CN206164993U - Pressure shot copper device of circuit board - Google Patents
Pressure shot copper device of circuit board Download PDFInfo
- Publication number
- CN206164993U CN206164993U CN201621180540.3U CN201621180540U CN206164993U CN 206164993 U CN206164993 U CN 206164993U CN 201621180540 U CN201621180540 U CN 201621180540U CN 206164993 U CN206164993 U CN 206164993U
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- copper particle
- circuit board
- steel plate
- width
- depressed part
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Abstract
The utility model discloses a pressure shot copper device of circuit board, including the circuit edition of books body, press, shot copper and steel sheet, the press is including the probe, the shot copper includes shot copper body and the bellying of protrusion in shot copper body surface, be provided with big or small shape and shot copper assorted depressed part on the circuit edition of books body, the width that the one side of bellying was kept away from to the shot copper body omits the width that is less than the depressed part top surface, the width that the one side of shot copper body was kept away from to the bellying omits the width that is greater than the depressed part bottom surface, the steel sheet includes steel sheet and lower steel sheet, the steel sheet is used for filling up below the circuit edition of books body down, prevents that the circuit edition of books body receives the pollution and influences the circuit, going up the steel sheet and being used for pressing on the circuit edition of books body of placing the shot copper, fixed shot copper prevents that the shot copper from shifting.
Description
Technical field
The utility model is related to field of circuit boards, more particularly, to a kind of pressure copper particle device of circuit board.
Background technology
With the development of IC technologies, it is desirable to which the circuit of circuit board and hole design are more and more intensive, and intensive circuit is to radiating
More and more higher is required, so to improve radiating effect, at present many clients can in the circuit board be embedded in copper particle, to accelerate pcb board
The rate of heat dispation of middle components and parts.The method of the embedded copper particle in conventional art is typically artificial to put copper particle into circuit board depression
Place, but in actual production process, manually carries out pressing the efficiency of copper particle low and using artificial vision, manually carry out the right of copper particle
Position, easily causes skew, causes scrapping for wiring board and copper particle.
Utility model content
In view of this, the technical problems to be solved in the utility model be to provide it is a kind of easily, efficiency high and align essence
The pressure copper particle device of accurate circuit board, specific technical scheme is as follows：
A kind of pressure copper particle device of circuit board, described pressure copper particle device includes circuit board body, press, copper particle and steel
Plate；Described press includes probe, for compressing copper particle；Described copper particle includes copper particle body and protrudes from copper particle body surface
Lug boss；The depressed part that size shape matches with copper particle is provided with described circuit board body；Described copper particle body
The width of depressed part top surface is slightly less than away from the width of the one side of lug boss so as to which copper particle can be completely embedded into depressed part；It is described
Lug boss away from the one side of copper particle body width slightly larger than depressed part bottom surface width, for clamping copper particle body；It is described
Steel plate include upper steel plate and lower steel plate；Described lower steel plate is used for pad below circuit board body, prevents circuit board body from receiving
Pollute and affect circuit；Described upper steel plate is used to be pressed in above the circuit board body for being placed with copper particle, fixed copper particle, prevents copper
Grain displacement.
Further improvement of these options is that described lug boss is cylinder, cuboid or prismatoid.
Further improvement of these options is that described lug boss is chamfering away from the edge of the one side of copper particle body.
Further improvement of these options is that the area of the upper and lower steel plate is more than or equal to described circuit board sheet
The area of body.
Further improvement of these options is that the cross-sectional area of described probe is more than or equal to the horizontal stroke of described copper particle
Area of section.
Compared with prior art, the utility model has the advantage that：
1. it is easily guided into, the copper particle lug boss in this device adopts Chamfer Edge so as to import more when depressed part is put into
Easily, using away from copper particle body one side and the stand out of depressed part bottom surface, copper particle and depressed part clamping are made；
2. strengthen radiating effect, copper particle is embedded in the circuit board, using the good heat dispersion of copper particle itself, will be arranged on
The heat of the components and parts on circuit board sheds in time, enhances radiating effect；
3. improve production efficiency, the artificial pressure copper particle of conventional method utilization, can only once press 1 copper particle, and utilize this device
Disposably the copper particle in circuit board body can be compressed；
4. accurate positioning, relies on vision, Manual-alignment in traditional production process, easily causes contraposition skew, causes electricity
Road plate body and copper particle scrap, and this device is using the positioning of upper and lower steel plate, it is to avoid the contraposition that visual fatigue and deviation are caused
Inaccurate problem and scrapping for producing；
5. product quality is improved, and the area of the upper and lower steel plate of the device is more than or equal to the area of circuit board body；Probe
Cross-sectional area in or equal to the area of copper particle body, the uniformity of the pressure being effectively guaranteed during pressure copper particle is protected
The planarization of circuit board is demonstrate,proved.
Description of the drawings
Fig. 1 is a kind of structural representation of the pressure copper particle device of circuit board of the utility model.
