CN103249257B - The welding resistance method of wiring board - Google Patents
The welding resistance method of wiring board Download PDFInfo
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- CN103249257B CN103249257B CN201310137449.8A CN201310137449A CN103249257B CN 103249257 B CN103249257 B CN 103249257B CN 201310137449 A CN201310137449 A CN 201310137449A CN 103249257 B CN103249257 B CN 103249257B
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- wiring board
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of welding resistance method of wiring board, described wiring board comprises plate body body, and plate body body is provided with open-work, and the welding resistance method of wiring board comprises the following steps successively: on the surface of plate body body wherein side, stick CVL layer; Steam vent is bored in the position that CVL layer is corresponding with the open-work of plate body body; On the surface of the other side of plate body body, utilize the mode of silk-screen to coat solder mask.The CVL layer of the present invention's present opposite side before the step of carrying out silk-screen solder mask bores upper air-vent, air when carrying out silk-screen solder mask on plate body body in open-work can be discharged in steam vent, wire printing material can successfully fill up open-work inside, solder mask is complete, can play good welding resistance effect; The present invention eliminates the step of consent, implements simple, greatly reduces workload and processing cost.
Description
Technical field
The present invention relates to the processing technology of wiring board, be specially a kind of welding resistance method of wiring board.
Background technology
Wiring board generally needs when manufacturing to carry out welding resistance process, carries out welding resistance process after namely completing the steps such as wiring boring at wiring board by subsides CVL layer (attaching film shape coverlay) and the mode of silk-screen solder resist material.Can be there is open-work in wiring board, and the step of silk-screen solder resist material is generally carried out after subsides CVL layer on the process rear plate bodies such as boring.As shown in Figure 1, after open-work one end on plate body body 1 is sealed by CVL layer 3, when the open-work other end carries out silk-screen due to the existence of air in open-work, the phenomenon that dew hole is bad is there will be after silk-screen completes, namely solder resist material completely can not fill up open-work, solder mask 2 existing defects formed, this phenomenon can have a strong impact on the welding resistance performance of sheet material.In order to overcome above-mentioned defect, method general at present first carries out consent process before silk-screen solder resist material, such a process increases workload, and cost increases to some extent.
Summary of the invention
For the problems referred to above, the invention provides a kind of simple wiring board welding resistance method of enforcement, the method can ensure that wiring board forms complete good welding resistance performance, saves production cost.
The technical scheme that the present invention adopts for its technical problem of solution is:
The welding resistance method of wiring board, described wiring board comprises plate body body, and plate body body is provided with open-work, and the welding resistance method of wiring board comprises the following steps successively: on the surface of plate body body wherein side, stick CVL layer; Steam vent is bored in the position that CVL layer is corresponding with the open-work of plate body body; On the surface of the other side of plate body body, utilize the mode of silk-screen to coat solder mask.
Wherein preferably, described solder mask is butter layer.
The diameter of described steam vent is 0.15mm.
Described plate body body is made up of the PI layer mediated and the metal level being distributed in PI layer both sides.
The invention has the beneficial effects as follows: the CVL layer of the present invention's present opposite side before the step of carrying out silk-screen solder mask bores upper air-vent, air when carrying out silk-screen solder mask on plate body body in open-work can be discharged in steam vent, wire printing material can successfully fill up open-work inside, solder mask is complete, can play good welding resistance effect; The present invention eliminates the step of consent, implements simple, greatly reduces workload and processing cost.
Accompanying drawing explanation
Be further detailed below in conjunction with the drawings and specific embodiments:
The defect schematic diagram that Fig. 1 causes for existing welding resistance method;
Fig. 2 is formed structural representation by welding resistance method of the present invention.
Embodiment
The present invention improves the welding resistance technique of wiring board, specifically for be the circuit board structure that plate body body is provided with open-work.Instant invention overcomes the impact of open-work during silk-screen solder mask, make the solder mask structural integrity of silk-screen gained.
