200931633 九、發明說明： 【發明所屬之技術領域】 - 本發明係有關於一種led之基板結構，尤指一種藉由一上層基板、 - 一軟板、一下層基板及一隔離膠之組合設計，而以該上、下基板壓合 中間之軟板所形成’不需採表面黏著技術（SMT : Surface Mount Technology)及過銲錫爐焊接，而可避免基板與軟板之間產生空焊問 題，使具提高元件良率，進而可降低製作成本之效果，而適用於結合 〇 發光晶片之基板結構者。 【先前技術】 按，發光二極體具有耗電量低、壽命長等優點，目前電子產品均 已普遍採用，而在科技曰新月異之下，電子產品外型已有朝向輕、薄、 短、小方向發展之趨勢。然，傳統之發光二極體結構，不論其承載基 座的體積多小，當透光層將各元件包覆結合成一體後，仍具有一定的 體積，已逐漸不符現代產品的需求。 〇 故’為因應產品外型越趨小型的趨勢，市面上已可見一種使用表 面黏著技術（SMT · Surface Mount Technology)將結合了發光晶片之 基板再結合於軟性印刷電路板（FPC : Flexible Printed Circuit，簡 稱軟板）上之結構，請參閱第6圖，主要係於一軟板A上設有一絕緣 基板B，而該絕緣基板B為印刷電路板(PC^PrintedCircuitB〇ard) 中的硬板，並於該絕緣基板B之頂面上設有導電圖案^，而該導電圖 案C形成有結合區C1 '正電極區C2及負電極區，該導電圖案 C避開該結合區c1、正電極區c 2及負電極區c 3處係塗佈有隔離 5 200931633 膠D ’而該結合區c1係供覆晶結合發光晶片。使用時，係將發光晶 片結合於該絕緣基板B頂面之結合區C1上，並以連結導線與導電圖 案C電性連結導通，再以膠體e將發光晶片覆蓋，即封裝完成。但， 上述結構仍需採表面黏著技術（SMT)，而需點膠再過銲錫爐焊接，以 使該絕緣基板B結合固定於該軟板A上’如此’容易使該絕緣基板b 與軟板A之間產生空焊的問題，而導致元件不良率的提高，進而也提 高了製作的成本。而當軟板A與絕緣基板B以焊接相互結合時，該絕 緣基板B仍會較佔據板面空間，讓單元體積的面積增加，並且在彎折 繞設使用時，讓該軟板A與絕緣基板B之結合處的結構較脆弱，而易 導致軟板A與絕緣基板B分離、造成電路接觸不良等問題。另外，上 述習知結構在用於發光燈條…等之應用時，常會有上、下彎曲與拉扯 的情形發生，而絕緣基板B焊接於軟板A上的結構抵抗彎折、拉扯的 能力較差。 本發明人有鑑於習知結構尚有可改善處，乃潛心研思、設計組製， 以提供消費大眾使用，為本發明所欲研創之創作動機者。 【發明内容】 本發明之主要目的，係在提供一種led之基板結構，藉由一上層 基板、一軟板（FPC : Flexible Printed Circuit)、一下層基板及一 隔離膠之組合設計，不需採表面黏著技術（SMT : Surface M〇unt Technology)，而不需點膠及過銲錫爐焊接結合基板與軟板，可避免使 基板與軟板產生空焊的問題’進而可提高猶之良率，達到降低製作 成本之目的，以增進整體的實用性及便利性者。 6 200931633 本發明之另一目的，係在提供一種LED之基板結構，藉由一上層 基板、一軟板（FPC)、一下層基板及一隔離膠之組合設計，該上、下 基板夹合軟板(FPC)的結合方式避免了目前之軟板與基板焊接結合處 結構較脆弱的問題，進而可更適用於彎折繞設、不受電路安裝空間的 限制，在使用上更具彈性，以提昇整體之實用性及便利性者。 本發明之又一目的，係在提供一種LED之基板結構，藉由一上層 基板、一軟板（FPC)、一下層基板及一隔離膠之組合設計，該上、下 基板夾合軟板（FPC)的結合方式，使電路板的體積更小，可大幅度縮 減發光二極體（LED)種積’更可_於不同長度需求之發光燈條、 小型化電子產品…等之應用，以增進整體之實用性及便利性者。 本發明之再一目的，係在提供一種LED之基板結構，藉由一上層 基板、一軟板（FPC)、一下層基板及一隔離膠之組合設計，而該上、 下基板之間夾合軟板（FPC)的結構，對於應用上遇彎折、拉扯等情形 具較佳的抵抗能力，進而提昇整體之實用性及便利性者。 為達成上述之目的，本發明係包括有一上層基板、一軟板（Fpc)、 一下層基板及一隔離膠。該上層基板之頂面係設有導電圖案，以形成 有一結合區與複數個電極區；該軟板（Fpc)係結合於該上層基板之下 方；該下層基板係結合於該軟板之下方，而該下層基板之底面係設有 導電線路；該隔離膠塗佈於該上層基板之頂面及該下層基板之底面 處；藉此，以形成上、下層為基板而中間為軟板之基板結構，使具實 用性及便利性者。 7 200931633 本發明之其他特點及具體實施例可於以下配合附圖之詳細說明 中，進一步瞭解。 【實施方式】 請參閱第1〜4圖，本發明係一種LE：D之基板結構，該LED之基 板結構係包括： 一上層基板1 〇 ,該上層基板1 〇係為絕緣基板，並可採電路板 - (PCB : Printed Circuit Board)、玻璃纖維板(FR-4)、耐高溫玻璃纖 〇 維板(FR5)、陶瓷基板（Ceramic Substrate)、金屬夾心印刷線路板 (MCPCB : Metal Core PCB)、直接銅接合基板（DBC : Direc1： c〇pper Bonded Substrate)、金屬複合材料基板、鋁基覆銅板、鋁基板…等之 其中任一，而該上層基板丄〇之頂面係設有導電圖案丄丄，該導電圖 案1 1係為於該上層基板i 〇之頂面結合一導電層，而於導電層上藉 蝕刻的技術刻出所需的導電線路佈局，且該導電圖案丄丄係形成有一 結合區1 1 1與複數個電極區（於本實施例中，該複數個電極區係包 Ο 含有—正電極112與二負電極113之電極區，而該上層基板1〇 係可直接作為表面黏著型（SMD : Surface_M〇unt Device) LED之焊裝 用’可於該上層基板1Q之結合區111上進-步結合至少-發光晶 片（chip);該上層基板工〇與發光晶片的結合方式係可採覆晶⑺^ chip)方式，而將發光晶片直接結合機結合區1 1 1上，並藉由導 電圖案11之導電線路佈局以供與正電極i i 2、二負電極丄i 3之 電極區電性連結；或者，於實施時，該上層基板10與發光晶片的結 。方式另可採打線（Wire Bonding)之結合方式，先將發光晶片直接 8 200931633 焊於該上層基板1〇之結合區1 1 1上，再藉連結導線電性連接該發 光晶片與正、負電極區112、113，以形成電路導通；其中，該 • 發光晶片係可採表面黏著型（SMD : Surface-Mount Device) LED者。 一軟板2 0，該軟板2 0係為軟性印刷電路板（FPC : Flexible Printed Circuit) ’該軟板2 0係結合於該上層基板1 〇之 下方’而該軟板2 0係可採聚亞醯胺(Polyimide)…等可撓性材料製 成’該軟板2 0與上層基板1〇相互結合之一面係設有金屬線路層2 Ο 1與金屬鍵層2 2，而該金屬線路層21係為導電線路佈局，該金屬 線路層21係可選自銘、銀、銅、錄、鐵、銘、鑛、銘所組成的群組 等其中任一者’而該金屬鍍層2 2係分布於避開該金屬線路層21 處，又該軟板2 0之另外一面則設有金屬鑛層2 2，而該金屬鍍層2 2係可選自由金(Au)、鎳(Ni)、鉻(Cr)所組成之組群等其中任一者。 