CN102523700A - Method for burying and plugging holes on HDI (high-density interconnection) circuit boards - Google Patents
Method for burying and plugging holes on HDI (high-density interconnection) circuit boards Download PDFInfo
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- CN102523700A CN102523700A CN2011104371666A CN201110437166A CN102523700A CN 102523700 A CN102523700 A CN 102523700A CN 2011104371666 A CN2011104371666 A CN 2011104371666A CN 201110437166 A CN201110437166 A CN 201110437166A CN 102523700 A CN102523700 A CN 102523700A
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- wiring board
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- consent
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Abstract
The invention belongs to the technical field of manufacturing circuit boards, relates to a burying and plugging process of HDI (high-density interconnection) circuit boards, in particular to a method for burying and plugging holes on the HDI circuit boards. The method for burying and plugging holes on the HDI circuit boards aims to solve the problems that brownification and press are generally performed after baking of buried and plugged holes in the existing process of burying and plugging holes on the HDI circuit boards so that performance of the PCBs is affected due to the fact that resin ink has a water absorption function during brownification and press, and includes: a, the brownification step of the HDI circuit boards distributed with wires; b, the step of hole burying and plugging by a screen printer; c, the process step of resin ink on the holes and d, the baking step. By the aid of the technical scheme, the above technical problems can be solved effectively.
Description
Technical field
The invention belongs to wiring board manufacturing technology field, what relate to the HDI wiring board buries the plug processing procedure, is specifically related to a kind of method of on the HDI wiring board, burying consent.
Background technology
Consent is a kind of method of HDI wiring board manufacture craft behind the wiring board circuit, and the phenomenons such as plate starved, depression and layering that prevent after the pressing that act as that plug buries take place, and reduces the risk of scrapping after the pressing, and saves time, saves money.
As an example, what have the HDI wiring board now buries the blocking method processing step substantially as follows: the plate after the copper facing directly uses wire mark machine consent; Toast behind the consent; Re-using 6 grinders after having toasted grinds 1-2 time; Make circuit after grinding, normal then pressing.
Also be that the brown pressing generally is after burying consent baking, to carry out, there is water sorption in the resin printing ink that the drawback of doing like this is to bury plug and influences the performance of PCB when the brown pressing.
Summary of the invention
Technical problem to be solved by this invention is that existing HDI wiring board buries in the technology of consent generally the brown pressing is arranged in and buries after the consent baking; Owing to the resin printing ink that buries plug exists water sorption to influence the problem of PCB performance when the brown pressing; And a kind of method of on the HDI wiring board, burying consent is provided to this problem, comprising:
A, the HDI wiring board of having crossed line carried out the step of brown;
B, the step of burying consent with the wire mark machine;
C, to the treatment step of the resin printing ink on the hole;
The step of d, baking.
The step (also being a step) that the present invention will carry out brown to the HDI wiring board of having crossed line is arranged in buries consent step (also being the b step) before; Except increasing HDI PCB surface roughness; Increase outside the adhesion of copper face and PP; Can not produce the problems referred to above, the final quality to the HDI wiring board does not almost influence yet simultaneously.
What is more important; The technology that the said existing HDI wiring board of background technology part buries consent generally contains grinding process; Except the described existing HDI wiring board of background technology part buries the technology of consent; Recently one Chinese patent application " method and system of buried via hole consent on a kind of circuit board " (application number 200910088289.6) also disclose a kind of on circuit board the method for buried via hole consent, this method comprises aims at the following ink dot of the consent web plate in the consent wire mark machine with the hole on the said circuit board, then rabbet ink is filled in the hole; Baking subsequently; Grind, this patent application has changed the buried via hole consent by manually-operated traditional mode, has improved production efficiency of products and stability to a certain extent.
Yet the existence of grinding steps can make the production time of whole HDI wiring board be difficult to shorten, in addition; The maintenance cost of milling apparatus often higher (for example brushing the maintenance of emery wheel); Cause the production cost of HDI wiring board to be difficult to descend, in the production practices, though the above-mentioned needs by grinding process institute elicitation technique problem of solution are arranged; But directly grinding process itself is improved, often be difficult to prove effective.
The present invention finds; If will carry out the step (also being a step) of brown to the HDI wiring board of having crossed line is arranged in and buries consent step (also being the b step) before; Then can make the technology intention that substitutes grinding process have the possibility of realization at least; For example, the present invention has just realized this technology intention: said c step adopts the mode that resin printing ink is flattened that the resin printing ink on the hole is handled.
Resin printing ink do not flattened need use grinder, before baking procedure, make the leveling of resin printing ink on the HDI wiring board, reach the degree that the hole is filled up, guarantee baking procedure after, follow-up to the interlayer quality behind the HDI circuit board pressing.
