CN111093330A - Method for plugging buried hole with resin in circuit board - Google Patents
Method for plugging buried hole with resin in circuit board Download PDFInfo
- Publication number
- CN111093330A CN111093330A CN202010010699.5A CN202010010699A CN111093330A CN 111093330 A CN111093330 A CN 111093330A CN 202010010699 A CN202010010699 A CN 202010010699A CN 111093330 A CN111093330 A CN 111093330A
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- Prior art keywords
- holes
- resin
- board
- multilayer board
- buried
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011347 resin Substances 0.000 title claims abstract description 66
- 229920005989 resin Polymers 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000007650 screen-printing Methods 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 238000005553 drilling Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 3
- 238000004880 explosion Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000004743 Polypropylene Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Abstract
The invention discloses a method for plugging holes in a buried hole of a circuit board by resin, which comprises the following steps: providing a multi-layer board to be plugged with holes after electroplating; manufacturing an inner layer circuit on the multilayer board; carrying out browning treatment on the multilayer board; carrying out resin hole plugging on buried holes in the multilayer board by using a screen printer and a screen printing plate; leveling the resin protruding out of the buried hole by using a leveling machine; baking the multilayer board by adopting heating equipment; and carrying out outer layer pressing on the multilayer board. According to the method for filling the holes in the buried hole with the resin for the circuit board, which is provided by the invention, through the process technology of filling the holes with the resin after browning, the trouble of a thin resin plate grinding in the prior art is solved, the problem of expansion and shrinkage caused by the thin resin plate filling hole grinding is avoided, on the other hand, the problem of plate explosion caused by glue shortage of thin PP pressing filling glue is solved, and the good reliability of the product is ensured.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for plugging buried holes of a circuit board with resin.
Background
An hdi (high Density interconnect) board, i.e., a high Density interconnect board, is a circuit board with a relatively high line distribution Density using micro-blind via-burying technology. The HDI board is provided with an inner layer circuit and an outer layer circuit, and the inside of each layer of circuit is connected by utilizing the processes of drilling, in-hole metallization and the like.
At present, the plate thickness of the high-order HDI plate is thinner and thinner, after the first pressing, the plate thickness is about 0.40mm, the number of the buried holes may reach 14 ten thousand holes/pnl, and the second pressing PP (Prepreg) is 106 or 1037 and other thin PPs. The existing HDI board buried hole resin plug hole flow is as follows: buried hole electroplating-resin hole plugging-baking plate-grinding plate-inner layer circuit manufacturing-AOI (Automated Optical Inspection) -pressing. Because the problem of glue shortage and plate explosion layering after thin PP (polypropylene) is pressed exists when resin plugging is not performed on buried holes in the HDI (high density interconnector) plate, the conventional method needs to perform resin plugging on the buried holes. However, in practical application, after the resin holes are filled and cured, the grinding process cannot be performed due to the thinness of the sheet, and the problem of the expansion and shrinkage of the sheet grinding plate is serious, which causes great trouble to production.
In order to overcome the problem, the invention provides a method for filling holes in circuit board buried holes by resin.
Disclosure of Invention
The invention provides a method for plugging a buried hole of a circuit board with resin, which aims to overcome the defects of the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a method of burying holes in resin for plugging holes in a circuit board, the method comprising:
providing a multi-layer board to be plugged with holes after electroplating;
manufacturing an inner layer circuit on the multilayer board;
carrying out browning treatment on the multilayer board;
carrying out resin hole plugging on buried holes in the multilayer board by using a screen printer and a screen printing plate;
leveling the resin protruding out of the buried hole by using a leveling machine;
baking the multilayer board by adopting heating equipment;
and carrying out outer layer pressing on the multilayer board.
Further, in the method for burying holes in resin for plugging holes in a circuit board, before the step of providing the plated multilayer board to be plugged with holes, the method further comprises the following steps:
pressing the prepared inner core board and the prepreg to obtain a multilayer board;
drilling the multilayer board to form buried holes;
and electroplating the multilayer board.
Further, in the method for filling holes in buried holes of a circuit board with resin, before the step of pressing the prepared inner core board and prepreg to obtain a multilayer board, the method further comprises:
providing a light plate;
and drilling the light plate to form a silk screen printing plate corresponding to the multilayer plate.
Furthermore, in the method for burying holes in the circuit board by resin for plugging the holes, the thickness of the optical plate is 0.2mm, and the hole diameter of the drilled hole is D +0.1 mm.
Further, in the method for filling holes in the buried holes of the circuit board by resin, the pressure of a scraper of the screen printing machine is 6Kg/cm2The scraper speed is 2 grids, the scraper angle is 14 degrees, and the mesh distance is 4 mm.
Further, in the method for plugging holes in the buried hole of the circuit board with resin, the step of leveling the resin protruding out of the buried hole by using a leveling machine includes:
carrying out primary leveling treatment on the resin protruding out of the buried hole by using a leveling machine;
and carrying out secondary leveling treatment on the resin protruding out of the buried hole by using a leveling machine.
