CN103730374A - Process for manufacturing cavity of package substrate - Google Patents
Process for manufacturing cavity of package substrate Download PDFInfo
- Publication number
- CN103730374A CN103730374A CN201210389990.3A CN201210389990A CN103730374A CN 103730374 A CN103730374 A CN 103730374A CN 201210389990 A CN201210389990 A CN 201210389990A CN 103730374 A CN103730374 A CN 103730374A
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- layer
- cavity
- material layer
- protective material
- golden finger
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
Abstract
The embodiment of the invention discloses a process for manufacturing a cavity of a package substrate. The process includes the following steps that an inner layer is manufactured; a protective material layer is laid, namely, a target cavity zone is determined on a core board with the inner layer manufactured, and a bonding golden finger of the target cavity zone is covered with the protective material layer; the core board is treated; the protective material layer is overlaid with a gasket in a press fit mode; an outer layer is manufactured; cavity depth-control milling is carried out, namely, depth-control milling is carried out on the target cavity zone of the core board with the outer layer manufactured to obtain a semi-finished cavity and expose the protective material layer; the protective material layer is removed, and namely the protective material layer in the semi-finished cavity is removed through the organic stripping method to expose the bonding golden finger; cavity forming is carried out, and namely the core board and the interior of the semi-finished cavity with the protective material layer removed are treated through the surface treatment method to obtain the formed cavity. According to the process for manufacturing the cavity of the package substrate, damage to the bonding golden finger is avoided, the dimensional accuracy and quality of the cavity are guaranteed, and the efficiency of the manufacturing process is improved.
Description
Technical field
The present invention relates to pcb board production field, relate in particular to a kind of manufacture craft of base plate for packaging cavity.
Background technology
Along with base plate for packaging is towards less, thinner trend development, requires the gold thread between base plate for packaging and chip to arrange more crypto set, thereby produced the making of base plate for packaging cavity body structure.In the turn on process of chip and base plate for packaging, can use internal layer golden finger to carry out routing, so-called routing, the Bonding(nation of client is fixed) welding, be commonly called as routing.In the fabrication processing of cavity, there is the dark milling step of control, adopt the dark milling step of control can cause routing golden finger to scratch.In order to protect routing golden finger, generally adopt in the industry welding resistance ink to cover routing golden finger, subsequent handling is removed welding resistance ink again, but there is the problems such as cavity yields is low, complex operation, fabrication cycle length in the very difficult removal of welding resistance ink.
Summary of the invention
Embodiment of the present invention technical problem to be solved is: a kind of manufacture craft of base plate for packaging cavity is provided, to guarantee dimensional accuracy and the quality of cavity, avoids the damage to routing golden finger, shorten fabrication cycle to improve the efficiency of manufacture craft.
In order to solve the problems of the technologies described above, the embodiment of the present invention has proposed a kind of manufacture craft of base plate for packaging cavity, comprises the steps:
Internal layer is made: on central layer, make required line map layer;
Covering protection material layer: make on complete central layer and determine target cavity body region at internal layer, covering protection material layer above the routing golden finger of this target cavity body region, covers the protected material layer of routing golden finger completely;
Central layer processing: process being coated with on the central layer of protective material layer, make the place except line map layer and covering protection material layer on central layer surface expose circuit copper;
Pad pressing: pad carry out pressing superposes above described protective material layer;
Outer making: on the central layer after pressing, positive and negative all covers PP layer, covers the pad that is pressed on protective material layer top completely, then at PP layer, carries out welding resistance outward and obtains solder mask;
Control dark milling cavity: the target cavity body region that adopts the dark milling technology of control to make complete central layer to skin is controlled dark milling, obtains semi-finished product cavity, exposes described protective material layer;
Remove protective material layer: utilize organic film method that takes off to remove the described protective material layer in semi-finished product cavity, expose described routing golden finger;
Cavity forming: the semi-finished product inside cavity after utilizing surface treatment method to central layer and removal protective material layer thereof is processed, and obtains molding cavity required chip is installed in molding cavity for subsequent technique.
Further, in described covering protection material layer step, described protective material layer is photosensitive dry film layer, and the routing golden finger top that adopts hot pressing mode that photosensitive dry film is affixed on to target cavity body region obtains photosensitive dry film layer; In described central layer treatment step, be to expose and development treatment on the central layer to being coated with photosensitive dry film layer.
