CN201636683U - Novel advertising lamp structure - Google Patents

Novel advertising lamp structure Download PDF

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Publication number
CN201636683U
CN201636683U CN2010201067561U CN201020106756U CN201636683U CN 201636683 U CN201636683 U CN 201636683U CN 2010201067561 U CN2010201067561 U CN 2010201067561U CN 201020106756 U CN201020106756 U CN 201020106756U CN 201636683 U CN201636683 U CN 201636683U
Authority
CN
China
Prior art keywords
printed circuit
circuit board
led chip
pcb
iron plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010201067561U
Other languages
Chinese (zh)
Inventor
何文铭
唐春生
唐秋熙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujian Wanban optoelectronic Technology Co., Ltd.
Original Assignee
FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd filed Critical FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
Priority to CN2010201067561U priority Critical patent/CN201636683U/en
Application granted granted Critical
Publication of CN201636683U publication Critical patent/CN201636683U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a novel advertising lamp structure, which comprises a plurality of LED chips, a plurality of iron sheets, a plurality of epoxide resins, a plurality of aluminium wires and a printed circuit board, wherein the LED chips are connected in series by the printed circuit board; the iron sheets are correspondingly arranged on the bottom parts of the LED chips to be used as cup bases; the epoxide resins are correspondingly arranged on the peripheries and the upper parts of the LED chips; and the aluminium wires are connected between the LED chips and the printed circuit board. The structure does not adopt the purely gold wire melting process and does not use a bracket so as to solve the problem of high cost of the existing advertising lamp.

Description

A kind of novel advertisement modulated structure
[technical field]
The utility model relates to a kind of outdoor lighting equipment, particularly a kind of novel advertisement modulated structure.
[background technology]
Advertisement word modules on the market generally adopts Piranha LED at present, the square structure that is encapsulated as the transparent resin encapsulation of Piranha LED, and it has four pins, and there is a scarce pin at the negative pole place.Piranha LED is the LED of astigmatic type, and lighting angle is greater than 120 degree, and luminous intensity is very high, and can bear bigger power.It is maximum that Piranha LED uses is light emitting module at the advertisement word.But owing to Piranha LED structural reason, in the components and parts encapsulation, have to take the technology of proof gold line welding, the cost height, and because the cost height of the support of Piranha itself, so cause the cost of advertising lamp high always.
[utility model content]
The technical problems to be solved in the utility model is to provide a kind of novel advertisement modulated structure, does not take the technology of proof gold line welding, without support, to solve the existing high problem of advertising lamp cost.
The technical problems to be solved in the utility model is achieved in that a kind of novel advertisement modulated structure, comprises a plurality of led chips, a plurality of iron plate, a plurality of epoxy resin, a plurality of aluminum steels and a printed circuit board (PCB); Described a plurality of led chip is by described printed circuit board (PCB) serial connection, described iron plate is arranged on the bottom of described led chip accordingly as cup, and described epoxy resin reaches the top around being arranged on led chip accordingly, described aluminum steel is connected led chip and described printed circuit board (PCB).
Preferable, technique scheme also comprises at least one resistance, is attempted by on the described printed circuit board (PCB), in order to be used for controlling the electric current by led chip.
Preferable, technique scheme comprises that also one is used to carry the glass wiring board of described led chip, iron plate, epoxy resin, aluminum steel and printed circuit board (PCB), and described glass wiring board comprises a solder mask, a silver coating, a copper foil layer and a carrier layer that is provided with from top to bottom; Described solder mask is that insulating materials is made, is coated on the surface of described glass wiring board; Described copper foil layer becomes circuit through excessive erosion, forms described printed circuit board, connects silver coating and power supply; Described silver coating dot matrix is symmetrically distributed in the dual-side of described led chip, and connects described led chip and described copper foil layer by described aluminum steel; Described carrier layer is the FR-4 glass mat.
Advantage of the present utility model is: without support, only need to have done a slice iron plate just on printed circuit board (PCB), greatly reduce the support cost; This encapsulating structure does not adopt the technology of proof gold line welding with respect to Piranha LED, adopts aluminum steel to connect, and saves the gold thread cost, has reduced welding process simultaneously, has reduced welding cost; Also can pass through the use of the glass wiring board of sandwich construction, no metal ingredient leaks outside, and has reduced the possibility that makes that metal material is not oxidized to greatest extent.
[description of drawings]
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the plan structure schematic diagram of a preferred embodiment of the present utility model.
Fig. 2 is the side-looking structural representation of Fig. 1.
Fig. 3 is the backsight structural representation of Fig. 1.
[specific embodiment]
See also Fig. 1 to shown in Figure 3, be the structural representation of a kind of preferred embodiment of advertising lamp of the present utility model, the advertising lamp structure of this embodiment comprises a plurality of led chips 1, a plurality of iron plate 2, a plurality of epoxy resin 3, a plurality of aluminum steels 4, a glass wiring board 5 and a resistance 6.
Described glass wiring board 5 is used to carry described led chip 1, iron plate 2, epoxy resin 3 and aluminum steel 4, be convenient to the encapsulation of advertising lamp, described glass wiring board 5 comprises a solder mask (not shown), a silver coating 51, a copper foil layer 52 and a carrier layer 53 that is provided with from top to bottom; Described solder mask, made for insulating materials, be coated on the surface of described glass wiring board; Described copper foil layer 52 becomes circuit through excessive erosion, forms a printed circuit board, connects silver coating 51 and power supply; Described silver coating 51 dot matrixs are symmetrically distributed in the dual-side of described led chip 1, and connect described led chip 1 and described copper foil layer 52 by described aluminum steel 4; Described carrier layer 53 is the FR-4 glass mat.
Described a plurality of led chip 1 is by described printed circuit board (PCB) serial connection, and to avoid welding procedure, the bottom that described iron plate 2 is arranged on described led chip 1 accordingly is as cup, with fixed L ED chip 1.
Described epoxy resin 3 is arranged on around the led chip 1 and the top accordingly, is used for protecting led chip 1, simultaneously as lens.
Described aluminum steel 4 is used to be connected between led chip 1 and the described printed circuit board (PCB), plays the effect of conduction, to avoid using gold thread, has greatly saved the gold thread cost.
Described resistance 6 is attempted by on the described printed circuit board (PCB), is used for controlling the electric current by described led chip 1.
In sum, the utility model only needs to have done a slice iron plate just on printed circuit board (PCB) without support, greatly reduces the support cost; This encapsulating structure does not adopt the technology of proof gold line welding with respect to Piranha LED, adopts aluminum steel to connect, and saves the gold thread cost, has reduced welding process simultaneously, has reduced welding cost; Also can pass through the use of the glass wiring board of sandwich construction, no metal ingredient leaks outside, and has reduced the possibility that makes that metal material is not oxidized to greatest extent.