Further, in the method for filling the holes in the buried holes of the circuit board with the resin, the speed of the leveling machine is 4.5 m/min.
Further, in the method for burying the hole and plugging the hole with the resin for the circuit board, the baking temperature of the heating equipment is 150 ℃, and the baking time is 40 min.
Further, in the method for filling holes in the circuit board by burying the holes with resin, before the step of performing browning treatment on the multilayer board, the method further comprises the following steps:
and carrying out AOI detection on the inner layer circuit.
Further, in the method for filling holes in the circuit board by burying the holes with resin, the step of performing browning treatment on the multilayer board comprises:
and performing browning treatment on the multilayer board which is detected to be intact by AOI.
According to the method for plugging the holes of the circuit board by the buried hole resin, provided by the embodiment of the invention, through the process technology of plugging the holes by the resin after browning, the trouble of a thin resin plate grinding in the prior art is solved, the problem of expansion and shrinkage caused by the thin resin plate plugging grinding is avoided, on the other hand, the problem of plate explosion caused by glue shortage of thin PP pressing filling is solved, and the good reliability of the product is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic flow chart of a method for plugging holes in a circuit board by using resin for burying holes according to an embodiment of the present invention;
FIG. 2 is a diagram illustrating the results of a reliability test in an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
Referring to fig. 1, a schematic flow chart of a method for plugging holes in buried holes of a circuit board by using resin according to an embodiment of the present invention is provided, and the method is suitable for a scenario in which holes are plugged in buried holes of an HDI board with a thinner and thinner board thickness by using resin. The method specifically comprises the following steps:
s101, providing a multilayer board to be plugged with holes after electroplating;
specifically, before the step S101, the method further includes:
(1) pressing the prepared inner core board and the prepreg to obtain a multilayer board;
(2) drilling the multilayer board to form buried holes;
(3) and electroplating the multilayer board.
S102, manufacturing an inner layer circuit on the multilayer board;
s103, performing browning treatment on the multilayer board;
it should be noted that the purpose of this step is to increase the roughness of the resin, so as to prepare for the subsequent resin plugging and bonding processes.
Specifically, before the step S103, the method further includes:
and carrying out AOI detection on the inner layer circuit.
Then, the step S103 specifically includes:
and performing browning treatment on the multilayer board which is detected to be intact by AOI.
S104, plugging holes in the buried holes in the multilayer board with resin by using a screen printer and a screen printing plate;
the pressure of the scraper of the screen printing machine is 6Kg/cm2The scraper speed is 2 grids, the scraper angle is 14 degrees, and the mesh distance is 4 mm.
Specifically, the pressure of the scraper of the screen printer is adjusted to 6Kg/cm2The scraper speed is adjusted to be 2 grids, the scraper angle is adjusted to be 14 degrees, the mesh distance is 4mm, then the silk screen printing plate is aligned to the multilayer board to be placed, resin is filled into the buried hole through the silk screen printing plate, the depth of the hole is larger than 100%, and even if the resin overflows out of the buried hole.
Specifically, before the step S101, the method further includes:
providing a light plate;
and drilling the light plate to form a silk screen printing plate corresponding to the multilayer plate.
Wherein the plate thickness of the optical plate is 0.2mm, and the bore diameter of the drill hole is D +0.1 mm.
S105, leveling the resin protruding out of the buried hole by using a leveling machine;
it should be noted that the speed of the leveler is 4.5 m/min.
Specifically, the step S105 further includes:
carrying out primary leveling treatment on the resin protruding out of the buried hole by using a leveling machine;
and carrying out secondary leveling treatment on the resin protruding out of the buried hole by using a leveling machine.
In this example, the purpose of the two levels with the leveler was to leave no significant residue on the orifice and the plate surface, since it was found in the experiment that visible ink residue was still present on the orifice and the plate surface when only one level of leveling was performed.
S106, baking the multilayer board by adopting heating equipment;
the baking temperature of the heating equipment is 150 ℃, and the baking time is 40 min.
And S107, performing outer layer pressing on the multilayer board.
It should be noted that, in the embodiment, when reliability tests are performed after the outer layer is pressed and after the finished product is finished, the test result shows that: the finished product subjected to the resin hole plugging process after the browning has no explosion plate layering abnormality in both an IR furnace and a thermal shock test; and comparing the results of leveling once and twice after plugging, the reliability test effect of leveling twice is obviously better, and particularly, refer to fig. 2.
According to the method for plugging the holes of the circuit board by the buried hole resin, provided by the embodiment of the invention, through the process technology of plugging the holes by the resin after browning, the trouble of a thin resin plate grinding in the prior art is solved, the problem of expansion and shrinkage caused by the thin resin plate plugging grinding is avoided, on the other hand, the problem of plate explosion caused by glue shortage of thin PP pressing filling is solved, and the good reliability of the product is ensured.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for plugging a buried hole of a circuit board with resin, which is characterized by comprising the following steps:
providing a multi-layer board to be plugged with holes after electroplating;
manufacturing an inner layer circuit on the multilayer board;
carrying out browning treatment on the multilayer board;
carrying out resin hole plugging on buried holes in the multilayer board by using a screen printer and a screen printing plate;
leveling the resin protruding out of the buried hole by using a leveling machine;
baking the multilayer board by adopting heating equipment;
and carrying out outer layer pressing on the multilayer board.