一下層基板3 0，該下層基板3 0係結合於該軟板2 0之下方， 而該下層基板3 0之底面係設有導電線路31，該下層基板3 〇係為 〇 絕緣基板’並可採電路板(PCB : Printed Circuit Board)、玻璃纖維 板(FR-4)、耐高溫玻璃纖維板(FR5)、陶瓷基板（Ceramic Substrate)、 金屬夾心印刷線路板（MCPCB: Metal Core PCB)、直接銅接合基板（DBC : Direct Copper Bonded Substrate )、金屬複合材料基板、銘基覆銅板、 鋁基板…等之其中任一，或者該下層基板3 〇係可採其他之低熱阻高 導熱係數材料或低熱阻高電阻材料，另外，該下層基板3 〇係可進一 步結合鋁製散熱器（圖未示），以供提高散熱效果者。 9 200931633 一隔離膠4〇，該隔離膠40塗佈於該上層基板10之頂面及該 下層基板3 0之底面處，而該隔離膠4 0係可為PU (Polyurethane， 聚脲酯）隔離膠或其他絕緣膠，而於該上層基板i 〇塗佈隔離膠4〇 時’該結合區1 11不需塗佈隔離膠40，以供結合至少一發光晶片， 而該正電極1 1 2與負電極1 1 3之電極區位；賊結合區丄工丄内之 部刀不需塗佈隔離膠4〇，以供與至少一發光晶片電性連接，又該下 層基板3 0之底面處係可塗佈整片之隔離膠4〇，以供覆蓋導電線路 31，或可設有數個導電用之極性接點32(請同參第4圖）而不塗 佈隔離膠4 〇。 請再參閱第1〜5圖’承上結構以形成本發明的LE：D之基板結構， 本發明的特點係在於藉由一上層基板1 〇、一軟板2 〇、一下層基板 3 0及一隔離膠4 〇之組合設計，而以該上層基板丄〇與下層基板3 0壓合該軟板2〇，以形成上、下層為基板（上層基板i 〇、下層基 板3 0)而中間為軟板2 〇之基板結構，該上層基板1〇之頂面設有 導電圖案11，而藉由該導電圖案i i形成有結合區工i i及正、負 電極之電極區（本實施例中係設有一正電極112與二負電極113 之電極區）’俾使本發赚實際實鱗，該上層基板i Q可於結合區丄 1 1上進一步覆晶（Flip Chip)結合至少一發光晶片5 〇 (如第5圖所 示），並藉導電圖案1 1之電路佈局與電極區電性連結，或亦可採打線 (Wire Bonding)之結合方式實施，而先將該至少一發光晶片5 〇透 過連結導線51電性連結至該上層基板1〇之正電極1 12、負電極 200931633 113之電極區，再結合於該上層基板1〇之結合區111上；再藉 由將該隔離膠4 0塗佈於該上層基板10之頂面且避開該結合區11 1處，以供保護導電圖案11及杜絕不小心令導電圖案11短路的設 計，且該隔離膠4 0亦塗佈於下層基板3 0之底面導電線路31上， 以供保護該導電線路31，再者，該下層基板3 0係可進一步設有至 少一個極性接點3 2 ’且使該隔離膠4 0塗佈區避開該至少一個極性 接點3 2，以供延伸連接電源；綜上所述，本發明係以壓合形成三層 © 結構，故不需採表面黏著技術（SMT)以點膠及過銲錫爐焊接一基板與 一軟板，故可避免該基板與軟板之間產生空焊的問題，進而可提高元 件之良率，達到降低製作的成本之效果，而該上、下基板1〇、3 〇 夾合軟板（FPC) 2 0的結合方式避免了習用之軟板與基板焊接結合處 結構較脆弱的問題，進而可更適用於彎折繞設、不受電路安裝空間的 限制，在使用上更具彈性’且夾合的結合方式並使電路板的體積更小， _用於結合發光晶片時，亦大幅度縮減發光二極體（LED)的體積， 〇 心刺於不同長度絲之發紐條、小型化電子產品..·等之應用， 又，該上、下基板1 〇、3 〇之間失合軟板（Fpc) 2 〇的結構，對於 在產品應用上若遭逢料、雜絲扯"等_，較胃知的軟板上痒 基板的結構更具絕佳馳抗能力，進而可增進整體之實祕及便利性 者。 ，综上所述’本發明確可達到創作之預期目的，具有實用價值無疑， 爰依法提出專利申請。 200931633200931633 IX. Description of the invention: [Technical field of the invention] - The invention relates to a substrate structure of a LED, in particular to a combination design of an upper substrate, a soft board, a lower substrate and a spacer. The upper and lower substrates are pressed into the middle of the soft board to form a 'SMT: Surface Mount Technology' and a soldering furnace to avoid the problem of air soldering between the substrate and the soft board. The utility model has the advantages of improving the component yield and further reducing the manufacturing cost, and is suitable for the substrate structure combined with the illuminating wafer. [Prior Art] According to the light-emitting diode, it has the advantages of low power consumption and long life. At present, electronic products have been widely used, and under the rapid development of electronic technology, the appearance of electronic products has been light and thin. The trend of short and small development. However, the conventional light-emitting diode structure, no matter how small the bearing base is, is still in a certain volume when the light-transmitting layer is combined and integrated into various components, and has gradually become inconsistent with the requirements of modern products. In order to respond to the trend of smaller products, a surface-bonding technology (SMT · Surface Mount Technology) has been used to re-bond substrates bonded with light-emitting chips to flexible printed circuit boards (FPC: Flexible Printed Circuit). Referring to FIG. 6 , the main structure is