CN107835590A - A kind of preparation method of buried via hole circuit board - Google Patents
A kind of preparation method of buried via hole circuit board Download PDFInfo
- Publication number
- CN107835590A CN107835590A CN201710971484.8A CN201710971484A CN107835590A CN 107835590 A CN107835590 A CN 107835590A CN 201710971484 A CN201710971484 A CN 201710971484A CN 107835590 A CN107835590 A CN 107835590A
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- CN
- China
- Prior art keywords
- circuit board
- resin
- preparation
- via hole
- completion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention belongs to printed-board technology field, there is provided a kind of preparation method of buried via hole circuit board, press together to form multilayer circuit board by first transferring multilayer internal layer circuit, after etching and brown；Drill to form via in the specific position of the multilayer circuit board, and heavy copper and plate electricity is carried out to the hole wall of via；Then treat that the via covers the transfer of progress outer-layer circuit after the completion of copper, then resin is circulated into the via, realizes filling holes with resin；Then treat that the multilayer circuit board for having completed consent is put in the rolling operation for carrying out resin on silk-screen table top with screen printer after the completion of filling holes with resin；Finally brown PROCESS FOR TREATMENT will be carried out again after the multilayer circuit board solidification after the completion of resin rolling, finally carry out outside plate pressing processing；So design can be solved during existing buried via hole circuit board making, it is necessary to cut excessive glue and cause circuit board the quality problems such as harmomegathus, plate face warpage, dew base material occur.
Description
Technical field
The invention belongs to printed-board technology field, more particularly to a kind of preparation method of buried via hole circuit board.
Background technology
The technique of filling holes with resin is that people are reducing PCB design size, a kind of technology for coordinating assembling component and inventing
Method, it is by after the hole wall copper facing by via the purpose of filling holes with resin, then fills resin, finally in resin surface copper facing again, this
The effect of sample design is that via can turn on, and the surface of pcb board does not have indenture, so reduces plate face wiring, pattern is set
Count area.
, it is necessary to priority control and bubble in attention consent plumpness and hole, conventional filling holes with resin side in manufacturing process
Formula has half tone silk-screen and machine vacuum taphole, and wherein half tone silk-screen air bubble problem easily occurs due to not vacuumizing in hole；And
Machine vacuum taphole can improve air bubble problem, but because vacuum taphole equipment is expensive, thus simply large enterprise using more,
On Making programme, conventional filling holes with resin technique and flow are：Plate after hole metallization carries out filling holes with resin, after resin solidification
The resin ground for being had more aperture by cutting excessive glue falls, then does circuit, is finally pressed again.But existing preparation method stream
Cheng Duo, the time is long, efficiency is low, cost is high, the quality problems such as harmomegathus, plate face warpage, dew base material easily occurs after cutting excessive glue.
The content of the invention
It is an object of the invention to provide a kind of preparation method of buried via hole circuit board, it is intended to solves existing buried via hole circuit board
, it is necessary to cut excessive glue and cause circuit board the quality problems such as harmomegathus, plate face warpage, dew base material occur in manufacturing process.
The present invention so solves：A kind of preparation method of buried via hole circuit board, comprises the following steps
S1, it will press together to form multilayer circuit board after the transfer of multilayer internal layer circuit, etching and brown；
S2, in the specific position of the multilayer circuit board drill to form via, and heavy copper and plate are carried out to the hole wall of via
Electricity；
S3, treat that the via covers the transfer of progress outer-layer circuit after the completion of copper, then resin be circulated into the via,
Realize filling holes with resin；
S4, treat that the multilayer circuit board for having completed consent is put on silk-screen table top with screen printer after the completion of filling holes with resin
Carry out the rolling operation of resin；
S5, brown PROCESS FOR TREATMENT will be carried out again after the multilayer circuit board solidification after the completion of resin rolling, finally carry out
Outside plate pressing is handled.
Further, in the step S4, before rolling step, above and below the multilayer circuit board after the completion of consent
A blank sheet of paper is laid in both sides respectively, and carries out with scraper in the outside of the blank sheet of paper scraping the unnecessary tree in the via both ends
Fat.
Further, the pressure limit that the scraper is applied on the blank sheet of paper is 4~8kg/cm2。
Further, translational speed of the scraper on the paper surface is 100~300mm/min.