The present invention finds to adopt the leveling mode to replace grinding process to have following technique effect at least:
The first, along with electronic product towards light, thin, little trend development, a large amount of uses of grinder make that the thickness of HDI wiring board is more and more thinner.Prior art is ground resin printing ink with grinder; Also promptly directly the resin printing ink on the HDI circuit plate hole is ground with the brush emery wheel on the grinder; As mentioned above; The grinder price is more expensive, and grinding can cause the consumption of brush emery wheel on the grinder, thereby makes that the cost of consent improves on the HDI wiring board.
Resin printing ink on the HDI circuit plate hole flattens; Can guarantee the quality of HDI wiring board; In fact; The resin quantity of ink that is used for consent on the HDI wiring board is quite limited, and leveling back only stays fritter area very, very rare printing ink at HDI wiring board plate face, and this is to thickness not influence basically of whole HDI wiring board.
Though the second, the resin printing ink that can bald spot from HDI circuit plate hole, overflows of grinder; Make the attenuation of whole HDI wiring board; But cause extra risk easily; Be that overgrinding will make the thin partially consequently base material of HDI wiring board face copper exposed, grind then to cause HDI wiring board rate best in quality to descend inadequately, and this risk be uncontrollable often owing to can't accomplish accurate the grinding.
According to the invention resin printing ink on the hole being flattened, need not flatten to the hole on each HDI wiring board, get final product but whole HDI wiring board flattened, thus, is controlled to the quality of HDI wiring board, does not have risk.
Three, the leveling mode that adopts of the present invention has great lifting than the efficient of grinding, and can know by second, grind and often a hole or a plurality of hole are carried out, and leveling is that whole HDI wiring board is once accomplished.
The present invention has further adopted following technical scheme:
The b step comprises: the frame aeroscopic plate is also adjusted aeroscopic plate, makes it to be fixed on the wire mark board face with the wire mark machine web plate kissing merging that has locked;
Fixedly PIN follows closely on aeroscopic plate, and HDI circuit grillage is nailed at aeroscopic plate PIN, uses the wire mark board in the face of the position fine setting, and HDI wiring board and wire mark machine web plate are matched;
The scraper angle of wire mark machine scraper is transferred to 0-15 °, the HDI wiring board is buried consent;
Said wire mark machine scraper pressure transfers to 5-8 Kg/cm
2, gait of march is controlled at the 2-4 lattice;
Said c step comprises that the PE diaphragm with dry film is installed on the manual press mold machine, flattens the HDI wiring board;
Manually the air pressure of press mold machine is 4-6Kg/cm2, and temperature is 17 ℃-23 ℃, and speed is 2-3m/min;
The said baking of d step is for inserting the frame baking;
Baking condition in the said d step is 140 ℃-160 ℃, and stoving time is 25min-35min.
Description of drawings
Fig. 1 is the said a kind of flow chart that on the HDI wiring board, buries the method for consent of embodiment.
Embodiment
A kind of on the basis of the method for burying consent on the HDI wiring board what adopt summary of the invention partly to introduce, the technical scheme that detailed disclosure is not given to this part in this part is introduced in detail.
The present invention optimizes a kind of each the related step of method of on the HDI wiring board, burying consent that is disclosed:
For the b step, it comprises: the frame aeroscopic plate is also adjusted aeroscopic plate, makes it to be fixed on the wire mark board face with the wire mark machine web plate kissing merging that has locked;
Fixedly PIN follows closely on aeroscopic plate, and HDI circuit grillage is nailed at aeroscopic plate PIN, uses the wire mark board in the face of the position fine setting, and HDI wiring board and wire mark machine web plate are matched;
The scraper angle of wire mark machine scraper is transferred to 0-15 °, the HDI wiring board is buried consent.This kind angular range can make and bury the consent active force and roughly just push away, and has improved and has buried the consent effect.
Further, can the scraper pressure of wire mark machine be transferred to 5-8kg/cm
2, gait of march is controlled at the 2-4 lattice, in fact, bury consent according to the above-mentioned parameter setting after, do not have light leakage phenomenon to take place and through burying the consent plumpness between 70%-110% after the follow-up baking.
Of summary of the invention; Resin printing ink on the hole is carried out smoothly can producing the corresponding techniques effect, and practical implementation leveling apparatus operating can be manual press mold machine that this cost of equipment maintenance is low; The dry film PE that employed PE diaphragm can be to use the circuit processing procedure to use; Facts have proved that the dry film PE that uses the circuit processing procedure to use can not influence quality, thereby can further reduce cost.
Further, can the air pressure of manual press mold machine be made as 4-6Kg/cm2, temperature is made as 17 ℃-23 ℃, and speed is made as 2-3m/min.