that an insulating substrate B is disposed on a flexible board A, and the insulating substrate B is a hard board in a printed circuit board (PC^PrintedCircuitB〇ard). And a conductive pattern is disposed on the top surface of the insulating substrate B, and the conductive pattern C is formed with a bonding region C1 'the positive electrode region C2 and the negative electrode region, the conductive pattern C avoiding the bonding region c1 and the positive electrode region The c 2 and negative electrode regions c 3 are coated with an isolation 5 200931633 glue D ' and the bonding region c1 is used for the flip chip bonding of the light-emitting wafer. In use, the light-emitting wafer is bonded to the bonding area C1 of the top surface of the insulating substrate B, and electrically connected to the conductive pattern C by the connecting wires, and then the light-emitting wafer is covered by the gel e, that is, the packaging is completed. However, the above structure still needs to adopt surface adhesion technology (SMT), and needs to be glued and soldered to the soldering furnace so that the insulating substrate B is bonded and fixed on the flexible board A. Thus, the insulating substrate b and the soft board are easily The problem of void welding occurs between A, which leads to an increase in component defect rate, which in turn increases the cost of fabrication. When the flexible board A and the insulating substrate B are combined with each other by soldering, the insulating substrate B still occupies more space on the board surface, so that the area of the unit volume increases, and the flexible board A and the insulation are insulated when the bending is used. The structure of the junction of the substrate B is relatively fragile, which easily causes problems such as separation of the flexible board A from the insulating substrate B, resulting in poor circuit contact. In addition, when the above-mentioned conventional structure is used for an application of a light bar or the like, there are often cases where the upper and lower bends and pulls occur, and the structure in which the insulating substrate B is welded to the flexible board A is less resistant to bending and pulling. . The present inventors have made improvements in the conventional structure, and have devoted themselves to research and design to provide the consumer with the use of the invention. SUMMARY OF THE INVENTION The main object of the present invention is to provide a LED substrate structure, which is designed by a combination of an upper substrate, a flexible printed circuit (FPC), a lower substrate, and a spacer. Surface Mount Technology (SMT: Surface M〇unt Technology), without the need for dispensing and soldering furnaces to bond the substrate to the soft board, avoiding the problem of empty soldering between the substrate and the soft board, which in turn improves the yield. To achieve the purpose of reducing production costs, in order to improve the overall practicality and convenience. 