As shown in Figure 2, the circuit board structure that the present invention is suitable for comprises plate body body 1, solder mask 2, CVL layer 3, and wherein, plate body body 1 is generally made up of the PI layer mediated and the metal level being distributed in PI layer both sides.In order to form above-mentioned circuit board structure, the present invention first sticks CVL layer 3 on the surface of plate body body 1 wherein side, then on the position that CVL layer 3 is corresponding with the open-work of plate body body 1, bore steam vent 31, finally just on the surface of the other side of plate body body 1, utilize the mode of silk-screen to coat solder mask 2.The material of silk-screen is generally butter, and the solder mask 3 of formation is butter layer.The CVL layer 3 of above-mentioned technique present opposite side before the step of carrying out silk-screen solder mask 2 bores upper air-vent 31, air when carrying out silk-screen solder mask 2 on plate body body 1 in open-work can be discharged in steam vent 31, wire printing material can successfully fill up open-work inside, solder mask 2 is complete, can play good welding resistance effect.
In general embodiment, the diameter of this steam vent 31 is set to the requirement that 0.15mm can meet use.
Embodiments of the present invention are not restricted to the described embodiments, as long as it reaches technique effect of the present invention with substantially identical means, all should belong to protection scope of the present invention.
Claims (4)
1. the welding resistance method of wiring board, described wiring board comprises plate body body, and plate body body is provided with open-work, it is characterized in that the welding resistance method of wiring board comprises the following steps successively:
CVL layer is sticked on the surface of plate body body wherein side;
Steam vent is bored in the position that CVL layer is corresponding with the open-work of plate body body;
On the surface of the other side of plate body body, utilize the mode of silk-screen to coat solder mask.
2. the welding resistance method of wiring board according to claim 1, is characterized in that described solder mask is butter layer.
3. the welding resistance method of wiring board according to claim 1, is characterized in that the diameter of described steam vent is 0.15mm.
4. the welding resistance method of wiring board according to claim 1, is characterized in that described plate body body is made up of the PI layer mediated and the metal level being distributed in PI layer both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310137449.8A CN103249257B (en) | 2013-04-19 | 2013-04-19 | The welding resistance method of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310137449.8A CN103249257B (en) | 2013-04-19 | 2013-04-19 | The welding resistance method of wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103249257A CN103249257A (en) | 2013-08-14 |
| CN103249257B true CN103249257B (en) | 2016-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310137449.8A Active CN103249257B (en) | 2013-04-19 | 2013-04-19 | The welding resistance method of wiring board |
Country Status (1)
| Country | Link |
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| CN (1) | CN103249257B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988766A (en) * | 2005-12-22 | 2007-06-27 | 科研技术顾问有限公司 | Method for making covered film composed of soft printed circuit board and covered film structure |
| CN202068676U (en) * | 2011-05-17 | 2011-12-07 | 珠海市耀宏电子科技有限公司 | Novel circuit board of light-emitting diode (LED) lamp |
| CN202514157U (en) * | 2012-03-28 | 2012-10-31 | 成都多吉昌新材料有限公司 | Environmental-friendly LED (Light Emitting Diode) flexible strip circuit board structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63284894A (en) * | 1987-05-18 | 1988-11-22 | Hitachi Ltd | Manufacture of printed wiring board |
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2013
- 2013-04-19 CN CN201310137449.8A patent/CN103249257B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988766A (en) * | 2005-12-22 | 2007-06-27 | 科研技术顾问有限公司 | Method for making covered film composed of soft printed circuit board and covered film structure |
| CN202068676U (en) * | 2011-05-17 | 2011-12-07 | 珠海市耀宏电子科技有限公司 | Novel circuit board of light-emitting diode (LED) lamp |
| CN202514157U (en) * | 2012-03-28 | 2012-10-31 | 成都多吉昌新材料有限公司 | Environmental-friendly LED (Light Emitting Diode) flexible strip circuit board structure |
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| CN103249257A (en) | 2013-08-14 |
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Effective date of registration: 20170407 Address after: Lane 519040 Industrial Zone in Guangdong province Zhuhai Sanzao fish Patentee after: Zhuhai wisdom Technology Co., Ltd. Address before: 519000 Guangdong province Zhuhai City Sanzao town Jinwan District moon Road No. 28 building A Patentee before: 3 Win Group (Zhuhai) Corporation |