Further, in described covering protection material layer step, described protective material layer is photosensitive printing ink layer, and the routing golden finger top that adopts silk-screen mode that photosensitive-ink is affixed on to target cavity body region obtains photosensitive printing ink layer; In described central layer treatment step, be to expose and development treatment on the central layer to being coated with photosensitive printing ink layer.
Further, in described covering protection material layer step, described protective material layer is thermo-cured ink layer, and the routing golden finger top that adopts silk-screen mode that thermo-cured ink is affixed on to target cavity body region obtains thermo-cured ink layer; In described central layer treatment step, be on the central layer to being coated with thermo-cured ink layer, to carry out hot curing processing.
Further, in described cavity forming step, described surface treatment method is chemical nickel porpezite, electroplating mild alloy, the hard gold of plating or electroless gold-plating method.
The beneficial effect of the embodiment of the present invention is: the manufacture craft of base plate for packaging cavity of the present invention; to guarantee the dimensional accuracy of cavity; improve the quality of cavity; utilize different protective layer materials to protect routing golden finger; and the process of removing protective material is easy; avoid the damage to routing golden finger, removed the troublesome operation that solder paste China ink is removed from, improved technique make efficiency.
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is the fabrication processing figure of embodiment of the present invention base plate for packaging cavity.
Fig. 2 is the schematic diagram after the internal layer making step of manufacture craft of embodiment of the present invention base plate for packaging cavity.
Fig. 3 is the schematic diagram after the covering protection material layer step of manufacture craft of embodiment of the present invention base plate for packaging cavity.
Fig. 4 is the schematic diagram after the pad pressing step of manufacture craft of embodiment of the present invention base plate for packaging cavity.
Fig. 5 is the schematic diagram after the outer making step of manufacture craft of embodiment of the present invention base plate for packaging cavity.
Fig. 6 is the schematic diagram after the dark milling cavity of the control step of manufacture craft of embodiment of the present invention base plate for packaging cavity.
Fig. 7 is the schematic diagram after the cavity forming step of manufacture craft of embodiment of the present invention base plate for packaging cavity.
The explanation of part drawing reference numeral:
10, central layer; 20, line map layer; 201, the routing golden finger of target cavity body region;
30, protective material layer; 40, pad; 50, PP layer; 60, solder mask;
70 ' semi-finished product cavitys; 70, finished product cavity.
Embodiment
It should be noted that, in the situation that not conflicting, the feature in embodiment and embodiment in the application can mutually combine, and below in conjunction with the drawings and specific embodiments, the present invention is described in further detail, and the present embodiment is as the criterion with direction shown in Fig. 7.
As shown in Figures 1 to 7, the embodiment of the present invention provides a kind of manufacture craft of base plate for packaging cavity, comprises the steps:
Internal layer is made: on central layer 10, make required line map layer 20;
Covering protection material layer: make on complete central layer 10 and determine target cavity body region at internal layer, covering protection material layer 30 above the routing golden finger 201 of this target cavity body region, covers the protected material layer 30 of routing golden finger 201 completely;
Central layer processing: the central layer 10 that is coated with protective material layer 30 is processed, made central layer 10 upper places except line map layer 20 and covering protection material layer 30, surface expose circuit copper, so that follow-up, central layer 10 is carried out to etching step;
Pad pressing: pad 40 carry out pressing superposes above described protective material layer 30;
Outer making: on the central layer 10 after pressing, positive and negative all covers PP layer 50, and PP layer 50 is polypropylene layer, and the pad 40 that is pressed on protective material layer 30 top is covered completely, then carries out welding resistance and obtain solder mask 60 outside PP layer 50;
Control dark milling cavity: the target cavity body region that adopts the dark milling technology of control to make complete central layer 10 to skin is controlled dark milling, obtains semi-finished product cavity 70 ', exposes described protective material layer 30;
Remove protective material layer: utilize organic film method that takes off to remove the described protective material layer 30 in semi-finished product cavity 70 ', expose described routing golden finger 201;
Cavity forming: utilize surface treatment method to process central layer 10 and the semi-finished product cavity 70 ' inside of removing after protective material layer thereof, obtain molding cavity 70 for subsequent technique at the required chip of the interior installation of molding cavity 70.