Fig. 2 is the structural representation of copper particle in the present embodiment 1.
Fig. 3 is the structural representation of copper particle in the present embodiment 2.
Fig. 4 is the structural representation of copper particle in the present embodiment 3.
Wherein, 1 is probe；2 is upper steel plate；3 is circuit board body；4 is lower steel plate；5 is the first release liners；6 is copper particle；
71 is copper particle body；81 is lug boss；72 is copper particle body；82 is lug boss；73 is copper particle body；83 is lug boss；9 is
Two release liners.
Specific embodiment
For the ease of it will be appreciated by those skilled in the art that entering to advance to the utility model below in conjunction with accompanying drawing and embodiment
One step is described in detail.
Embodiment 1
As shown in Figure 1 and Figure 2, the pressure copper particle device of a kind of circuit board, described pressure copper particle device include circuit board body 3,
Press, copper particle 6 and steel plate；Described press includes probe 1, for compressing copper particle 6；Described copper particle 6 includes copper particle body 71
With the lug boss 81 for protruding from the surface of copper particle body 71；Size shape is provided with described circuit board body 3 with the phase of copper particle 6
The depressed part matched somebody with somebody.
Copper particle lug boss 81 in the present embodiment be cylinder, in the cylinder away from copper particle body 71 one side side
Edge is chamfering, and the width in the face is slightly larger than the width of depressed part bottom surface, specially more than 0.001-0.003 inches.
Described copper particle body 71 is slightly less than the width of depressed part top surface away from the width of the one side of lug boss 81, specially
Less than 0.004-0.006 inches so as to which copper particle 6 can be completely embedded into depressed part；Because the edge is chamfering, it is put into copper particle recessed
During sunken portion, it is easily guided into, and using the pressure of the press in addition of stand out between copper particle and depressed part so that copper particle tightly blocks
In the depressed part of circuit board.
Dust or other pollutants are caught in order to ensure that circuit board is non-sticky in process of production, prevents from damaging circuit, it is described
Steel plate include upper steel plate 2 and lower steel plate 4, lower steel plate 4 is used for pad below circuit board body 3, prevents circuit board body 3 from getting dirty
Contaminate and affect circuit；And upper steel plate 2 is used to be pressed in above the circuit board body 3 for being placed with copper particle 6, fixed copper particle 6 prevents copper particle
6 displacements.
In in order to ensure production process, copper particle is pressed into the overall planarization after circuit board body, the upper steel plate 2, under
The area of steel plate 4 is more than the area of described circuit board body 3, and the cross-sectional area of described probe 1 is more than described copper particle sheet
The area of body；I.e. described upper steel plate 2 and lower steel plate 4 is completely covered circuit board body 3, and the cross-sectional area of probe 1 covers completely
The cross-sectional area of lid copper particle, it is ensured that during pressure copper particle, pressure is equably pressed on copper particle probe 1, prevents due to pressure
Power is uneven and offset copper particle, the situation of product rejection is produced.
The method of operating of pressure copper particle device above is as follows：
A, clean steel：With the viscous alcohol cleaning upper steel plate 2 of non-dust cloth and the surface dirt of lower steel plate 4 and foreign debris, it is to avoid
Circuit board body surface produces indenture；
B, put the first release liners 5：The first release liners 5 are placed on lower steel plate, the first described release liners 5 are to circuit board sheet
Body shields, it is to avoid circuit board body surface is contaminated；
C, placement circuit board body 3：Circuit board body 3 is placed on above the first release liners 5；
D, manually placement copper particle 6：Copper particle 6 is placed in the depressed part of circuit board body 3；
E, put the second release liners 9：The second release liners 9 are put in 3 faces in the circuit board body of Step d, it is to avoid copper particle 6 is subject to dirt
Dye and impression；
F, placement upper steel plate 2：Topmost, i.e. upper steel plate 2 is placed in the top of circuit board body 3 of step e, using upper steel plate
2 weight, stable, protective effect is played to copper particle 6, it is to avoid its displacement；
G, pressure copper particle 6：Lower steel plate 4, the first release liners 5, circuit board body 3, the second release liners 9 that f steps are folded in advance
Send into together in the platform of press with upper steel plate 2, according to set time, pressure parameter produced, using press probe 1 will
Copper particle 6 is pressed onto in the depressed part of circuit board body 3, and the work for pressing copper particle is completed after compressor operation terminates.
For improve production efficiency, in the state of press pressure is allowed, pre- folded method that can be according to more than is carried out simultaneously
The pressure copper particle operation of two pieces or two pieces circuit board bodies.
The area of the upper steel plate 2, lower steel plate 4 in the present embodiment can also be equal to the face of described circuit board body 3
Product；The area of the also equal to described copper particle body of the cross-sectional area of described probe 1.
