conducting wire layout, and the other one side of this soft board has the coat of metal.
9. the encapsulating structure of light-emitting diode as claimed in claim 8, wherein, this coat of metal is selected from the wherein arbitrary of the cohort be made up of gold, nickel, chromium.
10. the encapsulating structure of light-emitting diode as claimed in claim 8, wherein, this metallic circuit layer is selected from the wherein arbitrary of group that aluminium, silver, copper, nickel, iron, cobalt, cadmium, platinum forms.
11. the board structure of light-emitting diode as claimed in claim 1, wherein, further in conjunction with at least one luminescence chip, and a plurality of electrode districts of this at least one luminescence chip and top substrate layer electrically connect on the land of this top substrate layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100013472A CN101483210A (en) | 2008-01-09 | 2008-01-09 | Substrate construction for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100013472A CN101483210A (en) | 2008-01-09 | 2008-01-09 | Substrate construction for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101483210A true CN101483210A (en) | 2009-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100013472A Pending CN101483210A (en) | 2008-01-09 | 2008-01-09 | Substrate construction for LED |
Country Status (1)
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| CN (1) | CN101483210A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290504A (en) * | 2011-09-07 | 2011-12-21 | 惠州市西顿工业发展有限公司 | Chip-on-board (COB) packaged light-emitting diode (LED) module based on high-thermal-conductivity substrate flip-chip bonding technique and production method |
| CN105813391A (en) * | 2016-05-10 | 2016-07-27 | 浙江罗奇泰克电子有限公司 | Fabrication method of light emitting diode (LED) aluminum-based circuit board |
| CN107481988A (en) * | 2017-07-28 | 2017-12-15 | 永道无线射频标签(扬州)有限公司 | The crystal covered chip encapsulating products and its manufacture craft of a kind of unused conducting resinl |
| CN110880544A (en) * | 2018-09-06 | 2020-03-13 | 深圳市斯迈得半导体有限公司 | Chip for glass substrate and manufacturing method thereof |
-
2008
- 2008-01-09 CN CNA2008100013472A patent/CN101483210A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290504A (en) * | 2011-09-07 | 2011-12-21 | 惠州市西顿工业发展有限公司 | Chip-on-board (COB) packaged light-emitting diode (LED) module based on high-thermal-conductivity substrate flip-chip bonding technique and production method |
| CN102290504B (en) * | 2011-09-07 | 2014-04-16 | 惠州市西顿工业发展有限公司 | Chip-on-board (COB) packaged light-emitting diode (LED) module based on high-thermal-conductivity substrate flip-chip bonding technique and production method |
| CN105813391A (en) * | 2016-05-10 | 2016-07-27 | 浙江罗奇泰克电子有限公司 | Fabrication method of light emitting diode (LED) aluminum-based circuit board |
| CN105813391B (en) * | 2016-05-10 | 2017-04-26 | 浙江罗奇泰克电子有限公司 | Fabrication method of light emitting diode (LED) aluminum-based circuit board |
| CN107481988A (en) * | 2017-07-28 | 2017-12-15 | 永道无线射频标签(扬州)有限公司 | The crystal covered chip encapsulating products and its manufacture craft of a kind of unused conducting resinl |
| CN107481988B (en) * | 2017-07-28 | 2020-09-01 | 永道无线射频标签(扬州)有限公司 | Flip chip packaging product without conductive adhesive and manufacturing process thereof |
| CN110880544A (en) * | 2018-09-06 | 2020-03-13 | 深圳市斯迈得半导体有限公司 | Chip for glass substrate and manufacturing method thereof |
| CN110880544B (en) * | 2018-09-06 | 2021-09-03 | 深圳市斯迈得半导体有限公司 | Chip for glass substrate and manufacturing method thereof |
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