CN202514157U - Environmental-friendly LED (Light Emitting Diode) flexible strip circuit board structure - Google Patents
Environmental-friendly LED (Light Emitting Diode) flexible strip circuit board structure Download PDFInfo
- Publication number
- CN202514157U CN202514157U CN2012201221987U CN201220122198U CN202514157U CN 202514157 U CN202514157 U CN 202514157U CN 2012201221987 U CN2012201221987 U CN 2012201221987U CN 201220122198 U CN201220122198 U CN 201220122198U CN 202514157 U CN202514157 U CN 202514157U
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- white
- circuit board
- board structure
- lamp bar
- led
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Abstract
The utility model provides an environmental-friendly LED (Light Emitting Diode) flexible strip circuit board structure which comprises a base plate, wherein a conductive hole is arranged in the base plate; the base plate is formed by clamping an insulating adhering layer between an upper copper foil layer and a lower copper foil layer; and flexible conducive adhesive is filled in the conductive hole of the base; and white solder mask ink layers are coated on the upper surface and the lower surface of the base plate, except for the position preset for a bonding pad hole and copper positions. According to the environmental-friendly LED flexible strip circuit board structure, the flexible conductive adhesive is filled in the conductive hole; electroplating is not needed during manufacturing an LED flexible strip circuit board, so that the environment-friendly technology is achieved, and the cost is saved; and the white solder mask ink layers are printed through a silk-screen printing technology, so that the process of drilling holes required by the conventional white covering mask is omitted, and the cost is also saved.
Description
Technical field
The utility model relates to LED lamp bar wiring board, and the LED lamp bar wiring board to the environmental protection of the heavy copper of thru-hole electroplating need not holed, do not needed to the resistance weldering insulating barrier that particularly encapsulation shields to wiring board.
Background technology
In recent years, the soft lamp bar of LED in conjunction with FPC (FPC) technology had promoted developing rapidly of LED Lighting Industry greatly.Because the restriction of LED lamp efficiency, the soft lamp bar of LED mostly uses the higher white solder masks of reflectivity, and this white solder masks mainly contains two kinds; The one, silk-screen white resistance solder paste China ink on the plate of direct-on-line road; But the resistance of white in the market solder paste China ink hardness is higher, and stiffness is relatively poor, at high temperature is prone to xanthochromia simultaneously; Cause qualification rate relatively poor, influence the useful life of the soft lamp bar of LED; The 2nd, the white covered film structure of being set forth like patent CN201563288U; Its insulating barrier adopts polyimide film or polyester film; On flexility, obtain very big improvement, but the shortcoming of white resistance solder paste China ink is not resolved, this patent adopts four-layer structure in addition; And the operation that also need hole, it is also expensive to constitute cost.
The soft lamp bar of LED wiring board because some position needs via, just must be electroplated heavy copper in traditional operation in manufacture process, so neither environmental protection is with high costs again.
The utility model content
The purpose of the utility model provides that a kind of pliability is good, resistance weldering excellent performance, make the soft lamp bar of simple environmental protection LED circuit board structure.
This novel purpose is achieved in that the soft lamp bar of a kind of environmental protection LED circuit board structure, comprises that via is arranged on the substrate, and substrate is clipped between copper foil layer and the following copper foil layer by the insulation adhesive layer to be formed; Be filled with the compliant conductive adhesive in the via of said substrate; The upper and lower surface of said substrate is coated with white resistance weldering ink lay except that the pad hole of reserving with staying the copper position.
Above-mentioned via is the via of band burr.
Above-mentioned white resistance weldering ink lay is a white polyester acid imide ink lay, white polyester ink lay, white epoxy ink lay or white acrylic acid ester ink lay.