6 200931633 Another object of the present invention is to provide a substrate structure of an LED, which is designed by a combination of an upper substrate, a soft board (FPC), a lower substrate and a spacer, and the upper and lower substrates are softly bonded. The combination of the board (FPC) avoids the problem that the current soft board and the substrate are welded at a weak joint structure, and is more suitable for bending and winding, is not limited by the installation space of the circuit, and is more flexible in use. Improve the overall practicality and convenience. Another object of the present invention is to provide a substrate structure of an LED, which is designed by a combination of an upper substrate, a soft board (FPC), a lower substrate and a spacer, and the upper and lower substrates are sandwiched by a soft board ( The combination of FPC) makes the board smaller, and can greatly reduce the number of light-emitting diodes (LEDs), and can be applied to different lengths of light strips, miniaturized electronic products, etc. Improve the practicality and convenience of the whole. A further object of the present invention is to provide a substrate structure of an LED, which is designed by a combination of an upper substrate, a soft board (FPC), a lower substrate and a spacer, and the upper and lower substrates are sandwiched. The structure of the soft board (FPC) is better for the application in the case of bending, pulling, etc., thereby improving the overall practicability and convenience. To achieve the above object, the present invention includes an upper substrate, a flexible board (Fpc), a lower substrate, and a spacer. The top surface of the upper substrate is provided with a conductive pattern to form a bonding region and a plurality of electrode regions; the soft board (Fpc) is bonded under the upper substrate; the lower substrate is bonded under the soft board. The bottom surface of the lower substrate is provided with a conductive line; the spacer is applied on the top surface of the upper substrate and the bottom surface of the lower substrate; thereby forming a substrate structure in which the upper and lower layers are substrates and the middle is a soft board To make it practical and convenient. 7 200931633 Other features and embodiments of the present invention will be further understood from the following detailed description in conjunction with the drawings. [Embodiment] Referring to Figures 1 to 4, the present invention is a substrate structure of LE: D. The substrate structure of the LED includes: an upper substrate 1 〇, the upper substrate 1 is an insulating substrate, and can be used. Circuit board - (PCB: Printed Circuit Board), fiberglass board (FR-4), high temperature glass fiber reinforced plastic sheet (FR5), ceramic substrate (Ceramic Substrate), metal sandwich printed circuit board (MCPCB: Metal Core PCB), a direct copper bonded substrate (DBC: Direc1: c〇pper Bonded Substrate), a metal composite substrate, an aluminum-based copper clad laminate, an aluminum substrate, etc., and a top surface of the upper substrate is provided with a conductive pattern 丄The conductive pattern 11 is formed by bonding a conductive layer on the top surface of the upper substrate i, and etching the conductive layer on the conductive layer to form a desired conductive