For the d step, the baking condition in the said d step is 140 ℃-160 ℃, and stoving time is 25min-35min.
Certainly, in practical operation, should avoid destroying the brown layer and the pressing reliability that influences PCB, one of them counter-measure is to make the described baking of d step for inserting the frame baking.
Embodiment
Described manual press mold machine of present embodiment and wire mark machine are conventional equipment, and wherein the web plate that uses of wire mark machine is the aluminum web plate.
A kind of method of consent in the circuit board comprises:
The step of 1., the HDI wiring board of having crossed line being carried out the brown pressing;
2., bury the step of consent with the wire mark machine;
3., the step that the resin printing ink on the hole is flattened;
4., the step of baking.
Wherein 1. step gets final product according to the prior art operation, no longer explanation here, and 2. step comprises:
1. confirm whether the aluminium flake web plate is consistent with the multiplying power of wiring board, check whether the aluminium flake web plate meets the requirements (for example whether aluminium flake web plate surface is jagged, pollutant, stopple etc.);
2. the good aluminium flake web plate of smooth frame also pins web plate;
3. frame general-purpose aeroscopic plate and adjust aeroscopic plate makes it to merge with aluminium flake web plate kissing and is fixed on the wire mark board face;
4. use two-sided PIN nail on the general-purpose aeroscopic plate, planted the PIN nail and fixed the PIN nail;
5. use the corresponding HDI circuit grillage that buries plug to nail on, use the wire mark board, adjust the contraposition of HDI wiring board and web plate, make it to match with the aluminium flake web plate in the face of the position fine setting at the PIN of aeroscopic plate with the aluminium flake web plate;
6. be adjusted at 7kg/cm to the scraper pressure of wire mark machine
2, scraper angle transfers to 10 °, and gait of march is controlled at 3 lattice, buries consent.
Try plug with the said parameter of 6 steps, adjusting under the prerequisite of contraposition, bury the inclined to one side ﹑ of the resin printing ink uncork of plug and leak situation such as plug (less than the wiring board of 0.7mm the single-point printing opacity can be arranged) ﹑ overfill and take place for the thickness of wiring board.
3. step comprises:
The PE diaphragm of dry film is installed on the manual press mold machine, lets manual press mold machine connect source of the gas, and open manual press mold machine total power switch, open press mold machine fuselage starting switch, the HDI wiring board is flattened.
The parameter setting of leveling is: manually press mold machine air pressure is transferred to 4Kg/cm2; Temperature is set at 20 ℃, and speed is transferred to 3m/min, carries out visual to leveling HDI wiring board; Smooth getting final product, the concrete behaviour that the said in addition PE diaphragm with dry film is installed on the manual press mold machine can be:
Pull down manual press mold machine carriage, cleaning roller takes off an end lock tube on the PE film axle, puts on the PE film, refills lock tube, and the two ends lock tube tightens a little; The both hands PE film axle two ends of holding with a firm grip make PE film expansion direction in a clockwise direction, and PE film axle is taken on the pedestal; Aim at left end bayonet socket and firmly extruding left, right-hand member is aimed at simultaneously, and then unclamps hand; Load a PE film with loading onto a method of PE film, lower shaft PE film expansion direction is counterclockwise;
To go up a PE film and be moved to the centre position, locking two ends lock tube, ruler is write down scale value to the PE film edge above rotating, and turns to following ruler then and complies with the alignment of last axle PE film scale PE film and locking two ends up and down on the PE film;
Up and down PE film band is crossed other one side, makes on the roller of bottom of head upset of film, receives on the top roller for top, makes this 4 consistent rotations of roller, reaches the purpose of folding and unfolding.
4. step comprises:
HDI wiring board after the leveling is put into the baking box baking, and baking condition is 150 ℃, baking 30min.
For fear of destroying the brown layer; Cause the plate bursting because adhesion is bad after the pressing, should be noted that the action of taking and placing HDI wiring board in 2. this process of step, take plate must wear anti-oxidation gloves in 1. step; Handle with care, in addition 4. the baking in the step for inserting the frame baking.
The HDI wiring board that finally obtains confirms that through section burying the consent plumpness is 100%.
Claims (8)
1. method of on the HDI wiring board, burying consent comprises:
A, the HDI wiring board of having crossed line carried out the step of brown;
B, the step of burying consent with the wire mark machine;
C, to the treatment step of the resin printing ink on the hole;
The step of d, baking.
2. a kind of method of on the HDI wiring board, burying consent according to claim 1 is characterized in that said c step adopts the mode that resin printing ink is flattened that the resin printing ink on the hole is handled.