Further, the scraper moves along the direction parallel to the blank sheet of paper upper surface, and the scraper with it is described white
The upper surface of paper is set in the first angle, 5 °~10 ° of the scope of first angle.
Further, the thickness of the scraper is 20mm, and the length of the scraper is 650mm.
Further, in the step S3, consent is carried out using vacuum taphole machine during the filling holes with resin, and
The height of resin is higher than the aperture of the via after consent.
Further, the height of the resin after the completion of consent and the difference in height in the aperture are more than or equal to 50 μm,
And the resin that the aperture of the via is emerged is in the range of the 0.2mm of the via circumferential outside.
Further, in the step S4, after the completion for the treatment of filling holes with resin, within the time less than 30min described in implementation
The rolling of via both ends resin.
Further, in the step S5, the outside plate passes through half with the upper and lower side of the multilayer circuit board respectively
Cured sheets connect.
The technique effect that the preparation method of buried via hole circuit board provided by the invention has relative to existing technology is：More
Layer internal layer circuit plate completes drilling, and sink copper plate electric technique is completed directly to carry out the transfer of outer-layer circuit afterwards, and turns in circuit
Filling holes with resin is carried out after the completion of print, while immediately by the unnecessary resin rolling in via both ends after filling holes with resin terminates；So set
Meter can avoid cutting excessive glue process after resin solidification, so can avoid during cutting excessive glue to circuit board in itself caused by
The problems such as harmomegathus, plate face warpage and dew base material, the process for cutting excessive glue is saved, and the damage of copper process in which materials can be sunk the later stage by substantially reducing
Lose, and drastically increase the producing efficiency of wiring board.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is the flow chart of the preparation method of buried via hole circuit board provided in an embodiment of the present invention.
Fig. 2 be buried via hole circuit board provided in an embodiment of the present invention preparation method in structural representation after consent.
Fig. 3 be buried via hole circuit board provided in an embodiment of the present invention preparation method in resin rolling process structural representation
Figure.
Fig. 4 be buried via hole circuit board provided in an embodiment of the present invention preparation method in structural representation after resin rolling.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
Accompanying drawing 1 be refer to shown in Fig. 4, in the present invention is embodiment, there is provided a kind of preparation method of buried via hole circuit board,
Comprise the following steps
S1, it will press together to form multilayer circuit board 10 after the transfer of multilayer internal layer circuit, etching and brown；
In this step, sawing sheet is carried out according to the engineering design demand of reality, selects the shapes and sizes of base material, Ran Houjin
The transfer of row internal layer circuit, after being then etched shaping to internal layer circuit, internal layer circuit is detected, detection is completed laggard
Row brown, the multilayer wiring board is then carried out by pressing by prepreg and forms multilayer circuit board 10, multilayer line now
Plate 10 is the buried via hole layer for needing to carry out filling holes with resin.
S2, in the specific position of the multilayer circuit board drill to form via 11, and heavy copper is carried out to the hole wall of via 11
With plate electricity；
In this step, repairing for hair batch then first is carried out to the periphery of via 11 in the drill-through hole 11 in region for needing buried via hole
It is multiple, metalized is then carried out to the hole wall of via 11 using heavy process for copper, after the completion of heavy process for copper, the via 11 entered
Andante galvanic process processing so that the hole wall electric conductivity of the via 11 is more preferable.In addition after the completion of plate galvanic process via 11 hole wall
Figure galvanic process can also not enough be carried out by covering copper thickness, and copper clad layers are thickeied.The above-mentioned technological process parameter of this step is adopted
With the parameter of routine, do not repeat herein.
S3, treat that the via 11 covers the transfer of progress outer-layer circuit after the completion of copper, resin 20 is then circulated into the mistake
In hole 11, filling holes with resin is realized；
In this step, the transfer of outer-layer circuit is first completed, then carries out filling holes with resin again；So design is relative to tradition
First consent carry out the transfer of outer-layer circuit again, it is advantageous that needing to carry out a series of scraping behaviour after traditional filling holes with resin
Make, outer-layer circuit may be caused to damage；And the process of excessive glue is cut in this programme due to being subsequently not present, and then do not interfere with
Its efficiency made is obviously improved relative to existing method for outer-layer circuit, so design.