line layout, and the conductive pattern is formed with a conductive layer. The bonding region 11 1 and the plurality of electrode regions (in the embodiment, the plurality of electrode regions include an electrode region of the positive electrode 112 and the second negative electrode 113, and the upper substrate 1 can be directly used as a surface Adhesive type (SMD : Su rface_M〇unt Device) The soldering of the LED can be combined with at least a light-emitting chip on the bonding region 111 of the upper substrate 1Q; the bonding method of the upper substrate substrate and the light-emitting chip is a removable crystal (7) ^ chip), the light-emitting wafer is directly bonded to the machine bonding region 11 1 , and is arranged by the conductive line of the conductive pattern 11 for electrically connecting with the electrode regions of the positive electrode ii 2 and the second negative electrode 丄i 3 Or, when implemented, the junction of the upper substrate 10 and the light-emitting wafer. The method further adopts a combination of wire bonding (Wire Bonding), first soldering the light-emitting wafer directly to the bonding area 1 1 1 of the upper substrate 1 , and then electrically connecting the light-emitting chip and the positive and negative electrodes by connecting wires. The regions 112, 113 are formed to form a circuit; wherein the luminescent wafer is a surface-mountable (SMD: Surface-Mount Device) LED. a flexible board 20, the flexible board 20 is a flexible printed circuit board (FPC: Flexible Printed Circuit) 'The flexible board 20 is coupled to the lower layer 1 of the upper substrate 1' and the flexible board 20 is available a flexible material made of polyimide or the like. The soft board 20 and the upper substrate 1 are bonded to each other with a metal wiring layer 2 Ο 1 and a metal bonding layer 2 2, and the metal wiring is provided. The layer 21 is a conductive circuit layout, and the metal circuit layer 21 can be selected from any one of the group consisting of Ming, Silver, Copper, Record, Iron, Ming, Mine, and Ming, and the metal plating layer 2 It is distributed away from the metal circuit layer 21, and the other side of the soft board 20 is provided with a metal ore layer 22, and the metal plating layer 2 is optional free of gold (Au), nickel (Ni), chromium. Any of the group consisting of (Cr) and the like. The lower substrate 30 is bonded to the lower surface of the flexible substrate 20, and the bottom surface of the lower substrate 30 is provided with a conductive line 31, and the lower substrate 3 is made of a germanium insulating substrate. PCB (Printed Circuit Board), fiberglass board (FR-4), high temperature resistant fiberglass board (FR5), ceramic substrate (Ceramic Substrate), metal sandwich printed circuit board (MCPCB: Metal Core PCB), direct copper bonding Any one of the substrate (DBC: Direct Copper Bonded Substrate), the metal composite substrate, the inscription copper clad laminate, the aluminum substrate, or the like, or the lower substrate 3 can be made of other low thermal resistance high thermal conductivity material or high thermal resistance The resistor material, in addition, the lower substrate 3 can be further combined with an aluminum heat sink (not shown) for improved heat dissipation. 