CN111107717A

CN111107717A - Processing method of PCB capable of preventing finger from scratching

Info

Publication number: CN111107717A
Application number: CN201911214825.2A
Authority: CN
Inventors: 陈洁亮; 黄蝉; 廖群良
Original assignee: Xinqiang Electronics Qingyuan Co ltd
Current assignee: Xinqiang Electronics Qingyuan Co ltd
Priority date: 2019-12-02
Filing date: 2019-12-02
Publication date: 2020-05-05

Abstract

The invention relates to the technical field of PCB processing, and discloses a method for processing a PCB capable of preventing finger scratching. According to the invention, before the PCB forming operation, the hot setting oil is printed and selected on the fingers, so that the phenomenon of scratching of the PCB during the forming processing can be effectively prevented, the rejection rate of the PCB caused by the scratching phenomenon is reduced, the quality of the product is improved, the production efficiency is accelerated, the appearance of the product is free of defects, the rejection of the product caused by unqualified appearance of the product is avoided, and the competitiveness of an enterprise is improved.

Description

Processing method of PCB capable of preventing finger from scratching

Technical Field

The invention relates to the technical field of PCB processing, in particular to a method for processing a PCB capable of preventing fingers from scratching.

Background

With the rapid development of electronic technology, communication technology gradually moves to the foreground, and people's daily life and work are carried forward, people's living habits are changed, so that required signals are transmitted, and a PCB serves as a main channel for transmitting signals, and the development of the PCB towards high density is inevitable trend in order to meet the requirements.

The Chinese patent discloses a PCB processing method and a PCB (grant publication No. CN104470211A), the technology of the patent shows that a coated surface coating layer is not damaged by a high-temperature laminating process, the weldability of a finished PCB is not influenced, but the influence of fingers on the PCB in the processing process can not be ensured, the phenomenon of scratching is easily caused, and the delivery quality is influenced. Therefore, those skilled in the art have provided a method for processing a PCB panel to prevent finger scratch, so as to solve the above problems in the background art.

Disclosure of Invention

The invention aims to provide a method for processing a PCB (printed circuit board) capable of preventing fingers from being scratched, so as to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme:

the processing method of the PCB capable of preventing the finger from scratching comprises copper-clad plates, wherein the number of the copper-clad plates is not less than two, and a layer of copper foil is arranged at the top end of the copper-clad plate on the uppermost layer and at the bottom end of the copper-clad plate on the lowermost layer.

As a still further scheme of the invention: and a layer of prepreg is arranged between the copper-clad plate and between the copper-clad plate and the copper foil.

As a still further scheme of the invention: the prepreg is composed of glass fiber cloth and resin, and the resin is in a semi-cured state.

As a still further scheme of the invention: the realization method comprises the following steps:

s1: selecting a proper copper-clad plate large material according to the requirement, cutting the large material into a set size according to the requirement, polishing the corner of a cutting plate, removing dust on the cutting plate, and keeping the cutting plate dry;

s2: laminating the copper-clad cut board obtained in the step S1, a prepreg and copper foil according to a set number according to requirements, pressing at a high temperature and a high pressure, rotating a drill at a high speed by using a drilling machine to form a through cutting force, drilling a required hole in the laminated board to conduct the layers, forming a tool hole required by a post-processing procedure and a welding jack of an element, and plating the hole with a copper layer by using chemical liquid to conduct the layers;

s3: pressing the dry film on the electroplating plate obtained in the step S2, transferring the required image to the dry film through the negative plate by using an exposure machine, and developing, etching and stripping the image by using chemicals to obtain the required image circuit;

s4: performing line detection on the plate obtained in the step S3 by using AOI (automatic optical inspection) to finish the manufacture of an outer layer line, soaking an epoxy resin into a reinforcing material, performing double-sided layer addition through hot pressing, pressing the resin into the holes through pressure by virtue of the fluidity of the resin at high temperature to fill or half fill the holes, rotating a drill bit at high speed by using a drilling machine to form a through-cutting force, drilling the holes which are originally filled in the laminated plate again to form the holes, conducting the layers again, forming tool holes required by post-processing and welding jacks of elements, plating copper layers on the holes by using chemical liquid medicine again to conduct the layers, and forming a passage;