In this step, implemented during consent using the network of aluminum, the thickness of aluminium flake in the grid
Preferably 0.15mm, the tension force of the grid is preferably 24N/mm.The grid hole is bigger 0.1mm than the radius of via 11 simultaneously.
S4, treat that the multilayer circuit board 10 for having completed consent is put in into silk-screen table top with screen printer after the completion of filling holes with resin
The rolling operation of resin 20 is carried out on 30；
In this step, the step of 20 rolling of resin is to prevent the multilayer circuit board 10 for completing consent in silk
On ink pad face 30, while one or more blank sheet of paper 40 is laid in the both sides up and down of multilayer circuit board 10, then by specific
Scraper 50, with specific speed, apply pressure using specific, directionally scrape off the Excess resin 20 in outside of perforating, so
Avoid subsequently to cut the process of excessive glue, while can be by the transfer early excise of outer-layer circuit, it is thus also avoided that when cutting excessive glue pair
The influence of sheet material in itself.
S5, brown PROCESS FOR TREATMENT is carried out again after the multilayer circuit board 10 after the completion of the rolling of resin 20 is solidified, finally
Carry out the pressing of outside plate 60 processing.
In this step, the multilayer circuit board 10 after rolling is spaced one from placing, and can not encounter between multilayer circuit board 10,
The multilayer circuit board 10 of rolling number is finally subjected to baking sheet solidification so that resin 20 is fully cured, and then carries out the palm fibre of wiring board
Change, then outside plate 60 is connected to the both sides up and down of the multilayer circuit board 10 by prepreg 70.Then continue to be drilled,
Sink copper plate electric, outer layer etching, anti-welding processing, surface treatment and shaping, then circuit test, finally packs and dispatches from the factory.
The preparation method of the buried via hole circuit board of design above, complete to drill in multilayer internal layer circuit plate, and sink copper plate electric work
Skill directly carries out the transfer of outer-layer circuit after completing, and carries out filling holes with resin after the completion of circuit transfer, while in resin plug
Hole terminate after immediately by the unnecessary rolling of resin 20 in the both ends of via 11；So design and cut excessive glue after can avoiding the solidification of resin 20
Process, so can avoid during cutting excessive glue to circuit board in itself caused by harmomegathus, plate face warpage and dew base material the problems such as,
The process for cutting excessive glue is saved, and the loss of copper process in which materials can be sunk the later stage by substantially reducing, and drastically increase the system of wiring board
Make efficiency.
Specifically, as shown in figure 3, in embodiments of the present invention, in the step S4, before rolling step, in consent
After the completion of the multilayer circuit board lay a blank sheet of paper 40 respectively in both sides about 10, the blank sheet of paper 40 is used to adhere to the tree that scrapes
Fat 20, and carry out with scraper 50 in the outside of the blank sheet of paper 40 scraping the unnecessary resin 20 in the both ends of via 11, in the mistake of scraping
The scraper 50 of upper and lower ends is carried out simultaneously in journey.
In the present embodiment, as shown in figure 4, after the completion of rolling technique, due to surface direction of the scraper 50 along the blank sheet of paper 40
It is mobile, and resin 20 does not support at via 11, and then after the completion of rolling technique, the both ends of via 11 are in the circular arc of indent
Shape, so can be in order to the connection with prepreg 70.
In embodiments of the present invention, the pressure limit that the scraper 50 is applied on the blank sheet of paper 40 is preferably 4~8kg/cm2；
The pressure limit is foregoing specific pressure environment, and on the one hand so design can ensure the effect of rolling, on the other hand keep away
Exempt from the excessive outer-layer circuit on wiring board of pressure to cause to damage.
In embodiments of the present invention, translational speed of the scraper 50 on the surface of blank sheet of paper 40 is preferably 100~300mm/
Min, and the scraper 50 moves in one direction all the time, and so design can ensure the via 11 in moving process of scraper 50
The effect that the unnecessary resin 20 in both ends removes is more preferable.