9 200931633 A separator 4 is applied to the top surface of the upper substrate 10 and the bottom surface of the lower substrate 30, and the spacer 40 is a PU (Polyurethane) isolation. a glue or other insulating glue, and when the upper substrate i is coated with the release adhesive 4', the bonding region 1 11 does not need to be coated with the spacer 40 for bonding at least one light-emitting chip, and the positive electrode 1 1 2 The electrode position of the negative electrode 1 1 3; the knife in the thief bonding area is not required to be coated with a spacer 4 for electrically connecting with at least one light-emitting chip, and the bottom surface of the lower substrate 30 is The entire piece of the release adhesive is coated 4 to cover the conductive line 31, or a plurality of conductive contacts 32 (see FIG. 4) may be provided without applying the spacer 4 . Please refer to FIGS. 1 to 5 for the structure of the LE:D substrate of the present invention. The present invention is characterized in that an upper substrate 1 一, a soft board 2 〇, a lower substrate 30 and a combination of a separator 4 is used, and the upper substrate 丄〇 and the lower substrate 30 are pressed together to form the upper and lower layers as a substrate (upper substrate i 〇, lower substrate 30) with a substrate structure of the flexible substrate 2, wherein a top surface of the upper substrate 1 is provided with a conductive pattern 11, and an electrode region of the bonding region ii and the positive and negative electrodes is formed by the conductive pattern ii (in this embodiment The electrode region of the positive electrode 112 and the second negative electrode 113 is used to make the actual scale, and the upper substrate i Q can be further flip-chip bonded to the at least one light-emitting chip 5 on the bonding region 11. (As shown in FIG. 5), and the circuit layout of the conductive pattern 1 1 is electrically connected to the electrode region, or may be implemented by a combination of wire bonding, and the at least one light-emitting chip 5 is first transmitted through The connecting wire 51 is electrically connected to the positive electrode 1 of the upper substrate 1 、, negative The electrode region of the pole 200931633 113 is further bonded to the bonding region 111 of the upper substrate 1; and the spacer 40 is applied to the top surface of the upper substrate 10 and avoids the bonding region 11 1 . For protecting the conductive pattern 11 and eliminating the design of short-circuiting the conductive pattern 11 inadvertently, the spacer 40 is also applied to the bottom conductive line 31 of the lower substrate 30 for protecting the conductive line 31. The lower substrate 30 may further be provided with at least one polarity contact 3 2 ′ and the coating 40 coating area is avoided by the at least one polarity contact 3 2 for extending the connection power source; The invention forms a three-layer structure by pressing, so that it is not necessary to adopt surface adhesion technology (SMT) to solder a substrate and a soft board by