In described covering protection material layer step, described protective material layer is photosensitive dry film layer, and the routing golden finger top that adopts hot pressing mode that photosensitive dry film is affixed on to target cavity body region obtains photosensitive dry film layer; Or described protective material layer is photosensitive printing ink layer, the welding resistance ink using in the non-prior art of photosensitive-ink that photosensitive printing ink layer is used, the routing golden finger top that adopts silk-screen mode that photosensitive-ink is affixed on to target cavity body region obtains photosensitive printing ink layer; Or described protective material layer is thermo-cured ink layer, the routing golden finger top that adopts silk-screen mode that thermo-cured ink is affixed on to target cavity body region obtains thermo-cured ink layer.In silk-screen thermo-cured ink process, after pre-treatment program, on silk printing screen, carry out selectivity and block, after silk-screen, make the line map layer 20 top cover heating cured printing ink on central layer 10.
In described central layer treatment step, for different protective material layers, adopt different processing methods, its scope of application is more extensive.When protective material layer is photosensitive dry film layer, in described central layer treatment step, be to expose and development treatment on the central layer to being coated with photosensitive dry film layer.When protective material layer is photosensitive printing ink layer, in described central layer treatment step, be to expose and development treatment on the central layer to being coated with photosensitive printing ink layer.When protective material layer is thermo-cured ink layer; in described central layer treatment step; on the central layer to being coated with thermo-cured ink layer, to carry out hot curing processing; now without to exposing on central layer and development treatment; make whole technique more simple and easy quick; therefore, protective material layer preferably adopts thermo-cured ink.
In surface treatment method in described cavity forming step, when client product needed routing, as product electroless gold plating lead design, described surface treatment method is chemical nickel porpezite; As product has electroplating lead design, described surface treatment method is electroplating mild alloy.Or when client's product needed is welded, described surface treatment method is chemical nickel porpezite, electroplating mild alloy, the hard gold of plating or chemical gilding.
The manufacture craft tool of base plate for packaging cavity of the present invention has the following advantages:
1, in covering protection material layer step, the protective material adopting due to described protective material layer is photosensitive dry film, photosensitive-ink or thermo-cured ink, in follow-up removal protective material layer step, the process operation of removing protective material is simple and easy quick, has improved the efficiency of whole cavity manufacture craft; When adopting thermo-cured ink, without to core board to explosure and development step, only need carry out hot curing processing to central layer, its technique is also simpler and easy more quick than adopting the technique of photosensitive dry film, photosensitive-ink.
2, avoided removing the damage to routing golden finger in welding resistance ink process.
3, avoid removing the damage to PP layer in welding resistance ink process, guaranteed quality and the dimensional accuracy of cavity.
The above is the specific embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (5)
1. a manufacture craft for base plate for packaging cavity, is characterized in that, comprises the steps:
Internal layer is made: on central layer, make required line map layer;
Covering protection material layer: make on complete central layer and determine target cavity body region at internal layer, covering protection material layer above the routing golden finger of this target cavity body region, covers the protected material layer of routing golden finger completely;
Central layer processing: process being coated with on the central layer of protective material layer, make the place except line map layer and covering protection material layer on central layer surface expose circuit copper;
Pad pressing: pad carry out pressing superposes above described protective material layer;
Outer making: on the central layer after pressing, positive and negative all covers PP layer, covers the pad that is pressed on protective material layer top completely, then at PP layer, carries out welding resistance outward and obtains solder mask;
Control dark milling cavity: the target cavity body region that adopts the dark milling technology of control to make complete central layer to skin is controlled dark milling, obtains semi-finished product cavity, exposes described protective material layer;
Remove protective material layer: utilize organic film method that takes off to remove the described protective material layer in semi-finished product cavity, expose described routing golden finger;
Cavity forming: the semi-finished product inside cavity after utilizing surface treatment method to central layer and removal protective material layer thereof is processed, and obtains molding cavity required chip is installed in molding cavity for subsequent technique.
2. the manufacture craft of base plate for packaging cavity as claimed in claim 1, it is characterized in that, in described covering protection material layer step, described protective material layer is photosensitive dry film layer, and the routing golden finger top that adopts hot pressing mode that photosensitive dry film is affixed on to target cavity body region obtains photosensitive dry film layer; In described central layer treatment step, be to expose and development treatment on the central layer to being coated with photosensitive dry film layer.
3. the manufacture craft of base plate for packaging cavity as claimed in claim 1, it is characterized in that, in described covering protection material layer step, described protective material layer is photosensitive printing ink layer, and the routing golden finger top that adopts silk-screen mode that photosensitive-ink is affixed on to target cavity body region obtains photosensitive printing ink layer; In described central layer treatment step, be to expose and development treatment on the central layer to being coated with photosensitive printing ink layer.