s5: drilling holes in two aluminum sheets, wherein the holes in one aluminum sheet comprise a mechanical blind hole with an inner layer of L1-4 and a through hole with an inner layer of L1-8, the holes in the other aluminum sheet comprise holes with an inner layer of L8-5, plugging the two sides of the aluminum sheet, pressing resin ink into the holes obtained in S4 under the pressure of vacuum and a printing knife, and then performing high-temperature curing;

s6: leveling the resin ink on the PCB obtained in the step S4 by using a ceramic grinding brush and a non-woven fabric grinding brush, pressing a dry film on the PCB, transferring a required image to the dry film through a negative plate by using an exposure machine, and developing, etching and removing the image by using chemicals to obtain a required image circuit;

s7: performing line detection on the PCB obtained in the step S6 by using AOI (automatic optical inspection) to finish the manufacture of an outer layer line, and then, silk-screen printing solder resist ink and exposure development are performed on the line of the PCB to manufacture an image;

s8: printing and selecting thermosetting oil on the fingers to prevent the fingers from being scratched;

s9: printing required characters in the PCB obtained in the S8;

s10: performing surface treatment on the PCB obtained in the step S9, plating a layer of nickel on a surface conductor of the PCB in an electroplating mode, then plating a layer of gold, cutting the PCB into a shape required by design, and then removing the thermosetting oil on the fingers;

s11: carrying out open short circuit bare board test on the finished product to find electrical defects such as short circuit, open circuit and electric leakage;

s12: and (5) carrying out appearance detection on the finished product to ensure that the appearance is free from defects.

Compared with the prior art, the invention has the beneficial effects that:

before the PCB forming operation, the hot setting oil is printed and selected on the fingers, so that the phenomenon of scratching of the PCB during forming processing can be effectively prevented, the rejection rate of the PCB caused by the phenomenon of scratching is reduced, the quality of a product is improved, the production efficiency is accelerated, the appearance of the product is free of defects, the product is prevented from being scrapped due to unqualified appearance, and the competitiveness of an enterprise is improved.

Drawings

FIG. 1 is a process flow diagram of a method for processing a PCB board for preventing finger scratches.

Detailed Description

Referring to fig. 1, in an embodiment of the present invention, a method for processing a Printed Circuit Board (PCB) capable of preventing finger scratches includes at least two copper-clad plates, and a layer of copper foil is disposed on both a top end of an uppermost copper-clad plate and a bottom end of a lowermost copper-clad plate.

In this embodiment, preferably, a layer of prepreg is disposed between the copper-clad plate and the copper-clad plate, and between the copper-clad plate and the copper foil.

In this embodiment, preferably, the prepreg is composed of a glass fiber cloth and a resin, and the resin is in a semi-cured state.

In this embodiment, preferably, the implementation method includes the following steps:

s2: the copper-clad cut board obtained in the step S1, a prepreg and copper foil are overlapped together according to a set number as required, and then are pressed in a high-temperature and high-pressure state, a drill bit is rotated at a high speed by a drilling machine to form a through cutting force, required holes are drilled in the laminated board to enable the layers to be communicated, tool holes required by post-processing and welding jacks of elements are formed, so that the post-processing is convenient to process and position, the holes are plated with copper layers by chemical liquid, the layers are communicated with one another to form a passage, the prepreg is heated and cured to bond a plurality of copper-clad core boards and the copper foils together under the high-temperature and high-pressure condition, the copper foils are positioned at the upper end and the lower end of the whole laminated board, the warp and weft directions of the prepreg in the same laminated board must be consistent to ensure the flat board, and the phenomenon that after the laminated board is heated. The temperature of the pressing is divided into three stages: the pressure of pressfitting is divided into four stages: prepressing, medium-pressure, full-pressure and pressure reduction to ensure that volatile matters between layers are discharged in time, improve the fluidity of resin, ensure the adhesion degree and reduce the internal stress of the laminate;

s3: pressing a dry film on the electroplating plate obtained in the step S2, transferring a required image to the dry film through a negative plate by using an exposure machine, developing, etching and stripping the image by using chemicals to obtain a required image circuit, wherein the developing function is to wash away the dry film which does not undergo polymerization reaction by using alkali liquor, the dry film which undergoes polymerization reaction is reserved on the plate surface as a corrosion-resistant protective layer during etching, the etching function is to etch away copper exposed after development by using liquid medicine to form an inner layer circuit pattern, and the stripping function is to strip the corrosion-resistant layer which protects the copper surface by using strong alkali to expose the circuit pattern;