dispensing and over-welding furnace, thereby avoiding the occurrence of air welding between the substrate and the soft board. The problem can further improve the yield of the component and achieve the effect of reducing the cost of manufacturing. The combination of the upper and lower substrates 1 〇, 3 〇 sandwich soft board (FPC) 20 avoids the conventional soft board and substrate. The problem of weaker structure of the welded joint is more suitable for Folding, not limited by the installation space of the circuit, more flexible in use and the combination of clamping and making the board smaller, _ used to combine the light-emitting chip, also greatly reduce the light-emitting diode (LED) volume, 刺 刺 不同 不同 不同 不同 不同 不同 、 、 、 、 、 、 、 、 、 、 、 、 不同 不同 不同 不同 不同 不同 不同 不同 不同 不同 不同 不同 不同 不同 不同 不同 LED LED LED LED LED LED LED LED LED LED LED LED LED LED 2 The structure of the crucible is more excellent for the structure of the itch substrate on the soft board of the stomach, if it is affected by the product, the filth, etc., which can enhance the overall reality and convenience. Sex. In summary, the invention can indeed achieve the intended purpose of creation, and has practical value, and 提出 file a patent application according to law. 200931633
惟以上所述之具體實施例，僅係用以例釋本發明之特點及功效， 而非用以限定本發明之可實施範疇，因此在未脫離本發明上揭之精神 與技術範疇下，任何運用本發明所揭示内容而完成之等效改變及修 飾，均仍應為下述之申請專利範圍所涵蓋。 12 200931633 【圖式簡單說明】 第1圖係為本發明之實施例的立體外觀示意圖。 第2圖係為本發明之實施例的立體元件分解圖。 第3圖係為本發明之實施例的俯視示意圖。 第4圖係為本發明之實施例的仰視示意圖。 第5圖係為本發明之實施例結合一 LED之立體外觀示意圖。 第6圖係為習知結構之立體外觀示意圖。However, the specific embodiments described above are merely used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and thus, without departing from the spirit and scope of the present invention, Equivalent changes and modifications made by the disclosure of the present invention should still be covered by the scope of the following claims. 12 200931633 [Simplified description of the drawings] Fig. 1 is a perspective view showing a stereoscopic appearance of an embodiment of the present invention. Fig. 2 is an exploded perspective view of a three-dimensional element of an embodiment of the present invention. Figure 3 is a top plan view of an embodiment of the present invention. Figure 4 is a bottom plan view of an embodiment of the present invention. Fig. 5 is a perspective view showing the stereoscopic appearance of an LED in combination with an embodiment of the present invention. Figure 6 is a schematic perspective view of a conventional structure.
【主要元件符號說明】 10、上層基板 1 1 1、結合區 1 1 3、負電極 2 2、金屬鍍層 3 2、極性接點 51、連結導線 B、絕緣基板 C1、結合區 C 3、負電極區 E、膠體 1 1、導電圖案 1 12、正電極 2 0、軟板 2 1、金屬線路層 3 0、下層基板 31、導電線路 4 0、隔離膠 5 0、發光晶片 A、軟板 C、 導電圖案 C 2、正電極.區 D、 隔離膠 13[Description of main component symbols] 10. Upper substrate 1 1 1 , bonding region 1 1 3, negative electrode 2 2, metal plating layer 3, polarity contact 51, connecting wire B, insulating substrate C1, bonding region C 3, negative electrode Area E, colloid 1 1 , conductive pattern 1 12, positive electrode 20, soft board 2 1 , metal wiring layer 30, lower substrate 31, conductive line 40, spacer 50, light emitting chip A, soft board C, Conductive pattern C 2, positive electrode, area D, insulating glue 13