Compared with prior art; This novel beneficial effect is: the soft lamp bar of LED of the soft lamp bar of this environmental protection LED circuit board structure mainly comprise have whiteness high and stablize, pliability is good, the white solder mask of the soft lamp bar of the LED wiring board of resistance weldering performance and insulation protection excellent performance, need not the soft lamp bar of the LED wiring board substrate of electroplating technology.The soft lamp bar of the LED wiring board via of band burr, and the compliant conductive adhesive of filling via.The soft lamp bar of the LED of this structure need not be electroplated when processing the soft lamp bar of LED wiring board because adopt the compliant conductive adhesive to fill via, has accomplished the technology environmental protection, provides cost savings; White in addition solder mask adopts the silk screen printing process printing, has saved the operation that traditional white coverlay need be holed, and equally also provides cost savings.Like this can not need use white coverlay, can simplify technology, thoroughly improve the soft lamp bar of LED making technology shortcoming loaded down with trivial details, with high costs.
The soft lamp bar of this new LED circuit board structure more can be to the making and the application of the soft lamp bar of LED, and have whiteness high and stablize, pliability is good, resistance weldering excellent performance, with low cost, processing procedure simply, advantages such as environmental protection.
Description of drawings
Fig. 1 is this novel cross-section structure (layer structure is shown).
Fig. 2 is the vertical view (and two vias are shown) of Fig. 1.
Fig. 3 is the cross-section structure (layer structure is shown) of the soft lamp bar of traditional LED wiring board.
Fig. 4 is the vertical view (and two vias are shown) of Fig. 3.
Embodiment
Fig. 1, Fig. 2 illustrate the soft lamp bar of this environmental protection LED circuit board structure, and two via 6-1,6-2 are arranged on the substrate, and substrate is clipped between copper foil layer 2-1 and the following copper foil layer 2-3 by insulation adhesive layer 2-2 to be formed; Be filled with compliant conductive adhesive 3-1,3-2 in two via 6-1 of substrate, the 6-2; The upper and lower surface of substrate is coated with white resistance weldering ink lay 1 except that the pad hole of reserving 5 with staying the copper position 4.The copper position is all stayed on the upper and lower surface of substrate, and this stays the copper position with upper and lower being symmetrical set of via.Middle part, the upper and lower surface of substrate is provided with pad hole 5.Two vias are for being with the via of burr.
White resistance weldering ink lay be by whiteness high and stablize, pliability is good, the white resistance solder paste China ink of resistance weldering performance and insulation protection excellent performance through silk screen printing at the soft lamp bar of LED wiring board substrate upper and lower faces, with the pad hole with need stay the reservation of copper position.
The material of white resistance weldering ink lay is any one or two kinds and the above mixture in white polyimide ink, white polyester acid imide printing ink, white polyester printing ink, white epoxy printing ink, the white acrylic acid ester printing ink; Through silk screen printing on the soft lamp bar of LED wiring board substrate two sides, with the pad hole with need stay the copper position to reserve, form through light, hot curing.
The soft lamp bar of LED wiring board substrate is: the FPC wiring board substrate of the single or double that 2L-FCCL that requires applicable to the soft lamp bar of LED or 3L-FCCL process; Wherein need the position boring of via to adopt prismatic or thorn shape grinding tool; Make the hole that certain burr arranged, compliant conductive adhesive that helps like this filling and Copper Foil are bonding closely.
Be used for filling the compliant conductive adhesive of via: the compliant conductive adhesive that any one in the silver slurry of any one of polyimides adhesive, polyesterimide adhesive, polyester adhesive, epoxy adhesive, acrylate adhesive, polyurethane adhesive, acrylamide adhesive or two kinds and above mixture and conduction, carbon oar, copper slurry, gold paste, the tin slurry or two kinds and above mixture are formed.
Fig. 3, Fig. 4 illustrate the existing soft lamp bar of LED circuit board structure.Among Fig. 3, Fig. 4,1-1: white solder masks; 1-2: insulating barrier; 1-3: adhesive layer; 2-1: copper foil layer; 2-2: insulation adhesive layer; 2-3: copper foil layer; 4: stay the copper position; 5: the pad hole; 6-1,6-2: two vias; 7: plated conductive copper layer.