In embodiments of the present invention, the scraper 50 moves along the direction parallel to the upper surface of blank sheet of paper 40, and the scraper
50 with the upper surface of the blank sheet of paper 40 in the setting of the first angle, 5 °~10 ° of the scope of first angle.The blade of the scraper 50 herein
Part is inclined in itself, and then the scraper 50 is linear contact lay with the time of blank sheet of paper 40, while by scraper 50 and blank sheet of paper 40
Between set again in the first angle, and then ensure the moving process of scraper 50 more smoothly, and to wiring board outer surface
Damage is smaller.
Specifically, in embodiments of the present invention, the thickness of the scraper 50 is preferably 20mm, and the length of the scraper 50 is excellent
Elect 650mm as.
Specifically, as illustrated, in embodiments of the present invention, in step S3, being used during the filling holes with resin
Vacuum taphole machine carries out consent, and the height of resin 20 should be higher than that the aperture of the via 11 after consent.So design can be protected
Demonstrate,prove the fullness degree of consent.
Specifically, as shown in Fig. 2 in embodiments of the present invention, height and the aperture of the resin 20 after the completion of consent
Difference in height be more than or equal to 50 μm, and the resin 20 that the aperture of the via 11 is emerged is in the circumferential outside of via 11
In the range of 0.2mm.So design can be in order to the implementation of the follow-up rolling technique of resin 20.
Specifically, in embodiments of the present invention, in step S4, after the completion for the treatment of filling holes with resin, less than 30min when
The interior rolling for implementing the both ends resin 20 of via 11.The purpose so designed is to prevent time how long rear resin 20 from occurring to coagulate
Gu and then cause being difficult to carry out for the follow-up rolling of resin 20.
Specifically, as shown in figure 4, in embodiments of the present invention, in step S5, the outside plate respectively with the multilayer line
The upper and lower side of plate 10 is connected by prepreg 70.The wherein rotation of prepreg 70, in order to ensure that circuit surface and aperture are filled out
Glue is abundant, is typically chosen the high prepreg 70 of the content of resin 20, while in order to ensure resin 20 and the tree of prepreg 70 in hole
The adhesion of fat 20 and the matching of thermal coefficient of expansion, medium fusing point and the material of the prepreg of the above 70 are selected, and in order to protect
Demonstrate,prove circuit surface and aperture filler is abundant, select the prepreg 70 of more than >=2.
The present processes, the operating procedure in the manufacture craft of traditional buried via hole circuit board order is subjected on the one hand
Change, namely after in general technique is line consent, copper is mended to substrate after excessive glue is cut, then carries out the transfer of outer-layer circuit again；
And in this method, after the transfer of first outer-layer circuit, then filling holes with resin, the then rolling of resin 20.After conventional method cuts excessive glue, plate face
Reveal base material with filling holes with resin aperture, and then can not first do outer-layer circuit transfer；And circuit board harmomegathus after excessive glue is cut, to circuit system
Make, drilling has considerable influence；Plate face warpage after excessive glue is cut, has considerable influence to circuit, plating, anti-welding making；Whole process
Long flow path, fabrication cycle length, resin 20 wastes more, causes cost height；The application solves this problem well.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
- A kind of 1. preparation method of buried via hole circuit board, it is characterised in that：Comprise the following stepsS1, it will press together to form multilayer circuit board after the transfer of multilayer internal layer circuit, etching and brown；S2, in the specific position of the multilayer circuit board drill to form via, and heavy copper and plate electricity is carried out to the hole wall of via；S3, treat that the via covers the transfer of progress outer-layer circuit after the completion of copper, then resin is circulated into the via, realized Filling holes with resin；S4, treat the multilayer circuit board for having completed consent to be put on silk-screen table top with screen printer after the completion of filling holes with resin to carry out The rolling operation of resin；S5, brown PROCESS FOR TREATMENT will be carried out again after the multilayer circuit board solidification after the completion of resin rolling, finally carry out outside plate Pressing is handled.
- 2. the preparation method of buried via hole circuit board as claimed in claim 1, it is characterised in that：In the step S4, in rolling Before step, a blank sheet of paper is laid in both sides respectively above and below the multilayer circuit board after the completion of consent, and in the outer of the blank sheet of paper Side carries out scraping the unnecessary resin in the via both ends with scraper.
- 3. the preparation method of buried via hole circuit board as claimed in claim 2, it is characterised in that：The scraper is applied to the blank sheet of paper On pressure limit be 4~8kg/cm2。
- 4. the preparation method of buried via hole circuit board as claimed in claim 2, it is characterised in that：The scraper is in the paper surface On translational speed be 100~300mm/min.