3. a kind of method of on the HDI wiring board, burying consent according to claim 1 and 2 is characterized in that the b step comprises: the frame aeroscopic plate is also adjusted aeroscopic plate, makes it to be fixed on the wire mark board face with the wire mark machine web plate kissing merging that has locked;
Fixedly PIN follows closely on aeroscopic plate, and HDI circuit grillage is nailed at aeroscopic plate PIN, uses the wire mark board in the face of the position fine setting, and HDI wiring board and wire mark machine web plate are matched;
The scraper angle of wire mark machine scraper is transferred to 0-15 °, the HDI wiring board is buried consent.
4. a kind of method of on the HDI wiring board, burying consent according to claim 3 is characterized in that said wire mark machine scraper pressure transfers to 5-8 Kg/cm
2, gait of march is controlled at the 2-4 lattice.
5. a kind of method of on the HDI wiring board, burying consent according to claim 2 is characterized in that said c step comprises that the PE diaphragm with dry film is installed on the manual press mold machine, flattens the HDI wiring board.
6. a kind of method of on the HDI wiring board, burying consent according to claim 5, the air pressure that it is characterized in that manual press mold machine is 4-6Kg/cm2, and temperature is 17 ℃-23 ℃, and speed is 2-3m/min.
7. a kind of method of on the HDI wiring board, burying consent according to claim 1 and 2 is characterized in that the said baking of d step is for inserting the frame baking.
8. a kind of method of on the HDI wiring board, burying consent according to claim 1 and 2 is characterized in that the baking condition in the said d step is 140 ℃-160 ℃, and stoving time is 25min-35min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110437166.6A CN102523700B (en) | 2011-12-23 | 2011-12-23 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110437166.6A CN102523700B (en) | 2011-12-23 | 2011-12-23 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
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| Publication Number | Publication Date |
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| CN102523700A true CN102523700A (en) | 2012-06-27 |
| CN102523700B CN102523700B (en) | 2015-05-27 |
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| CN201110437166.6A Active CN102523700B (en) | 2011-12-23 | 2011-12-23 | Method for burying and plugging holes on HDI (high-density interconnection) circuit boards |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411108A (en) * | 2014-11-24 | 2015-03-11 | 东莞康源电子有限公司 | Solder resist ink circuit board manufacture method |
| CN105263268A (en) * | 2015-11-03 | 2016-01-20 | 胜宏科技（惠州）股份有限公司 | Resistance-welding hole filling device and resistance-welding processing method |
| CN107835590A (en) * | 2017-10-18 | 2018-03-23 | 深圳市景旺电子股份有限公司 | A kind of preparation method of buried via hole circuit board |
| CN111093330A (en) * | 2020-01-06 | 2020-05-01 | 东莞市五株电子科技有限公司 | Method for plugging buried hole with resin in circuit board |
| CN113766751A (en) * | 2021-09-28 | 2021-12-07 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006076609A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
| CN101478862A (en) * | 2008-11-29 | 2009-07-08 | 鸿源科技（杭州）有限公司 | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
| CN101720167A (en) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN101772280A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Mesh screen plughole process method |
| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN102248738A (en) * | 2011-04-25 | 2011-11-23 | 衢州威盛精密电子科技有限公司 | Liquid pore-filling vacuum stitching process |
-
2011
- 2011-12-23 CN CN201110437166.6A patent/CN102523700B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006076609A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
| CN101478862A (en) * | 2008-11-29 | 2009-07-08 | 鸿源科技（杭州）有限公司 | Process for blind hole, buried hole, and filled hole of multi-layered high density interconnected printed circuit board |
| CN101720167A (en) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN101772280A (en) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Mesh screen plughole process method |
| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN102248738A (en) * | 2011-04-25 | 2011-11-23 | 衢州威盛精密电子科技有限公司 | Liquid pore-filling vacuum stitching process |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411108A (en) * | 2014-11-24 | 2015-03-11 | 东莞康源电子有限公司 | Solder resist ink circuit board manufacture method |
| CN104411108B (en) * | 2014-11-24 | 2017-07-07 | 东莞康源电子有限公司 | The preparation method of solder mask wiring board |
| CN105263268A (en) * | 2015-11-03 | 2016-01-20 | 胜宏科技（惠州）股份有限公司 | Resistance-welding hole filling device and resistance-welding processing method |
| CN107835590A (en) * | 2017-10-18 | 2018-03-23 | 深圳市景旺电子股份有限公司 | A kind of preparation method of buried via hole circuit board |
| CN111093330A (en) * | 2020-01-06 | 2020-05-01 | 东莞市五株电子科技有限公司 | Method for plugging buried hole with resin in circuit board |
| CN113766751A (en) * | 2021-09-28 | 2021-12-07 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
| CN113766751B (en) * | 2021-09-28 | 2023-03-14 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
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| CN102523700B (en) | 2015-05-27 |
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