Claims (3)
1. the soft lamp bar of an environmental protection LED circuit board structure comprises that via (6-1) is arranged on the substrate, and substrate is clipped between copper foil layer (2-1) and the following copper foil layer (2-3) by insulation adhesive layer (2-2) to be formed; It is characterized in that, be filled with compliant conductive adhesive (3-1) in the via of said substrate (6-1); The upper and lower surface of said substrate is coated with white and hinders and weld ink lay (1) with staying except that the pad hole of reserving (5) the copper position (4).
2. the soft lamp bar of a kind of environmental protection LED according to claim 1 circuit board structure is characterized in that, said via is the via of band burr.
3. the soft lamp bar of a kind of environmental protection LED according to claim 1 and 2 circuit board structure is characterized in that, said white resistance weldering ink lay is a white polyester acid imide ink lay, white polyester ink lay, white epoxy ink lay or white acrylic acid ester ink lay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201221987U CN202514157U (en) | 2012-03-28 | 2012-03-28 | Environmental-friendly LED (Light Emitting Diode) flexible strip circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201221987U CN202514157U (en) | 2012-03-28 | 2012-03-28 | Environmental-friendly LED (Light Emitting Diode) flexible strip circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202514157U true CN202514157U (en) | 2012-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201221987U Expired - Lifetime CN202514157U (en) | 2012-03-28 | 2012-03-28 | Environmental-friendly LED (Light Emitting Diode) flexible strip circuit board structure |
Country Status (1)
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| CN (1) | CN202514157U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103249257A (en) * | 2013-04-19 | 2013-08-14 | 统赢软性电路(珠海)有限公司 | Solder resist method for circuit board |
| CN103697359A (en) * | 2013-12-20 | 2014-04-02 | 台龙电子（昆山）有限公司 | Reinforcing structure for adsorption force of bonding pad of wire connecting terminal of LED (Light Emitting Diode) light bar |
| CN103826389A (en) * | 2014-03-21 | 2014-05-28 | 广州市竟国电子有限公司 | Environment-friendly LED (Light Emitting Diode) circuit board |
| CN104900768A (en) * | 2015-04-14 | 2015-09-09 | 芜湖九瓷电子科技有限公司 | Preparation method for alumina ceramic substrate for LED |
| CN105555023A (en) * | 2016-02-03 | 2016-05-04 | 武汉华尚绿能科技股份有限公司 | High-conductivity transparent glass-based circuit board |
-
2012
- 2012-03-28 CN CN2012201221987U patent/CN202514157U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103249257A (en) * | 2013-04-19 | 2013-08-14 | 统赢软性电路(珠海)有限公司 | Solder resist method for circuit board |
| CN103249257B (en) * | 2013-04-19 | 2016-02-10 | 统赢软性电路(珠海)有限公司 | The welding resistance method of wiring board |
| CN103697359A (en) * | 2013-12-20 | 2014-04-02 | 台龙电子（昆山）有限公司 | Reinforcing structure for adsorption force of bonding pad of wire connecting terminal of LED (Light Emitting Diode) light bar |
| CN103826389A (en) * | 2014-03-21 | 2014-05-28 | 广州市竟国电子有限公司 | Environment-friendly LED (Light Emitting Diode) circuit board |
| CN103826389B (en) * | 2014-03-21 | 2017-10-10 | 广州市竟国电子有限公司 | Environment-friendly type LED wiring board |
| CN104900768A (en) * | 2015-04-14 | 2015-09-09 | 芜湖九瓷电子科技有限公司 | Preparation method for alumina ceramic substrate for LED |
| CN105555023A (en) * | 2016-02-03 | 2016-05-04 | 武汉华尚绿能科技股份有限公司 | High-conductivity transparent glass-based circuit board |
| CN105555023B (en) * | 2016-02-03 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | High conducting clear glass base circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 5 high tech Zone Gaopeng road in Chengdu city of Sichuan Province in 610041 Patentee after: Chengdu Changji new material Limited by Share Ltd Address before: No. 5 high tech Zone Gaopeng road in Chengdu city of Sichuan Province in 610041 Patentee before: Chengdu Do-itc New Material Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121031 |