2. The method for burying holes in resin for plugging holes in a wiring board as recited in claim 1, wherein said method further comprises, prior to said step of providing a plated multilayer board to be plugged, the steps of:
pressing the prepared inner core board and the prepreg to obtain a multilayer board;
drilling the multilayer board to form buried holes;
and electroplating the multilayer board.
3. The method for burying holes in resin plug holes of circuit board according to claim 2, wherein before said step of pressing prepared inner core board and prepreg to obtain multilayer board, said method further comprises:
providing a light plate;
and drilling the light plate to form a silk screen printing plate corresponding to the multilayer plate.
4. The method of claim 3, wherein the plate is 0.2mm thick and the bore diameter is D +0.1 mm.
5. The method for burying holes in resin for plugging holes in circuit board as claimed in claim 1, wherein the scraper pressure of said screen printer is 6Kg/cm2The scraper speed is 2 grids, the scraper angle is 14 degrees, and the mesh distance is 4 mm.
6. The method for filling holes with resin through holes buried in a circuit board according to claim 1, wherein the step of leveling the resin protruding out of the buried holes by using a leveling machine comprises the steps of:
carrying out primary leveling treatment on the resin protruding out of the buried hole by using a leveling machine;
and carrying out secondary leveling treatment on the resin protruding out of the buried hole by using a leveling machine.
7. The method for burying holes in resin plug holes of circuit board according to claim 6, wherein the speed of said leveling machine is 4.5 m/min.
8. The method for burying holes in resin for plugging holes in circuit board according to claim 1, wherein said heating device is baked at 150 ℃ for 40 min.
9. The method for burying holes in resin plug holes in a wiring board according to claim 1, wherein prior to said step of browning said multilayer board, said method further comprises:
and carrying out AOI detection on the inner layer circuit.
10. The method for burying holes in resin plug holes of circuit board according to claim 9, wherein said step of browning said multilayer board comprises:
and performing browning treatment on the multilayer board which is detected to be intact by AOI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010010699.5A CN111093330A (en) | 2020-01-06 | 2020-01-06 | Method for plugging buried hole with resin in circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010010699.5A CN111093330A (en) | 2020-01-06 | 2020-01-06 | Method for plugging buried hole with resin in circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111093330A true CN111093330A (en) | 2020-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010010699.5A Pending CN111093330A (en) | 2020-01-06 | 2020-01-06 | Method for plugging buried hole with resin in circuit board |
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| Country | Link |
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| CN (1) | CN111093330A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165771A (en) * | 2020-09-23 | 2021-01-01 | 通元科技(惠州)有限公司 | Hole plugging screen plate and method for processing PCB (printed Circuit Board) through hole plugging screen plate |
| CN113194610A (en) * | 2021-03-23 | 2021-07-30 | 江门市奔力达电路有限公司 | Grinding-free manufacturing method for high-density interconnection lamination circuit board buried hole plug resin |
| CN113524885A (en) * | 2021-07-17 | 2021-10-22 | 江苏本川智能电路科技股份有限公司 | Thick copper plate solder mask printing equipment and printing method thereof |
| CN113766751A (en) * | 2021-09-28 | 2021-12-07 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
| CN114603417A (en) * | 2022-03-31 | 2022-06-10 | 生益电子股份有限公司 | PCB grinding method, PCB back grinding device and PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112165771A (en) * | 2020-09-23 | 2021-01-01 | 通元科技(惠州)有限公司 | Hole plugging screen plate and method for processing PCB (printed Circuit Board) through hole plugging screen plate |
| CN113194610A (en) * | 2021-03-23 | 2021-07-30 | 江门市奔力达电路有限公司 | Grinding-free manufacturing method for high-density interconnection lamination circuit board buried hole plug resin |
| CN113524885A (en) * | 2021-07-17 | 2021-10-22 | 江苏本川智能电路科技股份有限公司 | Thick copper plate solder mask printing equipment and printing method thereof |
| CN113766751A (en) * | 2021-09-28 | 2021-12-07 | 信利半导体有限公司 | Compound screen plate for plugging holes and manufacturing process thereof |
| CN114603417A (en) * | 2022-03-31 | 2022-06-10 | 生益电子股份有限公司 | PCB grinding method, PCB back grinding device and PCB |
| CN114603417B (en) * | 2022-03-31 | 2023-01-24 | 生益电子股份有限公司 | PCB grinding method, PCB back grinding device and PCB |
| WO2023184727A1 (en) * | 2022-03-31 | 2023-10-05 | 生益电子股份有限公司 | Pcb grinding method, pcb regrinding device, and pcb |
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Application publication date: 20200501 |
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