4. the manufacture craft of base plate for packaging cavity as claimed in claim 1, it is characterized in that, in described covering protection material layer step, described protective material layer is thermo-cured ink layer, and the routing golden finger top that adopts silk-screen mode that thermo-cured ink is affixed on to target cavity body region obtains thermo-cured ink layer; In described central layer treatment step, be on the central layer to being coated with thermo-cured ink layer, to carry out hot curing processing.
5. the manufacture craft of base plate for packaging cavity as claimed in claim 1, is characterized in that, in described cavity forming step, described surface treatment method is chemical nickel porpezite, electroplating mild alloy, the hard gold of plating or electroless gold-plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210389990.3A CN103730374A (en) | 2012-10-15 | 2012-10-15 | Process for manufacturing cavity of package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210389990.3A CN103730374A (en) | 2012-10-15 | 2012-10-15 | Process for manufacturing cavity of package substrate |
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| CN103730374A true CN103730374A (en) | 2014-04-16 |
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| CN201210389990.3A Pending CN103730374A (en) | 2012-10-15 | 2012-10-15 | Process for manufacturing cavity of package substrate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472913A (en) * | 2015-12-28 | 2016-04-06 | 深圳市景旺电子股份有限公司 | Multi-layer board production method adopting dry film to replace high temperature adhesive tape |
| CN106028685A (en) * | 2016-06-21 | 2016-10-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board |
| CN111107717A (en) * | 2019-12-02 | 2020-05-05 | 欣强电子（清远）有限公司 | Processing method of PCB capable of preventing finger from scratching |
| CN111417263A (en) * | 2020-04-30 | 2020-07-14 | 上海创功通讯技术有限公司 | Circuit board structure manufacturing method, circuit board structure and electronic equipment |
| CN113766762A (en) * | 2021-06-01 | 2021-12-07 | 奥士康科技股份有限公司 | Method for preventing gold surface from being scratched and scratched |
| CN113923901A (en) * | 2021-10-12 | 2022-01-11 | 高德（江苏）电子科技有限公司 | Manufacturing method of printed circuit board capable of improving gold penetration of printing ink at cavity junction |
| CN113966096A (en) * | 2021-09-26 | 2022-01-21 | 东莞康源电子有限公司 | Machining method of miniature flip-chip welding type cavity carrier plate |
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| KR20110119155A (en) * | 2010-04-26 | 2011-11-02 | (주)피티앤케이 | Substrate for mounting an led package and manufacturing method thereof |
| CN102271463A (en) * | 2010-06-07 | 2011-12-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
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Patent Citations (4)
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| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| KR20110119155A (en) * | 2010-04-26 | 2011-11-02 | (주)피티앤케이 | Substrate for mounting an led package and manufacturing method thereof |
| CN102271463A (en) * | 2010-06-07 | 2011-12-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472913A (en) * | 2015-12-28 | 2016-04-06 | 深圳市景旺电子股份有限公司 | Multi-layer board production method adopting dry film to replace high temperature adhesive tape |
| CN106028685A (en) * | 2016-06-21 | 2016-10-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board |
| CN111107717A (en) * | 2019-12-02 | 2020-05-05 | 欣强电子（清远）有限公司 | Processing method of PCB capable of preventing finger from scratching |
| CN111417263A (en) * | 2020-04-30 | 2020-07-14 | 上海创功通讯技术有限公司 | Circuit board structure manufacturing method, circuit board structure and electronic equipment |
| CN113766762A (en) * | 2021-06-01 | 2021-12-07 | 奥士康科技股份有限公司 | Method for preventing gold surface from being scratched and scratched |
| CN113966096A (en) * | 2021-09-26 | 2022-01-21 | 东莞康源电子有限公司 | Machining method of miniature flip-chip welding type cavity carrier plate |
| CN113923901A (en) * | 2021-10-12 | 2022-01-11 | 高德（江苏）电子科技有限公司 | Manufacturing method of printed circuit board capable of improving gold penetration of printing ink at cavity junction |
| CN113923901B (en) * | 2021-10-12 | 2024-02-20 | 高德(江苏)电子科技股份有限公司 | Manufacturing method of printed circuit board capable of improving printing ink gold permeation at boundary of cavity |
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Application publication date: 20140416 |