Embodiment 2
As shown in figure 3, the present embodiment is different from embodiment 1, copper particle lug boss is cuboid, in described cuboid
It is chamfering away from the edge of the one side of copper particle body, and the width in the face is slightly larger than the width of depressed part bottom surface, is specially more than
0.001-0.003 inches.
Described copper particle body 72 is slightly less than the width of depressed part top surface away from the width of the one side of lug boss 82, specially
Less than 0.004-0.006 inches so as to which copper particle 6 can be completely embedded into depressed part；Because the edge is chamfering, it is put into copper particle recessed
During sunken portion, it is easily guided into, and using the pressure of the press in addition of stand out between copper particle and depressed part so that copper particle tightly blocks
In the depressed part of circuit board.
Embodiment 3
As shown in figure 4, the present embodiment above example, copper particle lug boss is prismatoid, in the prismatoid away from
The edge of the one side of copper particle body is chamfering, and the width in the face is slightly larger than the width of depressed part bottom surface, is specially more than
0.001-0.003 inches.
Described copper particle body 73 is slightly less than the width of depressed part top surface away from the width of the one side of lug boss 83, specially
Less than 0.004-0.006 inches so as to which copper particle 6 can be completely embedded into depressed part；Because the edge is chamfering, it is put into copper particle recessed
During sunken portion, it is easily guided into, and using the pressure of the press in addition of stand out between copper particle and depressed part so that copper particle tightly blocks
In the depressed part of circuit board.
The copper particle lug boss in pressure copper particle device in above example adopts Chamfer Edge so as to when depressed part is put into
Importing is easier, and using away from copper particle body one side and the stand out of depressed part bottom surface, makes copper particle and depressed part clamping；
It is embedded in the circuit board copper particle, using the good heat dispersion of copper particle itself, will arrange unit on circuit boards
The heat of device sheds in time, enhances radiating effect；The device also changes traditional artificial pressure copper particle method, disposably will
Copper particle in circuit board body is compressed；Avoid the inaccurate problem of contraposition that the visual fatigue and deviation of traditional manual operation causes
And produce scrap；And this device is also effectively guaranteed the uniformity of the pressure during pressure copper particle, it is ensured that circuit board
Planarization.
It is above wherein specific implementation of the present utility model, therefore its description is more concrete and detailed, but can not be
And it is interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the concept of the premise utility, some deformations and improvement can also be made, these obviously replace shape
Formula belongs to protection domain of the present utility model.
Claims (5)
1. the pressure copper particle device of a kind of circuit board, it is characterised in that：Described pressure copper particle device include circuit board body, press,
Copper particle and steel plate；Described press includes probe, for compressing copper particle；Described copper particle includes copper particle body and protrudes from copper particle
The lug boss of body surface；The depressed part that size shape matches with copper particle is provided with described circuit board body；Described
Copper particle body is slightly less than the width of depressed part top surface away from the width of the one side of lug boss so as to which copper particle can be completely embedded into depression
Portion；Described lug boss is slightly larger than the width of depressed part bottom surface away from the width of the one side of copper particle body, for clamping copper particle sheet
Body；Described steel plate includes upper steel plate and lower steel plate；Described lower steel plate is used for pad below circuit board body, prevents circuit board
Body it is contaminated and affect circuit；Described upper steel plate is used to be pressed in above the circuit board body for being placed with copper particle, fixed copper particle,
Prevent copper particle from shifting.
2. the pressure copper particle device of circuit board according to claim 1, it is characterised in that：Described lug boss be cylinder,
Cuboid or prismatoid.
3. the pressure copper particle device of circuit board according to claim 2, it is characterised in that：Described lug boss is away from copper particle sheet
The edge of the one side of body is chamfering.
4. the pressure copper particle device of circuit board according to claim 1, it is characterised in that：The area of the upper and lower steel plate is big
In or equal to the area of described circuit board body.
5. the pressure copper particle device of circuit board according to claim 1, it is characterised in that：The cross-sectional area of described probe is big
In or equal to the cross-sectional area of described copper particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621180540.3U CN206164993U (en) | 2016-10-28 | 2016-10-28 | Pressure shot copper device of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621180540.3U CN206164993U (en) | 2016-10-28 | 2016-10-28 | Pressure shot copper device of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206164993U true CN206164993U (en) | 2017-05-10 |
Family
ID=58657333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621180540.3U Active CN206164993U (en) | 2016-10-28 | 2016-10-28 | Pressure shot copper device of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206164993U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110804757A (en) * | 2019-11-27 | 2020-02-18 | 镇江耐丝新型材料有限公司 | A copper grain levels frock for in copper facing tank |
-
2016
- 2016-10-28 CN CN201621180540.3U patent/CN206164993U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110804757A (en) * | 2019-11-27 | 2020-02-18 | 镇江耐丝新型材料有限公司 | A copper grain levels frock for in copper facing tank |
| CN110804757B (en) * | 2019-11-27 | 2024-02-20 | 镇江耐丝新型材料有限公司 | Copper particle leveling tool used in copper plating tank |
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