s4: performing circuit detection on the board obtained in the step S3 by using AOI (automatic optical inspection) to complete the manufacture of an outer layer circuit, feeding back an image to equipment by an optical emission principle, comparing the image with a set data image to detect the defects of the PCB in each production process so as to repair or scrap the defects to ensure the quality of the PCB and find the problems existing in the previous process in time, soaking an epoxy resin into a reinforcing material, performing hot pressing to increase layers on two sides, pressing the holes into the holes by means of the flowability of the resin at high temperature through pressure to fill or half-fill the holes, wherein the reinforcing material can be glass fiber cloth, paper base and a composite material, then using a drilling machine to rotate a drill at high speed to form a through-cutting force, re-drilling the originally filled holes into the pressed board, re-conducting the layers to form tool holes and welding insertion holes of elements required by the post-process, plating a copper layer on the hole by using the chemical liquid medicine again to ensure that the layers are communicated with each other, thereby forming a passage;

s7: performing line detection on the PCB obtained in the step S6 by using AOI (automatic optical inspection) to finish the manufacture of an outer layer line, then, silk-screen printing solder mask ink and exposure development are performed on the line of the PCB to manufacture an image, so that the line of the PCB is permanently protected by the solder mask ink to prevent the problem of open short circuit caused by line oxidation or careless scratch, and the solder mask ink can be selected from time-proof ink, gold plating-proof ink or insulating medium ink;

s8: printing and selecting thermosetting oil on fingers to prevent the fingers from being scratched, wherein the main component of the thermosetting oil is formed by mixing polyvinyl chloride (PVC) with phthalate, a color fixing agent, a stabilizer and a thickening agent;

s9: printing required characters in the PCB obtained in the S8;

s10: performing surface treatment on the PCB obtained in the step S9, plating a layer of nickel on a surface conductor of the PCB in an electroplating mode, and then plating a layer of gold, wherein the nickel plating is mainly used for preventing diffusion between gold and copper, an oxidation layer of copper greatly influences welding, false soldering and cold soldering are easily formed, and a pad and a component can not be welded seriously, so that the PCB can be ensured to have good weldability and electrical property, and then the PCB is cut into a shape required by design, and then thermosetting oil on fingers is removed;

s11: the finished product is subjected to open-short circuit bare board test to find electric defects such as short circuit, open circuit, electric leakage and the like, and the test can adopt a special machine test, a general machine test and a flying probe test;

s12: and (4) carrying out appearance detection on the finished product to ensure that the appearance is free of defects, thereby meeting the final design requirement.

The above embodiments are only preferred embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equally replaced or changed within the scope of the present invention.

Claims

1. The processing method of the PCB capable of preventing the finger from scratching comprises copper-clad plates, and is characterized in that the number of the copper-clad plates is not less than two, and a layer of copper foil is arranged at the top end of the copper-clad plate on the uppermost layer and at the bottom end of the copper-clad plate on the lowermost layer.

2. The method for processing the PCB with the finger scratch resistance as claimed in claim 1, wherein a layer of prepreg is arranged between the copper-clad plate and between the copper-clad plate and the copper foil.

3. The method for processing the PCB board for preventing the finger from being scratched according to claim 2, wherein the prepreg is composed of glass fiber cloth and resin, and the resin is in a semi-cured state.

4. The method for processing the PCB board capable of preventing the finger from being scratched according to any one of claims 1 to 3, which is characterized by comprising the following steps of:

s2: laminating the copper-clad cut board obtained in the step S1, a prepreg and copper foil together according to a set number according to the requirement, pressing the laminated cut board, the prepreg and the copper foil in a high-temperature and high-pressure state, rotating a drill at a high speed by using a drilling machine to form a through cutting force, drilling a required hole in the laminated cut board to enable the layers to be communicated, forming a tool hole required by a post-process and a welding jack of an element, thereby facilitating the processing and positioning of the post-process, and plating a copper layer on the hole by using chemical liquid medicine to enable the layers to be communicated;

s9: printing required characters in the PCB obtained in the S8;