- 5. the preparation method of buried via hole circuit board as claimed in claim 2, it is characterised in that：The scraper is along parallel to described white The direction movement of paper upper surface, and the upper surface of the scraper and the blank sheet of paper is set in the first angle, first angle 5 °~10 ° of scope.
- 6. the preparation method of buried via hole circuit board as claimed in claim 2, it is characterised in that：The thickness of the scraper is 20mm, The length of the scraper is 650mm.
- 7. the preparation method of the buried via hole circuit board as described in claim any one of 1-6, it is characterised in that：In the step S3 In, consent is carried out using vacuum taphole machine during the filling holes with resin, and the height of resin is higher than the via after consent Aperture.
- 8. the preparation method of buried via hole circuit board as claimed in claim 7, it is characterised in that：The resin after the completion of consent Height and the difference in height in the aperture are more than or equal to 50 μm, and the resin that the aperture of the via is emerged crosses hole peripheral described In the range of the 0.2mm in outside.
- 9. the preparation method of the buried via hole circuit board as described in claim any one of 1-6, it is characterised in that：In the step S4 In, after the completion for the treatment of filling holes with resin, implement the rolling of via both ends resin within the time less than 30min.
- 10. the preparation method of the buried via hole circuit board as described in claim any one of 1-6, it is characterised in that：In the step S5 In, upper and lower side of the outside plate respectively with the multilayer circuit board is connected by prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710971484.8A CN107835590A (en) | 2017-10-18 | 2017-10-18 | A kind of preparation method of buried via hole circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710971484.8A CN107835590A (en) | 2017-10-18 | 2017-10-18 | A kind of preparation method of buried via hole circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107835590A true CN107835590A (en) | 2018-03-23 |
Family
ID=61648253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710971484.8A Pending CN107835590A (en) | 2017-10-18 | 2017-10-18 | A kind of preparation method of buried via hole circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN107835590A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446355A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of LED lamp bead package board filling holes with resin technique |
| CN111246670A (en) * | 2020-01-21 | 2020-06-05 | 惠州中京电子科技有限公司 | Method for manufacturing thin plate or soft plate through macroporous resin hole plugging |
| CN111683463A (en) * | 2020-07-08 | 2020-09-18 | 沪士电子股份有限公司 | Processing method of thick copper circuit board containing anti-bonding pad |
| CN112277493A (en) * | 2020-10-28 | 2021-01-29 | 中科传感技术(青岛)研究院 | Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece |
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| CN1262595A (en) * | 1999-01-26 | 2000-08-09 | 欣兴电子股份有限公司 | Equipment and method for making plug holes |
| CN102170755A (en) * | 2011-04-25 | 2011-08-31 | 衢州威盛精密电子科技有限公司 | Process for producing ceramic mobile phone circuit board |
| CN102523700A (en) * | 2011-12-23 | 2012-06-27 | 胜宏科技（惠州）股份有限公司 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
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|---|---|---|---|---|
| CN1262595A (en) * | 1999-01-26 | 2000-08-09 | 欣兴电子股份有限公司 | Equipment and method for making plug holes |
| CN102170755A (en) * | 2011-04-25 | 2011-08-31 | 衢州威盛精密电子科技有限公司 | Process for producing ceramic mobile phone circuit board |
| CN102523700A (en) * | 2011-12-23 | 2012-06-27 | 胜宏科技（惠州）股份有限公司 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446355A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of LED lamp bead package board filling holes with resin technique |
| CN111246670A (en) * | 2020-01-21 | 2020-06-05 | 惠州中京电子科技有限公司 | Method for manufacturing thin plate or soft plate through macroporous resin hole plugging |
| CN111246670B (en) * | 2020-01-21 | 2023-10-13 | 惠州中京电子科技有限公司 | Manufacturing method of sheet or soft board macroporous resin plug hole |
| CN111683463A (en) * | 2020-07-08 | 2020-09-18 | 沪士电子股份有限公司 | Processing method of thick copper circuit board containing anti-bonding pad |
| CN112277493A (en) * | 2020-10-28 | 2021-01-29 | 中科传感技术(青岛)研究院 | Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece |
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