Claims (3)

1. a novel advertisement modulated structure is characterized in that: comprise a plurality of led chips, a plurality of iron plate, a plurality of epoxy resin, a plurality of aluminum steels and a printed circuit board (PCB); Described a plurality of led chip is by described printed circuit board (PCB) serial connection, described iron plate is arranged on the bottom of described led chip accordingly as cup, and described epoxy resin reaches the top around being arranged on led chip accordingly, described aluminum steel is connected led chip and described printed circuit board (PCB).
2. novel advertisement modulated structure according to claim 1 is characterized in that: also comprise at least one resistance, be attempted by on the described printed circuit board (PCB).
3. novel advertisement modulated structure according to claim 1 and 2, it is characterized in that: comprise that also one is used to carry the glass wiring board of described led chip, iron plate, epoxy resin, aluminum steel and printed circuit board (PCB), described glass wiring board comprises a solder mask, a silver coating, a copper foil layer and a carrier layer that is provided with from top to bottom;
Described solder mask, made for insulating materials, be coated on the surface of described glass wiring board;
Described copper foil layer becomes circuit through excessive erosion, forms described printed circuit board, connects silver coating and power supply;
Described silver coating, dot matrix are symmetrically distributed in the dual-side of described led chip, and connect described led chip and described copper foil layer by described aluminum steel;
Described carrier layer is the FR-4 glass mat.
CN2010201067561U 2010-02-02 2010-02-02 Novel advertising lamp structure Expired - Fee Related CN201636683U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201067561U CN201636683U (en) 2010-02-02 2010-02-02 Novel advertising lamp structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201067561U CN201636683U (en) 2010-02-02 2010-02-02 Novel advertising lamp structure

Publications (1)

Publication Number Publication Date
CN201636683U true CN201636683U (en) 2010-11-17

Family

ID=43081175

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010201067561U Expired - Fee Related CN201636683U (en) 2010-02-02 2010-02-02 Novel advertising lamp structure

Country Status (1)

Country Link
CN (1) CN201636683U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102606905A (en) * 2011-10-21 2012-07-25 杭州临安新联电器工业有限公司 Heat-pipe type LED (light emitting diode) lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102606905A (en) * 2011-10-21 2012-07-25 杭州临安新联电器工业有限公司 Heat-pipe type LED (light emitting diode) lamp

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: FUJIAN WANBAN OPTOELECTRONICS TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: FUJIAN ZHONGKE WANBAN OPTRONICS CO., LTD.

Effective date: 20110321

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20110321

Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District

Patentee after: Fujian Wanban optoelectronic Technology Co., Ltd.

Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District

Patentee before: Fujian Zhongkewanbang Photoelectric Shares Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101117

Termination date: 20150202

EXPY Termination of patent right or utility model